BGM1014 MMIC wideband amplifier Rev. 2 — 19 September 2011 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Internally matched to 50 Good output match to 75 32 dB to 34 dB positive sloped gain for Low Noise Block (LNB) application 12.9 dBm saturated load power at 1 GHz 40 dB isolation 1.3 Applications LNB Intermediate Frequency (IF) amplifiers Cable systems General purpose 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VS DC supply voltage RF input; AC coupled - 5 6 V IS DC supply current 17 21.0 25 mA s212 insertion power gain f = 1 GHz 31.5 32.3 33.0 dB NF noise figure f = 1 GHz - 4.2 4.3 dB PL(sat) saturated load power f = 1 GHz 12.5 12.9 - dBm BGM1014 NXP Semiconductors MMIC wideband amplifier 2. Pinning information Table 2. Pinning Pin Description 1 VS 2, 5 GND2 3 RF_OUT 4 GND1 6 RF_IN Simplified outline 6 5 Symbol 1 4 6 1 2 3 4 3 2, 5 sym062 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGM1014 SC-88 plastic surface mounted package; 6 leads SOT363 4. Marking Table 4. Marking Type number Marking code BGM1014 C5- 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VS DC supply voltage RF input; AC coupled - 6 V IS supply current - 30 mA Tsp 90 C Ptot total power dissipation - 200 mW Tstg storage temperature 65 +150 C Tj junction temperature - 150 C PD maximum drive power - 10 dBm 6. Recommended operating conditions Table 6. BGM1014 Product data sheet Operating conditions Symbol Parameter Min Typ Max Unit VS DC supply voltage Conditions 4.5 5.0 5.5 V Tamb ambient temperature 40 +25 +85 C All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 2 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 7. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-sp) thermal resistance from junction to solder point Ptot = 200 mW; Tsp 90 C 300 K/W 8. Characteristics Table 8. Characteristics VS = 5 V; IS = 21.1 mA; Tj = 25 C; measured on demo board; unless otherwise specified. Symbol Parameter VS DC supply voltage IS supply current s212 insertion power gain Conditions RF input; AC coupled s222 input return loss output return loss Typ Max Unit - 5 6 V 17 21.0 25 mA 29.0 30.0 31.0 dB see Figure 4 f = 100 MHz s112 Min f = 1 GHz 31.5 32.3 33.0 dB f = 1.8 GHz 34.0 35.2 36.5 dB f = 2.2 GHz 33.0 34.1 35.5 dB f = 2.6 GHz 29.0 30.5 32.0 dB f = 3 GHz 25.0 26.4 28.0 dB f = 1 GHz 11 12.2 - dB f = 2.2 GHz 7.5 8.8 - dB f = 1 GHz 15 18.9 - dB f = 2.2 GHz 12 16.7 - dB f = 1 GHz 12 16.8 - dB f = 2.2 GHz 12 17.7 - dB f = 1 GHz 40 42 - dB f = 2.2 GHz 35 37 - dB f = 1 GHz - 4.2 4.3 dB f = 2.2 GHz - 4.1 4.3 dB - 2.5 - GHz f = 1 GHz 1.5 1.6 - f = 2.2 GHz 0.9 1.0 - f = 1 GHz 12.5 12.9 - f = 2.2 GHz 8.8 9.3 - dBm f = 1 GHz 10.5 11.2 - dBm f = 2.2 GHz 5.0 5.7 - dBm ZL = 50 ZL = 75 s122 NF isolation noise figure see Figure 3 see Figure 7 B bandwidth 3 dB below flat gain at f = 1 GHz K stability factor see Figure 8 PL(sat) saturated load power PL(1dB) load power at 1 dB gain compression BGM1014 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 dBm © NXP B.V. 2011. All rights reserved. 3 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier Table 8. Characteristics …continued VS = 5 V; IS = 21.1 mA; Tj = 25 C; measured on demo board; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IP3in f = 1 GHz 13 11.8 - dBm f = 2.2 GHz 21 19 - dBm IP3out IM2 input third order intercept point output third order intercept point f = 1 GHz second order intermodulation distortion 19.5 20.5 - dBm f = 2.2 GHz 14 15.1 - dBm f0 = 1 GHz; PL = 10 dBm 36 37 - dBc f0 = 1 GHz; PL = 5 dBm 33 34 - dBc 90° 1.0 +1 135° +0.5 0.8 45° +2 0.6 +0.2 0.4 +5 0.2 100MHz 180° 0 0.2 0.5 1 2 5 10 0° 0 3GHz −5 −0.2 −135° −2 −0.5 −45° −1 −90° 1.0 001aac489 IS = 21.1 mA; VS = 5 V; PD = 35 dBm; Zo = 50 Fig 1. BGM1014 Product data sheet Input reflection coefficient (s11); typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 4 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 90° 1.0 +1 135° +0.5 0.8 45° +2 0.6 100MHz +0.2 0.4 +5 0.2 180° 0 0.2 0.5 1 2 5 10 0° 0 3GHz −5 −0.2 −135° −2 −0.5 −45° −1 1.0 −90° 001aac490 IS = 21.1 mA; VS = 5 V; PD = 35 dBm; Zo = 50 Fig 2. Output reflection coefficient (s22); typical values 001aac491 0 s12 2 (dB) −10 001aac492 50 s21 2 (dB) 40 (1) (2) (3) −20 30 −30 20 −40 −50 10 0 1000 2000 3000 0 1000 f (MHz) 2000 3000 f (MHz) IS = 21.1 mA; VS = 5 V; PD = 35 dBm; Zo = 50 PD = 35 dBm; Zo = 50 (1) IS = 25.6 mA; VS = 5.5 V (2) IS = 21.5 mA; VS = 5 V (3) IS = 16.6 mA; VS = 4.5 V Fig 3. (s122) Isolation as a function of frequency; typical values BGM1014 Product data sheet Fig 4. Insertion gain (s212) as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 5 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 001aac493 20 PL (dBm) 15 001aac494 15 PL (dBm) (1) (2) (3) (1) (2) (3) 5 10 5 −5 0 −5 −40 −30 −20 PD (dBm) −10 −15 −50 f = 1 GHz; Zo = 50 −40 −20 −10 PD (dBm) f = 2.2 GHz; Zo = 50 (1) VS = 5.5 V (1) VS = 5.5 V (2) VS = 5 V (2) VS = 5 V (3) VS = 4.5 V (3) VS = 4.5 V Fig 5. −30 Load power as a function of drive power at 1 GHz; typical values Fig 6. 001aac495 5 Load power as a function of drive power at 2.2 GHz; typical values 001aac496 5 K NF (dB) 4 4.5 (1) (2) (3) 3 2 4 1 3.5 0 0 500 1000 1500 2000 2500 f (MHz) 0 1000 2000 3000 4000 f (MHz) Zo = 50 IS = 21.1 mA; VS = 5 V; Zo = 50 (1) VS = 5.5 V (2) VS = 5 V (3) VS = 4.5 V Fig 7. Noise figure as a function of frequency; typical values BGM1014 Product data sheet Fig 8. Stability factor as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 6 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 9. Application information Figure 9 shows a typical application circuit for the BGM1014 MMIC. The device is internally matched to 50 and therefore does not need any external matching. Good impedance matching is also achieved with a 75 load. The value of the input and output DC blocking capacitors C1 and C2 should be not more than 100 pF for applications above 100 MHz. Their values can be used to fine-tune the input and output impedance. For the RF choke, optimal results are obtained with a good quality chip inductor like the TDK MLG1608 (0603) or a wire-wound SMD. The value of the inductor can be used to fine-tune the output impedance. The RF choke and supply decoupling components should be located as close as possible to the MMIC. Ground paths must be as short as possible. The printed-circuit board (PCB) top ground plane must be as close as possible to the MMIC, and ideally directly beneath it. When using vias, use at least 3 vias for the top ground plane in order to limit ground path inductance. Supply decoupling with C3 should be from pin 1 to the same top ground plane. VS VS 1 IN 6 RF in C3 L1 C2 3 OUT C1 RF out BGM1014 SOT363 4 2, 5 GND1 Fig 9. BGM1014 Product data sheet GND2 001aac488 Typical application circuit All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 7 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier Figure 10 shows the PCB layout used for the typical application. 30 mm PH 30 mm IN OUT V+ PH IC1 C2 C1 L1 IN OUT C3 V+ 001aab395 Material = FR4; thickness = 0.6 mm; r = 4.6 Fig 10. Printed-circuit board layout and component view for typical application Table 9. BGM1014 Product data sheet List of components used for the typical application Component Description Value Dimensions C1, C2 multilayer ceramic chip capacitor 100 pF 0603 C3 multilayer ceramic chip capacitor 22 nF 0603 L1 SMD inductor 100 nH 0603 All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 8 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier Table 10. Scattering parameters VS = 5 V; IS = 21.1 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 C; measured on demo board. f (MHz) s11 s21 s12 s22 K-factor Magnitude (ratio) Angle (deg) Magnitude (ratio) Angle (deg) Magnitude (ratio) Angle (deg) Magnitude (ratio) Angle (deg) 100 0.287 16.1 31.28 9.1 0.02196 9.4 0.355 125.5 1.0 200 0.328 3.9 32.14 7.1 0.01734 3.3 0.258 115.3 1.1 400 0.319 28.8 33.57 30.9 0.01287 21.1 0.208 87.6 1.2 600 0.299 50.3 35.61 52.3 0.00969 35.3 0.179 62.1 1.5 800 0.272 68.6 38.05 73.3 0.00808 42.7 0.149 34.7 1.6 1000 0.243 84.7 41.37 95.5 0.00751 44.8 0.113 10.3 1.6 1200 0.225 98.9 45.48 119.1 0.00711 43.7 0.084 8.1 1.6 1400 0.229 106.9 49.78 144.8 0.00792 37.3 0.042 4.5 1.4 1600 0.261 127.8 54.37 173.0 0.00991 37.9 0.042 34.4 1.1 1800 0.317 154.4 57.96 154.4 0.01171 37.2 0.059 41.5 1.0 2000 0.364 167.7 56.65 120.1 0.01302 45.7 0.123 15.9 1.0 2200 0.362 126.7 50.11 85.0 0.01493 60.5 0.130 4.6 1.0 2400 0.354 87.5 41.68 54.6 0.01647 69.8 0.130 32.5 1.0 2600 0.325 47.6 33.47 25.9 0.01878 81.7 0.137 57.1 1.0 2800 0.282 7.7 26.34 1.4 0.02094 94.0 0.135 74.9 1.1 3000 0.231 32.0 20.81 20.3 0.02184 112.2 0.112 104.3 1.2 BGM1014 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 9 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 10. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 11. Package outline SOT363 (SC-88) BGM1014 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 10 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BGM1014 v.2 20110919 Product data sheet - BGM1014 v.1 Modifications: BGM1014 v.1 (9370 750 14499) BGM1014 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Package outline drawings have been updated to the latest version. 20050311 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 - © NXP B.V. 2011. All rights reserved. 11 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. 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Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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All rights reserved. 12 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGM1014 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 19 September 2011 © NXP B.V. 2011. All rights reserved. 13 of 14 BGM1014 NXP Semiconductors MMIC wideband amplifier 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Recommended operating conditions. . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 19 September 2011 Document identifier: BGM1014