TD62064,074P/AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62064P,TD62064AP,TD62064F,TD62064AF TD62074P,TD62074AP,TD62074F,TD62074AF 4CH HIGH−CURRENT DARLINGTON SINK DRIVER The TD62064P / AP / F / AF and TD62074P / AP / F / AF are high−voltage, high−current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads and all units of TD62074P / AP / F / AF feature uncommitted collectors and emitters for isolated darlington applications. For proper operation, the substrate (SUB) must be connected to the most negative voltage. Applications include relay, hammer, lamp and stepping moter drivers. FEATURES l Output current (single output) 1.5 A (Max) l High sustaining voltage output 35 V (Min) (TD62064P / F, 074P / F) 50 V (Min) (TD62064AP / AF, 074AP / AF) l Output clamp diodes : TD62064P / AP / F / AF l Isolated darlington array : TD62074P / AP / F / AF l Input compatible with TTL and 5 V CMOS l GND and SUB terminal = heat sink Weight DIP16−P−300−2.54A : 1.11 g (Typ.) HSOP16−P−300−1.00 : 0.50 g (Typ.) l Package type−P, AP : DIP−16 pin l Package type−F, AF : HSOP−16 pin PIN CONNECTION (TOP VIEW) TD62064P / AP TD62074P / AP 1 2001-06-04 TD62064,074P/AP/F/AF TD62064F / AF TD62074F / AF SCHEMATICS (EACH DRIVER) TD62064P / AP / F / AF Note: TD62074P / AP / F / AF The input and output parasitic diodes cannot be used as clamp diodes. MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Output Sustaining Voltage SYMBOL P, F AP, AF Output Current VCE (SUS) RATING −0.5~35 −0.5~50 UNIT V IOUT 1.5 A / ch Input Current IIN 50 mA Input Voltage VIN −0.5~17 V Clamp Diode Reverse Voltage P, F AP, AF Clamp Diode Forward Current Isolated Voltage Power Dissipation P, F AP, AF P, AP F, AF 35 VR (Note 1) 50 IF (Note 1) 1.5 VSUB (Note 2) 35 PD 50 1.47 / 2.7 (Note 3) 0.9 / 1.4 (Note 4) V A / ch V W Operating Temperature Topr −40~85 °C Storage Temperature Tstg −55~150 °C Note 1: Note 2: Note 3: Note 4: TD62064P / AP / F / AF TD62074P / AP / F / AF On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%) 2 2001-06-04 TD62064,074P/AP/F/AF RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) CHARACTERISTIC SYMBOL P, F Output Sustaining Voltage AP, AF TEST CONDITION MIN TYP. MAX 0 ― 35 0 ― 50 0 ― 1250 Duty = 10 % 0 ― 1250 Duty = 50 % 0 ― 390 Duty = 10 % 0 ― 907 Duty = 50 % 0 ― 172 0 ― 8 V 2.5 ― 8 V VCE (SUS) DC1 Circuit, Ta = 25°C Output Current P, AP (Note 1) IOUT F, AF (Note 2) Tpw = 25 ms 4 Circuits Tj = 120°C Ta = 85°C VIN Input Voltage (Output Off) VIN (OFF) 0 ― 0.4 V IIN 0 ― 20 mA 0 ― 35 0 ― 50 ― ― 1.25 ― ― 35 ― ― 50 P, F AP, AF Clamp Diode Forward Current Power Dissipation mA / ch VIN (ON) Clamp Diode Reverse Voltage Isolation Voltage V (Output On) Input Current VR IOUT = 1.25 A UNIT TD62064P / AP / F / AF IF P, F AP, AF P, AP F, AF VSUB PD TD62074P / AP / F / AF Ta = 85°C (Note 1) ― ― 1.4 Ta = 85°C (Note 2) ― ― 0.7 V A V W Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%) 3 2001-06-04 TD62064,074P/AP/F/AF ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC SYMBOL TEST CIR− CUIT AP, AF Output Leakage Current ICEX 1 P, F Collector−Emitter Saturation Voltage TEST CONDITION MIN TYP. MAX VCE = 50 V, Ta = 25°C ― ― 50 VCE = 50 V, Ta = 85°C ― ― 500 VCE = 35 V, Ta = 25°C ― ― 50 VCE = 35 V, Ta = 85°C ― ― 500 IOUT = 1.25 A, IIN = 2 mA ― ― 1.6 IOUT = 0.75 A, IIN = 935 µA ― ― 1.25 IOUT = 1.0 A ― 800 ― IOUT = 0.25 A ― 1500 ― VCE (sat) 2 DC Current Transfer Ratio hFE 2 VCE = 2 V Input Voltage (Output On) VIN (ON) 3 IOUT = 1.25 A, IIN = 2 mA ― ― 2.4 VR = 50 V, Ta = 25°C ― ― 50 VR = 50 V, Ta = 85°C ― ― 100 VR = 35 V, Ta = 25°C ― ― 50 VR = 35 V, Ta = 85°C ― ― 100 AP, AF Clamp Diode Leakage Current 4 IR F UNIT µA V V µA Clamp Diode Forward Voltage VF 5 IF = 1.25 A ― ― 2 V Input Capacitance CIN 6 VIN = 0 V, f = 1MHz ― 15 ― pF ― 0.1 ― ― 1.0 ― Turn−On Delay Turn−Off Delay P, F AP, AF P, F AP, AF VOUT = 35 V, RL = 29 Ω tON 7 CL = 15 pF tOFF VOUT = 50 V, RL = 42 Ω µs VOUT = 35 V, RL = 29 Ω VOUT = 50 V, RL = 42 Ω TEST CIRCUIT 1. ICEX 2. VCE (sat), hFE 3. VIN (ON) 4. IR 5. VF 6. CIN 4 2001-06-04 TD62064,074P/AP/F/AF 7. tON, tOFF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5ns, tf ≤ 10ns Note 2: CL includes probe and jig capacitance PRECAUTIONS for USING (1) This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. (2) When using TD62064P/AP/F/AF to drive an inductive load (such as a motor, solenoid, or relay), Toshiba recommend you use diodes (pins 1 and 8) to absorb the counter electromotive force generated when driving an inductive load. When using TD62074P/AP/F/AF to drive an inductive load (such as a motor, solenoid, or relay), Toshiba recommend you connect diodes externally to absorb the counter electromotive force generated when driving an inductive load. 5 2001-06-04 TD62064,074P/AP/F/AF 6 2001-06-04 TD62064,074P/AP/F/AF 7 2001-06-04 TD62064,074P/AP/F/AF PACKAGE DIMENSIONS DIP16−P−300−2.54A Unit : mm Weight: 1.11 g (Typ.) 8 2001-06-04 TD62064,074P/AP/F/AF PACKAGE DIMENSIONS HSOP16−P−300−1.00 Unit : mm Weight: 0.50 g (Typ.) 9 2001-06-04 TD62064,074P/AP/F/AF RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 10 2001-06-04