INFINEON V23818-K15-L36

Fiber Optics
Small Form Factor
Single Mode 1300 nm 1.0625 Gbit/s Fibre Channel
1.25 Gigabit Ethernet Transceiver
2x5/2x10 Pinning with LC™ Connector
V23818-K15-Lxx
Preliminary Data
Features
• Small Form Factor transceiver
• Complies with Fibre Channel and Gigabit Ethernet
standards
• RJ-45 style LC™ connector system
• Available with or without collar
• Half the size of SC Duplex 1x9 transceiver
• Single power supply (3.3 V)
• Low power consumption, 650 mW typical
• Loss of optical signal indicator
• Laser disable input
• LVPECL differential inputs and outputs
• AC/AC coupling in accordance to SFF MSA or optional
DC/DC coupling version
• For distance of up to 10 km on single mode fiber
(SMF)
• Class 1 FDA and IEC laser safety compliant
• Multisource 2x5/2x10 footprint1)
• Small size for high port density
• UL 94 V-0 certified
• Compliant with FCC (Class B) and EN 55022
• Tx and Rx power monitor on 2x10 pinning version
1)
File: 1119
File: 1120
Current MSA documentation can be found at www.infineon.com/fiberoptics
For ordering information see next page.
LC™ is a trademark of Lucent.
Data Sheet
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V23818-K15-Lxx
Ordering Information
Ordering Information
Part Number
Pinning Temperature
Range
Signal
Detect
V23818-K15-L37
2x5
0°C to 70°C
V23818-K15-L36
–40°C to 85°C
V23818-K15-L47
0°C to 70°C
V23818-K15-L46
–40°C to 85°C
V23818-K15-L17
2x10
0°C to 70°C
V23818-K15-L16
–40°C to 85°C
V23818-K15-L57
0°C to 70°C
V23818-K15-L56
–40°C to 85°C
V23818-K15-L35
2x5
0°C to 70°C
V23818-K15-L45
Data Sheet
2
Collar
Input
Output
LVPECL yes
DC
DC
LVTTL
AC
AC
LVPECL
DC
DC
LVTTL
AC
AC
LVPECL no
DC
DC
LVTTL
AC
AC
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V23818-K15-Lxx
Pin Configuration
Pin Configuration
Tx
MS
HL
HL 20 19 18 17 16 15 14 13 12 11
TOP VIEW
Rx
MS
HL
1 2 3 4 5 6 7 8 9 10
HL
File: 1335
Figure 1
2x10 Pin Connect Diagram
2x10 Pin Description
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
MS
HL
1)
Symbol
Level/Logic
Description
PDBias
DC current
Ground
Ground
PIN photo detector bias current
Receiver signal ground
Receiver signal ground
Not connected
Not connected
Receiver signal ground
Receiver power supply
Receiver optical input level monitor
Receiver data out bar
Receiver data out
Transmitter power supply
Transmitter signal ground
Transmitter disable
Transmitter data in
Transmitter data in bar
Transmitter signal ground
Laser diode bias current monitor
Laser diode bias current monitor
Laser diode optical power monitor
Laser diode optical power monitor
Mounting studs
Housing leads
VEEr
VEEr
NC
NC
VEEr
VCCr
SD
RD–
RD+
VCCt
VEEt
TDis
TD+
TD–
VEEt
BMon–
BMon+
PMon–
PMon+
Ground
Power supply
LVTTL or LVPECL output1)
LVPECL output
LVPECL output
Power supply
Ground
LVTTL input
LVPECL input
LVPECL input
Ground
DC voltage
DC voltage
DC voltage
DC voltage
LVPECL output active high for V23818-K15-L17/L16.
LVTTL output active high for V23818-K15-L57/L56.
Data Sheet
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V23818-K15-Lxx
Pin Configuration
Tx
MS
HL
HL
10 9 8 7 6
TOP VIEW
Rx
MS
1 2 3 4 5
HL
HL
File: 1331
Figure 2
2x5 Pin Connect Diagram
2x5 Pin Description
Pin
No.
Symbol
Level/Logic
Description
1
VEEr
VCCr
Ground
Receiver signal ground
2
Power supply
Receiver power supply
1)
Receiver optical input level monitor
3
SD
LVTTL or LVPECL output
4
RD–
LVPECL output
Receiver data out bar
5
RD+
LVPECL output
Receiver data out
6
Power supply
Transmitter power supply
7
VCCt
VEEt
Ground
Transmitter signal ground
8
TDis
LVTTL input
Transmitter disable
9
TD+
LVPECL input
Transmitter data in
10
TD–
LVPECL input
Transmitter data in bar
MS
Mounting studs
HL
Housing leads
1)
LVPECL output active high for V23818-K15-L37/L36/L35.
LVTTL output active high for V23818-K15-L47/L46/L45.
VEEr / VEEt
For 2x10 transceivers, connect pins 2, 3, 6, 12 and 16 to signal ground. For 2x5
transceivers, connect pins 1 and 7 to signal ground.
Data Sheet
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Pin Configuration
VCCr / VCCt
For 2x10 transceivers a 3.3 V DC power supply must be applied at pins 7 and 11. For
2x5 transceivers a 3.3 V DC power supply must be applied at pins 2 and 6. A
recommended power supply filter network is given in the termination scheme. Locate
power supply filtering directly at the transceiver power supply pins. Proper power supply
filtering is essential for good EMI performance.
TD+ / TD–
Transmitter data LVPECL level inputs. For V23818-K15-L47/L46/L57/L56/L45
terminated and AC coupled internally. For V23818-K15-L37/L36/L17/L16/L35 use
termination and coupling as shown in the termination scheme.
RD– / RD+
Receiver data LVPECL level outputs. For V23818-K15-L47/L46/L57/L56/L45 biased and
AC coupled internally. For V23818-K15-L37/L36/L17/L16/L35 use termination and
coupling as shown in the termination scheme.
TDis
A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input
must be applied. Leave pin unconnected if feature not required.
SD
LVTTL output for V23818-K15-L47/L46/L57/L56/L45.
LVPECL output for V23818-K15-L37/L36/L17/L16/L35.
A logical high output indicates normal optical input levels to the receiver. Low optical
input levels at the receiver result in a low output. Signal Detect can be used to determine
a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source.
However it is not a detection of a bad link due to data-related errors.
MS
Mounting studs are provided for transceiver mechanical attachment to the circuit board.
They also provide an optional connection of the transceiver to the equipment chassis
ground. The holes in the circuit board must be tied to chassis ground.
HL
Housing leads are provided for additional signal grounding. The holes in the circuit board
must be included and tied to signal ground.
Data Sheet
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V23818-K15-Lxx
Pin Configuration
2x10 Transceiver Additional Functionality
PDBias
Connect pin 1 to VCC through a bias resistor, of a value not exceeding 2 kΩ, as shown in
Figure 3 to monitor PIN photo detector bias current. Leave pin floating if not used.
Typical behaviour is shown in Figure 4 and Figure 5 using a 2 kΩ load.
VCC
≤ 2 kΩ
Vbias
Pin 1
Figure 3
Data Sheet
File: 1307
Photo Detector Bias Interface
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Pin Configuration
Typical Responsitivity of PIN Photo Detector Bias Current Monitor
Photo Detector Monitor Current (µA)
400
300
200
100
0
0
100
200
300
400
Received Optical Power (µW)
Figure 4
File: 1308
Linear Response
Photo Detector Monitor Current (µA)
400
300
200
100
0
−30
−24
−18
−12
Received Optical Power (dBm)
Figure 5
Data Sheet
−6
0
File: 1309
Logarithmic Response
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Pin Configuration
BMon– / BMon+
The DC voltage measured across pins 17 and 18 is proportional to the laser bias current.
Use the equation:
Ibias = Vbias /10 Ω
Use this output to monitor laser performance and EOL conditions. A schematic and
typical behaviour are shown in Figure 6 and Figure 7. Ibias @ ambient 25°C < 60 mA.
Leave pins floating if function is not required.
VCC
Pin 18
3 kΩ
10 Ω
Pin 17
3 kΩ
VEE
File: 1310
Figure 6
Bias Monitor – Transceiver Internal
0.36
BMon Output Voltage (V)
0.32
0.28
0.24
0.2
0.16
0.12
0.08
0.04
0
0
10
20
30
40
50
60
70
Temperature (˚C)
File: 1312
Figure 7
Data Sheet
Typical Variations of Bias Monitor Voltage over Temperature
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Pin Configuration
PMon– / PMon+
This output is derived from the Tx monitor diode. Output voltage is in the range of
1.2 ±0.2 V. Source resistance RS = 100 kΩ.
Note: This voltage level is not MSA compliant.
Data Sheet
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V23818-K15-Lxx
Description
Description
The Infineon single mode transceiver is based on and compliant to the Physical Medium
Depend (PMD) sublayer and baseband medium, type 1000-Base-LX (long wavelength)
as specified in IEEE Std 802.3 and Fibre Channel FC-PI Rev. 13 100-SM-LC-L.
The appropriate fiber optic cable is 9 µm single mode fiber with LC connector.
The Infineon single mode transceiver is a single unit comprised of a transmitter, a
receiver, and an LC receptacle. This design frees the customer from many alignment
and PC board layout concerns.
This transceiver supports the LC connectorization concept, which competes with UTP/
CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop
applications while providing the advantages of fiber optic technology. The receptacle
accepts the new LC connector. The Small Form Factor is specially developed for
distances of up to 10 km.
The module is designed for low cost LAN and WAN applications. It can be used as the
network end device interface in mainframes, workstations, servers, and storage devices,
and in a broad range of network devices such as bridges, routers, hubs, and local and
wide area switches.
This transceiver operates at 1.0625 and 1.25 Gbit/s from a single power supply. The full
differential data inputs and outputs are LVPECL compatible.
Functional Description of SFF Transceiver
This transceiver is designed to transmit serial data via single mode fiber.
BMonBMon+
Automatic
Shut-Down
Tx
Coupling Unit
TDis
3k
TDTD+
Laser
Driver
10
Power
Control
200
PMonPMon+
RDRD+
SD
3k
3k
e/o
Laser
o/e
3k
Monitor
Rx
Coupling Unit
Receiver
o/e
PDBias
Figure 8
Data Sheet
Single
Mode
Fiber
File: 1357
Functional Diagram 2x10 Pin Rows
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V23818-K15-Lxx
Description
Automatic
Shut-Down
Tx
Coupling Unit
TDis
TD−
TD+
e/o
Laser
Driver
Laser
o/e
Power
Control
Monitor
Rx
Coupling Unit
RD−
RD+
Limiting
Amp
TIA
Single
Mode
Fiber
o/e
SD
File: 1351
Figure 9
Functional Diagram 2x5 Pin Rows
The receiver component converts the optical serial data into an electrical data (RD+ and
RD–). The Signal Detect output (SD) shows whether an optical signal is present.
The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD–)
into optical serial data.
The module has an integrated shutdown function that switches the laser off in the event
of an internal failure.
Reset is only possible if the power is turned off, and then on again. (VCCt switched below
VTH).
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging. The power control uses
the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a
controlling signal, to prevent the laser power from exceeding the operating limits.
Data Sheet
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V23818-K15-Lxx
Description
Regulatory Compliance
Feature
Standard
Comments
ESD:
EIA/JESD22-A114-B
Electrostatic Discharge to (MIL-STD 883D
the Electrical Pins
Method 3015.7)
Class 1C
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Immunity:
EN 61000-4-3
Against Radio Frequency IEC 61000-4-3
Electromagnetic Field
With a field strength of 3 V/m, noise
frequency ranges from 10 MHz to
2 GHz. No effect on transceiver
performance between the
specification limits.
Immunity:
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR Part 15, Noise frequency range:
Class B
30 MHz to 18 GHz
EN 55022 Class B
CISPR 22
(13.97) *)
.550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
Figure 10
Data Sheet
File: 1501
Transceiver Pitch
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V23818-K15-Lxx
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min.
Package Power Dissipation
Unit
max.
0.95
W
4
V
VEE–0.5
V
5
V
85
°C
Hand Lead Soldering Temp/Time
260/10
°C/s
Wave Soldering Temp/Time
260/10
°C/s
Aqueous Wash Pressure
< 110
psi
VCC–VEE
Supply Voltage
VCC+0.5
Data Input Levels
VIDpk-pk
Differential Data Input Voltage Swing
Storage Ambient Temperature
–40
Exceeding any one of these values may destroy the device immediately.
Data Sheet
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V23818-K15-Lxx
Technical Data
Recommended Operating Conditions
Parameter
Symbol
Limit Values
min.
Ambient Temperature1), 3)
TAMB
Ambient Temperature2), 3)
Power Supply Voltage
VCC–VEE
typ.
max.
–40
85
0
70
3.14
3.3
Unit
°C
3.46
V
–1165
–880
mV
Transmitter
Data Input High Voltage DC/DC VIH–VCC
Differential Data Input Voltage
Swing AC/AC
VIDpk-pk
500
3200
mV
Data Input Low Voltage DC/DC
VIL–VCC
ti
ICCt
–1810
–1475
mV
120
ps
140
mA
Input Center Wavelength
λRx
1260
1580
nm
Supply Current Rx
ICCr
130
mA
Data Input Rise/Fall Time
Supply Current Tx
Receiver
1)
2)
3)
For V23818-K15-L36/L46/L16/L56.
For V23818-K15-L37/L47/L17/L57/L35/L45.
Ambient operating temperature requires a 2 ms–1 airflow over the device.
The electro-optical characteristics described in the following tables are valid only for use
under the recommended operating conditions.
Data Sheet
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V23818-K15-Lxx
Technical Data
Transmitter Electro-Optical Characteristics
Parameter
Symbol
Limit Values
min.
typ.
Unit
max.
Output Power (Average)1)
PO
–9.5
–3
dBm
Center Wavelength
λC
1270
1355
nm
Spectral Width (RMS)
σ
4
nm
Extinction Ratio (Dynamic)
ER
Reset Threshold for VCCt2)
2.7
V
Power on Delay2)
VTH
tDEL
30
ms
Total Tx Jitter
TJ
53
TDis Assert Voltage LVTTL
TDis Deassert Voltage LVTTL
TDis Assert Time3)
TDis Deassert Time4)
VTDH
VTDL
tASS
tDAS
1)
2)
3)
4)
9
dB
130
2
ps
V
0.8
V
0.4
1
ms
0.06
10
µs
Into single mode fiber, 9 µm diameter
Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES.
TDis assertion to laser shutdown.
TDis reassertion to laser startup.
Receiver Electro-Optical Characteristics
Parameter
Symbol
Limit Values
min.
Sensitivity (Average Power)1)
Saturation (Average Power)
PIN
PSAT
typ.
Unit
max.
–20
–3
dBm
dBm
Min. Optical Modulation
Amplitude2)
OMA
15
µW
Signal Detect Assert Level3)
PSDA
PSDD
PSDA
–PSDD
tASS
tDAS
–20
dBm
Signal Detect Deassert Level2), 4)
Signal Detect Hysteresis
Signal Detect Assert Time3)
Signal Detect Deassert Time4)
–37
3
Receiver 3 dB Cut off
Frequency2)
Data Sheet
dBm
15
dB
0.1
ms
0.35
ms
1.5
GHz
2003-03-21
V23818-K15-Lxx
Technical Data
Receiver Electro-Optical Characteristics (cont’d)
Parameter
Symbol
Limit Values
min.
typ.
Unit
max.
Receiver 10 dB Cut off
Frequency2)
3
GHz
VOH–VCC –1110
VOL–VCC –1800
Output Voltage5)
Differential Data Output Voltage VODpk-pk 1000
–650
mV
–1300
mV
2000
mV
VCC
mV
Output Voltage5)
5)
Swing
Signal Detect Output High
Voltage LVPECL6), 7)
VSDH–VEE VCC
Signal Detect Output Low
Voltage LVPECL6), 7)
VSDL–VEE VCC
Signal Detect Output High
Voltage LVTTL6), 8)
VSDH
Signal Detect Output Low
Voltage LVTTL6), 8)
VSDL
Rx-Monitor 9), 10)
Rx-Mon
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
–1200
–1900
–820
VCC
–1580
2.4
0.5
mV
V
0.5
V
1
A/W
Minimum average optical power at which the BER is less than 1x10–10. Measured with a 27–1 NRZ PRBS.
Fibre Channel PI Standard.
An increase in optical power above the specified level will cause the Signal Detect to switch from a low state
to a high state (high active output).
A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state
to a low state.
Load is 100 Ω differential.
Internal load is 510 Ω to GND, no external load necessary. Signal Detect is a high active output. High level
means signal is present, low level means loss of signal.
For V23818-K15-L37/L36/L17/L16/L35.
For V23818-K15-L47/L46/L57/L56/L45.
Monitor current needs to be sunk to VCC.
Only available on 2x10 transceivers: V23818-K15-L17/L16/L57/L56.
Data Sheet
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V23818-K15-Lxx
Eye Safety
Eye Safety
This laser based single mode transceiver is a Class 1 product.
It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11.
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Attention: All adjustments have been made at the factory prior to shipment of the
devices. No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result
in voided product warranty.
Note: Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Data
Wavelength
1300 nm
Total output power
(as defined by IEC: 7 mm aperture at 14 mm distance)
< 2 mW
Total output power
(as defined by FDA: 7 mm aperture at 20 cm distance)
< 180 µW
Beam divergence
6°
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
File: 1401
Figure 11
Required Labels
Indication of
laser aperture
and beam
20 19 18 17 16 15 14 13 12 11
Tx
Top view
Rx
1 2 3 4 5 6 7 8 9 10
File: 1334
Figure 12
Data Sheet
Laser Emission
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EMI-Recommendations
EMI-Recommendations
To avoid electromagnetic radiation exceeding the required limits please take note of the
following recommendations.
When Gigabit switching components are found on a PCB (multiplexers, clock recoveries
etc.) any opening of the chassis may produce radiation also at chassis slots other than
that of the device itself. Thus every mechanical opening or aperture should be as small
as possible.
On the board itself every data connection should be an impedance matched line (e.g.
strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should
be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched
line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:
for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not planned, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an εr of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
Data Sheet
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Recommended Termination Schemes
Recommended Termination Schemes
BMon+
BMon−
18
17
Laser
Driver
VEEt
12,16
TD+
14
100 Ω
TD−
15
TDis
13
VCCt
11
VCCr
7
SD
8
VCC SerDes
VCC
C6
C8
SerDat Out +
C7
SerDat Out −
ECL/
PECL
Driver
TDis
L1
VCC
3.3 V
R5
19
R4
20
PMon−
PMon+
2x10 DC/DC Transceiver
C1
SFF Transceiver
Signal
Detect
Serializer/
Deserializer
L2
C3
C10
C2
SD
1
PDBias
RD−
9
RD+
RD+
10
VEEr
C4
SerDat In −
R1
RD−
C9
C5
SerDat In +
Receiver
PLL etc.
2,3,6
R3
Limiting
Amplifier
R2
PreAmp
C1/2/3
= 4.7 ... 10 µF
C4/5/6/7 = 100 nF
C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
L1/2*)
R1
= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or
100 Ω differential is provided. Check for termination inside of SerDes chip).
R2/3
= 150 Ω
R4/5
= Biasing (depends on SerDes chip).
Place R1/4/5 close to SerDes chip.
Place R2/3 close to Infineon transceiver.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1390
Figure 13
Data Sheet
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V23818-K15-Lxx
Recommended Termination Schemes
BMon+
VCC SerDes
18
12,16
TD+
14
100 Ω
TD−
15
TDis
13
VCCt
11
VCC
SerDat Out +
C4
SerDat Out −
TDis
L1
VCC
3.3 V
C1
SFF Transceiver
VCCr
Serializer/
Deserializer
L2
7
C3
C6
C2
SD
8
SD
R1
Signal
Detect
1
PDBias
Limiting
Amplifier
RD−
9
RD+
10
VEEt
SerDat In −
C5
SerDat In +
Receiver
PLL etc.
2,3,6
R3
PreAmp
ECL/
PECL
Driver
R6
Laser
Driver
VEEt
R2
17
R4
19
R5
20
BMon−
PMon−
PMon+
2x10 AC/AC Transceiver
C1/2/3
C4/5/6
= 4.7 ... 10 µF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
*)
= 1 ... 4.7 µH
L1/2
R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω
differential is provided. Check for termination inside of SerDes chip.
R5/6
= Biasing (depends on SerDes chip).
Place R1/2/3/4/5/6 close to SerDes chip.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1391
Figure 14
Data Sheet
20
2003-03-21
V23818-K15-Lxx
Recommended Termination Schemes
2x5 DC/DC Transceiver
9
100 Ω
VCC
C6
TD−
10 C8
TDis
8
VCCt
6
VCCr
2
SD
3
RD−
RD−
4
RD+
RD+
5
VEEr
1
SerDat Out −
L1
VCC
3.3 V
C1
Serializer/
Deserializer
L2
C3
C10
C2
SD
C4
R1
SerDat In −
C9
C5
SerDat In +
Receiver
PLL etc.
R3
Signal
Detect
Limiting
Amplifier
C7
ECL/
PECL
Driver
TDis
SFF Transceiver
PreAmp
SerDat Out +
R5
TD+
VCC SerDes
R4
7
R2
Laser
Driver
VEEt
C1/2/3
= 4.7 ... 10 µF
C4/5/6/7 = 100 nF
C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
L1/2*)
R1
= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or
100 Ω differential is provided. Check for termination inside of SerDes chip).
R2/3
= 150 Ω
R4/5
= Biasing for outputs depending on Serializer.
Place R1/4/5 close to SerDes chip.
Place R2/3 close to Infineon transceiver.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1392
Figure 15
Data Sheet
21
2003-03-21
V23818-K15-Lxx
Recommended Termination Schemes
2x5 AC/AC Transceiver
VCC SerDes
7
VCC
TD+
9
SerDat Out +
TD−
10 C4
TDis
8
VCCt
6
VCCr
2
SD
3
RD−
RD−
4
RD+
RD+
5
VEEr
1
SerDat Out −
TDis
L1
VCC
3.3 V
C1
SFF Transceiver
Serializer/
Deserializer
L2
C3
C6
C2
SerDat In −
C5
Receiver
PLL etc.
R4
SerDat In +
R3
Limiting
Amplifier
R2
SD
R1
Signal
Detect
PreAmp
ECL/
PECL
Driver
R6
100 Ω
R5
Laser
Driver
VEEt
C1/2/3
C4/5/6
= 4.7 ... 10 µF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
L1/2*)
R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω
differential is provided. Check for termination inside of SerDes chip.
= Biasing (depends on SerDes chip).
R5/6
Place R1/2/3/4/5/6 close to SerDes chip.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1393
Figure 16
Data Sheet
22
2003-03-21
V23818-K15-Lxx
Package Outlines
Package Outlines
a) recommended bezel position
Drawing shown is 2x10 pinning with collar
Dimensions in mm [inches]
File: 1213
Figure 17
Data Sheet
23
2003-03-21
V23818-K15-Lxx
Revision History:
2003-03-21
Previous Version:
2003-03-05
Page
Subjects (major changes since last revision)
15
Table "Transmitter Electro-Optical Characteristics" changed
DS2
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2003-03-21
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2003.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.