REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. --les 05-01-18 Raymond Monnin B Update drawing to current MIL-PRF-38535 requirements. -jt 14-10-20 C.SAFFLE THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil David W. Queenan STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DRAWING APPROVAL DATE 85-07-08 REVISION LEVEL B MICROCIRCUITS, DIGITAL, LOW POWER SCHOTTKY TTL, MAGNITUDE COMPARATOR, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 84151 1 OF 9 5962-E020-15 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84151 01 R A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number 01 Circuit function 54LS682 8-bit magnitude comparator 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter R S 2 Descriptive designator GDIP1-T20 or CDIP2-T20 GDFP2-F20 or CDFP3-F20 CQCC1-N20 Terminals Package style 20 20 20 dual-in-line flat square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range ....................................................... Input voltage range ....................................................... Storage temperature range ............................................. Maximum power dissipation (PD) 1/ .............................. Lead temperature (soldering, 10 seconds) ..................... Thermal resistance, junction-to-case (θJC) ..................... Junction temperature (TJ) ................................................ -0.5 V dc to +7.0 V dc -1.5 V dc at -18 mA to +7.0 V dc -65°C to +150°C 385 mW +300°C See MIL-STD-1835 +175°C 1.4 Recommended operating conditions. Supply voltage (VCC) ...................................................................... Minimum high level input voltage (VIH) ......................................... Maximum low level input voltage (VIL) .......................................... Case operating temperature range (TC) …………………………….. -4.5 V dc minimum to 5.5 V dc maximum 2.0 V dc 0.7 V dc -55°C to +125°C _________ 1/ Maximum power dissipation is defined as VCC x ICC, and must withstand the added PD due to short-circuit test; e.g., IOS. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 3 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturer’s QM plan, the “QD” certification mark shall be used in place of the "Q" or "QML" certification mark. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max High level output voltage VOH VCC = 4.5 V, IOH = -0.4 mA 1, 2, 3 All Low level output voltage VOL VCC = 4.5 V, IOL = 12 mA 1, 2, 3 All 0.4 V Input clamp voltage VI C VCC = 4.5 V, IIN = -18 mA 1 All -1.5 V High level input current IIH1 VCC = 5.5 V, VIN = 2.7 V 1, 2, 3 All 20 µA IIH2 VCC = 5.5 V, VIN = 5.5 V 1, 2, 3 All 100 µA Low level input current IIL VCC = 5.5 V, VIN = 0.4 V 1, 2, 3 All -400 µA Short circuit output current IOS VCC = 5.5 V, VOUT = 0.0 V 1/ 1, 2, 3 All -130 mA Supply current ICC VCC = 5.5 V, inputs grounded, outputs open 1, 2, 3 All 70 mA High level output current IOH 1, 2, 3 All -400 µA Low level output current IOL 1, 2, 3 All 12 mA Propagation delay time, tPLH1 9 All 25 ns VCC = 5.0 V, CL = 50 pF ±10%, P to P = Q tPHL1 10, 11 RL = 667 Ω ±5% 9 tPLH2 9 All tPHL2 9 All tPLH3 9 All tPHL3 9 tPLH4 9 All tPHL4 9 All ns 30 ns 30 ns 30 ns 42 All 10, 11 1/ 25 42 10, 11 Q to P > Q ns 42 10, 11 Propagation delay time, 25 35 All 10, 11 P to P > Q ns 35 10, 11 Propagation delay time, 25 35 10, 11 Q to P = Q -20 V 35 10, 11 Propagation delay time, 2.5 30 ns 42 Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed one second. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 5 Device type Case outlines Terminal number 1 01 R and S Terminal symbol 2 Terminal symbol P>Q P0 Q0 P1 Q1 P2 Q2 P3 Q3 GND P4 Q4 P5 Q5 P6 Q6 P7 Q7 P>Q P0 Q0 P1 Q1 P2 Q2 P3 Q3 GND P4 Q4 P5 Q5 P6 Q6 P7 Q7 P=Q VCC P=Q VCC 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 FIGURE 1. Terminal connections. INPUTS DATA PQ P=Q P>Q P<Q X OUTPUTS P=Q L H H H P>Q H L H H H = high level L = low level X = irrelevant FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 6 FIGURE 3. Logic diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 7 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Additional electrical subgroups for group C periodic inspections Subgroups (in accordance with MIL-STD-883, method 5005, table I) --1*, 2, 3, 9 1, 2, 3, 7, 9 1, 2, 3 10, 11 ** * PDA applies to subgroup 1. ** Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 8 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 84151 A REVISION LEVEL B SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 14-10-20 Approved sources of supply for SMD 84151 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 8415101RA 8415101SA 84151012A Vendor CAGE number 01295 01295 01295 Vendor similar PIN 2/ SNJ54LS682J SNJ54LS682W SNJ54LS682FK 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 01295 Vendor name and address Texas Instruments, Inc. Semiconductor Group 8505 Forest Ln. PO Box 660199 Dallas, TX 75243 POC U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.