Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 (11-09-21-065) Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents Preface ............................................................................................................................... 5 1 Introduction General ............................................................................................................... 8 1.2 System Description ................................................................................................. 8 1.3 Product Description ................................................................................................. 8 1.4 Functional Description.............................................................................................. 8 1.5 Memory Organization 1.6 Command Set 1.7 2 2.2 2.3 2.4 ........................................................................ 17 3.1 Lot Definition ....................................................................................................... 18 3.2 Wafer identification ................................................................................................ 18 3.3 Wafer Map File 3.5 3.6 3.7 3.8 3.9 .................................................................................................... Ink Dot Specification .............................................................................................. Packing for Wafers ................................................................................................ Packing for Sawn Wafers ........................................................................................ Barcode Label ..................................................................................................... Storage Conditions ............................................................................................... Antenna Calculation............................................................................................... 20 20 21 22 24 24 24 ................................................................... 27 Regulatory, Safety, and Warranty Notices ..................................................................... 28 Warranty and Liability ............................................................................................. 28 Hazards from Electrostatic Discharge ESD .................................................................... 28 Regulatory, Safety, and Warranty Notices 4.1 4.2 4.3 A ............................................................................................................ 11 ........................................................................................... 12 Mechanical Wafer Specification ................................................................................. 12 Mechanical Die Specification .................................................................................... 14 Bump Specification ................................................................................................ 15 Electrical Specification Shipping, Packing & Further Handling 3.4 4 .............................................................................................. 9 ..................................................................................................... 10 Ordering Information and Part Numbers ....................................................................... 10 Specification 2.1 3 ............................................................................................................... 7 1.1 Terms & Abbreviations SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback .............................................................................................. 29 Contents 3 List of Figures 1-1 1-2 2-1 2-2 2-3 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 RFID System With Reader, Antenna, and Tag-it HF-I Transponder .................................................. 8 Memory Organization of the Tag-it HF-I Pro Transponder IC ......................................................... 9 Wafer on FFC ............................................................................................................... 13 Antenna and Test Pad Location .......................................................................................... 14 Cross Section of Bump .................................................................................................... 15 Position of Wafer Identification Code .................................................................................... 18 Wafer Identification Code 1 ............................................................................................... 19 Wafer Identification Code 2 ............................................................................................... 19 Ink Dot Drawing ............................................................................................................ 21 Packing of Wafers .......................................................................................................... 22 Packing of Sawn Wafers (Multi) .......................................................................................... 23 Packing of Sawn Wafers (Single) ........................................................................................ 23 Barcode Label .............................................................................................................. 24 Recommended Operating Range – Impedance vs Antenna Q ...................................................... 25 List of Tables 1-1 1-2 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 3-1 3-2 3-3 3-4 4 Command Set for Tag-it HF-I Pro Transponder IC .................................................................... Part Numbers ............................................................................................................... Absolute Maximum Ratings ............................................................................................... Recommended Operating Conditions ................................................................................... Electrical Characteristics ................................................................................................. General Mechanical Wafer Specification ................................................................................ Mechanical Wafer Specification After Grinding, Sawing on FFC .................................................... Mechanical Die Specification ............................................................................................. Antenna and Test Pad Location .......................................................................................... Bump Specification ......................................................................................................... Ink Dot Specification ....................................................................................................... Ink Dot Placement .......................................................................................................... Storage Conditions ......................................................................................................... Antenna System Parameters ............................................................................................. List of Figures 10 10 12 12 12 12 13 14 14 15 20 21 24 25 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Preface SCBU045 (11-09-21-065) – October 2007 Edition Three – October 2007 This is the third edition of this reference guide. It contains a description of the Tag-it HF-I Pro Transponder IC, the specifications, part numbers, dimensions and instructions for further handling. Important Notice Texas Instruments (TI) reserves the right to make changes to its products or services or to discontinue any product or service at any time without notice. TI provides customer assistance in various technical areas, but does not have full access to data concerning the use and applications of customer's products. Therefore, TI assumes no liability and is not responsible for customer applications or product or software design or performance relating to systems or applications incorporating TI products. In addition, TI assumes no liability and is not responsible for infringement of patents and/or any other intellectual or industrial property rights of third parties, which may result from assistance provided by TI. TI products are not designed, intended, authorized or warranted to be suitable for life support applications or any other life critical applications which could involve potential risk of death, personal injury or severe property or environmental damage. The TIRIS™ and TI-RFid™ logos, and the words TIRIS, TI-RFID, and Tag-it™ are trademarks or registered trademarks of Texas Instruments Incorporated. Copyright 2007 Texas Instruments Incorporated (TI) This document be downloaded onto a computer, stored and duplicated as necessary to support the use of the related TI product. Any other type of duplication, circulation or storage on data carriers in any manner not authorized by TI represents a violation of the applicable copyright laws and shall be prosecuted. SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback 5 www.ti.com About This Guide About This Guide This reference guide for the Tag-it HF-I Pro Transponder IC is designed for use by TI partners who are engineers experienced with Radio Frequency Identification Devices (RFID) and the processing of wafers. Regulatory, safety and warranty notices that must be followed are given in Chapter 4. Conventions WARNING A WARNING IS USED WHERE CARE MUST BE TAKEN, OR A CERTAIN PROCEDURE MUST BE FOLLOWED, IN ORDER TO PREVENT INJURY OR HARM TO YOUR HEALTH. CAUTION This indicates information on conditions that must be met, or a procedure that must be followed, which, if not heeded, could cause permanent damage to the equipment or software. Note: Indicates conditions that must be met, or procedures that must be followed, to ensure proper functioning of the equipment or software. Note: Information: Indicates information that makes usage of the equipment or software easier. If You Need Assistance For more information, please contact the sales office or distributor nearest you. This contact information can be found on our web site at: http://www.ti-rfid.com. 6 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Chapter 1 SCBU045 (11-09-21-065) – October 2007 Introduction This chapter introduces you to the Tag-it HF-I Pro Transponder IC. Topic 1.1 1.2 1.3 1.4 1.5 1.6 1.7 .................................................................................................. Page General...................................................................................... 8 System Description ..................................................................... 8 Product Description .................................................................... 8 Functional Description ................................................................ 8 Memory Organization .................................................................. 9 Command Set ........................................................................... 10 Ordering Information and Part Numbers ...................................... 10 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Introduction 7 www.ti.com General 1.1 General The Tag-it HF-I Pro Transponder IC is part of TI’s 13.56 MHz product family, which is based on the ISO/IEC 15693 standard for contactless integrated circuit cards (vicinity cards) and ISO/IEC 18000-3 standard for item management. The Tag-it HF-I Pro Transponder IC builds the basis for various available inlay shapes, which are used as consumable smart labels in markets requiring quick and accurate identification of items, such as: • asset tagging • electronic ticketing • anti-counterfeit prevention • building access badges User data is written to and read from memory blocks using a non-volatile EEPROM silicon technology. Each block is separately programmable by the user and can be locked to protect data from modification. Once the data has been ‘locked’ it can only be changed by the password protected write command. Multiple transponders, which appear in the Readers RF field, can be identified, read from and written to by using the Unique Identifier (UID), which is programmed and locked at the factory and can not be changed. 1.2 System Description For operation, a reader with antenna is required to send a command to the transponder and to receive its response (see Figure 1-1). The command of the Reader can be either in addressed or non-addressed mode. The Transponder does not transmit data until the reader sends a request (Reader talks first principle). Antenna Reader Tag-It HF-I Transponder Figure 1-1. RFID System With Reader, Antenna, and Tag-it HF-I Transponder 1.3 Product Description The Tag-it HF-I Pro Transponder IC is compliant to the ISO/IEC 15693 and ISO/IEC 18000-3 standard. To build a complete transponder, the Tag-it HF-I Pro Transponder IC has to build a resonance circuit with the antenna it is assembled on (e.g., an etched aluminum antenna). 1.4 Functional Description The Tag-it HF-I Pro Transponder IC is a low-power, full-duplex Transponder IC for use with passive contactless identification transponder systems. The transponder IC is designed to operate with a 13.56 MHz carrier frequency. The ISO standard defines, for some communication parameters, several modes in order to meet different international radio regulations and different application requirements. Therefore, communication between the reader and the transponder (Down-Link communication) takes place using ASK modulation index between 10% and 30% or 100% and datacoding (pulse position modulation) ‘1 out of 4’ or ‘1 out of 256’. 8 Introduction SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Memory Organization According to ISO 15693 Up-Link communication (Transponder to Reader) can be accomplished with one subcarrier (ASK modulation) or with two subcarrier (FSK modulation). Both modes (ASK and FSK) can operate with either high or low data rate. The transponder answers in the mode it was interrogated from the reader and supports all communication parameter combinations. Up- and Down-Link are frame synchronized and CRC check sum secured. Each Tag-it HF-I Pro Transponder IC has a ‘unique’ address (UID) stored in two blocks, which are factory-programmed and 64 bits long (=264 different addresses). This can be used for addressing each transponder uniquely and individually for a one-to-one exchange between the reader and the transponder. A mechanism to resolve collisions of a multiplicity of transponders (Anticollision) is also implemented. This special feature allows multiple transponders to be read simultaneously and offers the capability to inventory, in a very short time, a large number of transponders by their unique address, provided they are within the reader operating range. Also, the Application Family Identifier (AFI), which is optional in the ISO15693 is supported by the Tag-it HF-I Pro Transponder. For more details about the communication between reader and transponder see ISO/IEC 15693 and the Tag-it HF-I Pro Extended Command Specification. 1.5 Memory Organization User data is read and stored in a 256 bit non-volatile user memory that is organized in 8 blocks. Each block with 32 bit is user programmable and can be locked individually to protect data from modification. Once set, the lock bit cannot be reset. The user memory is field programmable per block. Two levels of block locking are supported: Individual block locking by the user (U) or individual block locking of factory programmed data (F) during manufacturing. Bit 2 of the “Block Security Status” Byte defined in ISO 15693-3 is used to store the Factory Lock Status of the Block. Factory Block locking irreversibly protects the locked data from any further reprogramming. User locked blocks can be reprogrammed by use of the password protected write command. 32 bits Block Addr Lock Bits 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 F = Factory Lock, U = User Lock F U User data (256 bits) X UID Number (64 bits) 0x0A AFI 0x0B Password Figure 1-2. Memory Organization of the Tag-it HF-I Pro Transponder IC SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Introduction 9 www.ti.com Command Set 1.6 Command Set Table 1-1. Command Set for Tag-it HF-I Pro Transponder IC Request Mode Request Code Inventory Addressed NonAddressed AFI Opt. Flag Inventory 0x01 √ – – √ 0/– Stay Quiet 0x02 – √ – – 0/– Read_Single_Block 0x20 – √ √ – –/1 Write_Single_Block 0x21 – √ √ – –/1 Lock_Block 0x22 – √ √ – –/1 Kill 0xA4 – √ – – –/1 WriteSingleBlockPwd 0xA5 – √ – – –/1 Request ISO 15693 Mandatory and Optional Commands TI Custom Commands Note: The Option Flag (Bit 7) of the ISO 15693 defined Request Flags must be set to 1 for all Write and Lock commands to respond properly. For reliable programming we recommend a programming time ≥ 10 ms before the reader sends the End Of Frame (EOF) to request the response from the Transponder. 1.7 Ordering Information and Part Numbers The Tag-it HF-I Pro Transponder IC is available with following finishing options: Table 1-2. Part Numbers Part-Number RF-HDT-SJLS-G1 RF-HDT-AJLS-G1 Note: 10 Introduction Bumping NI/AU AU Yes Yes Packing Inking Grinding Sawing Yes Yes Yes Yes Yes Yes Yes Yes Multi Wafer Single Wafer Other finishing options on request SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Chapter 2 SCBU045 (11-09-21-065) – October 2007 Specification This chapter provides the electrical and mechanical specifications of the Tag-it HF-I Pro Transponder IC. Topic 2.1 2.2 2.3 2.4 .................................................................................................. Electrical Specification ............................................................. Mechanical Wafer Specification .................................................. Mechanical Die Specification ...................................................... Bump Specification ................................................................... SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Page 12 12 14 15 Specification 11 www.ti.com Electrical Specification 2.1 Electrical Specification Table 2-1. Absolute Maximum Ratings Parameter Symbol Antenna Input Current Iant_dc Antenna Input Voltage Vant_dc Storage Temperature Ts Junction (Chip) Temp. Tj ESD Immunity ANT1, ANT2, TDAT, GND Note: Note Min Nom -40 HBM Max Unit 10 mA 10 V 125 °C 150 °C 2.5 2.0 kV Stress beyond the limits of those listed under ‘Absolute Maximum Ratings’ cause permanent damage to the device. Functional operation of the device under these or any other conditions beyond those indicated under ‘Recommended Operating Conditions’ is not implied. Exposure to absolute-maximum-rated conditions for extended time affect device reliability. Table 2-2. Recommended Operating Conditions Parameter Symbol Operating temperature TA Carrier frequency fTX Antenna input voltage VANT Impedance of LC circuit Z Note Min Nom –40 Max 85 13.56 @ fTX unmodulated Unit °C MHz 2.5 Vlim V 6.5 15.5 kΩ Table 2-3. Electrical Characteristics Parameter Note Min Nom Max Unit –10% 23.5 10% pF Input capacitance CIN @ 2VRMS Operating supply current ICC VANT=min 25 Programming 35 Uplink modulation index MPICC Limiter clamping voltage Vlim Data retention Write and erase endurance Note: 2.2 Symbol μA VANT<7V 0.1 0.3 tDRET 55C 10 Years W&E Ta=25C 100 000 Cycles 10 V For highest possible read-out coverage we recommend to operate readers at a modulation depth of 20% or higher. Mechanical Wafer Specification Table 2-4. General Mechanical Wafer Specification Parameter 12 Specification Value Wafer diameter 200 mm ±0.3 mm (8 inch) Thickness 711 μm Scribe line width 84 μm Electrical connection of substrate VSS potential Complete dies per wafer 24172 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Mechanical Wafer Specification Table 2-5. Mechanical Wafer Specification After Grinding, Sawing on FFC Parameter Backside Material Value Si Roughness: Ra 500 Å Rtm 2500 Å Product Thickness RF-HDT-SJLS-G1 150 μm ± 5 μm RF-HDT-AJLS-G1 Figure 2-1. Wafer on FFC SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Specification 13 www.ti.com Mechanical Die Specification 2.3 Mechanical Die Specification Table 2-6. Mechanical Die Specification Parameter Value Bond pad metallization material ALCu 0.5 % Bond pad metallization thickness 0.95 μm Bond and test pad location Table 2-7 Die dimension (including scribe line) 1080 * 1080 μm ±15 μm Die dimension (excluding scribe line) 996 * 996 μm ±15 μm Top side passivation material SiNi Passivation thickness 1.1 μm Table 2-7. Antenna and Test Pad Location Pad No. Name LLCx[μm] LLCy[μm] URCx[μm] URCy[μm] 1 ANT1 30 30 n.a. n.a. 2 ANT2 n.a. n.a. 966 966 3 TDAT 118 866 168 936 4 GND 836 60 886 130 Test pad Figure 2-2. Antenna and Test Pad Location 14 Specification SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Bump Specification 2.4 Bump Specification Table 2-8. Bump Specification Parameter Note: Value Bump material NI covered with AU, chemical process AU Bump height 25 μm ±10% 20 μm ±3 μm Bump hardness >HV 450 HV 35-80 Surface roughness <1 μm < 3 μm Shear strength >150 cN >400 cN Contact between the test pads and the antenna is not allowed as it can have an impact on the electrical performance of the transponder. NI/AU AU Figure 2-3. Cross Section of Bump SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Specification 15 16 Specification SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Chapter 3 SCBU045 (11-09-21-065) – October 2007 Shipping, Packing & Further Handling Topic 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 .................................................................................................. Lot Definition ............................................................................ Wafer identification ................................................................... Wafer Map File .......................................................................... Ink Dot Specification ................................................................. Packing for Wafers .................................................................... Packing for Sawn Wafers ........................................................... Barcode Label .......................................................................... Storage Conditions .................................................................. Antenna Calculation .................................................................. SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Page 18 18 20 20 21 22 24 24 24 Shipping, Packing & Further Handling 17 www.ti.com Lot Definition 3.1 Lot Definition A definite quantity of wafers from the same diffusion batch produced under presumed uniform conditions. Occasionally a lot equals 25 wafers. 3.2 Wafer identification Each wafer is marked with laser marking to identify the wafer. The wafer map file is linked to the wafer identification. There are two marks on the wafer. The following figure shows the position of the wafer identification codes. The reference die is the black marked die in the corner at the right lower position of the wafer. Figure 3-1. Position of Wafer Identification Code 18 Shipping, Packing & Further Handling SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Wafer identification Code 1: Wafer Lot number naming rule: LT 5 0002 00-13-E0 Check sum wafer sequence number fix no (00). serial no (0000~9999) year (0~9, will repeat every 10 years) Fab Code Figure 3-2. Wafer Identification Code 1 Code 2: Wafer Lot number naming rule: HH98F 13 – A7 Check sum Wafer sequence number Wafer lot Figure 3-3. Wafer Identification Code 2 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Shipping, Packing & Further Handling 19 www.ti.com Wafer Map File 3.3 Wafer Map File All lots are supplied with wafer mapping file. This mapping file is stored on a CD and enclosed in the pack box. The mapping file is stored for 3 years, if any problem might occur. We handle our TI world wide wafer map standard. The wafer file name is explained as follows: HGWY5 0020_20041001114135.cp3 Format Date-time Qty wafers Wafer lot # Wafer map files are provided in a TI Worldwide (WW) format, which is in ASCII text form. An example of the TI WW wafer map file is shown below. Contact your sales representative to obtain details on the TI WW format. FACILITY=UMC-F8E LOT=HGWY5 DEVICE=$8TMS37114APK WAFERS=20 X_SIZE=074.134 Y_SIZE=083.858 BIN_NAME.01="G,PASS" BIN_NAME.09="FAIL" STATUS="PROD" SCRIBE="BOTTOM,15,NTRL,FAB" WAFER_SIZE=200 WAFERID.01=LT5000200-13-E0 NUM_BINS.01=01 BIN_COUNT.01.01=02463 MAP_XY.01.01="Y-10 19 15 12 10/8 Y-9 20 18 15 13/12 9/7 Y-8 20/14 12/10 8/6 3 Y-7 15/13 10 8 4 2" 3.4 Ink Dot Specification All Tag-it HF-I Pro Transponder ICs are electrically tested and dies that fail the probe test will be inked. Bump failures are not marked with an ink dot. Table 3-1. Ink Dot Specification Parameter Diameter 20 Value Min 250 μm Max 600 μm Height Max 25 μm Colour Black Position Central, not to touch bond pads Shipping, Packing & Further Handling SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Packing for Wafers D A C B Figure 3-4. Ink Dot Drawing Table 3-2. Ink Dot Placement 3.5 No. Max Min A 400 150 B 400 150 C 400 150 D 400 150 Ink 600 250 Remark Size limit Packing for Wafers The wafers are packed for transportation to protect them against shock, static discharge and contamination in a wafer shipper box up to 25 wafers. This box is packed in an antistatic moisture bag with silica gel and in a double layered carton box. Note: When the silica gel has changed the color to blue, it is an indication that moisture has entered the bag. SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Shipping, Packing & Further Handling 21 www.ti.com Packing for Sawn Wafers CD Taped on Foam Label Up Spacer Box Lid Wafers Max 25 Wafer Box Label on Wafer Box Blue Silica Gel Anti-Static Moisture Bag Spacer Carton Box Label on Carton Box Figure 3-5. Packing of Wafers 3.6 Packing for Sawn Wafers Packing in Multi Wafer Box Sawn wafers are mounted on foil and delivered on standard 8” disco wafer frame (see Figure 2-1 Wafer on FCC). A special plastic container is used to store up to 25 wafers in frames. This plastic container is packed in an antistatic moisture bag with silica gel and in a double layered carton box. Note: 22 When the silica gel has changed the color to blue, it is an indication that moisture has entered the bag. Shipping, Packing & Further Handling SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Packing in Single Wafer Box CD with Wafermap File Bod Lid Fil Frame SHPR Assy Open Mark FFC 8” Std Disco Sawn Wafer on Foil Label on Box Wafer Box Blue Silica Gel Anti-Static Moisture Bag Fill With Bubble Foam Carton Box Label on Carton Box Figure 3-6. Packing of Sawn Wafers (Multi) Packing in Single Wafer Box Sawn wafers are mounted on foil and delivered on standard 8” disco wafer frame (see Figure 2-1 Wafer on FCC). A special plastic container is used to store the wafer in frames. This plastic container is packed in an antistatic moisture bag and in a carton box. Figure 3-7. Packing of Sawn Wafers (Single) SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Shipping, Packing & Further Handling 23 www.ti.com Barcode Label 3.7 Barcode Label The following figure shows the barcode label that is placed on the packing box, the wafer container and the CD with the map file. Note: The data provided below is an example and should only be viewed as guide values. ( 1P ) (Q) (D) Part Number Quantity of functional Chips Datecode; Lot Number Figure 3-8. Barcode Label 3.8 Storage Conditions The wafers should be kept in the original packing during storage. Table 3-3. Storage Conditions Parameter 3.9 Value Temperature 20°C ± 5°C Atmosphere Dried N2 or dried air with 40%–60% r.h. Duration Max. 6 months Antenna Calculation CHIP Rcont L Rchip Cchip CLpar RL Rcont Rchip: IC Input Impedance Cchip:IC Input Capacitance Rcont: Pad/assembly contact resistance CLpar: Parasitic capacitance of antenna RL: Series resistance of antenna L: Antenna Inductance 24 Shipping, Packing & Further Handling SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback www.ti.com Antenna Calculation Resonance frequency: fres = Total quality factor: 1 2 * p * L * Cchip Qres = Qc * Ql Qc + Ql Input impedance: Z = Qres * L Cchip Based on an IC capacitance of 23.5 pF, the impedance shall be matched to be in the specified impedance range of 6.5 to 15.5 kΩ to fit the IC capabilities. Note: If Z > 15.5 kΩ, reduced performance of read range must be considered. Table 3-4. Antenna System Parameters Parameter Cchip [pf] Min Nom Max Tolerance [%] 21.15 23.5 25.85 10 Qchip 80 100 120 20 L [μH] 5.74 5.86 5.98 2 15 40 44 10 fres [MHz] 12.8 13.56 14.44 Qres 12.63 28.57 32.2 Z [kΩ] 6.58 14.27 15.48 QL 2.5 .10 2.19 .10 1.88 .10 Znom( QL)1.56 .10 Test conditions Comment 13.56 MHz @ 2 Vrms 13.56 MHz @ 2 Vrms 4 Recommended operating range 4 QC=80 4 4 Zmin ( QL) 1.25 .104 Zmax( QL) 9375 6250 3125 0 0 7.5 15 22.5 30 37.5 45 52.5 60 QL Figure 3-9. Recommended Operating Range – Impedance vs Antenna Q SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Shipping, Packing & Further Handling 25 26 Shipping, Packing & Further Handling SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Chapter 4 SCBU045 (11-09-21-065) – October 2007 Regulatory, Safety, and Warranty Notices This chapter describes important safety precautions and safety regulations. Topic 4.1 4.2 4.3 .................................................................................................. Page Regulatory, Safety, and Warranty Notices .................................... 28 Warranty and Liability ................................................................ 28 Hazards from Electrostatic Discharge ESD .................................. 28 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Regulatory, Safety, and Warranty Notices 27 www.ti.com Regulatory, Safety, and Warranty Notices 4.1 Regulatory, Safety, and Warranty Notices An RFID system comprises an RF transmission device, and is therefore subject to national and international regulations. A system reading from or writing to these transponders may be operated only under an experimental license or final approval issued by the relevant approval authority. Before any such device or system can be marketed, an equipment authorization must be obtained form the relevant approval authority. The Tag-it HF-I Pro Transponder IC has been manufactured using state-of-the-art technology and in accordance with the recognized safety rules. Observe precautions in operating instructions • Condition for the safe processing, handling and fault-free operation of the Tag-it HF-I Pro Transponder IC is the knowledge of the basic safety regulations. • All persons who operate with the Tag-it HF-I Pro Transponder IC must observe the guidelines and particularly the safety precautions outlined in this document. • In addition, basic rules and regulations for accident prevention applicable to the operating site must also be considered. 4.2 Warranty and Liability The "General Conditions of Sale and Delivery" of Texas Instruments Incorporated or a TI subsidiary apply. Warranty and liability claims for defect products, injuries to persons and property damages are void if they are the result of one or more of the following causes: • improper use of the transponders IC • unauthorized assembly, operation and maintenance of the transponders IC • operation of the transponder IC with defective and/or non-functioning safety and protective equipment • failure to observe the instructions given in this document during transport, storage, assembly, operation, maintenance and setting up of the transponder IC • unauthorized changes to the transponder IC • insufficient monitoring of the transponder ICs' operation or environmental conditions • repairs • catastrophes caused by foreign bodies and acts of God. CAUTION Tag-it HF-I Pro Transponder ICs are 100% thoroughly tested. It is the responsibility of TIs customer to evaluate their assembly process for compatibility with the Tag-it HF-I Pro Transponder IC properties and to ensure through appropriate process controls that determined machine and material parameter are met on an ongoing basis. TI does not accept warranty claims for material that has already undergone packaging or conversion process. 4.3 Hazards from Electrostatic Discharge ESD WARNING ELECTRONIC DEVICES CAN ELECTROSTATIC ENERGY. 28 Regulatory, Safety, and Warranty Notices ALSO BE DESTROYED BY SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Appendix A SCBU045 (11-09-21-065) – October 2007 Terms & Abbreviations A list of the abbreviations and terms used in various TI-RFID manuals can now be found in a separate manual: TI-RFID Product Manuals – Terms & Abbreviations Document number 11-03-21-002 SCBU045 (11-09-21-065) – October 2007 Submit Documentation Feedback Terms & Abbreviations 29 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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