Footprint for wave soldering

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PLCC FOOTPRINT (WAVE SOLDERING)
Ax
C
Philips Semiconductors
handbook, full pagewidth
solder lands
Bx
solder resist
1.27
((Ny−1)x)
C
occupied area
solder thief
By
Ay
G
board
direction
2.00
(2x)
2.00
(2x)
0.60
1.27((Nx−1)x)
F
MLC749
Wave soldering
PACKAGE
NAME
FOOTPRINT DIMENSIONS (mm)
Nx
Ay
Bx
By
C
F
G
PLCC20
SOT380-1
5
5
9.70
9.70
6.60
6.60
1.55
15.35
15.35
±0.25
PLCC28
SOT261-2
PLCC28
SOT261-3
7
7
12.20
12.20
9.10
9.10
1.55
17.85
17.85
±0.25
7
7
12.20
12.20
9.10
9.10
1.55
17.85
17.85
±0.25
PLCC44
SOT187-2
11
11
17.30
17.30
14.20
14.20
1.55
22.95
22.95
±0.25
PLCC52
SOT238-2
13
13
19.80
19.80
16.70
16.70
1.55
25.50
25.50
±0.25
PLCC52
SOT238-3
13
13
19.80
19.80
16.70
16.70
1.55
25.50
25.50
±0.25
PLCC68
SOT188-2
17
17
24.30
24.30
21.80
21.80
1.55
30.55
30.55
±0.25
PLCC68
SOT188-3
17
17
24.30
24.30
21.80
21.80
1.55
30.55
30.55
±0.25
PLCC84
SOT189-2
21
21
30.00
30.00
26.90
26.90
1.55
35.65
35.65
±0.25
PLCC84
SOT189-3
21
21
30.00
30.00
26.90
26.90
1.55
35.65
35.65
±0.25
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PDF: 2001 Feb 19
Ax
PLACEMENT
ACCURACY
Ny
PC board footprint
PHILIPS OUTLINE
CODE