HT1 MOA3 S30 TM HITAG 1 Chip Module Preliminary Specification Revision 1.1 August 1997 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 Table of Contents 1 Definitions .............................................................................................................................. 3 1.1 Objective of the Specifications ..................................................................................................................... 3 1.2 Definition of the Chip Module ..................................................................................................................... 3 1.3 Use of the Modules ...................................................................................................................................... 3 2 Specifications ......................................................................................................................... 4 2.1 Mechanical Properties ................................................................................................................................. 4 2.2 Materials ..................................................................................................................................................... 4 2.3 Temperature Range ..................................................................................................................................... 4 2.4 Storage Conditions ...................................................................................................................................... 5 2.5 Delivery Conditions..................................................................................................................................... 5 2.6 Electrical Specifications............................................................................................................................... 6 3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7 3.1 Drawing of the Reel..................................................................................................................................... 7 3.2 Module outline suggestion ........................................................................................................................... 8 3.3 Splicing Specification .................................................................................................................................. 9 4 Coil Specifications................................................................................................................ 10 5 Functional Description of HITAG 1 ................................................................................... 12 5.1 Memory Organization................................................................................................................................ 12 5.2 Anticollision.............................................................................................................................................. 13 5.3 Operation Modes and Configuration .......................................................................................................... 14 5.3.1 Modes of Operation............................................................................................................................ 14 5.3.2 Configuration..................................................................................................................................... 14 5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17 5.5 Definition of Keys and Logdata ................................................................................................................. 17 6 Quality Inspection ............................................................................................................... 19 7 Characterisation and Test of the Final Transponder......................................................... 20 7.1 Characterisation of the Transponder .......................................................................................................... 20 7.2 Final Test of the Transponder .................................................................................................................... 20 8 Ordering Information.......................................................................................................... 21 HITAGTM is a trademark of Philips Electronics N.V. Ht1moa3.doc/HS Page 2 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 1 Definitions 1.1 Objective of the Specifications This specification lists the parameters to be fulfilled by the HITAG 1 chip module HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs). 1.2 Definition of the Chip Module A chip module is an electronically packaged chip covered with a globe top cap. The HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1. So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 1 chip module. 1.3 Use of the Modules The HITAG 1 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification. For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body. Ht1moa3.doc/HS Page 3 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 2 Specifications 2.1 Mechanical Properties Width 7.55 mm (Proposed Punching Outline) Length 11.75 mm (Proposed Punching Outline) Overall Thickness 0.45 mm ± 0.03 mm Film Thickness 0.16 mm ± 0.005 mm Bondpad Size for Transponder Coil / Module Interconnection 1.9 x 3.5 mm see also drawing in chapter 3 Suitable for Welding/Soldering/ Conductive Gluing 2.2 Materials Tape 110 µm Glass epoxy Copper Plating 35 µm ED copper Bond Plating Ni / Au Suitable for Al and Au wire bonding Backside Plating Ni / Au Glob Top Filled Epoxy Thermal curing 2.3 Temperature Range Operating -25°C to +85°C For packed transponder, depending on type of package Processing 150°C for 30 minutes at a standard lamination pressure for contactless smart card plastic materials (e.g. PVC, PET, ...) Welding Parameters max. 25 ms @ 500 °C on bond pads Soldering Parameters max. 3 s @ 390 °C on bond pads Ht1moa3.doc/HS Page 4 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 2.4 Storage Conditions Temperature 15 - 30 °C Relative Humidity 40 - 70 % Duration 1 year 2.5 Delivery Conditions Delivery Identification Date of ready for shipment, reel numbers, total quantity of good modules with the detail of good modules per reel, order number, product type, no supplier identification on reels, bags and boxes. Types of Delivery Chip modules on reel approx. 15.000 to 20.000 pcs. per reel, tape width super 35 mm, pitch 9,5 mm, 2 rows single chip modules (bulk goods) 500 pcs . per bag According to documentation "Packing Method Modules (reel)" Order-No. 3322 845 04881 Packing and Transport "Packing Method Modules (singulated)" Bad Module Marking All bad modules (mechanical and electrical faults) must be punched by reject hole for customer see drawings chapter 3 Bad positions (reel): <20% Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7 mm, thermal resistance at <190°C by < 100 cN tractive power and < 30 sec. duration. Labeling Identification label on the reel and on carton bag: - Product type - Number of the reel - Total number of positions - Number of good positions - Date of sealing (to be checked) - Two batches per reel only - Batchnumber indication (only coded, to be checked) Ht1moa3.doc/HS Page 5 of 24 see drawings chapter 3 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 2.6 Electrical Specifications Symbol min Junction Temperature TJ -55°C Input Peak Current IINpeak typ max Comment / Conditions Absolute Maximum Ratings 140°C 30 mA Latch up Current 100 mA MIL-STD 883D, Method 3023 ESD 2 kV MIL-STD 883D, Method 3015.7, Human Body Operating Range Temperature TA 1) 3) -40°C 85°C RThJunctionAmbient ≤ 30 K/W @ IINpeak = 30 mA VIN,TH 3,1 Vp 4,2 Vp start modulation after SETCC Input Read Voltage 1) 3) VIN,RD 3,5 Vp 4,5 Vp read E²PROM Input Write Voltage 1) 3) VIN,WR 3,7 Vp 4,7 Vp write E²PROM 4,0 Vp VINHigh - VINLow @ VINHigh = 5,0 Vp 2) T0=8 µs, TMOD=6*T0 RMODL 4,5 kΩ VINLow ≤ 2,0 Vp RMODNL 3,6 kΩ VINLow ≥ 2,0 Vp 231 pF VIN = 4,0 Vp Input Threshold Voltage Demodulator Range 3) VDEM_R 2,0 Vp Modulator R_MOD linear 3) R_MOD nonlinear 3) Resonance Capacitor 3) CResInit 189 pF 210 pF EEPROM Write Current Read Current 4) IW 25 µA VDD = 2,8 V 4) IR 9 µA VDD = 2,8 V Data Retention Years 10 Write Endurance Cycles 100.000 1) VIN = VIN1 − VIN2 ... voltage between connection pads 2) VINHigh VINLow TMOD 3) @ Ri = 10 kΩ resistance of measurement equipment 4) tested on silicon level Ht1moa3.doc/HS input voltage before modulation input voltage during modulation duration of the modulation Page 6 of 24 @ 55°C Specifications of the HT1 MOA3 S30 Rev. 1.1 3 Drawing of the Chip Module HT1 MOA3 S30 3.1 Drawing of the Reel Ht1moa3.doc/HS Page 7 of 24 1997-08-19 Specifications of the HT1 MOA3 S30 Rev. 1.1 3.2 Module outline suggestion Ht1moa3.doc/HS Page 8 of 24 1997-08-19 Specifications of the HT1 MOA3 S30 Rev. 1.1 3.3 Splicing Specification Ht1moa3.doc/HS Page 9 of 24 1997-08-19 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 4 Coil Specifications The HITAG 1 chip module has to be connected to a coil whose parameters are briefly described in the following. Equivalent circuit of the transponder Xpc Rpc Cp Cchip Uc Rchip Uc ... voltage at the connection pads fres ... resonant frequency of the transponder Xpc ... parallel reactance of the coil (f = 125 kHz) Rpc ... parallel resistance of the coil (f = 125 kHz) Cp ... parasitic capacitance of the package Cchip ... capacitance of the chip (Uc > 4 Vpp) Rchip ... resistance of the chip fresc ... self resonant frequency of the coil Lpc = Xpc/2πf (f = 125 kHz) Lpc = 7.72 mH ± x % (Cp = 0, x depends on the coil production process) Cchip = 210 pF ± 10 % Rpc > 45 k fresc > 750 kHz Note: The parasitic capacitance of the package (Cp) must be considered. fres = 1 1 = 125 kHz ⇒ L pc = 2 2π (Cchip + Cp).Lpc (2πfres ) Cchip + C p Typical values for Cp hot laminated cards: moulded tags: Ht1moa3.doc/HS ( Cp = 1.5 pF Cp = 6.0 pF Page 10 of 24 ) Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used. It is assumed that the winding is done in circular form. N = N L U d u L 1 ,8 5 2 U ln ( u ) d ... Number of windings ... Inductance [nH] ... average coil circumference [cm] ... copper diameter [mm] ... average coil circumference [mm] For fine tuning a measurement of the inductance and an according adjustment of the number of windings is necessary. This process always needs some iterations. Ht1moa3.doc/HS Page 11 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 5 Functional Description of HITAG 1 5.1 Memory Organization The 2 kBit EEPROM memory on the transponder is divided into 16 blocks. Every block consists of 4 pages. A page is the smallest access unit. Every page consists of 4 bytes (at 8 bits). Block access is only available for Blocks 2-15, page access is available for Pages 0-63. Block 0 Block 1 secret secret or public user data Block 4 user data r/w or OTP Block 7 Block 8 public user data Block 15 r/w public Serial Number Configuration Key A wo or 0 Key B secret Logdata 1B r/w Logdata 0A or Logdata 1A 0 Logdata 0B ro r/w wo OTP 0 read only read/write write only one time programmable neither read nor write Configuration of the memory is done in the configuration page Areas (or settings) with light dark background may be configured by the OEM client using the Configuration Page (Page 1). Memory locations marked with "secret" can only be accessed after a mutual authentication. An enciphered data communication is used in that area. Memory locations marked with "public" can be accessed without mutual authentication, no encryption is used. Block 0 includes the unique serial number (programmed during the production process), the Configuration Page (configuration of the memory area) and the keys, Block 1 includes the logdata. Ht1moa3.doc/HS Page 12 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 Blocks 4 to 7 can be used either as secret or public areas (configurable), and Blocks 2 to 7 either as read / write or read only areas (configurable). You can also modify keys and logdata and prevent them from being accessed. Finally the Configuration Page itself can be set to read only. It is extremely important to be particularly careful when using the Configuration Page (it only can be set to read only once!), keys and logdata as you can lose access to the secret area on the transponder in case of a mistake. ATTENTION: Changing of the Configuration Page (Page 1), Keys and Logdata must be done in secure environment. The transponder must not be moved out of the communication field of the antenna during programming! We recommend to put the transponder close to the antenna (zero-distance) and not to remove it during programming. 5.2 Anticollision Anticollision Mode in long range applications including HITAG 1 transponders permits you to process several transponders simultaneously. Theoretically up to 232 transponders can be processed simultanously. In practice this number is limited, because of the mutual influence of the transponders - they detune each other, if there are too many too close to each other. The currently used read/write device must also support full anticollision feature (e.g. HTRM800). For read/write devices without that feature only one transponder is handled even if there are several transponders within the communication field of the antenna. In this case either no communication takes place or the "stronger" or closer transponder takes over. By muting a selected transponder (HALT Mode) another transponder that is to be found in the communication field of the antenna can be recognized. Ht1moa3.doc/HS Page 13 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 5.3 Operation Modes and Configuration 5.3.1 Modes of Operation The HITAG 1 can be operated in two modes (Standard Protocol Mode, Advanced Protocol Mode) that cannot be configured using the Configuration Page, but via special host commands. Advanced Protocol Mode is not available for HITAG 1 transponders based on ASIC HT1 ICS30 01x (only available for HITAG 1 transponders based on ASIC HT1 ICS30 02x) and uses, above all, an additional Cyclic Redundancy Check (CRC) for read operations. 5.3.2 Configuration The Configuration Page consists of 4 Configuration Bytes, the first two bytes are used for configuration, the other two bytes can be used freely. The bitmaps in Configuration Bytes 0 and 1 determine the configuration of the memory, i.e. they define which area is secret or public, read/write, read only, write only or neither read nor write. You can allocate and write the Configuration Page until it is locked (Bit 4 of Configuration Byte 1 is set to ‘0’). After that these bytes are read only bytes and the configuration of the transponder memory cannot be changed any more. ATTENTION: Once set to read only the Configuration Page cannot be changed back to read/write again (transponder is hardware protected)! Configuration Bytes 2 and 3: These two bytes, too, are set to read only by the OEM Lock Bit (Configuration Byte 1 / Bit 4 = ”0”). Considering that fact you can use these two bytes freely. They will not affect memory configuration. Explanations of abbreviations used: r/w ro wo 0 Ht1moa3.doc/HS read and write read only write only neither read nor write Page 14 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 Configuration Byte 0: 7 6 5 4 3 2 1 0 Block 7: "1" ... r/w "0" ... ro Block 6: "1" ... r/w "0" ... ro Block 5: "1" ... r/w "0" ... ro Block 4: "1" ... r/w "0" ... ro Block 3: "1" ... r/w "0" ... ro Block 2: "1" ... r/w "0" ... ro Key A and Key B: "1" ... wo "0" ... 0 Logdata A and B: "1" ... r/w "0" ... 0 Configuration Byte 0 / Bit 7: Bit 7 = ‘1’: Logdata can be read and written to. Bit 7 = ‘0’: Logdata cannot be accessed. This bit can be set or reset until Bit 4 of Configuraion Byte 1 is set to ‘0’. For further information on Logdata and Keys see chapter “Definition of Keys and Logdata“. Configuration Byte 0 / Bit 6: Bit 6 = ‘1’: Keys can only be written to. Bit 6 = ‘0’: Keys cannot be accessed. This bit can be set or reset until Bit 4 of Configuration Byte 1 is set to ‘0’. For further information on Logdata and Keys see chapter “Definition of Keys and Logdata“. Configuration Byte 0 / Bits 0 ... 5: If one of these Configuration Bits is ‘1’, the corresponding block of the transponder can be read and written. If the bit is set to ‘0’, the corresponding block can only be read. Within one block the configuration is always identical, that means either all 4 pages are read/write or all of them are read only. These bits can be set or reset until Bit 4 of Configuration Byte 1 is set to ‘0’. Ht1moa3.doc/HS Page 15 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 Configuration Byte 1: 7 6 5 4 3 2 1 0 Access type for Blocks 4 to 7: "0" ... SECRET "1" ... PUBLIC reserved reserved reserved OEM Lock Bit: "0" ... Configuration Page is ro "1" ... Configuration Page is r/w reserved reserved reserved Configuration Byte 1 / Bits 5 ... 7: These three bits are reserved. ATTENTION: When writing a new value to Configuration Byte 1, bit positions marked as “reserved“ must not be altered. To meet that condition read the current Configuration Byte 1 value and mask in your new values for bit positions you are allowed to change. Configuration Byte 1 / Bit 4: Bit 4 = ‘1’: Configuration Page can be read and written to. Bit 4 = ‘0’: Configuration Page can only be read. This process is irreversible ! ATTENTION: Do not set Bit 4 of Configuration Byte 1 to ‘0’ before having written the final data into the Configuration Page of the transponder. Configuration Byte 1 / Bits 1 ... 3: These three bits are reserved. ATTENTION: When writing a new value to Configuration Byte 1, bit positions marked as “reserved“ must not be altered. To meet that condition read the current Configuration Byte 1 value and mask in your new values for bit positions you are allowed to change. Configuration Byte 1 / Bit 0: Bit 0 = ‘0’: Access type for Blocks 4 to 7 is SECRET. Bit 0 = ‘1’: Access type for Blocks 4 to 7 is PUBLIC. This bit can be set or reset until Bit 4 of Configuration Byte 1 is set to ‘0’. Ht1moa3.doc/HS Page 16 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 5.4 Configuration of Delivered HITAG 1 Transponders HITAG 1 transponders are delivered with the following configuration by Philips Semiconductors: Unique Serial Number: Serial Number: Read Only - fixed Configuration Byte 0: Logdata: Key A, Key B: Blocks 2 - 7: ‘1’ = r/w ‘1’ = wo ‘1’ = r/w - can be changed can be changed can be changed Configuration Byte 1: OEM Lock Bit: Blocks 4 - 7: ‘1’ = Configuration Page is r/w ‘1’ = public - can be changed can be changed Value for Transport Keys, Transport Logdata: 0x00000000 RECOMMENDATION: Before delivering transponders to end users, the Configuration Page should be set to read only (Configuration Byte 1/Bit 4 = ‘0’). 5.5 Definition of Keys and Logdata In order to be able to read data from the secret area of a transponder, you have to carry out a procedure called authentication. To do this you need special data (keys). After transmitting the according command the authentication is automatically carried out by the read/write device. Keys are cryptographic codes, which determine data encryption during data transfer between read/write device and transponder. Two keys (Key A and Key B) which you can use independently of each other, have been installed for security and flexibility reasons. The identity of either Key A or Key B on the read/write device and on the transponder is sufficient. Logdata represent "passwords" needed to gain access to secret areas on the transponder. A pair of logdata is included with every cryptographic key (Key A and Key B). This logdata pair has to be identical both on the transponder and the read/write device. ad Key A: Logdata 0 A Logdata 1 A ad Key B: Ht1moa3.doc/HS Logdata 0 B and Logdata 1 B Page 17 of 24 "Password" which the transponder sends to the read/write device and which is verified by the latter. "Password" which the read/write device sends to the transponder and which is checked for identity by the latter. analogous to Key A Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 It is important that the following values are in accordance with each other, i.e. the respective data on the read/write device and on the transponder have to be identical pairs: on the on the read/write transponder device KEY A KEY A ⇔ LOGDATA 0A ⇔ LOGDATA 0A Set A LOGDATA 1A ⇔ LOGDATA 1A KEY B KEY B ⇔ LOGDATA 0B ⇔ LOGDATA 0B Set B LOGDATA 1B ⇔ LOGDATA 1B The keys and logdata are predefined by Philips Semiconductors by means of defined Transport Keys (both keys show the same bit map) and Transport Logdata (all logdata show the same bit map), see also chapter “Configuration of Delivered HITAG 1 Transponders“. They can be written to, which means that they can be changed. ATTENTION: Keys and Logdata only can be changed if their current values are known! Ht1moa3.doc/HS Page 18 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 6 Quality Inspection Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with AQL1.0. Optical Properties scratches, according to the reference sample encapsulation failures, catalogue gold discolouration, delamination Geometrical Properies width Electrical Properties measured with gauge length measured with gauge overall thickness measured with micrometer at the center of the glob top operation basic read/write operations Shipment Quantity Packing and Labeling Ht1moa3.doc/HS Page 19 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 7 Characterisation and Test of the Final Transponder 7.1 Characterisation of the Transponder The parameters recommended to be characterised for the transponder are: Parameter Comment Resonant frequency f res Transponder does not modulate Resonant frequency @ Tamb = 22°C, @ BTH Threshold value BTH Start of modulation Threshold value for READ BRD Command READ_PAGE OK Threshold value for WRITE BWR Command WRITE_PAGE OK For the measurement of these parameters we recommend to use the test equipment available from SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1). This device also supports functional testing (besides parameter testing). Therefore it can also be used as production test equipment for the final transponder test. For further information please contact Scemtec GmbH. 7.2 Final Test of the Transponder In addition to the equipment described in the previous chapter Philips Semiconductors offers a device for a final functional test of transponders, the HITAGTM Test System HT OT490. Parameter tests are not supportet by this device. Basic flow for production and test: 1. Assembly of transponders 2. Functional test and final test of the EEPROM Since the Keys and Logdata are changed during final test the Configuration and personalization must take place after the final test. The final test is disabled (not reversible) by setting the Tag-test mode bit to 0. For the final test of transponders we recommend to use the HITAGTM Test System HT OT490 of Philips Semiconductors or the Transponder Measurement System STM-1 of Scemtec. Ht1moa3.doc/HS Page 20 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 8 Ordering Information Type Name Description Ordering Number HT1 MOA3 S30/E/3 HITAG 1 S30 Chip Module, reels 9352 600 61118 HT1 MOA3 S30/E/1 HITAG 1 S30 Chip Module, bulk 9352 602 18122 Ht1moa3.doc/HS Page 21 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 Definitions Data sheet status Objective specification This data sheet conta ins ta rget o r goal spec ifications for product deve lopment. Preliminary specification This data sheet conta ins p reliminary data; supp lementary data may be pub lished later. Product spec ification This data sheet conta ins final product spec ifications. Limiting values Limiting va lues g iven are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134). Stress above one o r more of the limiting va lues may cause pe rmanent da mage to the dev ice. These are stress ratings on ly and ope ration of the dev ice at these o r at any othe r cond itions above those g iven in the Characteristics sect ion of the spec ification is not implied. Exposu re to limiting va lues for extended pe riods may aff ect dev ice reliab ility. Application information Where application information is given, it is adv isory and does not form part of the spec ification. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors´ customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such improper use or sale. Ht1moa3.doc /HS Page 22 of 24 Specifications of the HT1 MOA3 S30 Rev. 1.1 - this page intentionally left blank - Ht1moa3.doc/HS Page 23 of 24 1997-08-19 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTHRYDE, NSW 2113, Tel. +612 9805 4455, Fax. +612 9805 4466 Austria: Computerstraße 6, A-1101 WIEN, P.O.Box 213, Tel. +431 60 101, Fax. +431 30 101 1210 Belarus: Hotel Minsk Business Centre, Bld. 3, r.1211, Volodarski Str. 6, 220050 MINSK, Tel. +375172 200 733, Fax. +375172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA Tel. +3592 689 211, Fax. +3592 689 102 Canada: Philips Semiconductors/Components, Tel. +1800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +85223 19 7888, Fax. +85223 19 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +4532 88 2636, Fax. +4531 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +3589 61 5800, Fax. +3589 61 580/xxx France: 4 Rue du Port-aux-Vins, BP 317, 92156 SURESNES Cedex, Tel. +331 40 99 6161, Fax. +331 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +4940 23 53 60, Fax. +4940 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +301 4894 339/239, Fax. +301 4814 240 Hungary: see Austria India: Philips INDIA Ltd., Shivsagar Estate, A Block, Dr. Annie Besant Rd. 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