REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to table I: Change ICL conditions from 40 V to 30 V; Rise time delay, inverting and non-inverting, change max limits from 150 to 205; Fall time delay, change non-inverting input to output, max limit from 80 to 145; Analog shutdown delay time, change max limit from 200 to 230. 87-12-10 M. A. Frye B Changes in accordance with NOR 5962-R056-92. 91-11-27 M. A. Frye C Changes in accordance with NOR 5962-R234-92. 92-08-10 M. A. Frye D Changes in accordance with NOR 5962-R122-93. 93-04-02 M. A. Frye E Update boilerplate to add device class N. Add case outline X. Editorial changes throughout. Redrawn. - rrp 97-09-30 R. Monnin F Add case outline Y. Changes to 1.2.4, 1.3, and figure 1. - rrp 99-02-23 R. Monnin G Drawing updated to reflect current requirements. - ro 02-11-07 R. Monnin H Add device type 03. Add case outline F. Changes to 1.2.2, 1.2.4, 1.3, 1.4, Table I, figure 1, figure 2, Table IIA. Add table IIB. -rrp 11-03-22 C. Saffle J Sheet 8, figure 1, add device type 03 to the case outline 2 column. - drw 16-04-01 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Marcia B. Kelleher STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY D. A. DiCenzo APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A N. A. Hauck DRAWING APPROVAL DATE MICROCIRCUIT, LINEAR, POWER DRIVER DUAL CHANNEL, MONOLITHIC SILICON 87-07-13 REVISION LEVEL J SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-87619 1 OF 13 5962-E153-16 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes M and Q), and nontraditional performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for the application environment. 1.2 PIN. The PIN is as shown in the following example: For device classes M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 87619 01 E A Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device classes N or V: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 87619 03 V E A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number 01 02 03 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Circuit function UC1707 UC2707 UC1707-SP Dual-channel power driver Dual-channel power driver Dual-channel power driver SIZE 5962-87619 A REVISION LEVEL J SHEET 2 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with a nontraditional performance environment (encapsulated in plastic) Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835, JEDEC Publication 95, as follows: Outline letter E F 2 X Y Descriptive designator GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 MS-001 BB MS-013 AA Terminals 16 16 20 16 16 Package style Document Dual-in-line Flat pack Square leadless chip carrier Plastic dual-in-line Plastic SOIC MIL-STD-1835 MIL-STD-1835 MIL-STD-1835 JEDEC Publication 95 JEDEC Publication 95 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VIN) .................................................................................... +40 V dc Collector supply voltage (VC) ...................................................................... +40 V dc Output current (each output, source or sink): Steady state ............................................................................................. ±500 mA Peak transient .......................................................................................... ±1.0 A (for cases E, F, and 2) ±1.5 A (for cases X and Y) Capacitive discharge energy ....................................................................... 15 μJ (for cases E, F, and 2) 20 μJ (for cases X and Y) Digital inputs ................................................................................................ +5.5 V dc 2/ Analog stop inputs ....................................................................................... VIN V dc Power dissipation (PD): TA = +25°C .............................................................................................. 1 W (for cases E, F, and 2) 3/ 2 W ( for cases X and Y) TC = +25°C .............................................................................................. 2 W (for cases E, F, and 2) 4/ 5 W (for cases X and Y) Storage temperature range (TS) ................................................................. -65°C to +150°C Lead temperature (soldering, 10 seconds) .................................................. +300°C Thermal resistance, junction-to-case (θJC): Cases E, F, and 2 .................................................................................... See MIL-STD-1835 ________ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Digital drive can exceed 5.5 V if input current is limited to 10 mA. 3/ Derate at 10 mW/°C above TA = +50°C. 4/ Derate at 16 mW/°C above TC = +25°C. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 3 1.4 Recommended operating conditions. Supply voltage (VIN) .................................................................................... Collector supply voltage (VC) ....................................................................... Digital inputs ................................................................................................ Analog inputs .............................................................................................. Ambient operating temperature range (TA): Device types 01 and 03 ........................................................................... Device type 02 ......................................................................................... +5 V to +40 V +5 V to +40 V 0 V to 5 V 0 V to VIN -55°C to +125°C -25°C to +85°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONICS INDUSTRIES ALLIANCE (EIA) JEP 95 - Registered and Standard Outlines for Semiconductor Devices (Copies of this document are available online at www.jedec.org/ or from the JEDEC – Solid State Technology Association, th 3103 North 10 Street, Suite 240-S, Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 4 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes N, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes N, Q, and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes N, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 53 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 5 TABLE I. Electrical performance characteristics. Test Conditions 1/ -55°C ≤ TA ≤ +125°C Symbol VIN = VC = 20 V Group A subgroups Device type unless otherwise specified Limits Min Unit VIN supply current ICC(IN) VIN = 40 V 1, 2, 3 All Max 15 mA VC supply current ICC(C) VC = 40 V, outputs low 1, 2, 3 All 7.5 mA VC leakage current ICL VIO = 0 V, VC = 30 V 1, 2, 3 All 0.1 mA Digital input low level voltage Digital input high level voltage Input current VIL 1, 2, 3 All 0.8 V VIH 1, 2, 3 All II VI = 0 V 1, 2, 3 All -1.0 mA Input leakage current IIL VI = 5 V 1, 2, 3 All 0.1 mA Output high saturation voltage, (VC – VO) VCO(SAT) IO = -50 mA 1, 2, 3 All 2.0 V 2.2 2.5 IO = -500 mA Output low saturation voltage VO(SAT) 1, 2, 3 IO = 50 mA All 0.4 VAT 0 V ≤ VCM ≤ 15 V 1, 2, 3 01, 02 100 150 03 All 90 150 Input bias current IIB VCM = 0 V 1, 2, 3 Shutdown threshold voltage Latch disable threshold voltage Rise time delay 2/ VSHUTDOWN SHUTDOWN pin input 1, 2, 3 All VDISABLE LATCH DISABLE pin input 1, 2, 3 All tr(delay) Inverting input to output 9, 10, 11 01, 03 Non-inverting input to output Fall time delay 2/ tf(delay) V 2.5 IO = 500 mA Analog threshold voltage V Inverting input to output mV -20 µA 0.4 2.2 V 0.8 2.2 V 145 ns 205 9, 10, 11 01, 03 Non-inverting input to output 80 ns 145 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 6 TABLE I. Electrical performance characteristics – continued. Test Rise time Conditions 1/ -55°C ≤ TA ≤ +125°C VIN = VC = 20 V Group A subgroups Device type unless otherwise specified Inverting input to output, 9, 10, 11 01, 03 Symbol tr Limits Min Unit Max 70 ns CL = 2.2 nF Non-inverting input to output, CL = 2.2 nF Fall time tf 70 Inverting input to output, 9, 10, 11 01, 03 70 ns CL = 2.2 nF Non-inverting input to output, CL = 2.2 nF 70 Analog shutdown delay time tshut(A) Stop (+) ref. = 0 V, Stop (-) input = 0 V to 0.5 V 9, 10, 11 01, 03 190 ns Digital shutdown delay time Functional test tshut Shutdown pin = 2 V 9, 10, 11 01, 03 60 ns 7, 8 All 1/ 2/ See 4.4.1c For device type 02, -25°C ≤ TA ≤ +85°C. Delay is measured to 10 percent output change. 4. VERIFICATION 4.1 Sampling and inspection. For device classes N, Q, and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes N, Q, and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. Interim and final electrical test parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 7 Device types 01, 03 02 01, 03 03 Case outlines E X and Y 2 F NC INPUT B INVERTING INPUT B NONINVERTING LATCH DISABLE Terminal number 1 Terminal number 3 INPUT B INVERTING INPUT B NONINVERTING LATCH DISABLE INPUT B INVERTING INPUT B NONINVERTING LATCH DISABLE 4 GROUND GROUND INPUT B INVERTING INPUT B NONINVERTING LATCH DISABLE 5 GROUND GROUND GROUND GROUND 6 OUTPUT A OUTPUT A NC OUTPUT A 7 SHUTDOWN SHUTDOWN GROUND SHUTDOWN 8 +VCC +VCC OUTPUT A +VCC 9 ANALOG STOP (+) ANALOG STOP (+) SHUTDOWN ANALOG STOP (+) 10 ANALOG STOP (-) ANALOG STOP (-) +VCC ANALOG STOP (-) 11 OUTPUT B OUTPUT B NC OUTPUT B 12 GROUND GROUND ANALOG STOP (+) GROUND 13 GROUND GROUND ANALOG STOP (-) GROUND 14 +VIN +VIN OUTPUT B +VIN 15 INPUT A NONINVERTING INPUT A INVERTING --- GROUND 17 INPUT A NONINVERTING INPUT A INVERTING --- GROUND INPUT A NONINVERTING INPUT A INVERTING --- 18 --- --- +VIN --- 19 --- --- --- 20 --- --- INPUT A NONINVERTING INPUT A INVERTING 2 16 GROUND NC --- NOTES: All four ground terminals must be connected to common ground. NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 8 Each Channel INVERTING H L H L NONINVERTING H H L L OUTPUT L H L L OUTPUT = INVERTING and NONINVERTING OUTPUT = INVERTING or NONINVERTI NG Shutdown ANALOG STOP LOGIC X X 1 0 SHUTDOWN LATCH DISABLE 0 1 Open Open X X X 0 PREVIOUS STATE OF OUTPUT X X X Shutdown 0 0 Open Open 0 1 Normal X OUTPUT Follows input logic Low (Shutdown) Low (Shutdown) Latched Shutdown (See Note) Follows input logic Follows input logic NOTE: If the output was previously in Shutdown and Latch Disable was low and stays low, then even if the Analog Stop Logic is changed or the Shutdown pin is open, the outputs will remain in Shutdown. FIGURE 2. Truth tables. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 9 FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 10 4.2.2 Additional criteria for device classes N, Q, and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF38535, appendix B. 4.3 Qualification inspection for device classes N, Q, and V. Qualification inspection for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes N, Q, and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes N, Q, and V, subgroups 7 and 8 shall include verifying the functionality of the device. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 11 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 1 1 1 1,2,3,7,9 1/ 1,2,3,7,9 1/ 1,2,3,7,9 1/ 1,2,3,7,8 2/ 3/ 9,10,11 Group A test requirements (see 4.4) 1,2,3,7,8,9,10,11 1,2,3,7,8, 9,10,11 1,2,3,7,8, 9,10,11 1,2,3,7,8, 9,10,11 Group C end-point electrical parameters (see 4.4) 1,2,3 1,2,3 1,2,3 1,2,3,7,8, 9,10,11 Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) 1,2,3 1,2,3 1,2,3 1,2,3 Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Subgroups (in accordance with MIL-PRF-38535, table III) Device class N --- --- Device class Q Device class V --- 3/ --- 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 3/ Delta limits (see table IIB) shall be required and the delta values shall be computed with reference to the zero hour electrical parameters (see table I). TABLE IIB. Burn-in delta parameters and group C delta parameters. TA = +25°C Parameters Symbol Conditions Device type Delta limits VIN supply current ICC(IN) VIN = 40 V 03 ±1.5 mA VC supply current ICC(C) VC = 40 V 03 ±0.75 mA VCO(SAT) IO = 50 mA 03 ±0.2 V VO(SAT) IO = 50 mA 03 ±0.04 V IIB VCM = 0 V 03 2 µA Output high saturation voltage Output low saturation voltage Input bias current STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 12 4.4.2.2 Additional criteria for device classes N, Q, and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB, in accordance with MIL-PRF-38535, and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes N, Q, and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes N, Q, and V. Sources of supply for device classes N, Q, and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime -VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87619 A REVISION LEVEL J SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 16-04-01 Approved sources of supply for SMD 5962-87619 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8761901EA 01295 UC1707J/80900 3/ UC1707J/883B 01295 UC1707L/81032 3/ UC1707L/883B 5962-8761901VEA 01295 UC1707JQMLV 5962-8761901V2A 01295 UC1707LQMLV 5962-8761902NXB 3/ UC2707N 5962-8761902NYB 3/ UC2707DW/81249 5962-8761903VEA 01295 UC1707J-SP 5962-8761903VFA 01295 UC1707W-SP 5962-8761903V2A 01295 UC1707L-SP 5962-87619012A 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Page 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - continued DATE: 16-04-01 Vendor CAGE number Vendor name and address 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Ln. PO Box 660199 Dallas, TX 75243 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Page 2 of 2