Fiber Optics Small Form Factor Single Mode 1300 nm 1.0625 Gbit/s Fibre Channel 1.25 Gigabit Ethernet Transceiver 2x5/2x10 Pinning with LC™ Connector V23818-K15-Lxx Preliminary Data Features • Small Form Factor transceiver • Complies with Fibre Channel and Gigabit Ethernet standards • RJ-45 style LC™ connector system • Available with or without collar • Half the size of SC Duplex 1x9 transceiver • Single power supply (3.3 V) • Low power consumption, 650 mW typical • Loss of optical signal indicator • Laser disable input • LVPECL differential inputs and outputs • AC/AC coupling in accordance to SFF MSA or optional DC/DC coupling version • For distance of up to 10 km on single mode fiber (SMF) • Class 1 FDA and IEC laser safety compliant • Multisource 2x5/2x10 footprint1) • Small size for high port density • UL 94 V-0 certified • Compliant with FCC (Class B) and EN 55022 • Tx and Rx power monitor on 2x10 pinning version 1) File: 1119 File: 1120 Current MSA documentation can be found at www.infineon.com/fiberoptics For ordering information see next page. LC™ is a trademark of Lucent. Data Sheet 1 2003-03-21 V23818-K15-Lxx Ordering Information Ordering Information Part Number Pinning Temperature Range Signal Detect V23818-K15-L37 2x5 0°C to 70°C V23818-K15-L36 –40°C to 85°C V23818-K15-L47 0°C to 70°C V23818-K15-L46 –40°C to 85°C V23818-K15-L17 2x10 0°C to 70°C V23818-K15-L16 –40°C to 85°C V23818-K15-L57 0°C to 70°C V23818-K15-L56 –40°C to 85°C V23818-K15-L35 2x5 0°C to 70°C V23818-K15-L45 Data Sheet 2 Collar Input Output LVPECL yes DC DC LVTTL AC AC LVPECL DC DC LVTTL AC AC LVPECL no DC DC LVTTL AC AC 2003-03-21 V23818-K15-Lxx Pin Configuration Pin Configuration Tx MS HL HL 20 19 18 17 16 15 14 13 12 11 TOP VIEW Rx MS HL 1 2 3 4 5 6 7 8 9 10 HL File: 1335 Figure 1 2x10 Pin Connect Diagram 2x10 Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MS HL 1) Symbol Level/Logic Description PDBias DC current Ground Ground PIN photo detector bias current Receiver signal ground Receiver signal ground Not connected Not connected Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Transmitter signal ground Laser diode bias current monitor Laser diode bias current monitor Laser diode optical power monitor Laser diode optical power monitor Mounting studs Housing leads VEEr VEEr NC NC VEEr VCCr SD RD– RD+ VCCt VEEt TDis TD+ TD– VEEt BMon– BMon+ PMon– PMon+ Ground Power supply LVTTL or LVPECL output1) LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input Ground DC voltage DC voltage DC voltage DC voltage LVPECL output active high for V23818-K15-L17/L16. LVTTL output active high for V23818-K15-L57/L56. Data Sheet 3 2003-03-21 V23818-K15-Lxx Pin Configuration Tx MS HL HL 10 9 8 7 6 TOP VIEW Rx MS 1 2 3 4 5 HL HL File: 1331 Figure 2 2x5 Pin Connect Diagram 2x5 Pin Description Pin No. Symbol Level/Logic Description 1 VEEr VCCr Ground Receiver signal ground 2 Power supply Receiver power supply 1) Receiver optical input level monitor 3 SD LVTTL or LVPECL output 4 RD– LVPECL output Receiver data out bar 5 RD+ LVPECL output Receiver data out 6 Power supply Transmitter power supply 7 VCCt VEEt Ground Transmitter signal ground 8 TDis LVTTL input Transmitter disable 9 TD+ LVPECL input Transmitter data in 10 TD– LVPECL input Transmitter data in bar MS Mounting studs HL Housing leads 1) LVPECL output active high for V23818-K15-L37/L36/L35. LVTTL output active high for V23818-K15-L47/L46/L45. VEEr / VEEt For 2x10 transceivers, connect pins 2, 3, 6, 12 and 16 to signal ground. For 2x5 transceivers, connect pins 1 and 7 to signal ground. Data Sheet 4 2003-03-21 V23818-K15-Lxx Pin Configuration VCCr / VCCt For 2x10 transceivers a 3.3 V DC power supply must be applied at pins 7 and 11. For 2x5 transceivers a 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD– Transmitter data LVPECL level inputs. For V23818-K15-L47/L46/L57/L56/L45 terminated and AC coupled internally. For V23818-K15-L37/L36/L17/L16/L35 use termination and coupling as shown in the termination scheme. RD– / RD+ Receiver data LVPECL level outputs. For V23818-K15-L47/L46/L57/L56/L45 biased and AC coupled internally. For V23818-K15-L37/L36/L17/L16/L35 use termination and coupling as shown in the termination scheme. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output for V23818-K15-L47/L46/L57/L56/L45. LVPECL output for V23818-K15-L37/L36/L17/L16/L35. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in a low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground. Data Sheet 5 2003-03-21 V23818-K15-Lxx Pin Configuration 2x10 Transceiver Additional Functionality PDBias Connect pin 1 to VCC through a bias resistor, of a value not exceeding 2 kΩ, as shown in Figure 3 to monitor PIN photo detector bias current. Leave pin floating if not used. Typical behaviour is shown in Figure 4 and Figure 5 using a 2 kΩ load. VCC ≤ 2 kΩ Vbias Pin 1 Figure 3 Data Sheet File: 1307 Photo Detector Bias Interface 6 2003-03-21 V23818-K15-Lxx Pin Configuration Typical Responsitivity of PIN Photo Detector Bias Current Monitor Photo Detector Monitor Current (µA) 400 300 200 100 0 0 100 200 300 400 Received Optical Power (µW) Figure 4 File: 1308 Linear Response Photo Detector Monitor Current (µA) 400 300 200 100 0 −30 −24 −18 −12 Received Optical Power (dBm) Figure 5 Data Sheet −6 0 File: 1309 Logarithmic Response 7 2003-03-21 V23818-K15-Lxx Pin Configuration BMon– / BMon+ The DC voltage measured across pins 17 and 18 is proportional to the laser bias current. Use the equation: Ibias = Vbias /10 Ω Use this output to monitor laser performance and EOL conditions. A schematic and typical behaviour are shown in Figure 6 and Figure 7. Ibias @ ambient 25°C < 60 mA. Leave pins floating if function is not required. VCC Pin 18 3 kΩ 10 Ω Pin 17 3 kΩ VEE File: 1310 Figure 6 Bias Monitor – Transceiver Internal 0.36 BMon Output Voltage (V) 0.32 0.28 0.24 0.2 0.16 0.12 0.08 0.04 0 0 10 20 30 40 50 60 70 Temperature (˚C) File: 1312 Figure 7 Data Sheet Typical Variations of Bias Monitor Voltage over Temperature 8 2003-03-21 V23818-K15-Lxx Pin Configuration PMon– / PMon+ This output is derived from the Tx monitor diode. Output voltage is in the range of 1.2 ±0.2 V. Source resistance RS = 100 kΩ. Note: This voltage level is not MSA compliant. Data Sheet 9 2003-03-21 V23818-K15-Lxx Description Description The Infineon single mode transceiver is based on and compliant to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000-Base-LX (long wavelength) as specified in IEEE Std 802.3 and Fibre Channel FC-PI Rev. 13 100-SM-LC-L. The appropriate fiber optic cable is 9 µm single mode fiber with LC connector. The Infineon single mode transceiver is a single unit comprised of a transmitter, a receiver, and an LC receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LC connectorization concept, which competes with UTP/ CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop applications while providing the advantages of fiber optic technology. The receptacle accepts the new LC connector. The Small Form Factor is specially developed for distances of up to 10 km. The module is designed for low cost LAN and WAN applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 and 1.25 Gbit/s from a single power supply. The full differential data inputs and outputs are LVPECL compatible. Functional Description of SFF Transceiver This transceiver is designed to transmit serial data via single mode fiber. BMonBMon+ Automatic Shut-Down Tx Coupling Unit TDis 3k TDTD+ Laser Driver 10 Power Control 200 PMonPMon+ RDRD+ SD 3k 3k e/o Laser o/e 3k Monitor Rx Coupling Unit Receiver o/e PDBias Figure 8 Data Sheet Single Mode Fiber File: 1357 Functional Diagram 2x10 Pin Rows 10 2003-03-21 V23818-K15-Lxx Description Automatic Shut-Down Tx Coupling Unit TDis TD− TD+ e/o Laser Driver Laser o/e Power Control Monitor Rx Coupling Unit RD− RD+ Limiting Amp TIA Single Mode Fiber o/e SD File: 1351 Figure 9 Functional Diagram 2x5 Pin Rows The receiver component converts the optical serial data into an electrical data (RD+ and RD–). The Signal Detect output (SD) shows whether an optical signal is present. The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD–) into optical serial data. The module has an integrated shutdown function that switches the laser off in the event of an internal failure. Reset is only possible if the power is turned off, and then on again. (VCCt switched below VTH). The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Data Sheet 11 2003-03-21 V23818-K15-Lxx Description Regulatory Compliance Feature Standard Comments ESD: EIA/JESD22-A114-B Electrostatic Discharge to (MIL-STD 883D the Electrical Pins Method 3015.7) Class 1C EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV on the receptacle cause no damage to transceiver (under recommended conditions). Immunity: EN 61000-4-3 Against Radio Frequency IEC 61000-4-3 Electromagnetic Field With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Noise frequency range: Class B 30 MHz to 18 GHz EN 55022 Class B CISPR 22 (13.97) *) .550 *) min. pitch between SFF transceiver according to MSA. Dimensions in (mm) inches Figure 10 Data Sheet File: 1501 Transceiver Pitch 12 2003-03-21 V23818-K15-Lxx Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values min. Package Power Dissipation Unit max. 0.95 W 4 V VEE–0.5 V 5 V 85 °C Hand Lead Soldering Temp/Time 260/10 °C/s Wave Soldering Temp/Time 260/10 °C/s Aqueous Wash Pressure < 110 psi VCC–VEE Supply Voltage VCC+0.5 Data Input Levels VIDpk-pk Differential Data Input Voltage Swing Storage Ambient Temperature –40 Exceeding any one of these values may destroy the device immediately. Data Sheet 13 2003-03-21 V23818-K15-Lxx Technical Data Recommended Operating Conditions Parameter Symbol Limit Values min. Ambient Temperature1), 3) TAMB Ambient Temperature2), 3) Power Supply Voltage VCC–VEE typ. max. –40 85 0 70 3.14 3.3 Unit °C 3.46 V –1165 –880 mV Transmitter Data Input High Voltage DC/DC VIH–VCC Differential Data Input Voltage Swing AC/AC VIDpk-pk 500 3200 mV Data Input Low Voltage DC/DC VIL–VCC ti ICCt –1810 –1475 mV 120 ps 140 mA Input Center Wavelength λRx 1260 1580 nm Supply Current Rx ICCr 130 mA Data Input Rise/Fall Time Supply Current Tx Receiver 1) 2) 3) For V23818-K15-L36/L46/L16/L56. For V23818-K15-L37/L47/L17/L57/L35/L45. Ambient operating temperature requires a 2 ms–1 airflow over the device. The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 14 2003-03-21 V23818-K15-Lxx Technical Data Transmitter Electro-Optical Characteristics Parameter Symbol Limit Values min. typ. Unit max. Output Power (Average)1) PO –9.5 –3 dBm Center Wavelength λC 1270 1355 nm Spectral Width (RMS) σ 4 nm Extinction Ratio (Dynamic) ER Reset Threshold for VCCt2) 2.7 V Power on Delay2) VTH tDEL 30 ms Total Tx Jitter TJ 53 TDis Assert Voltage LVTTL TDis Deassert Voltage LVTTL TDis Assert Time3) TDis Deassert Time4) VTDH VTDL tASS tDAS 1) 2) 3) 4) 9 dB 130 2 ps V 0.8 V 0.4 1 ms 0.06 10 µs Into single mode fiber, 9 µm diameter Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. TDis assertion to laser shutdown. TDis reassertion to laser startup. Receiver Electro-Optical Characteristics Parameter Symbol Limit Values min. Sensitivity (Average Power)1) Saturation (Average Power) PIN PSAT typ. Unit max. –20 –3 dBm dBm Min. Optical Modulation Amplitude2) OMA 15 µW Signal Detect Assert Level3) PSDA PSDD PSDA –PSDD tASS tDAS –20 dBm Signal Detect Deassert Level2), 4) Signal Detect Hysteresis Signal Detect Assert Time3) Signal Detect Deassert Time4) –37 3 Receiver 3 dB Cut off Frequency2) Data Sheet dBm 15 dB 0.1 ms 0.35 ms 1.5 GHz 2003-03-21 V23818-K15-Lxx Technical Data Receiver Electro-Optical Characteristics (cont’d) Parameter Symbol Limit Values min. typ. Unit max. Receiver 10 dB Cut off Frequency2) 3 GHz VOH–VCC –1110 VOL–VCC –1800 Output Voltage5) Differential Data Output Voltage VODpk-pk 1000 –650 mV –1300 mV 2000 mV VCC mV Output Voltage5) 5) Swing Signal Detect Output High Voltage LVPECL6), 7) VSDH–VEE VCC Signal Detect Output Low Voltage LVPECL6), 7) VSDL–VEE VCC Signal Detect Output High Voltage LVTTL6), 8) VSDH Signal Detect Output Low Voltage LVTTL6), 8) VSDL Rx-Monitor 9), 10) Rx-Mon 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) –1200 –1900 –820 VCC –1580 2.4 0.5 mV V 0.5 V 1 A/W Minimum average optical power at which the BER is less than 1x10–10. Measured with a 27–1 NRZ PRBS. Fibre Channel PI Standard. An increase in optical power above the specified level will cause the Signal Detect to switch from a low state to a high state (high active output). A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state to a low state. Load is 100 Ω differential. Internal load is 510 Ω to GND, no external load necessary. Signal Detect is a high active output. High level means signal is present, low level means loss of signal. For V23818-K15-L37/L36/L17/L16/L35. For V23818-K15-L47/L46/L57/L56/L45. Monitor current needs to be sunk to VCC. Only available on 2x10 transceivers: V23818-K15-L17/L16/L57/L56. Data Sheet 16 2003-03-21 V23818-K15-Lxx Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength 1300 nm Total output power (as defined by IEC: 7 mm aperture at 14 mm distance) < 2 mW Total output power (as defined by FDA: 7 mm aperture at 20 cm distance) < 180 µW Beam divergence 6° FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 11 Required Labels Indication of laser aperture and beam 20 19 18 17 16 15 14 13 12 11 Tx Top view Rx 1 2 3 4 5 6 7 8 9 10 File: 1334 Figure 12 Data Sheet Laser Emission 17 2003-03-21 V23818-K15-Lxx EMI-Recommendations EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows: for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an εr of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. Data Sheet 18 2003-03-21 V23818-K15-Lxx Recommended Termination Schemes Recommended Termination Schemes BMon+ BMon− 18 17 Laser Driver VEEt 12,16 TD+ 14 100 Ω TD− 15 TDis 13 VCCt 11 VCCr 7 SD 8 VCC SerDes VCC C6 C8 SerDat Out + C7 SerDat Out − ECL/ PECL Driver TDis L1 VCC 3.3 V R5 19 R4 20 PMon− PMon+ 2x10 DC/DC Transceiver C1 SFF Transceiver Signal Detect Serializer/ Deserializer L2 C3 C10 C2 SD 1 PDBias RD− 9 RD+ RD+ 10 VEEr C4 SerDat In − R1 RD− C9 C5 SerDat In + Receiver PLL etc. 2,3,6 R3 Limiting Amplifier R2 PreAmp C1/2/3 = 4.7 ... 10 µF C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1 = 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 Ω R4/5 = Biasing (depends on SerDes chip). Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1390 Figure 13 Data Sheet 19 2003-03-21 V23818-K15-Lxx Recommended Termination Schemes BMon+ VCC SerDes 18 12,16 TD+ 14 100 Ω TD− 15 TDis 13 VCCt 11 VCC SerDat Out + C4 SerDat Out − TDis L1 VCC 3.3 V C1 SFF Transceiver VCCr Serializer/ Deserializer L2 7 C3 C6 C2 SD 8 SD R1 Signal Detect 1 PDBias Limiting Amplifier RD− 9 RD+ 10 VEEt SerDat In − C5 SerDat In + Receiver PLL etc. 2,3,6 R3 PreAmp ECL/ PECL Driver R6 Laser Driver VEEt R2 17 R4 19 R5 20 BMon− PMon− PMon+ 2x10 AC/AC Transceiver C1/2/3 C4/5/6 = 4.7 ... 10 µF = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. *) = 1 ... 4.7 µH L1/2 R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip. R5/6 = Biasing (depends on SerDes chip). Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1391 Figure 14 Data Sheet 20 2003-03-21 V23818-K15-Lxx Recommended Termination Schemes 2x5 DC/DC Transceiver 9 100 Ω VCC C6 TD− 10 C8 TDis 8 VCCt 6 VCCr 2 SD 3 RD− RD− 4 RD+ RD+ 5 VEEr 1 SerDat Out − L1 VCC 3.3 V C1 Serializer/ Deserializer L2 C3 C10 C2 SD C4 R1 SerDat In − C9 C5 SerDat In + Receiver PLL etc. R3 Signal Detect Limiting Amplifier C7 ECL/ PECL Driver TDis SFF Transceiver PreAmp SerDat Out + R5 TD+ VCC SerDes R4 7 R2 Laser Driver VEEt C1/2/3 = 4.7 ... 10 µF C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1 = 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 Ω R4/5 = Biasing for outputs depending on Serializer. Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1392 Figure 15 Data Sheet 21 2003-03-21 V23818-K15-Lxx Recommended Termination Schemes 2x5 AC/AC Transceiver VCC SerDes 7 VCC TD+ 9 SerDat Out + TD− 10 C4 TDis 8 VCCt 6 VCCr 2 SD 3 RD− RD− 4 RD+ RD+ 5 VEEr 1 SerDat Out − TDis L1 VCC 3.3 V C1 SFF Transceiver Serializer/ Deserializer L2 C3 C6 C2 SerDat In − C5 Receiver PLL etc. R4 SerDat In + R3 Limiting Amplifier R2 SD R1 Signal Detect PreAmp ECL/ PECL Driver R6 100 Ω R5 Laser Driver VEEt C1/2/3 C4/5/6 = 4.7 ... 10 µF = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip. = Biasing (depends on SerDes chip). R5/6 Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1393 Figure 16 Data Sheet 22 2003-03-21 V23818-K15-Lxx Package Outlines Package Outlines a) recommended bezel position Drawing shown is 2x10 pinning with collar Dimensions in mm [inches] File: 1213 Figure 17 Data Sheet 23 2003-03-21 V23818-K15-Lxx Revision History: 2003-03-21 Previous Version: 2003-03-05 Page Subjects (major changes since last revision) 15 Table "Transmitter Electro-Optical Characteristics" changed DS2 For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. Edition 2003-03-21 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.