5962-9164001M2A SMD

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Changes in accordance with NOR 5962-R107-95.
95-04-12
M. A. Frye
B
Add case outline X. Update boilerplate. Editorial changes throughout. -rrp
98-02-19
Raymond Monnin
C
Update drawing to current requirements. Editorial changes throughout. - drw
05-02-01
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
REV
C
C
C
C
C
C
C
C
C
C
C
C
C
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
PMIC N/A
PREPARED BY
Rick C. Officer
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
Charles E. Besore
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, LINEAR, CMOS QUAD
DIFFERENTIAL LINE RECEIVER, MONOLITHIC
SILICON
91-09-11
AMSC N/A
REVISION LEVEL
C
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-91640
13
5962-E111-05
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
91640
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
M
E
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type. The device type identifies the circuit function as follows:
Device type
Generic number
01
Circuit function
26C32
CMOS quad differential line receiver
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
X
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
See figure 1
CQCC1-N20
Terminals
16
16
16
20
Package style
Dual-in-line
Flat pack
Flat pack
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
2
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC).......................................................................
Differential input voltage (VID) ...................................................................
Maximum current per output.....................................................................
Enable input voltage (VIN) .........................................................................
Power dissipation (PD): (TA = +25°C) 2/
Case E ..................................................................................................
Case F ..................................................................................................
Case X ..................................................................................................
Case 2...................................................................................................
Storage temperature range.......................................................................
Lead temperature (soldering, 4 seconds) .................................................
Junction temperature (TJ) .........................................................................
Thermal resistance, junction-to-case (θJC):
Cases E, F, and 2 .................................................................................
Case X ..................................................................................................
Thermal resistance, junction-to-ambient (θJA):
Case E ..................................................................................................
Case F ..................................................................................................
Case X ..................................................................................................
Case 2...................................................................................................
7.0 V dc
-11 V dc to +14 V dc
+25 mA
7.0 V dc
1375 mW
1000 mW
1339 mW
1700 mW
-65°C to +150°C
260°C
150°C
See MIL-STD-1835
9°C/W
+100°C/W
+150°C/W
+112°C/W
+85°C/W
1.4 Recommended operating conditions.
Supply voltage range (VCC) .......................................................................... 4.5 V dc to 5.5 V dc
Ambient operating temperature range (TA) .................................................. -55°C to +125°C
Input hysteresis (VHYST)................................................................................ 60 mV typical
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ 25°C, derate at a factor of 11 mW/°C for cases E and 2, and 8.9 mW/°C for case F and X.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 77 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
4.5 V ≤ VCC ≤ 5.5 V
Group A
subgroups
Device
type
unless otherwise specified
Limits
Min
Logical 1 input voltage
VIH
1,2,3
01
Logical 0 input voltage
VIL
1,2,3
01
Logical 1 output voltage
VOH
VID = +200 mV,
VCC = 4.5 V, IOUT = -6.0 mA
1,2,3
01
Logical 0 output voltage
VOL
VCC = 5.5 V, VID = -200 mV,
IOUT = 6.0 mA
1,2,3
01
Minimum differential input
voltage
VTH
VCC = 5.0 V, VOUT = VOH or
0.45 V, -7 V < VCM < +7 V
1,2,3
01
Input current (under test)
IIN
VIN = +10 V, VCC = 5.0 V,
other input = GND
1,2,3
01
Unit
Max
2.0
V
0.8
V
3.8
-200
VIN = -10 V, VCC = 5.0 V,
other input = GND
V
0.3
V
+200
mV
+1.8
mA
-2.7
IOZ
VOUT = VCC or GND,
ENABLE = VIL,
ENABLE = VIH
1,2,3
01
-5.0
+5.0
µA
II
VIN = 2.7 V to 0.4 V
1,2,3
01
-100
+20
µA
Input resistance
RIN
-7 V < VCM < +7 V,
one input ac GND
1,2,3
01
4.0
25
kΩ
Quiescent power supply
current
ICC
VID = +1 V, VCC = 5.5 V
1,2,3
01
25
mA
See 4.4.1c
7, 8
01
9, 10, 11
01
35
ns
Maximum three state output
leakage current
Maximum enable input
current
Functional tests
Propagation delay input to
output
tPLH
VCM = 0 V, CL = 50 pF,
VID = 2.5 V, See figure 5
tPHL
35
Output rise time
tR
VCM = 0 V, CL = 50 pF,
See figure 5
9, 10, 11
01
10
ns
Output fall time
tF
VCM = 0 V, CL = 50 pF,
See figure 5
9, 10, 11
01
9
ns
tPLZ
RL = 1 kΩ, CL = 50 pF,
VID = 2.5 V,
9,10,11
01
29
ns
Propagation delay enable to
output
tPHZ
1/
See figures 5 and 6
29
tPZL
29
tPZH
29
All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground
unless otherwise specified.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
5
Ltr
A
A1
b
C
D
E
E1
e
K
L
R
R1
S
S1
Inches
Millimeters
Min
.050
.004
.015
.004
--.400
.245
Max
.080
.012
.019
.008
.390
.420
.270
Min
1.27
0.10
0.38
0.10
--10.16
6.22
.012
.043
.017
.017
.018
---
0.20
0.94
0.33
0.33
--0.13
.050 BSC
.008
.037
.013
.013
--.005
Notes
Max
2.03
0.30
0.48
0.20
9.91
10.67
6.86
2
2
1.27 BSC
0.30
1.09
0.43
0.43
0.46
---
NOTES:
1. The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally
designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. Maximum limits may be increased by .003 inches after lead finish is applied.
FIGURE 1. Case outline X.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
6
Device type
01
Case outlines
E, F, and X
2
Terminal
number
1
INPUT A1-
NC
2
INPUT A2+
INPUT A1-
3
OUTPUT A
INPUT A2+
4
ENABLE
OUTPUT A
5
OUTPUT C
ENABLE
6
INPUT C2+
NC
7
INPUT C1-
OUTPUT B
8
GND
INPUT B2+
9
INPUT D1-
INPUT B1-
10
INPUT D2+
GND
11
OUTPUT D
NC
12
INPUT C1-
13
ENABLE
OUTPUT B
INPUT C2+
14
INPUT B2+
OUTPUT C
15
INPUT B1-
16
VCC
ENABLE
NC
17
---
OUTPUT D
18
---
INPUT D2+
19
---
INPUT D1-
20
---
VCC
Terminal symbol
NC = No connection
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
7
ENABLE
0
ENABLE
1
(See note)
INPUT
OUTPUT
X
VID ≥ VTH (max)
VID ≤ VTH (min)
Open
VTH (min) ≤ VID ≤ VTH (max)
HI-Z
1
0
1
INDETERMINATE
HI-Z = THREE STATE
X = Don’t care
NOTE: Input conditions may be any combination not defined for ENABLE and ENABLE.
FIGURE 3. Truth table.
FIGURE 4. Logic diagram.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
8
FIGURE 5. Timing waveforms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
9
NOTES:
CL includes load and test jig capacitance.
S1 = VCC for tPZL and tPLZ measurements.
S1 = GND for tPZH and tPHZ measurements.
FIGURE 6. Test circuit.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
10
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
11
TABLE II. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
Device
class V
1
---
1
1, 2, 3, 9 1/
1, 2, 3, 9 1/
1, 2, 3, 9 1/
1, 2, 3, 7, 8, 9, 10, 11
1, 2, 3, 7, 8, 9,
10, 11
1, 2, 3, 7, 8,
9, 10, 11
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
---
---
---
1/ PDA applies to subgroup 1.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table II herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table II herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
12
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)
692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-91640
A
REVISION LEVEL
C
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 05-02-01
Approved sources of supply for SMD 5962-91640 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9164001MEA
27014
DS26C32AMJ/883
5962-9164001MFA
27014
DS26C32AMW/883
5962-9164001MXA
27014
DS26C32AMWG/883
5962-9164001M2A
27014
DS26C32AME/883
5962-9164001QEA
01295
AM26C32MJB
5962-9164001QFA
01295
AM26C32MWB
5962-9164001Q2A
01295
AM26C32MFKB
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
27014
National Semiconductor
2900 Semiconductor Dr
PO Box 58090
Santa Clara, CA 95052-8090
01295
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Ln.
PO Box 660199
Dallas, TX 75243
Point of contact:
U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.