BGU7052 SiGe:C Low Noise High Linearity Amplifier Rev. 2 — 21 February 2012 Product data sheet 1. Product profile 1.1 General description The BGU7052 is a low noise high linearity amplifier for wireless infrastructure applications. The LNA has a high input and output return loss and is designed to operate between 1.5 GHz and 2.5 GHz. It is housed in a 3 3 0.85 mm3 10-terminal plastic thin small outline package. The LNA is ESD protected on all terminals. 1.2 Features and benefits Low Noise Figure (NF) = 0.76 dB at 1900 MHz High linearity performance, IP3O = 35 dBm at 1900 MHz High input and output return loss Unconditionally stable 110 GHz transit frequency - SiGe:C technology Supply voltage 3.3 V Small 10-terminal leadless package 3 3 0.85 mm3 Moisture sensitivity level 1 1.3 Applications LNA for wireless infrastructure applications (1.5 GHz to 2.5 GHz) Low noise applications 1.4 Quick reference data Table 1. Quick reference data f = 1900 MHz; Tamb = 25 C; input and output 50 ; unless otherwise specified. Min Typ Max Unit VCC Symbol Parameter supply voltage Conditions 3.0 3.3 3.6 V ICC supply current 63 80 95 mA Gass associated gain 18.5 20 NF noise figure - 0.76 0.95 dB PL(1dB) output power at 1 dB gain compression 13 14.5 - dBm IP3O output third-order intercept point 32 35 dBm 21.5 dB - BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 2. Pinning information 2.1 Pinning terminal 1 index area n.c. 1 10 n.c. VCC1 2 9 VCC2 GND 3 8 GND RF_IN 4 7 RF_OUT GND 5 6 GND BGU7052 aaa-002089 Transparent top view Fig 1. Pin configuration 2.2 Pin description Table 2. Pin description Symbol Pin Description n.c. 1, 10 not connected GND 3, 5, 6, 8 ground RF_IN 4 RF input RF_OUT 7 RF output VCC 2, 9 supply voltage 3. Ordering information Table 3. Ordering information Type number Package Name BGU7052 BGU7052 Product data sheet Description Version HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 SOT650-1 © NXP B.V. 2012. All rights reserved. 2 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit 0 5 V - 300 mW - 20 dBm VCC supply voltage Ptot total power dissipation Pi(RF)CW continuous waveform RF input power Tstg storage temperature 65 +150 C Tj junction temperature - 150 C Tamb ambient temperature 40 +85 C VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E - 4 kV Charged Device Model (CDM); According JEDEC standard 22-C101B - 2 kV Typ Unit 20 K/W VCC = 3.3 V 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions 6. Characteristics Table 6. Characteristics VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified. All RF parameters are measured at the device RF in and RF output terminals. Symbol Parameter ICC supply current Gass associated gain NF PL(1dB) IP3O BGU7052 Product data sheet Conditions noise figure output power at 1 dB gain compression output third-order intercept point Min Typ Max Unit 63 80 95 f = 1750 MHz - 21.5 - f = 1900 MHz 18.5 20 f = 1950 MHz - 19.7 - dB f = 1750 MHz - 0.76 - dB dB 21.5 dB f = 1900 MHz - 0.76 0.95 dB f = 1950 MHz - 0.79 - dB f = 1750 MHz - 15.5 - dBm f = 1900 MHz 13 14.5 - dBm f = 1950 MHz - 14.5 - dBm f = 1750 MHz - 36.8 - dBm f = 1900 MHz 32 35.3 - dBm f = 1950 MHz - 35.1 - dBm All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 mA © NXP B.V. 2012. All rights reserved. 3 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier Table 6. Characteristics …continued VCC = 3.3 V; Tamb = 25 C; input and output 50 ; unless otherwise specified. All RF parameters are measured at the device RF in and RF output terminals. Symbol Parameter Conditions Min Typ Max Unit RLin f = 1750 MHz - 23 - dB f = 1900 MHz - 23 - dB f = 1950 MHz - 22 - dB f = 1750 MHz - 22 - dB f = 1900 MHz - 22 - dB input return loss output return loss RLout ISL isolation K Rollett stability factor f = 1950 MHz - 21 - dB f = 1750 MHz - 28.5 - dB f = 1900 MHz - 27.5 - dB f = 1950 MHz - 27 - dB 0 GHz f 25 GHz 1 - - 6.1 Performance curves 6 G% DDD 6 G% DDD I0+] VCC = 3.3 V. (1) Tj = 40 C (2) Tj = 25 C (2) Tj = 25 C (3) Tj = 85 C (3) Tj = 85 C Input reflection coefficient as a function of frequency BGU7052 Product data sheet I0+] VCC = 3.3 V. (1) Tj = 40 C Fig 2. Fig 3. Forward transmission coefficient as a function of frequency All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 4 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 6 G% DDD 6 G% DDD I0+] VCC = 3.3 V. (1) Tj = 40 C (2) Tj = 25 C (2) Tj = 25 C (3) Tj = 85 C (3) Tj = 85 C Output reflection coefficient as a function of frequency Fig 5. DDD 6SDUV G% . I0+] Reverse transmission coefficient as a function of frequency DDD 6 6 VCC = 3.3 V. (1) Tj = 40 C Fig 4. 6 6 I0+] VCC = 3.3 V; Tamb = 25 C. I*+] VCC = 3.3 V. (1) Tj = 40 C (2) Tj = 25 C (3) Tj = 85 C Fig 6. Wideband s-parameters as a function of frequency BGU7052 Product data sheet Fig 7. Stability K-factor as a function of frequency All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 5 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier aaa-002084 20 aaa-002085 50 PL(1dB) (dBm) IP3O (dBm) 18 (1) 40 (1) (2) (2) 16 (3) 30 (3) 14 20 12 10 10 1700 1750 1800 1850 1900 0 1700 2000 1950 f (MHz) VCC = 3.3 V. 1750 1850 1900 2000 1950 f (MHz) VCC = 3.3 V. (1) Tj = 40 C (1) Tj = 40 C (2) Tj = 25 C (2) Tj = 25 C (3) Tj = 85 C (3) Tj = 85 C Fig 8. 1800 Output power at 1 dB gain compression as a function of frequency 1) G% Fig 9. Output third-order intercept point as a function of frequency I0+] VCC = 3.3 V. (1) Tj = 40 C (2) Tj = 25 C (3) Tj = 85 C Fig 10. Noise figure as function of frequency BGU7052 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 6 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 7. Application information Figure 11 shows the typical application circuit for the BGU7052. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking C1 and C2 are recommended to be 1 nF. DC decoupling capacitors C3 and C4 should be located as close as possible to the BGU7052. In case different system blocks are supplied via the same voltage rail, it is recommended to use a bias choke in the bias line on the positions of R1 and R2. The value of this choke is depending on the frequency that needs to be dececoupled. R1 RF_INPUT C7 C1 C5 C3 C4 VCC2 C9 R2 VCC1 VCC1 2 9 RF_IN 4 7 RF_OUT 3 5 6 C6 C2 C8 VCC2 C10 RF_OUTPUT 8 aaa-000479 See Table 7 for a list of components. Fig 11. Schematics of application board BGU7052 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 7 of 13 BGU7052 NXP Semiconductors X2 C2 X3 RFOUT SiGe:C Low Noise High Linearity Amplifier C8 C10 C4 V2 C5 R2 GND R1 V1 C9 C6 C7 C3 RFIN C1 X1 aaa-002088 See Table 7 for a list of components. Fig 12. Layout of the evaluation board Table 7. List of components See Figure 11 for schematics. Component Value Size Function capacitor [1] 1 nF 0402 DC block C3, C4 capacitor [1] 100 pF 0402 bias decoupling C5, C6 capacitor [1] 100 nF 0402 bias decoupling C7, C8, C9, C10 capacitor [2] 100 nF 0603 optional R1, R2 resistor 0 0402 C1, C2 BGU7052 Product data sheet Description [1] Murata GRM155 or capacitor of same quality. [2] Murata GRM188 or capacitor of same quality. All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 8 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 8. Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm SOT650-1 0 1 2 mm scale X A B D A A1 E c detail X terminal 1 index area C e1 terminal 1 index area e 5 y y1 C v M C A B w M C b 1 L Eh 6 10 Dh DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 2.55 2.15 3.1 2.9 1.75 1.45 0.5 2 0.55 0.30 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT650-1 --- MO-229 --- EUROPEAN PROJECTION ISSUE DATE 01-01-22 02-02-08 Fig 13. Package outline SOT650-1 (HVSON10) BGU7052 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 9 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 9. Abbreviations Table 8. Abbreviations Acronym Description AC Alternating Current ESD ElectroStatic Discharge HBM Human Body Model LNA Low Noise Amplifier PDA Personal Digital Assistant RF Radio Frequency SiGe:C Silicon Germanium Carbon 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BGU7052 v.2 20120221 Product data sheet - BGU7052 v.1 Product data sheet - - Modifications: BGU7052 v.1 BGU7052 Product data sheet • Table 6: updated 20120214 All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 10 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGU7052 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 11 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGU7052 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 21 February 2012 © NXP B.V. 2012. All rights reserved. 12 of 13 BGU7052 NXP Semiconductors SiGe:C Low Noise High Linearity Amplifier 13. Contents 1 1.1 1.2 1.3 1.4 2 2.1 2.2 3 4 5 6 6.1 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Performance curves . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 21 February 2012 Document identifier: BGU7052