INTEGRATED CIRCUITS DATA SHEET TDA9859 Universal hi-fi audio processor for TV Product specification Supersedes data of 2001 Jul 02 File under Integrated Circuits, IC02 2001 Jul 11 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 FEATURES • Multi-source selector switches six AF inputs (three stereo sources or six mono sources) • Each of the input signals can be switched to each of the outputs (crossbar switch) • Outputs for loudspeaker channel and peri-TV connector (SCART) GENERAL DESCRIPTION • Switchable spatial stereo and pseudo stereo effects The TDA9859 provides control facilities for the main and the SCART channel of a TV set. Due to extended switching possibilities, signals from three stereo sources can be handled. • Audio surround decoder can be added externally • Two general purpose logic output ports • I2C-bus control of all functions. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VP positive supply voltage (pin VP) 7.2 8.0 8.8 IP supply current − 25 − mA Vi(rms) input signal levels for 0 dB gain (RMS value) 2 − − V Vo(rms) output signal levels for 0 dB gain (RMS value) 2 − − V Gv voltage gain in main channel volume control (in 1 dB steps, balance included) −63 − +15 dB mute −80 − − dB bass control (in 1.5 dB steps) −12 − +15 dB treble control (in 3 dB steps) V −12 − +12 dB THD total harmonic distortion − 0.1 − % S/N signal-to-noise ratio − 85 − dB Tamb ambient temperature 0 − 70 °C ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA9859 SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 TDA9859H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm SOT307-2 2001 Jul 11 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 5.6 nF CBL1 R L audio inputs SCART R L MAIN R 7 (15) (1) CBL2 CTL 22 (36) 21 (35) 19 (31) 470 nF AINR 30 (3) 470 nF SCIN L 1 (7) 470 nF SCIN R 32 (5) 470 nF MIN L 3 (9) I2C-BUS INTERFACE TDA9859 (TDA9859H) MULTIPLE SOURCE AND MODE SELECTOR (CROSSBAR SWITCH) 3 VP 6 (14) REFERENCE VOLTAGE VOLUME CONTROL 4 (10) (16) CSMO 8 24 (38) 9 (18) 23 (37) 10 (19) AGND GND MOUTL MOUTR LINL LINR 100 µF L 27 (42) 11 (20) 12 (21) (1) CPS2 14 (25) R VOLUME BALANCE MHB917 CBR2 CTR 5.6 nF 33 nF R LINE output or optional surround sound decoder connection TREBLE CONTROL BASS CONTROL CBR1 CPS1 L loudspeaker channel outputs (26) 15 LOUTR FORCED MONO 29 (2) P1 (17) DGND MUTE PSEUDO STEREO 470 nF P2 (8) 2 (30) 18 LOUTL STEREO SPATIAL STEREO 470 nF MIN R 5 (13) +8 V 25 17 16 (27) (40) (29) (4) 31 Philips Semiconductors R AIN L 28 (43) L AUX MAD SDA SCL Universal hi-fi audio processor for TV 33 nF SCOUTL SCOUTR 26 (41) BLOCK DIAGRAM full pagewidth 2001 Jul 11 I2C-bus SCART output L extended bass control (1) 11 (22) 12 (21) 0.15 µF 68 nF 13 kΩ Product specification Fig.1 Block diagram and application circuit. TDA9859 The pin numbers given in parenthesis refer to the TDA9859H version. (1) For extended bass control, the capacitor between CBR/L1 and CBR/L2 should be replaced by the extended bass control network. Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 PINNING PIN SYMBOL PIN SYMBOL DESCRIPTION TDA9859 TDA9859H SDA 17 29 serial data input/output; I2C-bus port 1 output LOUTL 18 30 MAIN input; left channel loudspeaker output; left channel CTL 19 31 smoothing capacitor of reference voltage treble capacitor connection; left channel n.c. 20 32 not connected − 33 not connected SCINL 1 7 SCART input; left channel P1 2 8 MINL 3 9 CSMO 4 10 DESCRIPTION TDA9859 TDA9859H n.c. − 11 not connected n.c. n.c. − 12 not connected n.c. − 34 not connected CBL2 21 35 bass capacitor connection 2; left channel CBL1 22 36 bass capacitor connection 1; left channel LINL 23 37 input to left loudspeaker channel 24 38 MAIN output; left channel MINR 5 13 MAIN input; right channel VP 6 14 supply voltage SCOUTR 7 15 SCART output; right channel GND 8 − ground AGND − 16 analog ground DGND − 17 digital ground MOUTR 9 18 MAIN output; right channel MOUTL LINR 10 19 input to right loudspeaker channel n.c. − 39 not connected MAD 25 40 module address select input SCOUTL 26 41 SCART output; left channel CPS2 27 42 pseudo stereo capacitor 2 AINL 28 43 AUX input; left channel n.c. − 44 not connected n.c. − 1 not connected CPS1 29 2 pseudo stereo capacitor 1 AINR 30 3 AUX input; right channel P2 31 4 port 2 output SCINR 32 5 SCART input signal RIGHT n.c. − 6 not connected CBR1 11 20 bass capacitor connection 1; right channel CBR2 12 21 bass capacitor connection 2; right channel n.c. − 22 not connected n.c. − 23 not connected n.c. 13 24 not connected CTR 14 25 treble capacitor connection; right channel LOUTR 15 26 loudspeaker output; right channel SCL 16 27 serial clock input; I2C-bus n.c. − 28 not connected 2001 Jul 11 4 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 handbook, halfpage SCINL 1 32 SCINR P1 2 31 P2 MINL 3 30 AINR CSMO 4 29 CPS1 MINR 5 28 AINL VP 6 27 CPS2 SCOUTR 7 26 SCOUTL GND 8 MOUTR 25 MAD TDA9859 9 24 MOUTL LINR 10 23 LINL CBR1 11 22 CBL1 CBR2 12 21 CBL2 n.c. 13 20 n.c. CTR 14 19 CTL LOUTR 15 18 LOUTL 17 SDA SCL 16 MHA779 Fig.2 Pin configuration TDA9859 SDIP32 version. 2001 Jul 11 5 Philips Semiconductors Product specification 34 n.c. 35 CBL2 36 CBL1 37 LINL 38 MOUTL TDA9859 39 n.c. 40 MAD 41 SCOUTL 42 CPS2 handbook, full pagewidth 43 AINL 44 n.c. Universal hi-fi audio processor for TV n.c. 1 33 n.c. CPS1 2 32 n.c. AINR 3 31 CTL P2 4 30 LOUTL SCINR 5 29 SDA n.c. 6 SCINL 7 27 SCL P1 8 26 LOUTR MINL 9 25 CTR TDA9859H 28 n.c. n.c. 22 CBR2 21 CBR1 20 LINR 19 MOUTR 18 DGND 17 AGND 16 SCOUTR 15 23 n.c. VP 14 n.c. 11 MINR 13 24 n.c. n.c. 12 CSMO 10 MHB918 Fig.3 Pin configuration TDA9859H QFP44 version. 2001 Jul 11 6 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 FUNCTIONAL DESCRIPTION Loudspeaker channel The TDA9859 consists of the following functions: Volume control is divided into volume control common and volume control left/right. The common part (−40 to +15 dB) controls the left and right channels simultaneously; the left/right part (−23 to 0 dB) controls the volume of left and right channels independently. Treble control provides a control range from −12 to +12 dB and bass control from −12 to +15 dB. Extended bass control can be provided by an external T-network (see Fig.1) from −15 to +19 dB (in 2 dB steps). • Source select switching block • Loudspeaker channel with effect controls • Two port outputs for general purpose • I2C-bus control. Source select switching block The TDA9859 selects and switches the input signals from three stereo or six mono sources MAIN, AUX and SCART (see Fig.1) to the outputs SCART and loudspeaker (crossbar-switching; Table 4). The main channel (LINE outputs) is looped outside the circuit (from pins MOUTR and MOUTL to pins LINR and LINL), so signals can be used as LINE output or a surround sound decoder can be inserted. I2C-bus control All control settings are stored in subaddress registers. Data transmission is simplified by auto-incrementing the subaddresses. The on-chip Power-on reset sets the mute bit to active, so both the SCART and the loudspeaker outputs are muted. The muting can be switched off by writing a ‘0’ (non-muted) into the mute control bits. Effect controls ‘Linear stereo’, ‘stereo with spatial effect (30% or 52% anti-phase crosstalk)’ and ‘forced mono with or without pseudo-stereo effect’ are controlled by three bits. A muting of 85 dB is provided. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage (pin VP) − 0 10 V Vn voltage on all pins, ground excluded − 0 VP V IO output current at LOUT and SCOUT pins − − 2.5 mA at port output pins − − 1.5 mA Ptot total power dissipation − − 850 mW Tamb ambient temperature − 0 70 °C Tstg storage temperature − −25 +150 °C Ves electrostatic handling voltage all pins; note 1 − ±300 V all pins; note 2 − ±2000 V Notes 1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor (machine model). 2. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor (human body model). 2001 Jul 11 7 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE UNIT TDA9859 (SDIP32) 60 K/W TDA9859H (QFP44) 65 K/W thermal resistance from junction to ambient in free air CHARACTERISTICS VP = 8 V; Tamb = 25 °C; treble and bass in linear positions (0 dB); volume control left/right 0 dB; spatial function, pseudo-stereo function and forced-mono function in off position and measurements taken in Fig.1; unless otherwise specified. SYMBOL PARAMETER VP supply voltage (pin VP) CONDITIONS MIN. 7.2 TYP. MAX. UNIT 8.0 8.8 V IP supply current (pin VP) − 25 − mA Vref internal reference voltage − 0.5VP − V VSMO voltage at pin CSMO − VP − 0.1 − V DC voltage on pins VI DC input voltage at pins SCIN, MIN, LIN and AIN − 0.5VP − V VO DC output voltage at pins SCOUT, MOUT and LOUT − 0.5VP − V VC DC voltage on capacitors (pins CBR1, CBR2, CTR, CTL, CBL2, CBL1, CPS2 and CPS1) − 0.5VP − V 2 − − V Audio select switch; line and SCART outputs (controlled via I2C-bus); see Table 4 THD ≤ 0.5% on output pins Vi(rms) maximum AF input signal on pins SCIN, MIN and AIN (RMS value) Ri input resistance at pins SCIN, MIN and AIN 20 30 40 kΩ B−0.5 dB −0.5 dB bandwidth for pins SCOUT, MOUT and LOUT 20 − 20 000 Hz Vo(rms) maximum AF output signal on pins SCOUT and MOUT (RMS value) 2 − − V RL allowed external load resistance on output pins MOUT 10 − − kΩ on output pins SCOUT 5 − − kΩ − 0 − dB − 90 − dB Gv voltage gain from any input to SCART and MAIN outputs αcr switch crosstalk on outputs between AF inputs 2001 Jul 11 THD ≤ 0.5% f = 10 kHz; unused inputs connected to ground 8 Philips Semiconductors Product specification Universal hi-fi audio processor for TV SYMBOL TDA9859 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Volume control common (f = 1 kHz, 55 steps) 2 − − V 7.5 10 − kΩ nominal −40 − +15 dB minimum −38 − +14 dB 0.5 1.0 1.5 dB Vi(rms) maximum input signal on pins LIN (RMS value) Ri input resistance on pins LIN Gv volume control common voltage gain ∆Gv Gv = 0; THD ≤ 0.5% on output pins LOUT volume control common voltage gain step width Gv = −32 to +15 dB Gv = −40 to −33 dB 0.25 1.0 1.75 dB volume control common voltage gain set error Gv = −32 to +15 dB − − 1 dB Gv = −40 to −33 dB − − 2 dB nominal −24 − 0 dB minimum −23 − −1 dB mute position −80 −85 − dB volume control left/right voltage gain step width 0.5 1.0 1.5 dB volume control left/right voltage gain tracking error − − 2 dB maximum boost 14 15 16 dB maximum attenuation 11 12 13 dB 1 1.5 2 dB 18 19 20 dB Volume control left/right (f = 1 kHz, 24 steps) Gv ∆Gv volume control left/right voltage gain Bass control Gv bass control voltage gain ∆Gv bass control voltage gain step width Gv(extended) extended bass control voltage gain CB = 33 nF; f = 40 Hz see Fig.1; f = 60 Hz maximum boost maximum attenuation 14 15 16 dB ∆Gv(extended) extended bass control voltage gain step width 1 2 3 dB maximum boost 11 12 13 dB maximum attenuation 11 12 13 dB 2.5 3 3.5 dB anti-phase crosstalk by spatial effect 1 − 52 − % αct(spat2) anti-phase crosstalk by spatial effect 2 − 30 − % ϕ phase shift by pseudo-stereo Treble control Gv ∆Gv treble control voltage gain f = 15 kHz treble control voltage gain step width Effect controls αct(spat1) 2001 Jul 11 see Fig.4 9 Philips Semiconductors Product specification Universal hi-fi audio processor for TV SYMBOL TDA9859 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Loudspeaker channel outputs (pins LOUTR and LOUTL) Vo(max)(rms) maximum output signal (RMS value) ∆VDC(max) maximum DC offset voltage between adjoining step and any step to mute for volume control for bass control THD ≤ 0.5%; RL > 10 kΩ; CL < 1.5 nF 2 − − V Gv = 0 to +15 dB/mute − 2 15 mV Gv = −64 to 0 dB/mute − 0.5 10 mV Gv = 0 to +15 dB/mute − 2 15 mV Gv = −12 to 0 dB/mute − 0.5 10 mV − 0.5 10 mV Ro output resistance − − 100 Ω Ro(L) allowed output load resistor 10 − − kΩ Co(L) allowed output load capacitor − − 1.5 nF Vno(W) weighted noise voltage at output (quasi-peak level) Gv = +15 dB − 102 − µV Gv = 0 dB − 32 − µV Gv = −40 dB − 27 − µV Gv = −80 dB (mute) − 20 − µV 20 − 20000 Hz for treble control B−1 dB −1 dB bandwidth for loudspeaker channel THD total harmonic distortion Gv = −12 to +12 dB/mute CCIR 468-3 weighted f = 20 to 12500 Hz for Vi(rms) = 0.2 V Gv = −30 to +15 dB − 0.1 0.3 % for Vi(rms) = 1 V Gv = −30 to 0 dB − 0.1 0.3 % Gv = −30 to −6 dB − 0.1 0.3 % αcs(l-r) stereo channel separation f = 10 kHz; Gv = 0 dB; opposite input grounded by 1 kΩ resistor − 75 − dB αct(bus) crosstalk from I2C-bus to AF outputs V bus(p-p) α bus = 20 log --------------------V o(rms) Gv = 0 dB − 100 − dB Gv = 0 dB; Vripple(rms) < 200 mV − 55 − dB THD ≤ 0.5%; RL > 5 kΩ 2 − − V 5 − − kΩ start of reset − − 2.5 V end of reset 5.2 6.0 6.8 V start of reset 4.4 5.2 6.0 V for Vi(rms) = 2 V (Vbus = spurious I2C-bus signal voltage on AF output) PSRR100 power supply ripple rejection with 100 Hz ripple SCART output (pins SCOUTR and SCOUTL) Vo(max)(rms) maximum output signal (RMS value) Ro(L) output load resistor Power-on reset VPONR increasing supply voltage decreasing supply voltage 2001 Jul 11 10 Philips Semiconductors Product specification Universal hi-fi audio processor for TV SYMBOL PARAMETER TDA9859 CONDITIONS MIN. TYP. MAX. UNIT I2C-bus (pins SCL and SDA) VIH HIGH-level input voltage VIL LOW-level input voltage II input current VACK output voltage with acknowledge at pin SDA − VP 0 − 1.5 V − − ±10 µA − − 0.4 V 3 ISDA = −3 mA V Module address (pin MAD) VIL LOW-level input voltage 0 − 1.5 V VIH HIGH-level input voltage 3 − VP V − − 0.3 V − − 1 mA Port outputs (open-collector outputs pins P1 and P2) VOL LOW-level output voltage IO(sink) port output sink current 2001 Jul 11 IO(sink) = 1 mA 11 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 I2C-BUS PROTOCOL This circuit operates as a slave receiver only. For more information about the I2C-bus, see “The I2C-bus and how to use it”, order number 9398 393 40011. I2C-bus format S SLAVE ADDRESS W A SUBADDRESS A DATA(1) A(1) P Note 1. Multiple DATA-A (acknowledge) sequences may occur. Table 1 Explanation of I2C-bus format NAME DESCRIPTION S START condition (SCL HIGH, SDA HIGH-to-LOW) SLAVE ADDRESS 100 0000 (MAD = LOW) or 100 0001 (MAD = HIGH) W 0 A acknowledge (SDA = LOW); generated by the device SUBADDRESS subaddress (byte); see Table 2 DATA(1) data byte; see Table 2 P STOP condition (SCL = HIGH, SDA = LOW-to-HIGH) Note 1. If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed by the device. Table 2 I2C-bus transmission SUBADDRESS DATA BITS FUNCTION BINARY HEX D7 D6 D5 D4 D3 D2 D1 D0 Loudspeaker channel Volume control common 0000 0000 00 0 0 V05 V04 V03 V02 V01 V00 Volume control left 0000 0001 01 0 0 0 VL4 VL3 VL2 VL1 VL0 Volume control right 0000 0010 02 0 0 0 VR4 VR3 VR2 VR1 VR0 Bass control 0000 0011 03 0 0 0 BA4 BA3 BA2 BA1 BA0 Treble control 0000 0100 04 0 0 0 0 TR3 TR2 TR1 TR0 SCART output(1) 0000 1000 08 0 MU1 P1 P2 I13 I12 I11 I10 Loudspeaker output 0000 1001 09 EF2 MU2 EF1 ST I23 I22 I21 I20 Switching control byte Note 1. If auto-increment of the subaddress is used, it is necessary to insert three dummy data words between the treble control byte and the switching control bytes. 2001 Jul 11 12 Philips Semiconductors Product specification Universal hi-fi audio processor for TV Table 3 TDA9859 Function of the bits in Table 2 BITS FUNCTION V00 to V05 volume control common for loudspeaker channel; see Table 9 VL0 to VL4 volume control for left loudspeaker channel; see Table 6 VR0 to VR4 volume control for right loudspeaker channel; see Table 6 BA0 to BA4 bass control for left and right loudspeaker channels; see Table 7 TR0 to TR3 treble control for left and right loudspeaker channels; see Table 8 I10 to I13 input selection for SCART channels; see Table 4 I20 to I23 input selection for loudspeaker channels; see Table 4 MU1 and MU2 mute control bits (MU1 for SCART channel, MU2 for loudspeaker channel) 0 = channel not muted 1 = channel muted EF1, EF2 and ST effect control bits for loudspeaker channel; see Table 5 P1 and P2 control bits for ports P1 and P2 control bit = 0: port output = LOW-level control bit = 1: port output = HIGH-level Table 4 Input selection BITS OF DATA BYTE 8 AND 9 INPUT HEX D7 D6 D5 D4 D3 D2 D1 D0 AUX LEFT XB(1) (1) MU (1) (1) 1 0 1 1 AUX RIGHT X9(1) (1) MU (1) (1) 1 0 0 1 AUX STEREO X7(1) (1) MU (1) (1) 0 1 1 1 SCART LEFT XA(1) (1) MU (1) (1) 1 0 1 0 SCART RIGHT X5(1) (1) MU (1) (1) 0 1 0 1 SCART STEREO X6(1) (1) MU (1) (1) 0 1 1 0 MAIN LEFT XC(1) (1) MU (1) (1) 1 1 0 0 MAIN RIGHT XD(1) (1) MU (1) (1) 1 1 0 1 MAIN STEREO X8(1) (1) MU (1) (1) 1 0 0 0 Note 1. Byte 8 (SCART channels): The value of X depends on MU1 and control bits P1 and P2. Byte 9 (loudspeaker channels): see Table 5 for the programming of these bits. The value of X depends on the selected effects and MU2. 2001 Jul 11 13 Philips Semiconductors Product specification Universal hi-fi audio processor for TV Table 5 TDA9859 Effect controls DATA BYTE TO SUBADDRESS 09 SETTING SPECIAL EFFECTS HEX EF2 MU2 ST I23 I22 I21 I20 1 1 (1) (1) (1) (1) 1 1 (1) (1) (1) (1) 0 1 (1) (1) (1) (1) 0 1 0 (1) (1) (1) (1) 0 0 0 (1) (1) (1) (1) Stereo with spatial effect 1 (52%) BX(1) 1 0 Stereo with spatial effect 2 (30%) 3X(1) 0 0 Stereo without spatial effect 1X(1) 0 0 Forced mono with pseudo stereo 2X(1) 0 Forced mono without pseudo stereo 0X(1) 0 EF1 Note 1. The value of X depends on the selected input (see Table 4). Table 6 Volume control left/right Table 7 DATA BITS Gv (dB) 0 DATA BITS VL4 VL3 VL2 VL1 VL0 Gv (dB) VR4 VR3 VR2 VR1 VR0 +15 1 1 1 1 1 +13.5 18 1 1 0 0 0 17 1 0 1 1 1 HEX 1F Bass control HEX BA4 BA3 BA2 BA1 BA0 19 1 1 0 0 1 −1 1E 1 1 1 1 0 +12 −2 1D 1 1 1 0 1 +10.5 16 1 0 1 1 0 −3 1C 1 1 1 0 0 +9 15 1 0 1 0 1 14 1 0 1 0 0 −4 1B 1 1 0 1 1 +7.5 −5 1A 1 1 0 1 0 +6 13 1 0 0 1 1 −6 19 1 1 0 0 1 +4.5 12 1 0 0 1 0 −7 18 1 1 0 0 0 +3 11 1 0 0 0 1 10 1 0 0 0 0 0F 0 1 1 1 1 −8 17 1 0 1 1 1 +1.5 −9 16 1 0 1 1 0 0 −10 15 1 0 1 0 1 0 0E 0 1 1 1 0 0D 0 1 1 0 1 0C 0 1 1 0 0 −11 14 1 0 1 0 0 −1.5 −12 13 1 0 0 1 1 −3 −13 12 1 0 0 1 0 −4.5 0B 0 1 0 1 1 0A 0 1 0 1 0 −14 11 1 0 0 0 1 −6 −15 10 1 0 0 0 0 −7.5 09 0 1 0 0 1 −16 0F 0 1 1 1 1 −9 08 0 1 0 0 0 07 0 0 1 1 1 06 0 0 1 1 0 −17 0E 0 1 1 1 0 −10.5 −18 0D 0 1 1 0 1 −12 −19 0C 0 1 1 0 0 −20 0B 0 1 0 1 1 −21 0A 0 1 0 1 0 −22 09 0 1 0 0 1 −23 08 0 1 0 0 0 Mute 07 0 0 1 1 1 2001 Jul 11 14 Philips Semiconductors Product specification Universal hi-fi audio processor for TV Table 8 TDA9859 Treble control DATA BITS Gv (dB) HEX 0 TR3 TR2 TR1 +12 0A 0 1 0 +9 09 0 1 0 +6 08 0 1 +3 07 0 DATA BITS TR0 Gv (dB) HEX V05 V04 V03 V02 V01 V00 1 0 −7 29 1 0 1 0 0 1 0 1 −8 28 1 0 1 0 0 0 0 0 0 −9 27 1 0 0 1 1 1 0 1 1 1 −10 26 1 0 0 1 1 0 0 06 0 0 1 1 0 −11 25 1 0 0 1 0 1 −3 05 0 0 1 0 1 −12 24 1 0 0 1 0 0 −6 04 0 0 1 0 0 −13 23 1 0 0 0 1 1 −9 03 0 0 0 1 1 −14 22 1 0 0 0 1 0 −12 02 0 0 0 1 0 −15 21 1 0 0 0 0 1 −16 20 1 0 0 0 0 0 −17 1F 0 1 1 1 1 1 −18 1E 0 1 1 1 1 0 1D 0 1 1 1 0 1 Table 9 Volume control common DATA BITS Gv (dB) HEX V05 V04 V03 V02 V01 V00 −19 +15 3F 1 1 1 1 1 1 −20 1C 0 1 1 1 0 0 +14 3E 1 1 1 1 1 0 −21 1B 0 1 1 0 1 1 1A 0 1 1 0 1 0 +13 3D 1 1 1 1 0 1 −22 +12 3C 1 1 1 1 0 0 −23 19 0 1 1 0 0 1 +11 3B 1 1 1 0 1 1 −24 18 0 1 1 0 0 0 17 0 1 0 1 1 1 +10 3A 1 1 1 0 1 0 −25 +9 39 1 1 1 0 0 1 −26 16 0 1 0 1 1 0 +8 38 1 1 1 0 0 0 −27 15 0 1 0 1 0 1 14 0 1 0 1 0 0 +7 37 1 1 0 1 1 1 −28 +6 36 1 1 0 1 1 0 −29 13 0 1 0 0 1 1 +5 35 1 1 0 1 0 1 −30 12 0 1 0 0 1 0 +4 34 1 1 0 1 0 0 −31 11 0 1 0 0 0 1 10 0 1 0 0 0 0 0F 0 0 1 1 1 1 +3 33 1 1 0 0 1 1 −32 +2 32 1 1 0 0 1 0 −33 +1 31 1 1 0 0 0 1 −34 0E 0 0 1 1 1 0 0D 0 0 1 1 0 1 0 30 1 1 0 0 0 0 −35 −1 2F 1 0 1 1 1 1 −36 0C 0 0 1 1 0 0 −2 2E 1 0 1 1 1 0 −37 0B 0 0 1 0 1 1 0A 0 0 1 0 1 0 −3 2D 1 0 1 1 0 1 −38 −4 2C 1 0 1 1 0 0 −39 09 0 0 1 0 0 1 −5 2B 1 0 1 0 1 1 −40 08 0 0 1 0 0 0 −6 2A 1 0 1 0 1 0 2001 Jul 11 15 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 MHA311 0 handbook, full pagewidth (1) phase (degree) (2) −100 (3) −200 −300 −400 10 102 103 104 (1) Normal effect; CPS1 = CPS2 = 15 nF. (2) Intensified effect; CPS1 = 47 nF; CPS2 = 5.6 nF. (3) More intensified effect; CPS1 = 68 nF; CPS2 = 5.6 nF. Fig.4 Pseudo stereo effect (phase) as a function of frequency. 2001 Jul 11 16 f (Hz) 105 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 PACKAGE OUTLINES SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 ME seating plane D A2 A A1 L c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT232-1 2001 Jul 11 EUROPEAN PROJECTION 17 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-08-01 SOT307-2 2001 Jul 11 EUROPEAN PROJECTION 18 Philips Semiconductors Product specification Universal hi-fi audio processor for TV Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). WAVE SOLDERING There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Through-hole mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Surface mount packages Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 2001 Jul 11 TDA9859 19 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING − suitable BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable − HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable(3) suitable − PLCC(4), SO, SOJ suitable suitable − suitable − suitable − recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Jul 11 20 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective specification Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary specification Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product specification Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Jul 11 21 Philips Semiconductors Product specification Universal hi-fi audio processor for TV TDA9859 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2001 Jul 11 22 Philips Semiconductors Product specification Universal hi-fi audio processor for TV NOTES 2001 Jul 11 23 TDA9859 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/03/pp24 Date of release: 2001 Jul 11 Document order number: 9397 750 08551