DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D119 BYD43 series Fast soft-recovery rectifiers Product specification Supersedes data of February 1995 1996 Jun 05 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series FEATURES DESCRIPTION • Glass passivated Cavity free cylindrical glass package through Implotec(1) technology. This package is hermetically sealed • High maximum operating temperature and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. • Low leakage current • Excellent stability • Available in ammo-pack. k handbook, 4 columns a MAM123 Fig.1 Simplified outline (SOD81) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM IF(AV) PARAMETER MIN. MAX. BYD43U − 1300 V BYD43V − 1500 V BYD43-16 − 1700 V BYD43-18 − 1900 V BYD43-20 − 2100 V repetitive peak reverse voltage BYD43U − 1200 V BYD43V − 1400 V BYD43-16 − 1600 V BYD43-18 − 1800 V BYD43-20 − 2000 V average forward current − 1.20 A 0.68 A − 0.65 A − 0.30 A BYD43U and V − 11 A BYD43-16 to 20 − 6 A average forward current BYD43U and V BYD43-16 to 20 IFRM 1996 Jun 05 Ttp = 55 °C; lead length = 10 mm; see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 − BYD43U and V IFRM UNIT non-repetitive peak reverse voltage BYD43-16 to 20 IF(AV) CONDITIONS repetitive peak forward current repetitive peak forward current Tamb = 65 °C; PCB mounting (see Fig.20); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11 Ttp = 55 °C; see Figs 6 and 7 Tamb = 65 °C; see Figs 8 and 9 BYD43U and V − 6.0 A BYD43-16 to 20 − 3.2 A 2 Philips Semiconductors Product specification Fast soft-recovery rectifiers SYMBOL IFSM BYD43 series PARAMETER non-repetitive peak forward current CONDITIONS MIN. t = 10 ms half sinewave; Tj = Tj max prior to surge; VR = VRRMmax MAX. UNIT − 6 A BYD43-16 to 20 − 6 A Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C MIN. TYP. MAX. − − 1.20 V − − 2.05 V − − 1.5 V − − 2.4 V − − 1 µA − − 5 µA BYD43U and V see Figs 12 and 13 ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS IF = 1 A; Tj = Tj max; see Figs 14 and 15 BYD43U and V BYD43-16 to 20 VF forward voltage IF = 1 A; see Figs 14 and 15 BYD43U and V BYD43-16 to 20 IR reverse current VR = VRRMmax; see Figs 16 and 17 BYD43U and V BYD43-16 to 20 IR trr reverse current VR = VRRMmax BYD43U and V Tj = 165 °C; see Fig 16 − − 100 µA BYD43-16 to 20 Tj = 125 °C; see Fig 17 − − 50 µA when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig 22 − − 250 ns − − 300 ns − 20 − pF − 15 − pF − − 5 A/µs − − 5 A/µs reverse recovery time BYD43U and V BYD43-16 to 20 Cd diode capacitance f = 1 MHz; VR = 0 V; see Figs 18 and 19 BYD43U and V BYD43-16 to 20 dI R -------dt UNIT maximum slope of reverse recovery current BYD43U and V BYD43-16 to 20 when switched from IF = 1 A to VR ≥ 30 V and dIF/dt = −1 A/µs; see Fig.21 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm Rth j-a thermal resistance from junction to ambient note 1 VALUE UNIT 60 K/W 120 K/W Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.20. For more information please refer to the “General Part of associated Handbook”. 1996 Jun 05 3 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series GRAPHICAL DATA MLC311 1.6 MLC315 0.8 handbook, halfpage handbook, halfpage I F(AV) I F(AV) (A) (A) lead length 10 mm lead length 10 mm 1.2 0.6 0.8 0.4 0.4 0.2 0 0 0 100 T tp ( oC) 200 0 BYD43U and V a = 1.42; VR = VRRMmax; δ = 0.5. Switched mode application. BYD43-16 to 20 a = 1.42; VR = VRRMmax; δ = 0.5. Switched mode application. Fig.2 Fig.3 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). MLC312 1.0 I F(AV) (A) 0.8 (A) 0.4 0.6 0.3 0.4 0.2 0.2 0.1 100 Tamb ( o C) 0 200 0 100 BYD43U and V a = 1.42; VR = VRRMmax; δ = 0.5. Device mounted as shown in Fig.20. Switched mode application. BYD43-16 to 20 a = 1.42; VR = VRRMmax; δ = 0.5. Device mounted as shown in Fig.20. Switched mode application. Fig.4 Fig.5 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). 1996 Jun 05 4 200 MLC316 0.5 I F(AV) handbook, halfpage 0 T tp ( oC) Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). handbook, halfpage 0 100 Tamb ( o C) 200 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series MLC320 12 handbook, full pagewidth I FRM (A) 10 δ = 0.05 8 0.1 6 0.2 4 0.5 2 1 0 10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4 BYD43U and V Ttp = 55 °C; Rth j-tp = 60 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1 400 V. Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. MLC322 8 handbook, full pagewidth I FRM (A) 6 δ = 0.05 4 0.1 0.2 2 0.5 1 0 10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4 BYD43-16 to 20 Ttp = 55 °C; Rth j-tp = 60 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V. Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. 1996 Jun 05 5 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series MLC321 8 handbook, full pagewidth I FRM (A) 6 δ = 0.05 4 0.1 0.2 2 0.5 1 0 10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4 BYD43U and V Tamb = 65 °C; Rth j-a = 120 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1400 V. Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. MLC323 4 handbook, full pagewidth I FRM (A) 3 δ = 0.05 2 0.1 0.2 1 0.5 1 0 10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4 BYD43-16 to 20 Tamb = 65 °C; Rth j-a = 120 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V. Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. 1996 Jun 05 6 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series MLC310 3 MLC314 3 handbook, halfpage handbook, halfpage P (W) P (W) a = 3 2.5 2 1.57 2 a = 3 2.5 2 1.57 2 1.42 1 0 1.42 1 0 1 0 2 I F(AV) (A) 0 0.5 1.0 I F(AV) (A) BYD43U and V a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5. BYD43-16 to 20 a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5. Fig.10 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. Fig.11 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. MLC265 200 MLC318 200 handbook, halfpage handbook, halfpage Tj ( oC) Tj ( oC) 100 100 BYD43U 0 0 1000 BYD43V VR (V) BYD43-16 0 2000 0 1000 VR (V) 18 20 2000 BYD43-16 to 20 Dotted line = VRRM; δ = 0.1. Solid line = VRRM; δ = 0.5. BYD43U and V VRRM; δ = 0.5. Fig.12 Maximum permissible junction temperature as a function of reverse voltage. 1996 Jun 05 Fig.13 Maximum permissible junction temperature as a function of reverse voltage. 7 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series MLC309 6 MLC192 3 handbook, halfpage handbook, halfpage IF (A) IF (A) 4 2 2 1 0 0 0 1 2 V F (V) 3 BYD43U and V Dotted line: Tj = 175 °C. Solid line: Tj = 25 °C. 0 2 4 V F (V) BYD43-16 to 20 Dotted line: Tj = 175 °C. Solid line: Tj = 25 °C. Fig.14 Forward current as a function of forward voltage; maximum values. Fig.15 Forward current as a function of forward voltage; maximum values. MLC313 103 handbook, halfpage MLC319 103 handbook, halfpage IR (µA) IR (µA) 102 102 10 10 1 0 100 Tj ( o C) 1 200 BYD43U and V VR = VRRMmax. 100 Tj ( o C) 200 BYD43-16 to 20 VR = VRRMmax. Fig.16 Reverse current as a function of junction temperature; maximum values. 1996 Jun 05 0 Fig.17 Reverse current as a function of junction temperature; maximum values. 8 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series MLC305 102 handbook, halfpage MLC317 10 handbook, halfpage Cd (pF) Cd (pF) 10 1 1 102 10 V R (V) 1 103 1 BYD43U and V f = 1 MHz; Tj = 25 °C. 102 10 V R (V) 103 BYD43-16 to 20 f = 1 MHz; Tj = 25 °C. Fig.18 Diode capacitance as a function of reverse voltage; typical values. Fig.19 Diode capacitance as a function of reverse voltage; typical values. 50 handbook, halfpage 25 IF halfpage handbook, dI F dt 7 t rr 50 10% t dI R dt 100% 2 IR MGC499 3 MGA200 Dimensions in mm. Fig.20 Device mounted on a printed-circuit board. 1996 Jun 05 Fig.21 Reverse recovery definitions. 9 Philips Semiconductors Product specification Fast soft-recovery rectifiers DUT handbook, full pagewidth BYD43 series IF (A) + 10 Ω 0.5 25 V t rr 1Ω 50 Ω 0 t 0.25 0.5 IR (A) 1 Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns. Source impedance: 50 Ω; tr ≤ 15 ns. Fig.22 Test circuit and reverse recovery time waveform and definition. 1996 Jun 05 10 MAM057 Philips Semiconductors Product specification Fast soft-recovery rectifiers BYD43 series PACKAGE OUTLINE 5 max handbook, full pagewidth 0.81 max 2.15 max 28 min 3.8 max 28 min MBC051 Dimensions in mm. The marking band indicates the cathode. Fig.23 SOD81. DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 05 11