PHILIPS PLUS173D

Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
DESCRIPTION
PLUS173B/D
FEATURES
The PLUS173 PLDs are high speed,
combinatorial Programmable Logic Arrays.
The Philips Semiconductors state-of-the-art
Oxide Isolated Bipolar fabrication process is
employed to produce propagation delays as
short as 12ns.
• I/O propagation delays (worst case)
The 24-pin PLUS173 devices have a
programmable AND array and a
programmable OR array. Unlike PAL 
devices, 100% product term sharing is
supported. Any of the 32 logic product terms
can be connected to any or all of the 10
output OR gates. Most PAL ICs are limited to
7 AND terms per OR function; the PLUS173
devices can support up to 32 input wide OR
functions.
• Two programmable arrays
The polarity of each output is userprogrammable as either Active-High or
Active-Low, thus allowing AND-OR or
AND-NOR logic implementation. This feature
adds an element of design flexibility,
particularly when implementing complex
decoding functions.
The PLUS173 devices are userprogrammable using one of several
commercially available, industry standard
PLD programmers.
PIN CONFIGURATIONS
N Package
– PLUS173B – 15ns max.
I0 1
24 VCC
I1 2
23 B9
I2 3
22 B8
I3 4
21 B7
I4 5
20 B6
I5 6
19 B5
I6 7
18 B4
I7 8
17 B3
I8 9
16 B2
I9 10
15 B1
I10 11
14 B0
GND 12
13 I11
– PLUS173D – 12ns max.
• Functional superset of 20L10 and most
other 24-pin combinatorial PAL devices
– Supports 32 input wide OR functions
• 12 inputs
• 10 bi-directional I/O
• 42 AND gates
– 32 logic product terms
– 10 direction control terms
• Programmable output polarity
– Active-High or Active-Low
• Security fuse
• 3-State outputs
• Power dissipation: 750mW (typ.)
• TTL Compatible
N = Plastic Dual In-Line (300mil-wide)
A Package
I2
I1
4
3
2
I0 VCC B9 B8
1 28 27 26
NC 5
25 NC
I4 6
24 B7
I5 7
23 B6
I6 8
22 B5
I7 9
21 B4
I8 10
20 B3
NC 11
19 NC
APPLICATIONS
• Random logic
• Code converters
• Fault detectors
• Function generators
• Address mapping
• Multiplexing
I3
12
13
I9
I10 GND I11 B0 B1 B2
14
15
16
17
18
A = Plastic Leaded Chip Carrier
ORDERING INFORMATION
DESCRIPTION
tPD (MAX)
ORDER CODE
DRAWING NUMBER
24-Pin Plastic Dual In-Line 300mil-wide
15ns
PLUS173BN
0410D
24-Pin Plastic Dual In-Line 300mil-wide
12ns
PLUS173DN
0410D
28-Pin Plastic Leaded Chip Carrier
15ns
PLUS173BA
0401F
28-Pin Plastic Leaded Chip Carrier
12ns
PLUS173DA
0401F
PAL is a registered trademark of Advanced Micro Devices Corporation.
October 22, 1993
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853–1298 11164
Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
PLUS173B/D
LOGIC DIAGRAM
(LOGIC TERMS–P)
I0
1
I1
2
I2
3
I3
4
I4
5
I5
6
I6
7
I7
8
I8
9
(CONTROL TERMS)
I9 10
I10 11
I11 13
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
S9
X9
X8
X7
X6
X5
X4
X3
X2
X1
31
24 23
16 15
8 7
0
NOTES:
1. All programmed ‘AND’ gate locations are pulled to logic “1”.
2. All programmed ‘OR’ gate locations are pulled to logic “0”.
3.
Programmable connection.
October 22, 1993
34
X0
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
23 B9
S8
22 B8
S7
21 B7
S6
20 B6
S5
19 B5
S4
18 B4
S3
17 B3
S2
16 B2
S1
15 B1
S0
14 B0
Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
PLUS173B/D
FUNCTIONAL DIAGRAM
P31
P0
D0
D9
I0
I11
B0
B9
S9
B9
X9
S0
B0
X0
ABSOLUTE MAXIMUM RATINGS1
THERMAL RATINGS
TEMPERATURE
RATING
SYMBOL
PARAMETER
MIN
MAX
UNIT
Maximum junction
150°C
75°C
VCC
Supply voltage
+7
VDC
Maximum ambient
VIN
Input voltage
+5.5
VDC
VOUT
Output voltage
+5.5
VDC
Allowable thermal rise
ambient to junction
IIN
Input currents
+30
mA
IOUT
Output currents
+100
mA
Tamb
Operating free-air temperature range
0
+75
°C
Tstg
Storage temperature range
–65
+150
°C
–30
NOTES:
1. Stresses above those listed may cause malfunction or permanent damage to the device. This
is a stress rating only. Functional operation at these or any other condition above those
indicated in the operational and programming specification of the device is not implied.
October 22, 1993
35
75°C
Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
PLUS173B/D
DC ELECTRICAL CHARACTERISTICS
0°C ≤ Tamb ≤ +75°C, 4.75 ≤ VCC ≤ 5.25V
LIMITS
SYMBOL
Input
PARAMETER
TEST CONDITIONS
MIN
TYP1
MAX
UNIT
0.8
V
voltage2
VIL
Low
VCC = MIN
VIH
High
VCC = MAX
VIC
Clamp
Output
2.0
VCC = MIN, IIN = –12mA
V
–0.8
–1.2
V
0.5
V
voltage2
VCC = MIN
VOL
Low4
IOL = 15mA
VOH
High5
IOH = –2mA
2.4
V
Input current9
VCC = MAX
IIL
Low
VIN = 0.45V
–100
µA
IIH
High
VIN = VCC
40
µA
VOUT = 2.7V
80
µA
VOUT = 0.45V
–140
Output current
VCC = MAX
IO(OFF)
IOS
ICC
Hi-Z state8
Short circuit3, 5, 6
VCC supply
current7
VOUT = 0V
VCC = MAX
–15
150
–70
mA
200
mA
Capacitance
VCC = 5V
IIN
Input
VIN = 2.0V
8
pF
CB
I/O
VB = 2.0V
15
pF
NOTES:
1. All typical values are at VCC = 5V, Tamb = +25°C.
2. All voltage values are with respect to network ground terminal.
3. Test one at a time.
4. Measured with inputs I0 – I4 = 0V, inputs I5 – I9 = 4.5V, I11 = 4.5V and I19 = 10V. For outputs B0 – B4 and for outputs B5 – B9 apply the
same conditions except I11 = 0V.
5. Same conditions as Note 4 except input I11 = +10V.
6. Duration of short circuit should not exceed 1 second.
7. ICC is measured with inputs I0 – I11 and B0 – B9 = 0V. Part in Virgin State.
8. Leakage values are a combination of input and output leakage.
9. IIL and IIH limits are for dedicated inputs only (I0 – I11).
October 22, 1993
36
Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
PLUS173B/D
AC ELECTRICAL CHARACTERISTICS
0°C ≤ Tamb ≤ +75°C, 4.75 ≤ VCC ≤ 5.25V, R1 = 300Ω, R2 = 390Ω
LIMITS
SYMBOL
PARAMETER
FROM
TO
TEST
PLUS173B
TYP
MAX
TYP
MAX
tPD
Propagation Delay2
Input +/–
Output +/–
CL = 30pF
11
15
10
12
ns
tOE
Output Enable1
Input +/–
Output –
CL = 30pF
11
15
10
12
ns
tOD
Output Disable1
Input +/–
Output +
CL = 5pF
11
15
10
12
ns
CONDITION
MIN
PLUS173D
MIN
UNIT
NOTES:
1. For 3-State outputs; output enable times are tested with CL = 30pF to the 1.5V level, and S1 is open for high-impedance to High tests and
closed for high-impedance to Low tests. Output disable times are tested with CL = 5pF. High-to-High impedance tests are made to an output
voltage of VT = (VOH – 0.5V) with S1 open, and Low-to-High impedance tests are made to the VT = (VOL + 0.5V) level with S1 closed.
2. All propagation delays are measured and specified under worst case conditions.
VOLTAGE WAVEFORM
TEST LOAD CIRCUIT
+3.0V
VCC
90%
10%
0V
tR
5ns
tF
C1
+5V
S1
C2
R1
BZ
In
5ns
+3.0V
INPUTS
90%
In
BM
CL
R2
DUT
10%
0V
BM
5ns
5ns
MEASUREMENTS:
All circuit delays are measured at the +1.5V level
of inputs and outputs, unless otherwise specified.
SYMBOL
BZ
OUTPUTS
NOTE:
C1 and C2 are to bypass VCC to GND.
Input Pulses
TIMING DEFINITIONS
GND
Test Load Circuit
TIMING DIAGRAM
PARAMETER
+3V
tPD
Propagation delay between
input and output.
tOD
Delay between input change
and when output is off (Hi-Z
or High).
tOE
I, B
1.5V
1.5V
0V
VOH
B
1.5V
Delay between input change
and when output reflects
specified output level.
October 22, 1993
1.5V
1.5V
VT
VOL
tPD
37
tOD
tOE
Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
LOGIC PROGRAMMING
The PLUS173 series is fully supported by
industry standard (JEDEC compatible) PLD
CAD tools, including Philips Semiconductors
SNAP design software package. ABEL and
CUPL design software packages also
support the PLUS173 architecture.
PLUS173B/D
PROGRAMMING AND
SOFTWARE SUPPORT
Refer to Section 9 (Development Software)
and Section 10 (Third-Party Programmer/
Software Support) of this data handbook for
additional information.
All packages allow Boolean and state
equation entry formats. SNAP, ABEL and
CUPL also accept, as input, schematic
capture format.
OUTPUT POLARITY – (B)
PLUS173 logic designs can also be
generated using the program table entry
format, which is detailed on the following
page. This program table entry format is
supported by SNAP only.
S
S
B
B
X
X
To implement the desired logic functions, the
state of each logic variable from logic
equations (I, B, O, P, etc.) is assigned a
symbol. The symbols for TRUE,
COMPLEMENT, INACTIVE, PRESET, etc.,
are defined below.
ACTIVE LEVEL
ACTIVE LEVEL
CODE
HIGH1
(NON-INVERTING)
CODE
LOW
H
(INVERTING)
L
AND ARRAY – (I, B)
I, B
I, B
I, B
I, B
I, B
I, B
I, B
P, D
I, B
I, B
I, B
I, B
P, D
I, B
P, D
P, D
STATE
CODE
STATE
CODE
STATE
CODE
STATE
CODE
INACTIVE1, 2
O
I, B
H
I, B
L
DON’T CARE
–
OR ARRAY – (B)
VIRGIN STATE
P
A factory shipped virgin device contains all
fusible links intact, such that:
1. All outputs are at “H” polarity.
P
S
S
2. All Pn terms are disabled.
3. All Pn terms are active on all outputs.
Pn STATUS
CODE
Pn STATUS
ACTIVE1
A
INACTIVE
CODE
•
NOTES:
1. This is the initial unprogrammed state of all link pairs. It is normally associated with all unused
(inactive) AND gates Pn, Dn.
2. Any gate Pn, Dn will be unconditionally inhibited if both the true and complement of any input
(I, B) are left intact.
ABEL is a trademark of Data I/O Corp.
CUPL is a trademark of Logical Devices, Inc.
October 22, 1993
38
October 22, 1993
H
L
—
I, B
I, B
DON’T CARE
VARIABLE
NAME
0
INACTIVE
AND
I, B(I)
LOW
HIGH
L
H
B(0)
(POL)
A
CONTROL
INACTIVE
ACTIVE
OR
2. Unused I and B bits in the AND array must be programmed
Don’t Care (—).
3. Unused product terms can be left blank.
NOTES
1. The PLA is shipped with all links intact. Thus a background
of entries corresponding to states of virgin links exists in the
table.
(Shown BLANK for clarity.)
PROGRAM TABLE #
PHILIPS DEVICE #
CUSTOMER NAME
REV
DATE
Philips Semiconductors Programmable Logic Devices
T
E
R
M
PIN
11 10
Product specification
Programmable logic arrays
(22 × 42 × 10)
PLUS173B/D
PROGRAM TABLE
POLARITY
I
AND
B(I)
0
1
2
3
4
5
6
7
8
10
9
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
D9
31
D8
D7
D6
D5
D4
D3
D2
D1
D0
9
8
7
6
5
4
3
2
1
0
13 11 10
9
8
7
6
5
4
3
2
1
39
9
8
7
6
5
B(0)
OR
4
3
2
1
0
23 22 21 20 19 18 17 16 15 14
9
8
7
6
5
4
3
2
1
0
23 22 21 20 19 18 17 16 15 14
Philips Semiconductors Programmable Logic Devices
Product specification
Programmable logic arrays
(22 × 42 × 10)
PLUS173B/D
SNAP RESOURCE SUMMARY DESIGNATIONS
P31
P0
D0
D9
DIN173
I0
NIN173
I11
DIN173
B0
NIN173
B9
AND
CAND
TOUT173
S9
B9
X9
OR
S0
B0
X0
EXOR173
October 22, 1993
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