Philips Semiconductors Product specification Rectifier diodes schottky barrier GENERAL DESCRIPTION Dual, low leakage, platinum barrier, schottky rectifier diodes in a full pack plastic envelope, featuring low forward voltage drop, absence of stored charge. and guaranteed reverse surge capability. The devices are intended for use in switched mode power supplies and high frequency circuits in general where low conduction and zero switching losses are important. PINNING - SOT186 PIN BYV143F series QUICK REFERENCE DATA SYMBOL VRRM VF IO(AV) PARAMETER BYV143FRepetitive peak reverse voltage Forward voltage Average output current (both diodes conducting) PIN CONFIGURATION MAX. MAX. MAX. UNIT 35 35 40 40 45 45 V 0.62 20 0.62 20 0.62 20 V A SYMBOL DESCRIPTION case 1 anode 1 (a) 2 cathode (k) 3 anode 2 (a) a2 3 a1 1 k2 1 2 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VRRM VRWM VR Repetitive peak reverse voltage Crest working reverse voltage Continuous reverse voltage Ths ≤ 112 ˚C IO(AV) Average output current (both diodes conducting) RMS output current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current, per diode IO(RMS) IFRM IFSM I2t IRRM IRSM Tstg Tj August 1996 CONDITIONS square wave; δ = 0.5; Ths ≤ 87 ˚C t = 25 µs; δ = 0.5; Ths ≤ 87 ˚C t = 10 ms t = 8.3 ms sinusoidal Tj = 125 ˚C prior to surge; with reapplied VRRM(max) I2t for fusing t = 10 ms Repetitive peak reverse current tp = 2 µs; δ = 0.001 per diode. Non-repetitive peak reverse tp = 100 µs current per diode. Storage temperature Operating junction temperature 1 MIN. - MAX. -35 35 35 35 -40 40 40 40 UNIT -45 45 45 45 V V V - 20 A - 20 A - 30 A - 100 110 A A - 50 1 A2s A - 1 A -65 - 175 150 ˚C ˚C Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier BYV143F series ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol Repetitive peak voltage from all three terminals to external heatsink R.H. ≤ 65% ; clean and dustfree Cisol Capacitance from T2 to external f = 1 MHz heatsink MIN. TYP. - MAX. UNIT 1500 V - 12 - pF MIN. TYP. MAX. UNIT - - 5.7 4.8 K/W K/W - 55 - K/W MIN. TYP. MAX. UNIT - 0.55 0.76 10 10 500 0.62 0.80 200 30 - V V µA mA pF THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Thermal resistance junction to heatsink Rth j-a Thermal resistance junction to ambient per diode both diodes (with heatsink compound) in free air. STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS VF Forward voltage (per diode) IR Reverse current (per diode) Cd Junction capacitance (per diode) IF = 15 A; Tj = 150˚C IF = 20 A VR = VRRM VR = VRRM; Tj = 125 ˚C f = 1MHz; VR = 5V; Tj = 25 ˚C to 125 ˚C August 1996 2 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier 15 BYV143F series BYV143 PF / W Ths(max) / C Vo = 0.4200 V Rs = 0.0120 Ohms 64.5 100 IR / mA BYV143 D = 1.0 0.5 10 0.2 10 150 C 93 0.1 125 C 1 100 C 5 tp D= T tp I 0 5 10 15 IF(AV) / A 0.1 0.01 150 25 20 Fig.1. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. 12 PF / W 2.2 10 0 25 VR/ V 50 Fig.4. Typical reverse leakage current per diode; IR = f(VR); parameter Tj Ths(max) / C a = 1.57 81.6 1.9 93 BYV143F Vo = 0.44 V Rs = 0.012 Ohms 75 C Tj = 50 C t T 0 121.5 PBYR745 Cd / pF 1000 2.8 4 8 104.4 6 115.8 4 127.2 2 138.6 0 0 5 100 10 150 15 10 1 10 IF(AV) / A Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). 50 IF / A 100 VR / V Fig.5. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C. Zth j-hs (K/W) BYV143 10 Tj = 25 C Tj = 150 C max typ 40 1 30 20 0.1 PD tp 10 t 0 0.01 0 0.2 0.4 0.6 VF / V 0.8 1 1.2 1.4 10us Fig.3. Typical and maximum forward characteristic IF = f(VF); parameter Tj August 1996 1ms tp (s) 0.1s 10s Fig.6. Transient thermal impedance; per diode; Zth j-hs = f(tp). 3 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier BYV143F series MECHANICAL DATA Dimensions in mm 10.2 max 5.7 max 3.2 3.0 Net Mass: 2 g 4.4 max 0.9 0.5 2.9 max 4.4 4.0 7.9 7.5 17 max seating plane 3.5 max not tinned 4.4 13.5 min 1 0.4 2 3 0.9 0.7 M 0.55 max 2.54 1.3 5.08 top view Fig.7. SOT186; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". August 1996 4 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes schottky barrier BYV143F series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1996 5 Rev 1.100