DISCRETE SEMICONDUCTORS DATA SHEET M3D743 BZA900AVL series Quadruple low capacitance ESD suppressor Product specification Supersedes data of 2003 Apr 15 2003 Oct 20 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor FEATURES BZA900AVL series PINNING • Low diode capacitance PIN DESCRIPTION • Low leakage current 1 cathode 1 • SOT665 surface mount package 2 common anode • Common anode configuration. 3 cathode 2 4 cathode 3 5 cathode 4 APPLICATIONS • Communication systems • Computers and peripherals • Audio and video equipment. handbook, halfpage 5 DESCRIPTION 4 1 Monolithic transient voltage suppressor diode in a five lead SOT665 package for 4-bit wide ESD transient suppression. 3 2 4 5 1 MARKING TYPE NUMBER 2 3 MGW315 MARKING CODE BZA956AVL V3 BZA962AVL V2 BZA968AVL V1 Fig.1 Simplified outline (SOT665) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION BZA956AVL − plastic surface mounted package; 5 leads SOT665 BZA962AVL − plastic surface mounted package; 5 leads SOT665 BZA968AVL − plastic surface mounted package; 5 leads SOT665 2003 Oct 20 2 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode IZ working current Tamb = 25 °C − IF continuous forward current Tamb = 25 °C − 200 mA IFSM non-repetitive peak forward current tp = 1 ms; square pulse − 3.5 A Ptot total power dissipation Tamb = 25 °C; note 2; see Fig.5 − 335 mW PZSM non repetitive peak reverse power dissipation square pulse; tp = 1 ms − 6 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C ESD electrostatic discharge IEC 61000-4-2 (contact discharge) 15 − kV HBM MIL-Std 883 − kV note 1 10 mA Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD CONDITIONS IEC 61000-4-2, level 4 (ESD) >15 kV (air); >8 kV (contact discharge) HBM MIL-Std 883, class 3 >4 kV THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient all diodes loaded 370 K/W Rth j-s thermal resistance from junction to solder point; note 1 one diode loaded 135 K/W all diodes loaded 125 K/W Note 1. Solder point of common anode (pin 2). 2003 Oct 20 3 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER V BZA956AVL VR = 3 V − − 200 nA BZA962AVL VR = 4 V − − 100 nA BZA968AVL VR = 4.3 V − − 20 nA working voltage IZ = 1 mA BZA956AVL 5.32 5.6 5.88 V BZA962AVL 5.89 6.2 6.51 V BZA968AVL 6.46 6.8 7.14 V BZA956AVL − − 200 Ω BZA962AVL − − 150 Ω BZA968AVL − − 100 Ω BZA956AVL − 1.3 − mV/K BZA962AVL − 2.4 − mV/K − 2.9 − mV/K − 22 28 pF differential resistance temperature coefficient IZ = 1 mA IZ = 1 mA diode capacitance f = 1 MHz; VR = 0 BZA956AVL BZA962AVL − 18 22 pF BZA968AVL − 16 19 pF diode capacitance IZSM 2003 Oct 20 UNIT 1.2 BZA968AVL Cd MAX. − reverse current SZ TYP. − forward voltage rdif MIN. IF = 200 mA VF IR VZ CONDITIONS f = 1 MHz; VR = 5 V BZA956AVL − 12 17 pF BZA962AVL − 9 12 pF BZA968AVL − 8 11 pF BZA956AVL − − 0.90 A BZA962AVL − − 0.85 A BZA968AVL − − 0.80 A non-repetitive peak reverse current tp = 1 ms; Tamb = 25 °C 4 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor MLE001 BZA900AVL series handbook, halfpage 102 handbook, halfpage IZSM PZSM (A) (W) 10 MLE003 BZA956AVL BZA956AVL 1 BZA962AVL 10 BZA968AVL BZA962AVL/BZA968AVL 10−1 10−2 10−1 1 tp (ms) 1 10−2 10 Fig.3 Fig.2 10−1 1 tp (ms) Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Maximum non-repetitive peak reverse current as a function of pulse time. MGT586 MLE002 26 Cd 10 400 handbook, halfpage handbook, halfpage Ptot (mW) (pF) 22 300 18 200 BZA956AVL 14 BZA962AVL 100 10 BZA968AVL 6 1 0 2 3 4 VR (V) 0 5 0 50 100 Tamb (°C) Tj = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Oct 20 Fig.5 Power derating curve. 5 150 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor handbook, full pagewidth ESD TESTER RZ 450 Ω RG 223/U 50 Ω coax CZ BZA900AVL series 10× ATTENUATOR DIGITIZING OSCILLOSCOPE 50 Ω note 1 1/4 BZA900AVL IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω Note 1: attenuator is only used for open socket high voltage measurements vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div BZA968AVL GND3 BZA962AVL GND2 GND BZA956AVL GND1 unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) GND GND vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) Fig.6 ESD clamping test set-up and waveforms. 2003 Oct 20 6 MLE005 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series APPLICATION INFORMATION Typical common anode application A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8. handbook, full pagewidth keyboard, terminal, printer, etc. A B C D I/O FUNCTIONAL DECODER BZA900AVL GND MLE008 Fig.7 Computer interface protection. VDD handbook, full pagewidth VGG address bus RAM I/O ROM data bus CPU CLOCK control bus BZA900AVL GND MLE009 Fig.8 Microprocessor protection. 2003 Oct 20 7 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. 2003 Oct 20 8 BZA900AVL series Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT665 D E A X Y S S HE 5 4 A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 01-01-04 01-08-27 SOT665 2003 Oct 20 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 20 10 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/03/pp11 Date of release: 2003 Oct 20 Document order number: 9397 750 11935