TFA9810 Stereo full-bridge audio amplifier 2 x 12 W Rev. 03 — 20 February 2008 Product data sheet 1. General description The TFA9810 is a two-channel power comparator for high-efficiency class D audio amplifier systems. It contains two full-bridge Bridge-Tied Load (BTL) power stages, drive logic, protection control logic and full differential input comparators. By using this power comparator a compact closed-loop self-oscillating digital amplifier system or open-loop system can be built. The TFA9810 does not require a heat sink and operates using an asymmetrical supply voltage. 2. Features n n n n n n Stereo full-bridge power comparator for class D audio amplifier applications No external heat sink required Operating voltage range: asymmetrical from 8 V to 20 V Thermally protected Zero dead-time switching Current-limiting (no audible interruptions) 3. Applications n n n n n n Self-oscillating or open-loop class D audio amplifier applications Flat-panel television sets Flat-panel monitors Multimedia systems Wireless speakers High-end CRT television sets 4. Quick reference data Table 1. Quick reference data Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol Parameter Condition Min Typ Max Unit VP supply voltage VP = VDDPx − VSSPx 8 12 20 V Ioff off-state current off mode - 110 200 µA Iq quiescent current with load, filter and snubbers connected - 35 45 mA ηpo output power efficiency output power 2 x 9 W into 8 Ω; Po = Po(nom) 87 89 - % TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W Table 1. Quick reference data …continued Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol Parameter Condition Min Typ Max Unit Po(RMS) RMS output power RL = 8 Ω; VP = 12 V; THD = 10 %; Two channel driven; no heat sink required. - 9.5 - W Po output power VP = 12 V; RL = 8 Ω - - - - 8.5 9.5 - W THD = 10 % 6.5 7.5 - W VP = 14 V; RL = 8 Ω; THD = 10 %; thermally limited THD = 1 % - 15 - W VP = 16 V; RL = 8 Ω; THD = 10 %; thermally limited - 15 - W VP = 12 V; RL = 6 Ω; THD = 10 %; thermally limited - 12 - W VP = 12 V; RL = 4 Ω; THD = 10 %; thermally limited - 15 - W 5. Ordering information Table 2. Ordering information Type number TFA9810T Package Name Description Version SO32 SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 2 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 6. Block diagram TFA9810 27 BOOT1P 25 VDDP1 DRIVER HIGH 26 OUT1P CONTROL LOGIC VDDA1 4 DRIVER LOW 30 VSSP1 IN1P 2 COMPARATOR 1 IN1N 3 STABI1 VSSA1 5 DRIVER HIGH DIAG 10 TEST 11 29 BOOT1N VDDP1 PROTECTION OVP UVP OCP OTP ODP WP 28 OUT1N CONTROL LOGIC DRIVER LOW VSSP1 31 STAB1 SO/OL 6 REFERENCE 22 BOOT2P ENABLE 7 24 VDDP2 DRIVER HIGH CDELAY 8 23 OUT2P CONTROL LOGIC DRIVER LOW VDDA2 13 19 VSSP2 IN2P 15 IN2N 14 STABI2 COMPARATOR 2 20 BOOT2N VDDP2 VSSA2 12 DRIVER HIGH 21 OUT2N CONTROL LOGIC DRIVER LOW VSSP2 18 STAB2 HEATSPREADER 1 16 17 32 VSSD(HW) Fig 1. 9 n.c. 010aaa016 Block diagram TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 3 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 7. Pinning information 7.1 Pinning VSSD(HW) 1 IN1P 2 32 VSSD(HW) 31 STAB1 IN1N 3 VDDA1 4 30 VSSP1 29 BOOT1N VSSA1 5 28 OUT1N SO/OL 6 27 BOOT1P ENABLE 7 26 OUT1P CDELAY 8 n.c. 9 TFA9810 SO32 25 VDDP1 24 VDDP2 DIAG 10 23 OUT2P TEST 11 22 BOOT2P VSSA2 12 21 OUT2N VDDA2 13 20 BOOT2N IN2N 14 19 VSSP2 18 STAB2 IN2P 15 17 VSSD(HW) VSSD(HW) 16 010aaa017 Fig 2. Pin configuration The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally connected to the die pad and must be connected to VSSA in the application. Together with the applied copper area on the Printed Circuit Board (PCB) these leads determine the ambient temperature, which affects the thermal resistance of the junction. 7.2 Pin description Table 3. Pin description Symbol Pin Description VSSD(HW) 1, 16, 17, 32 Negative digital supply voltage and handle wafer IN1P 2 Positive input comparator channel 1 IN1N 3 Negative input comparator channel 1 VDDA1 4 Positive analog supply voltage channel 1 VSSA1 5 Negative analog supply voltage channel 1 SO/OL 6 SO/OL input enables self-oscillating / open-loop configuration ENABLE 7 Enable input to switch between SLEEP and OPERATING CDELAY 8 CDELAY input determines the switch on/off timing n.c. 9 Not connected DIAG 10 Diagnostic output; open drain TEST 11 Test signal input; for testing purposes only VSSA2 12 Negative analog supply voltage channel 2 VDDA2 13 Positive analog supply voltage channel 2 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 4 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W Table 3. Pin description …continued Symbol Pin Description IN2N 14 Negative input comparator channel 2 IN2P 15 Positive input comparator channel 2 STAB2 18 Decoupling of internal 11 V regulator for channel 2 drivers VSSP2 19 Negative power-supply voltage channel 2 BOOT2N 20 Bootstrap high-side driver negative output channel 2 OUT2N 21 Negative output channel 2 BOOT2P 22 Bootstrap high-side driver positive output channel 2 OUT2P 23 Positive output channel 2 VDDP2 24 Positive supply voltage power channel 2 VDDP1 25 Positive power supply voltage channel 1 OUT1P 26 Positive output channel 1 BOOT1P 27 Bootstrap high-side driver positive output channel 1 OUT1N 28 Negative output channel 1 BOOT1N 29 Bootstrap high-side driver negative output channel 1 VSSP1 30 Negative supply voltage power channel 1 STAB1 31 Decoupling of internal 11 V regulator for channel 1 drivers 8. Functional description 8.1 General The TFA9810 is a dual-switching power comparator. It is the main building block for a stereo high-efficiency Class D audio power amplifier system. It contains two full-bridge BTL power stages, drive logic, protection-control logic and full differential input comparators and references (see Figure 1). By using this power comparator a compact closed-loop self-oscillating digital amplifier system or open-loop system can be built. A second-order low-pass filter converts the Pulse Width Modulation (PWM) output signal into an analog audio signal across the speaker. 8.2 Interfacing The pins ENABLE and SO/OL control the operating mode of the TFA9810. Both the ENABLE and the SO/OL pins refer to VSSD(HW). When the SO/OL pin is connected to VSSA the TFA9810 is in self-oscillating mode: when the SO/OL pin is floating the TFA9810 is in open-loop mode. The TEST pin needs to be connected to VDDA in both situations. Table 4. SO/OL connections Interfacing SO/OL connected to Configuration VSSD(HW) Self-oscillating Open Open-loop The device has two modes: SLEEP and OPERATING. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 5 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W In SLEEP mode the TFA9810 is not biased and has a very low supply current. When the TFA9810 is set to OPERATING mode the device is started via the start-up sequence, which provides a pop-free start-up behavior. After start-up the reference voltages STAB are present and the outputs start switching. Table 5. Start-up Interfacing ENABLE [V] Mode ENABLE < 0.8 V SLEEP ENABLE > 3 V OPERATING 8.3 Input comparators The input stages have a differential input and are optimized for low noise and low offset. This results in maximum flexibility in the application. 8.3.1 Operating in self-oscillating configuration The inputs (IN1P, IN1N, IN2P, IN2N) of the comparators are internally set to a voltage level of 0.5VP, but only during the start-up sequence. In operating mode the inputs are high-ohmic. 8.3.2 Operating in open-loop configuration No internal voltages are applied to the inputs. The input pins (IN1P, IN1N, IN2P, IN2N) are pulled down to VSSA level by internal resistors. 8.4 Diagnostic The DIAG output is an open-drain output. The maximum current is 2 mA. Whenever one of the protections is triggered the DIAG output is activated low. The DIAG output refers to VSSD. 8.5 Protections Overtemperature, overcurrent, overvoltage, undervoltage, overdissipation sensors, and window protection are included in the TFA9810. When one of these sensors exceeds its threshold level either the output power stage is switched off and the outputs (OUT1N, OUT1P, OUT2N, OUT2P) become floating, or the TFA9810 shuts down and starts up immediately. • OverTemperature Protection (OTP) If the junction temperature (Tj) exceeds a threshold level of about 150 °C then the outputs become floating. The device will start switching again after 5 µs and when the temperature is below 150 °C. This is thermal limitation without audible interruptions. • OverCurrent Protection (OCP) If the output current exceeds the maximum output current threshold level the output becomes floating. The device will start switching again after 5 µs. This is current limitation without audible interruptions. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 6 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W • OverVoltage Protection (OVP) When the supply voltage applied to the TFA9810 exceeds the maximum supply voltage threshold level the device will shut down. The device will restart when the supply voltage is within the operating range. • UnderVoltage Protection (UVP) When the supply voltage applied to the TFA9810 falls below the minimum supply voltage threshold level the device will shut down. The device will restart when the supply voltage is within the operating range. • OverDissipation Protection (ODP) The ODP in the TFA9810 is a combination of two protections. Exceeding a temperature threshold level of 135 °C an internal pre-warning is generated. When an overcurrent is detected during the pre-warning the device will shut down. When the ENABLE pin is high the TFA9810 will restart automatically. The restart sequence (switch-off → switch-on) will take 200 ms to 500 ms. • Window Protection (WP) During start-up, if one of the outputs is shorted to VSS or VDD the device will not start. This is an effective measure to protect the device against shorts between the outputs (before the filter) and the ground or supply lines. The supply must be switched off prior to removing any short. The WP protects the device against failure during board assembly. Table 6. Overview protections Protections Symbol Condition DIAG Outputs Recovering OTP Tj > 150 °C LOW Floating Automatic, after 5 µs and Tj < 150 °C OCP IO > IORM LOW Floating Automatic, after 5 µs and IO < IORM OVP VP > 20 V LOW Floating Restart (switch-off → switch-on when VP < 20 V) UVP VP < 8 V LOW Floating Restart (switch-off → switch-on when VP > 8 V) ODP Tj > 135 °C and IO > IORM LOW Floating Restart (switch-off → switch-on when Tj < 135 °C or IO < IORM) WP OUTX > VDDA - 1 V or OUTX < VSSA + 1 V LOW TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 7 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 8.6 Start-up sequence VP ENABLE STAB1 CDELAY V IN x FLOATING FLOATING PWM PWM AUDIO AUDIO OUT x AUDIO DIAG SLEEP START-UP OPERATING FAULT RESTART OPERATING SHUT-DOWN SLEEP 010aaa018 Fig 3. Start-up sequence 9. Internal circuitry 1,16, 17, 32 VDDA 22 V VSSA 010aaa024 Fig 4. Internal circuitry 0001 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 8 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W VDDA1 2 135 kΩ 5.5 V VSSA hvp 135 kΩ 5.5 V 3 VSSA1 010aaa025 Fig 5. Internal circuitry 0002 4 22 V 5 010aaa026 Fig 6. Internal circuitry 0003 VDDA1 VDDA1 50 µA 110 kΩ 6 VSSA1 VSSA 010aaa027 Fig 7. Internal circuitry 0004 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 9 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W VDDA1 3 kΩ 7 250 nA VSSA 010aaa028 Fig 8. Internal circuitry 0005 VDDA1 2 nA 8 200 nA 5 kΩ DISCHARGE VSSA1 010aaa029 Fig 9. Internal circuitry 0006 VDDA1 10 VSSA1 VSSD 010aaa030 Fig 10. Internal circuitry 0007 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 10 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W VDDA1 11 13 kΩ VSSA1 010aaa031 Fig 11. Internal circuitry 0008 Fig 12. Internal circuitry 0009 VDDA2 14 5.5 V 130 kΩ hvp VSSA2 130 kΩ 5.5 V 15 VSSA2 010aaa033 Fig 13. Internal circuitry 0010 VDDA2 100 mA 18 12 V VSSD 010aaa034 Fig 14. Internal circuitry 0011 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 11 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 24 23.5 V 19 010aaa035 Fig 15. Internal circuitry 0012 20 12 V OUT2N 010aaa036 Fig 16. Internal circuitry 0013 VDDP2 21 VSSP2 010aaa037 Fig 17. Internal circuitry 0014 22 12 V OUT2P 010aaa038 Fig 18. Internal circuitry 0015 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 12 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W VDDP2 23 VSSP2 010aaa039 Fig 19. Internal circuitry 0016 25 23.5 V 30 010aaa040 Fig 20. Internal circuitry 0017 VDDP1 26 VSSP1 010aaa041 Fig 21. Internal circuitry 0018 Fig 22. Internal circuitry 0019 TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 13 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W VDDP1 28 VSSP1 010aaa043 Fig 23. Internal circuitry 0020 29 12 V OUT1N 010aaa044 Fig 24. Internal circuitry 0021 VDDA1 100 mA 31 12 V VSSD 010aaa045 Fig 25. Internal circuitry 0022 10. Limiting values Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit asymmetrical −0.3 +23 V 3 - A VP supply voltage IORM repetitive peak output current Tj junction temperature - +150 °C Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C Pmax maximum power dissipation - 2.5 W TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 14 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W Table 7. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Vx DIAG VSS − 0.3 +12 V IN1P - IN1N −12 +12 V IN2P - IN2N −12 +12 V all other pins VSS − 0.3 VDD + 0.3 V VINX with respect to other pins −1500 +1500 V all other pins −2000 +2000 V Min Typ Max Unit - 41 44 K/W - 44 - K/W 30 K/W 8 K/W Vesd voltage on pin x electrostatic discharge voltage 11. Thermal characteristics Table 8. Characteristics Symbol Parameter Conditions [1] thermal resistance from junction to ambient SO32. JEDEC test board Ψj-lead thermal characterization parameter from junction to lead SO32 [1] Ψj-top thermal characterization parameter from junction to top of package SO32 [1] [2] Rth(j-a) SO32. Two-layer application board 4 [1] Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection. [2] Strongly depends on where the measurement is taken on the case. 12. Characteristics 12.1 Static characteristics Table 9. Static characteristics Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Supply voltage VP supply voltage VP = VDDPx − VSSPx 8 12 20 V Ioff off-state current off mode - 110 200 µA Iq quiescent current with load, filter, and snubbers connected - 35 45 mA with respect to VSSD −0.3 - +0.8 V 3 - VP V ENABLE input VIL LOW-level input voltage VIH HIGH-level input voltage with respect to VSSD TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 15 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W Table 9. Static characteristics …continued Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit II input current VI = 5 V - 1 20 µA SO/OL input VIL LOW-level input voltage with respect to VSSD - - 0.4 V VIH HIGH-level input voltage with respect to VSSD 3 4 4.5 V voltage on pin STABI 10 11 12 V - - 1 mV - - 15 µV STABI VSTABI with respect to VSS Comparator full-differential input stage Voffset(i)(eq) equivalent input offset voltage 20 Hz < f < 20 kHz Vcm common mode voltage VSSA + 3 - VDDA −1 V IIB input bias current - - 1 µA 150 - - °C level internal fixed 20 21.5 23 V level internal fixed 7 7.5 8 V 3 3.5 - A high level - VDDA − 1 - V low level - VSSA + 1 - V OverTemperature Protection (OTP) Tprot protection temperature OverVoltage Protection (OVP) Vth(ovp) overvoltage protection threshold voltage UnderVoltage Protection (UVP) VP(uvp) undervoltage protection supply voltage OverCurrent Protection (OCP) IO(ocp) [1] overcurrent protection output current Window Protection (WP) output voltage VO [1] Current limiting concept: in overcurrent condition no interruption of the audio signal in case of impedance drop. 12.2 Dynamic characteristics Table 10. Dynamic characteristics Tamb = 25 °C; VP = 12 V; RL = 8 Ω; Figure 33 unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit PWM output tr rise time - 10 - ns tf fall time - 10 - ns TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 16 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W Table 10. Dynamic characteristics …continued Tamb = 25 °C; VP = 12 V; RL = 8 Ω; Figure 33 unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tresp response time transition PWM output from LOW to HIGH - 60 - ns - 50 - ns - 60 - ns - 50 - ns VI = 70 mV VI = 3.3 V transition PWM output from HIGH to LOW VI = 70 mV VI = 3.3 V tw(min) minimum pulse width RDSon drain-source on-state resistance ηpo output power efficiency PWM output output power 2 x 9 W into 8 Ω. Po = Po(nom) - 60 - ns [1] - 0.28 0.35 Ω [2] 87 89 - % [1] High-side and low-side power switch have the same series resistance. [2] Output power measured across the loudspeaker load. Output power is measured indirectly via RDSon. 12.3 AC characteristics measured in a typical application Table 11. AC characteristics measured in typical application Tamb = 25 °C; VP = 12 V; RL = 8 Ω; fosc = 550 kHz; Figure 33 unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VP supply voltage VP = VDDPx − VSSPx 8 12 20 V Po(RMS) RMS output power RL = 8 Ω; VP = 12 V; THD = 10 %; Two channel driven; no heat sink required. - 9.5 - W Po output power VP = 12 V; RL = 8 Ω 8.5 9.5 - W THD = 10 % 6.5 7.5 - W VP = 14 V; RL = 8 Ω; THD = 10 %; thermally limited THD = 1 % - 12 - W VP = 16 V; RL = 8 Ω; THD = 10 %; thermally limited - 15 - W VP = 12 V; RL = 6 Ω; THD = 10 %; thermally limited - 12 - W VP = 12 V; RL = 4 Ω; THD = 10 %; thermally limited - 15 - W THD+N total harmonic distortion-plus-noise Po is 1 W; f = 1 kHz; AES17 brick-wall filter - 0.04 0.1 % ηpo output power efficiency Po = 9 W 87 89 - % Gv(cl) closed-loop voltage gain VI = 100 mV (RMS); fi = 1 kHz 19 19.7 21 dB Vn(o) output noise voltage Inputs shorted; - 150 - µV AES17 brick-wall filter TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 17 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W Table 11. AC characteristics measured in typical application …continued Tamb = 25 °C; VP = 12 V; RL = 8 Ω; fosc = 550 kHz; Figure 33 unless otherwise specified. Symbol Parameter Conditions S/N signal-to-noise ratio Vo = 10 V (RMS); gain 20 dB SVRR supply voltage ripple rejection Vripple = 2 V(p-p); fi= 1 kHz αcs channel separation Po = 1 W; fi = 1 kHz [1] [1] Min Typ Max Unit - 96 - dB 34 45 - dB 55 70 - dB Minimum value determined by R5, R10, R17, R22 equalling +1 % and R7, R14, R18, R20 equalling −1 %. 13. Quality specification In accordance with SNW-FQ-611-E, ‘if this type is used as an audio amplifier’. The number of the quality specification can be found in the Quality Reference Handbook. The handbook can be ordered using the code 9398 510 63011. 14. Application information 14.1 Output power estimation For BTL configuration the output power just before clipping can be estimated using Equation 1: BTL : Po 0.5 % 2 RL ------------------------------------------------------ × V P R L + 2 × ( R DSon + R s ) = -------------------------------------------------------------------------------2 × RL (1) Where, • • • • • VP = supply voltage (VDDPx − VSSPx) [V] RL = load resistance [Ω] RDSon = drain-source on-state resistance [Ω] Rs = series resistance [Ω] Po0.5 % = output power at the THD level of 0.5 % [W] The output power at 10 % THD can be estimated by using Equation 2: P o 10 % = 1.25 × P o 0.5 % (2) Figure 26 and Figure 27 below show the estimated output power at THD = 0.5 % and THD = 10 % as a function of the BLT supply voltage for different load impedances. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 18 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 010aaa019 25 Po (W) 20 (3) (2) 15 (1) 10 5 0 8 12 16 20 VP (V) (1) RL = 4 Ω (2) RL = 6 Ω (3) RL = 8 Ω Fig 26. BTL output power as function of supply voltage: THD = 0.5 %. 3 A 010aaa020 30 (3) Po (W) (2) 20 (1) 10 0 8 12 16 20 VP (V) (1) RL = 4 Ω (2) RL = 6 Ω (3) RL = 8 Ω Fig 27. BTL output power as function of supply voltage: THD = 10 %. 3 A 14.2 Output current limiting The peak output current is internally limited above a level of 3 A minimum. During normal operation the output current should not exceed this threshold level of 3 A, otherwise the output signal will be distorted. The peak output current in BTL can be estimated using Equation 3: VP I O max ≤ ------------------------------------------------------ ≤ 3 A R L + 2 × ( R DSon + R s ) (3) Where: • VP = supply voltage (VDDPx − VSSPx) [V]. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 19 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W • RL = load resistance [Ω]. • RDSon = drain-source on-state resistance [Ω]. • Rs = series resistance [Ω]. Example: A 4 Ω speaker in BTL configuration can be used up to a supply voltage of 12 V without running into current limiting. Current limiting (clipping) will avoid audio holes, but it causes a sound distortion similar to voltage clipping. 14.3 Speaker configuration and impedance For a flat-frequency response (second-order Butterworth filter) it is necessary to change the low-pass filter components LLC and CLC according to the speaker configuration and impedance. Table 12 shows the practical required values: Table 12. Filter component values Configuration Impedance [Ω] LLC [µF] CLC [nF] BTL 4 10 1500 6 16 1000 8 22 680 14.4 Differential input For a high common-mode rejection ratio and a maximum of flexibility in the application, the audio inputs of the application are fully differential. The input configuration for a differential-input application is illustrated in Figure 28. OUT1P + AUDIO DSP VSS − IN1P IN1N OUT1N 010aaa021 Fig 28. Input configuration for differential input 14.5 Single-ended input When using an audio source with a single-ended ‘out’, it is important to connect the IN1N from the application board to the VSS/GND of the audio source (e.g. Audio DSP). The input configuration for single-ended ‘in’ application is illustrated in Figure 29. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 20 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W OUT1P + IN1P AUDIO DSP IN1N − OUT1N 010aaa022 Fig 29. Input configuration for single-ended input 14.6 Curves measured in a typical application 010aaa197 +30 Gv (dB) +25 +20 (1) (2) +15 +10 10−2 10−1 1 102 10 fi (Hz) VP = 12 V, Vi = 100 mV (1) OUT1 (2) OUT2 Fig 30. Gain as a function of frequency TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 21 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 010aaa195 10 THD+N (%) 1 10−1 (2) (1) 10−2 10 102 103 104 105 fi (Hz) VP = 12 V, RL = 8 Ω, Po = 1 W (1) OUT1 (2) OUT2 Fig 31. Total harmonic distortion + noise as a function of frequency 010aaa196 10 THD+N (%) 1 10−1 (1) (2) 10−2 10−2 10−1 1 10 Po (W) VP = 12 V, RL = 8 Ω, fi = 1 kHz (1) OUT1 (2) OUT2 Fig 32. Total harmonic distortion as a function of output power 14.7 Typical application diagram TFA9810 The typical application diagram with the TFA9810 supplied from an asymmetrical supply is shown in Figure 33. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 22 of 29 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 12 V 12 V C32 220 µF 12 V L1 BEAD R3 10 Ω C33 100 nF C3 100 nF 1 2 IN1 C4 100 nF VDDA1 4 R7 R6 10 kΩ 10 kΩ R31 IN1P Rev. 03 — 20 February 2008 R10 GND C10 220 pF 10 kΩ R11 R14 100 kΩ GND 13 9 2 R32 IN1N 3 29 CDELAY 28 31 10 kΩ 10 kΩ C21 220 pF 23 R23 22 15 R26 100 kΩ GND OUT2+ 1 OUT1 L4 22 µH C16 1µF Snubber network (Optional) GND STABI2 GND L5 22 µH OUT2P C19 220 nF BOOT2P 2 J6 R29 10 Ω C29 470 pF R30 10 Ω C30 470 pF C20 680 nF 20 C22 68 pF BOOT2N C25 220 nF R34 IN2N 21 OUT2N 12 1 16 17 32 30 19 C23 GND 680 nF 1 10 kΩ 5 GND OUT2− L6 22 µH OUT2 R100 22 Ω VSSA1 VSSA2 VSSD VSSD VSSD VSSDVSSP1 VSSP2 Fig 33. Typical application diagram TFA9810 GND 010aaa023 TFA9810 23 of 29 © NXP B.V. 2008. All rights reserved. J7 10 kΩ C13 GND 680 nF 10 kΩ 14 10 kΩ GND Audio amplifier 2 x 12 W R22 GND C24 220 pF C28 470 pF STABI1 OUT2+ 11, TEST R33 IN2P R28 10 Ω C12 680 nF C17 1µF R17 100 kΩ R19 C27 470 pF OUT1N 10 VDDA2 C26 1 µF 18 7 DIAG R27 10 Ω OUT1− 6 2 J3 BOOT1N 8 TFA9810 ENABLE J5 C9 220 nF BOOT1P C14 220 nF SO/OL R18 L3 22 µH OUT1+ OUT1P 10 kΩ C15 330 nF OUT2− 24 26 GND 2 IN2 25 GND VDDP2 27 OUT1+ 1 GND n.c VDDP1 C11 47 pF 10 kΩ J4 VDDA2 C5 100 nF 10 kΩ C8 220 pF C18 1 µF ENABLE GND R5 100 kΩ J2 C7 1 µF SW1 C31 100 nF GND OUT1− C6 1 µF L2 BEAD C2 220 µF C1 220 µF 2 GND NXP Semiconductors TFA9810_3 Product data sheet 1 VP J1 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 12 V 12 V C32 220 µF 12 V L1 BEAD R3 10 Ω C33 100 nF C3 100 nF 1 2 IN1 ENABLE C4 100 nF GND VDDA1 R5 100 kΩ 4 R7 R6 10 kΩ 10 kΩ R31 IN1P Rev. 03 — 20 February 2008 R10 GND C10 220 pF 10 kΩ R11 9 25 2 GND VDDP2 24 26 27 R32 IN1N 3 29 R35 200 kΩ 28 CDELAY SO/OL 31 OUT2− 1 R18 10 VDDA2 11 R33 IN2P R19 10 kΩ C21 220 pF J5 R22 GND C24 220 pF R23 R26 100 kΩ GND OUT2+ GND C13 GND 680 nF 1 OUT1 L4 22 µH STAB1 C16 1µF Snubber network (Optional) GND STAB2 OUT2+ 23 22 15 GND L5 22 µH OUT2P C19 220 nF BOOT2P 2 J6 R29 10 Ω C29 470 pF R30 10 Ω C30 470 pF C20 680 nF 10 kΩ 20 C22 68 pF BOOT2N C25 220 nF R34 IN2N 21 OUT2N 12 1 16 17 32 30 19 C23 GND 680 nF 1 10 kΩ 5 GND OUT2− L6 22 µH OUT2 R100 22 Ω VSSA1 VSSA2 VSSD VSSD VSSD VSSDVSSP1 VSSP2 GND Fig 34. Typical application diagram TFA9810 with externally adjusted switch-on time 010aaa431 TFA9810 24 of 29 © NXP B.V. 2008. All rights reserved. J7 10 kΩ C28 470 pF C17 1µF 14 10 kΩ R28 10 Ω C12 680 nF Audio amplifier 2 x 12 W C26 1 µF DIAG R17 100 kΩ 10 kΩ 2 IN2 18 7 ENABLE C27 470 pF OUT1N 6 TFA9810 GND R27 10 Ω OUT1− 8 2 J3 BOOT1N C14 220 nF OUT1+ C18 1 µF C9 220 nF BOOT1P 10 kΩ C15 4.7 µF L3 22 µH OUT1+ OUT1P STAB1 R14 100 kΩ GND 13 GND n.c VDDP1 C11 47 pF 10 kΩ J4 VDDA2 C5 100 nF 10 kΩ C8 220 pF J2 C7 1 µF SW1 C31 100 nF GND OUT1− C6 1 µF L2 BEAD C2 220 µF C1 220 µF 2 GND NXP Semiconductors TFA9810_3 Product data sheet 1 VP J1 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 14.8 Typical application: bill of materials Table 13. Typical application: bill of materials Item Quantity Reference Part Description 1 2 C1, C2. 220 µF/35 V General purpose 85 °C, diameter 8 mm 2 5 C3, C4, C5, C31, C33. 100 nF/50 V SMD 0805 X7R 3 2 C16, C17. 1 µF/50 V SMD 1206 X7R 4 4 C6, C7, C18, C26 1 µF/25 V MKT 5 4 C8, C10, C21, C24. 220 pF/25 V SMD 0402 NP0 6 4 C9, C14, C19, C25. 220 nF/25 V SMD 0805 X7R 7 1 C11 47 pF/25 V SMD 0402 NP0 8 4 C12, C13, C20, C23. 680 nF/25 V MKT 9 1 C15 330 nF/25 V SMD 0805 X7R 10 1 C22. 68 pF/25 V SMD 0402 NP0 11 1 C32 1000 µF/25 V CE12-02R 12 3 J1, J3, J6. Screw terminal Two pins 13 2 J2, J5. CINCH CINCH 14 2 J4, J7 Jumper Closed on demo board only 15 2 L1, L2. BEAD SMD 1206 Würth Elektronik DC < 0.5 Ω 10 MHz > 80 Ω 16 4 L3, L4, L5, L6. 22 µH 8RDY TOKO A7040HN-220M, 11RHBP TOKO A7503CY-220M or Sagami 7311NA-220M 17 5 R3 10 / 0.25 W / 5 % SMD 1206 18 4 R5, R14, R17, R26. 100 k / 0.1 W / 1 % for 20 dB SMD 0603 200 k / 0.1 W / 1 % for 26 dB 19 12 R6, R7, R10, R11, R18, 10 k / 0.1 W / 1 % R19, R22, R23, R31, R32, R33, R34. SMD 0603 20 1 SW1 PCB switch Secme 090320901 21 1 U1 TFA9810T SOT287-1 (SO32) NXP Semiconductors 14.9 Snubber network Table 14. Snubber network: bill of materials Item Quantity Reference 1 4 C27, C28, C29, C30 470 pF, 25 V Part SMD 0805 X7R Footprint 2 4 R27, R28, R29, R30 10 / 0.25 W / 5% SMD 1206 15. Test information General Quality Specification for General Applications, Power management and RF Power. Document SNW-FQ-611 refers. TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 25 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 16. Package outline SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 D E A X c y HE v M A Z 17 32 Q A2 A (A 3) A1 pin 1 index θ Lp L 16 1 0 detail X w M bp e 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.2 1.0 0.25 0.25 0.1 0.95 0.55 0.01 0.02 0.01 0.011 0.007 0.81 0.80 0.30 0.29 0.05 0.419 0.394 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.055 0.016 0.047 0.039 0.01 0.01 0.037 0.004 0.022 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT287-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 00-08-17 03-02-19 MO-119 Fig 35. Package outline SOT287-1 (SO23) TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 26 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 17. Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes TFA9810_3 20080220 Product data sheet - TFA9810_2 Modifications: • • Figure 33 has been updated. Figure 34 has been added. TFA9810_2 20070831 Preliminary data sheet - TFA9810_1 TFA9810_1 20070815 Preliminary data sheet - - TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 27 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TFA9810_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 20 February 2008 28 of 29 TFA9810 NXP Semiconductors Audio amplifier 2 x 12 W 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.4 8.5 8.6 9 10 11 12 12.1 12.2 12.3 13 14 14.1 14.2 14.3 14.4 14.5 14.6 14.7 14.8 14.9 15 16 17 18 18.1 18.2 18.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Input comparators. . . . . . . . . . . . . . . . . . . . . . . 6 Operating in self-oscillating configuration . . . . . 6 Operating in open-loop configuration . . . . . . . . 6 Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Start-up sequence . . . . . . . . . . . . . . . . . . . . . . 8 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal characteristics. . . . . . . . . . . . . . . . . . 15 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 Static characteristics. . . . . . . . . . . . . . . . . . . . 15 Dynamic characteristics . . . . . . . . . . . . . . . . . 16 AC characteristics measured in a typical application. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Quality specification . . . . . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 18 Output power estimation. . . . . . . . . . . . . . . . . 18 Output current limiting. . . . . . . . . . . . . . . . . . . 19 Speaker configuration and impedance . . . . . . 20 Differential input . . . . . . . . . . . . . . . . . . . . . . . 20 Single-ended input . . . . . . . . . . . . . . . . . . . . . 20 Curves measured in a typical application . . . . 21 Typical application diagram TFA9810 . . . . . . . 22 Typical application: bill of materials. . . . . . . . . 25 Snubber network. . . . . . . . . . . . . . . . . . . . . . . 25 Test information . . . . . . . . . . . . . . . . . . . . . . . . 25 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 18.4 19 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information . . . . . . . . . . . . . . . . . . . . 28 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 20 February 2008 Document identifier: TFA9810_3