REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R050-92. 91-11-19 Monica L. Poelking B Add case outline 2. Redraw the waveforms and add test circuit and notes to figure 4, switching waveforms and test circuit. Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - LTG 05-11-28 Thomas M. Hess C Update test condition of IOH and IOL values for High and Low output voltage to table I. Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - MAA 11-07-26 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Greg A. Pitz STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY D. A. DiCenzo APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE N. A. Hauck DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, OCTAL D-TYPE FLIP-FLOP WITH ENABLE, MONOLITHIC SILICON 87-05-15 REVISION LEVEL AMSC N/A C SIZE CAGE CODE A 14933 SHEET DSCC FORM 2233 APR 97 5962-87807 1 OF 12 5962-E436-11 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87807 01 R A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function 54HC377 Octal D-type flip-flop with enable 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter R 2 Descriptive designator Terminals GDIP1-T20 or CDIP2-T20 CQCC1-N20 Package style 20 20 Dual-in-line Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) ...................................................... -0.5 V dc to +7.0 V dc DC input voltage range (VIN) .................................................... -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) ............................................... -0.5 V dc to VCC + 0.5 V dc Clamp diode current ................................................................ 20 mA DC output current (per pin) ...................................................... 25 mA DC VCC or GND current (per pin) ............................................. 50 mA Storage temperature range (TSTG) ........................................... -65C to +150C Maximum power dissipation (PD) 2/ ......................................... 500 mW Lead temperature (soldering, 10 seconds) .............................. 260C Thermal resistance, junction-to-case (JC) ............................... See MIL-STD-1835 Junction temperature (TJ) ........................................................ 175C 1.4 Recommended operating conditions. Supply voltage range (VCC) ...................................................... +2.0 V dc to +6.0 V dc Input voltage range (VIN) .......................................................... 0.0 V dc to VCC Output voltage range (VOUT) .................................................... 0.0 V dc to VCC Case operating temperature range (TC) ................................... -55C to +125C Input rise or fall time (tr, tf ): VCC = 2.0 V ........................................................................... 0 to 1000 ns VCC = 4.5 V ........................................................................... 0 to 500 ns VCC = 6.0 V ........................................................................... 0 to 400 ns 1/ 2/ Unless otherwise specified, all voltages are referenced to ground. For TC = +100C to +125C, derate linearly at 12 mW/C. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 2 1.4 Recommended operating conditions - Continued. Minimum setup time, enable or input D to clock (ts): TC = +25C: VCC = 2.0 V ....................................................................... 100 ns VCC = 4.5 V ....................................................................... 20 ns VCC = 6.0 V ....................................................................... 17 ns TC = -55C to +125C: VCC = 2.0 V ....................................................................... 150 ns VCC = 4.5 V ....................................................................... 30 ns VCC = 6.0 V ....................................................................... 25 ns Minimum clock pulse width (tw): TC = +25C: VCC = 2.0 V ....................................................................... 100 ns VCC = 4.5 V ....................................................................... 20 ns VCC = 6.0 V ....................................................................... 17 ns TC = -55C to +125C: VCC = 2.0 V ....................................................................... 150 ns VCC = 4.5 V ....................................................................... 30 ns VCC = 6.0 V ....................................................................... 25 ns Minimum hold time, input D to clock (th1): TC = +25C: VCC = 2.0 V ....................................................................... 5 ns VCC = 4.5 V ....................................................................... 5 ns VCC = 6.0 V ....................................................................... 5 ns TC = -55C to +125C: VCC = 2.0 V ....................................................................... 5 ns VCC = 4.5 V ....................................................................... 5 ns VCC = 6.0 V ....................................................................... 5 ns Minimum hold time, enable to clock (th2): TC = +25C: VCC = 2.0 V ....................................................................... 5 ns VCC = 4.5 V ....................................................................... 5 ns VCC = 6.0 V ....................................................................... 5 ns TC = -55C to +125C: VCC = 2.0 V ....................................................................... 5 ns VCC = 4.5 V ....................................................................... 5 ns VCC = 6.0 V ....................................................................... 5 ns Maximum clock frequency (fMAX): TC = +25C: VCC = 2.0 V ....................................................................... 5 MHz VCC = 4.5 V ....................................................................... 25 MHz VCC = 6.0 V ....................................................................... 29 MHz TC = -55C to +125C: VCC = 2.0 V ....................................................................... 3 MHz VCC = 4.5 V ....................................................................... 16 MHz VCC = 6.0 V ....................................................................... 19 MHz STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 4 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Min High level output voltage VOH VIN = VIH minimum or VIL maximum IOH = -20 A VIN = VIH minimum or VIL maximum IOH = -4.0 mA VIN = VIH minimum or VIL maximum IOH = -5.2 mA Low level output voltage High level input voltage 2/ Low level input voltage 2/ Quiescent supply current Input leakage current Input capacitance VOL VIN = VIH minimum or VIL maximum IOL = + 20 A VCC = 2.0 V 1, 2, 3 All 4.4 VCC = 6.0 V 5.9 VCC = 4.5 V 3.7 VCC = 6.0 V 5.2 1, 2, 3 Max 1.9 VCC = 4.5 V VCC = 2.0 V V All 0.1 VCC = 4.5 V 0.1 VCC = 6.0 V 0.1 VIN = VIH minimum or VIL maximum IOL = +4.0 mA VCC = 4.5 V 0.4 VIN = VIH minimum or VIL maximum IOL = +5.2 mA VCC = 6.0 V 0.4 VIH VCC = 2.0 V All V 3.15 VCC = 6.0 V 4.2 1, 2, 3 All V 1.5 VCC = 4.5 V VCC = 2.0 V VIL 1, 2, 3 Unit 0.3 VCC = 4.5 V 0.9 VCC = 6.0 V 1.2 V ICC VCC = 6.0 V, VIN = VCC or GND 1, 2, 3 All 160 A IIN VCC = 6.0 V, VIN = VCC or GND 1, 2, 3 All 1.0 A CIN VCC = GND, TC = 25C See 4.3.1c 4 All 10.0 pF See 4.3.1d 7 All Functional tests See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Min Propagation delay time, clock to Qn 3/ tPHL, tPLH CL = 50 pF See figure 4 VCC = 2.0 V 9 VCC = 4.5 V VCC = 6.0 V All tTLH, tTHL CL = 50 pF See figure 4 VCC = 2.0 V VCC = 6.0 V 205 310 9 41 10, 11 62 9 35 9 VCC = 4.5 V Max 10, 11 10, 11 Transition time 4/ Unit ns 53 All 75 10, 11 110 9 15 10, 11 22 9 13 10, 11 19 ns 1/ For a power supply of 5.0 V 10%, the worst case output voltages (VOH and VOL) occur for HC at 4.5 V. Thus, the 4.5 V values should be used when designing with this supply. Worst cases VIH and VIL occur at VCC = 5.5 V and 4.5 V, respectively. (The VIH value at 5.5 V is 3.85 V). The worst case leakage currents (IIN and ICC) occur for CMOS at the higher voltage and so the 6.0 V values should be used. Power dissipation capacitance (CPD), typically 30 pF, determine 2 the no load dynamic power consumption, PD = CPD VCC f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. 2/ Tests are not required if applied as a forcing function for VOH and VOL. 3/ AC testing at VCC = 2.0 V and VCC = 6.0 V shall be guaranteed, if not tested, to the specified limits. 4/ Transition times (tTLH, tTHL), if not tested, shall be guaranteed to the specified limits. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 7 Device type All Case outlines R and 2 Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ENABLE G Q1 D1 D2 Q2 Q3 D3 D4 Q4 GND CLOCK Q5 D5 D6 Q6 Q7 D7 D8 Q8 VCC FIGURE 1. Terminal connections. Operating mode Clock Load “1” Load “0” Hold (do nothing) X Inputs Enable l l h H Dn h l Outputs Qn H L X X No change No change H = High voltage level steady state h = High voltage level one setup time prior to the low-to-high clock transition L = Low voltage level steady state l = Low voltage level one setup time prior to the low-to-high clock transition = Low-to-high clock transition X = Irrelevant FIGURE 2. Truth table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 8 FIGURE 3. Logic diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 9 NOTES: 1. CL = 50 pF minimum or equivalent (includes test jig and probe capacitance). 2. Input signal from pulse generator: VIN = 0.0 V to VCC; PRR 1 MHz; ZO = 50; tr = 6.0 ns; tf = 6.0 ns; tr and tf shall be measured from 0.1 VCC to 0.9 VCC and from 0.9 VCC to 0.1 VCC, respectively; duty cycle = 50 percent. 3. The outputs are measured one at a time with one transition per measurement. FIGURE 4. Switching waveforms and test circuit. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) ---1*, 2, 3, 9 1, 2, 3, 4, 7, 9, 10, 11 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CIN measurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHz. Test all applicable pins on 5 devices with zero failures. d. Subgroup 7 shall include verification of the truth table as specified on figure 2 herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 11 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990 or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime -VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87807 A REVISION LEVEL C SHEET 12 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 11-07-26 Approved sources of supply for SMD 5962-87807 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8780701RA 01295 SNJ54HC377J 5962-87807012A 01295 SNJ54HC377FK 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 01295 Vendor name and address Texas Instruments Incorporated Semiconductor Group 8505 Forest Ln. P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.