REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. Delete 1.5 and make change to 4.4.1b. - ro 06-06-14 R. MONNIN B Update drawing to current MIL-PRF-38535 requirements. Remove class M references. - jt 14-06-19 C. SAFFLE REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY LARRY E. SHAW STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY TUAN D. NGUYEN APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A RAY L. MONNIN DRAWING APPROVAL DATE 97-03-14 REVISION LEVEL B MICROCIRCUIT, DIGITAL, BIPOLAR, LOWPOWER SCHOTTKY TTL, 4-BIT MAGNITUDE COMPARATORS, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-97547 1 OF 12 5962-E321-14 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 97547 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q E A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identify the circuit function as follows: Device type Generic number 01 Circuit function 54LS85 4-bit magnitude comparators 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter E F 2 Descriptive designator GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 Terminals 16 16 20 Package style Dual-in-line Flat pack Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 2 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) ............................................................. Input voltage (VI) ............................................................................... Operating free-air temperature range ............................................... Maximum power dissipation (PD) ..................................................... Storage temperature range .............................................................. Junction temperature (TJ) ................................................................ 7.0 V dc 7.0 V dc -55°C to +125°C 140 mW -65°C to +150°C 150°C Thermal resistance, junction-to-case (θJC) ....................................... See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) .............................................................. +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) ............................................ +2.0 V Maximum low level input voltage (VIL) .............................................. +0.7 V Maximum high level output current (IOH) ......................................... -400 µA Maximum low level output current (IOL) ............................................ +4 mA Case operating temperature range (TC) .......................................... -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _____ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCC range and case temperature range of -55°C to +125°C. Unused inputs must be held high or low. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Conditions -55°C ≤ TC ≤ +125°C Symbol Group A subgroups 4.5 V ≤ VCC ≤ 5.5 V Device type unless otherwise specified Limits 1/ Min Unit Max Input clamp voltage VIK II = -18 mA, VCC = 4.5 V 1,2,3 01 Short circuit output current IOS 2/ VCC = 5.5 V 1,2,3 01 -20 High level output voltage VOH IOH = -400 µA, VCC = 4.5 V, 1,2,3 01 2.5 1,2,3 01 0.4 V 1,2,3 01 0.1 mA -1.5 V -100 mA V VIL = 0.7 V, VIH = 2 V Low level output voltage VOL IOL = 4 mA, VCC = 4.5 V, VIL = 0.7 V, VIH = 2 V Input current at maximum input voltage II VI = 7 V, VCC = 5.5 V, A < B, A > B inputs 0.3 VI = 7 V, VCC = 5.5 V, all other inputs High level input current IIH 1,2,3 VI = 2.7 V, VCC = 5.5 V, 01 20 µA A < B, A > B inputs 60 VI = 2.7 V, VCC = 5.5 V, all other inputs Low level input current IIL 1,2,3 VI = 0.4 V, VCC = 5.5 V, 01 -0.4 mA A < B, A > B inputs -1.2 VI = 0.4 V, VCC = 5.5 V, all other inputs Supply current Functional test ICC VI = 4.5 V, VCC = 5.5 V 3/ VCC = 4.5 V, 4/ 1,2,3 01 7,8 01 20 L H L H mA VIN = VIH min or VIL max, verify output VO, see 4.4.1b VCC = 5.5 V, 4/ VIN = VIH min or VIL max, verify output VO, see 4.4.1b See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions -55°C ≤ TC ≤ +125°C Number of gate levels 4.5 V ≤ VCC ≤ 5.5 V Group A subgroups device type 01 unless otherwise specified Propagation delay time, low-to-high level output, tPLH any A or B data input Limits 1/ Min 9 Unit Max VCC = 5 V, TA = +25°C, 5/ 1 36 CL = 15 pF, RL = 2 kΩ, 2 36 to output A < B, A > B 3 36 VCC = 5 V, TA = +25°C, 5/ 4 45 ns CL = 15 pF, RL = 2 kΩ, to output A = B Propagation delay time, high-to-low level output, tPHL any A or B data input VCC = 5 V, TA = +25°C, 5/ 1 9 30 CL = 15 pF, RL = 2 kΩ, 2 30 to output A < B, A > B 3 30 VCC = 5 V, TA = +25°C, 5/ 4 45 ns CL = 15 pF, RL = 2 kΩ, to output A = B Propagation delay time, low-to-high level output, tPLH 1 9 22 ns 1 9 17 ns 2 9 20 ns 2 9 26 ns CL = 15 pF, RL = 2 kΩ, A < B or A = B input Propagation delay time, high-to-low level output, VCC = 5 V, TA = +25°C, 5/ to output A > B tPHL VCC = 5 V, TA = +25°C, 5/ CL = 15 pF, RL = 2 kΩ, A < B or A = B input to output A > B Propagation delay time, low-to-high level output, A = B input tPLH Propagation delay time, high-to-low level output, A = B input tPHL VCC = 5 V, TA = +25°C, 5/ CL = 15 pF, RL = 2 kΩ, to output A = B VCC = 5 V, TA = +25°C, 5/ CL = 15 pF, RL = 2 kΩ, to output A = B See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type VCC = 5 V, TA = +25°C, 5/ 1 9 22 ns 1 9 17 ns Limits 1/ Min Propagation delay time, low-to-high level output, tPLH A > B or A = B input Max CL = 15 pF, RL = 2 kΩ, A > B or A = B input Propagation delay time, high-to-low level output, Unit to output A < B tPHL VCC = 5 V, TA = +25°C, 5/ CL = 15 pF, RL = 2 kΩ, to output A < B 1/ For negative and positive voltage and current values, the sign designates the potential difference in reference to GND and the direction of current flow, respectively, and the absolute value of the magnitude, not the sign, is relative to the minimum and maximum limits, as applicable, listed herein. 2/ Not more than one output should be shorted at a time, and the duration of the short-circuit should not exceed one second. 3/ ICC is measured with outputs open, A = B grounded, and all other inputs at 4.5 V. 4/ Tests shall be performed in sequence, attributes data only. Functional tests shall include the truth table and other logic patterns used for fault detection. The test vectors used to verify the truth table shall, at a minimum, test all functions of each input and output. All possible input to output logic patterns per function shall be guaranteed, if not tested, to the truth table in figure 2 herein. Functional tests shall be performed in sequence as approved by the qualifying activity on qualified devices. Allowable tolerances per MIL-STD-883 may be incorporated. For outputs L ≤ 0.8 V, H ≥ 2.0 V. 5/ Test circuit and timing waveforms are shown in figure 4. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 7 Device type Case outlines Terminal number 01 E and F 2 Terminal symbol 1 B3 NC 2 A < B in B3 3 A = B in A < B in 4 A > B in A = B in 5 A > B out A > B in 6 A = B out NC 7 A < B out A > B out 8 GND A = B out 9 B0 A < B out 10 A0 GND 11 B1 NC 12 A1 B0 13 A2 A0 14 B2 B1 15 A3 A1 16 VCC NC 17 --- A2 18 --- B2 19 --- A3 20 --- VCC NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 8 COMPARING CASCADING INPUTS INPUTS OUTPUTS A3, B3 A2, B2 A1, B1 A0, B0 A>B A<B A=B A>B A<B A=B A3 > B3 X X X X X X H L L A3 < B3 X X X X X X L H L A3 = B3 A2 > B2 X X X X X H L L A3 = B3 A2 < B2 X X X X X L H L A3 = B2 A2 = B2 A1 > B1 X X X X H L L A3 = B3 A2 = B2 A1 < B1 X X X X L H L A2 = B3 A2 = B2 A1 = B1 A0 > B0 X X X H L L A3 = B3 A2 = B2 A1 = B1 A0 < B0 X X X L H L A3 = B3 A2 = B2 A1 = B1 A0 = B0 H L L H L L A3 = B3 A2 = B2 A1 = B1 A0 = B0 L H L L H L A3 = B3 A2 = B2 A1 = B1 A0 = B0 X X H L L H A3 = B3 A2 = B2 A1 = B1 A0 = B0 H H L L L L A3 = B3 A2 = B2 A1 = B1 A0 = B0 L L L H H L H = High level voltage L = Low level voltage X = Irrelevant FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 9 NOTES: 1. CL includes probe and jig capacitance. 2. All diodes are 1N3064 or equivalent FIGURE 3. Test circuit and timing waveforms. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. c. Subgroups 4, 5, 6, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 11 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) Device Device class Q class V ----1,2,3, 1/ 7,8,9 1,2,3,7,8,9 1,2,3, 2/ 7,8,9 1,2,3,7,8,9 1,2,3 1,2,3,7,8,9 1,2,3 1,2,3 --- --- 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 12 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-97547 A REVISION LEVEL B SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 14-06-19 Approved sources of supply for SMD 5962-97547 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9754701QEA 01295 SNJ54LS85J 5962-9754701QFA 01295 SNJ54LS85W 5962-9754701Q2A 01295 SNJ54LS85FK 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 01295 Vendor name and address Texas Instruments, Inc. Semiconductor Group 8505 Forest Ln. P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.