PHILIPS 74AHCT2G32DP

74AHC2G32; 74AHCT2G32
Dual 2-input OR gate
Rev. 01 — 23 February 2004
Product data sheet
1. General description
The 74AHC2G/AHCT2G32 is a high-speed Si-gate CMOS device. This device provides
two 2-input OR gates.
2. Features
■ Symmetrical output impedance
■ High noise immunity
■ ESD protection:
◆ HBM EIA/JESD22-A114-A exceeds 2000 V
◆ MM EIA/JESD22-A115-A exceeds 200 V
◆ CDM EIA/JESD22-C101 exceeds 1000 V.
■ Low power dissipation
■ Balanced propagation delays
■ SOT505-2 and SOT765-1 package
■ Specified from −40 °C to +85 °C and −40 °C to +125 °C.
3. Quick reference data
Table 1:
Quick reference data
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
CL = 15 pF;
VCC = 5 V
-
3.2
5.5
ns
Type 74AHC2G
tPHL, tPLH
propagation delay
nA and nB to nY
CI
input capacitance
CPD
power dissipation
capacitance
CL = 50 pF;
fi = 1 MHz
[1] [2]
-
1.5
10
pF
-
16
-
pF
-
3.3
6.9
ns
-
1.5
10
pF
-
17
-
pF
Type 74AHCT2G
tPHL, tPLH
propagation delay
nA and nB to nY
CI
input capacitance
CPD
[1]
power dissipation
capacitance
CL = 15 pF;
VCC = 5 V
CL = 50 pF;
fi = 1 MHz
[1] [2]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
[2]
The condition is VI = GND to VCC.
4. Ordering information
Table 2:
Ordering information
Type number
Package
Temperature range Name
Description
Version
74AHC2G32DP
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74AHCT2G32DP
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74AHC2G32DC
−40 °C to +125 °C
VSSOP8
plastic very shrink small outline package; 8 leads;
body width 2.3 mm
SOT765-1
74AHCT2G32DC
−40 °C to +125 °C
VSSOP8
plastic very shrink small outline package; 8 leads;
body width 2.3 mm
SOT765-1
5. Marking
Table 3:
Marking
Type number
Marking code
74AHC2G32DP
A32
74AHCT2G32DP
C32
74AHC2G32DC
A32
74AHCT2G32DC
C32
6. Functional diagram
1
1
1A
2
1B
5
2A
6
2B
1Y
7
2Y
3
7
5
≥1
3
6
mna733
Fig 1. Functional diagram.
9397 750 12532
Product data sheet
≥1
2
mna734
Fig 2. IEC logic symbol.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
2 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
B
Y
A
mna166
Fig 3. Logic diagram (logic driver).
7. Pinning information
7.1 Pinning
1A
1
8
VCC
1B
2
7
1Y
2Y
3
6
2B
GND
4
5
2A
32
mna732
Fig 4. Pin configuration.
7.2 Pin description
Table 4:
Pin description
Pin
Symbol
Description
1
1A
data input
2
1B
data input
3
2Y
data output
4
GND
ground (0 V)
5
2A
data input
6
2B
data input
7
1Y
data output
8
VCC
supply voltage
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
3 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
8. Functional description
8.1 Function table
Table 5:
Function table [1]
Input
Output
nA
nB
nY
L
L
L
L
H
H
H
L
H
H
H
H
[1]
H = HIGH voltage level;
L = LOW voltage level.
9. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
−0.5
+7.0
V
VI
input voltage
−0.5
+7.0
V
IIK
input diode current VI < −0.5 V
-
−20
mA
-
±20
mA
-
±25
mA
IOK
output diode
current
VO < −0.5 V or VO > VCC + 0.5 V
IO
output source or
sink current
VO > −0.5 V or VO < VCC + 0.5 V
ICC, IGND
VCC or GND
current
-
±75
mA
Tstg
storage
temperature
−65
+150
°C
Ptot
power dissipation
-
250
mW
[1]
Tamb = −40 °C to +125 °C
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
10. Recommended operating conditions
Table 7:
Symbol
Recommended operating operations
Parameter
Conditions
Min
Typ
Max
Unit
V
Type 74AHC2G
VCC
supply voltage
2.0
5.0
5.5
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
operating ambient
temperature
−40
+25
+125
°C
see Section 11 and Section 12
per device
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
4 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
Table 7:
Recommended operating operations …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr, tf
input rise and fall
times
VCC = 3.3 V ± 0.3 V
-
-
100
ns/V
VCC = 5 V ± 0.5 V
-
-
20
ns/V
Type 74AHCT2G
VCC
supply voltage
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
operating ambient
temperature
see Section 11 and Section 12
per device
−40
+25
+125
°C
tr, tf
input rise and fall
times
VCC = 5 V ± 0.5 V
-
-
20
ns/V
11. Static characteristics
Table 8:
Static characteristics type 74AHC2G32
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
HIGH-level input
voltage
VCC = 2.0 V
1.5
-
-
V
VCC = 3.0 V
2.1
-
-
V
VCC = 5.5 V
3.85
-
-
V
VCC = 2.0 V
-
-
0.5
V
VCC = 3.0 V
-
-
0.9
V
VCC = 5.5 V
-
-
1.65
V
IO = −50 µA; VCC = 2.0 V
1.9
2.0
-
V
IO = −50 µA; VCC = 3.0 V
2.9
3.0
-
V
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
V
IO = −4.0 mA; VCC = 3.0 V
2.58
-
-
V
IO = −8.0 mA; VCC = 4.5 V
3.94
-
-
V
IO = 50 µA; VCC = 2.0 V
-
0
0.1
V
IO = 50 µA; VCC = 3.0 V
-
0
0.1
V
IO = 50 µA; VCC = 4.5 V
-
0
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
V
Tamb = 25 °C
VIH
VIL
VOH
VOL
LOW-level input
voltage
HIGH-level output
voltage
LOW-level output
voltage
VI = VIH or VIL
VI = VIH or VIL
ILI
input leakage current
VI = VCC or GND; VCC = 5.5 V
-
-
0.1
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
µA
CI
input capacitance
-
1.5
10
pF
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
5 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
Table 8:
Static characteristics type 74AHC2G32 …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V
1.5
-
-
V
VCC = 3.0 V
2.1
-
-
V
VCC = 5.5 V
3.85
-
-
V
VCC = 2.0 V
-
-
0.5
V
VCC = 3.0 V
-
-
0.9
V
VCC = 5.5 V
-
-
1.65
V
IO = −50 µA; VCC = 2.0 V
1.9
-
-
V
IO = −50 µA; VCC = 3.0 V
2.9
-
-
V
IO = −50 µA; VCC = 4.5 V
4.4
-
-
V
IO = −4.0 mA; VCC = 3.0 V
2.48
-
-
V
IO = −8.0 mA; VCC = 4.5 V
3.8
-
-
V
IO = 50 µA; VCC = 2.0 V
-
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.44
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.44
V
Tamb = −40 °C to +85 °C
VIH
VIL
VOH
VOL
HIGH-level input
voltage
LOW-level input
voltage
HIGH-level output
voltage
LOW-level output
voltage
VI = VIH or VIL
VI = VIH or VIL
ILI
input leakage current
VI = VCC or GND; VCC = 5.5 V
-
-
1.0
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
10
µA
CI
input capacitance
-
-
10
pF
VCC = 2.0 V
1.5
-
-
V
VCC = 3.0 V
2.1
-
-
V
VCC = 5.5 V
3.85
-
-
V
VCC = 2.0 V
-
-
0.5
V
VCC = 3.0 V
-
-
0.9
V
VCC = 5.5 V
-
-
1.65
V
IO = −50 µA; VCC = 2.0 V
1.9
-
-
V
IO = −50 µA; VCC = 3.0 V
2.9
-
-
V
IO = −50 µA; VCC = 4.5 V
4.4
-
-
V
IO = −4.0 mA; VCC = 3.0 V
2.40
-
-
V
IO = −8.0 mA; VCC = 4.5 V
3.70
-
-
V
Tamb = −40 °C to +125 °C
VIH
VIL
VOH
HIGH-level input
voltage
LOW-level input
voltage
HIGH-level output
voltage
VI = VIH or VIL
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
6 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
Table 8:
Static characteristics type 74AHC2G32 …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VOL
LOW-level output
voltage
VI = VIH or VIL
IO = 50 µA; VCC = 2.0 V
-
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.55
V
ILI
input leakage current
VI = VCC or GND; VCC = 5.5 V
-
-
2.0
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
40
µA
CI
input capacitance
-
-
10
pF
Table 9:
Static characteristics type 74AHCT2G32
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
V
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
V
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
V
IO = −8.0 mA; VCC = 4.5 V
3.94
-
-
V
LOW-level output
voltage
VI = VIH or VIL
IO = 50 µA; VCC = 4.5 V
-
0
0.1
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
V
Tamb = 25 °C
VOL
ILI
input leakage current
VI = VIH or VIL; VCC = 5.5 V
-
-
0.1
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
µA
∆ICC
additional quiescent
supply current per
input pin
VI = 3.4 V; other inputs at
VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.35
mA
CI
input capacitance
-
1.5
10
pF
Tamb = −40 °C to +85 °C
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
V
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
V
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = −50 µA; VCC = 4.5 V
4.4
-
-
V
IO = −8.0 mA; VCC = 4.5 V
3.8
-
-
V
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
7 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
Table 9:
Static characteristics type 74AHCT2G32 …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VOL
LOW-level output
voltage
VI = VIH or VIL
IO = 50 µA; VCC = 4.5 V
-
-
0.1
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.44
V
ILI
input leakage current
VI = VIH or VIL; VCC = 5.5 V
-
-
1.0
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
10
µA
∆ICC
additional quiescent
supply current per
input pin
VI = 3.4 V; other inputs at
VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.5
mA
CI
input capacitance
-
-
10
pF
Tamb = −40 °C to +125 °C
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
V
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
V
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = −50 µA; VCC = 4.5 V
4.4
-
-
V
IO = −8.0 mA; VCC = 4.5 V
3.70
-
-
V
VOL
LOW-level output
voltage
VI = VIH or VIL
IO = 50 µA; VCC = 4.5 V
-
-
0.1
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.55
V
ILI
input leakage current
VI = VIH or VIL; VCC = 5.5 V
-
-
2.0
µA
ICC
quiescent supply
current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
40
µA
∆ICC
additional quiescent
supply current per
input pin
VI = 3.4 V; other inputs at
VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.5
mA
CI
input capacitance
-
-
10
pF
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
8 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
12. Dynamic characteristics
Table 10: Dynamic characteristics type 74AHC2G32
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr = tf ≤ 3.0 ns; see Figure 6.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = 25 °C
tPHL, tPLH
propagation delay
nA and nB to nY
see Figure 5
VCC = 3.0 V to 3.6 V; CL = 15 pF
[1]
-
4.4
7.9
ns
VCC = 4.5 V to 5.5 V; CL = 15 pF
[2]
-
3.2
5.5
ns
-
6.3
11.4
ns
-
4.6
7.5
ns
-
16
-
pF
VCC = 3.0 V to 3.6 V; CL = 15 pF
1.0
-
9.5
ns
VCC = 4.5 V to 5.5 V; CL = 15 pF
1.0
-
6.5
ns
VCC = 3.0 V to 3.6 V; CL = 50 pF
1.0
-
13.0
ns
VCC = 4.5 V to 5.5 V; CL = 50 pF
1.0
-
8.5
ns
VCC = 3.0 V to 3.6 V; CL = 15 pF
1.0
-
10.0
ns
VCC = 4.5 V to 5.5 V; CL = 15 pF
1.0
-
7.0
ns
VCC = 3.0 V to 3.6 V; CL = 50 pF
1.0
-
14.5
ns
VCC = 4.5 V to 5.5 V; CL = 50 pF
1.0
-
9.5
ns
VCC = 3.0 V to 3.6 V; CL = 50 pF
VCC = 4.5 V to 5.5 V; CL = 50 pF
power dissipation
capacitance
CPD
CL = 50 pF; fi = 1 MHz
[3] [4]
Tamb = −40 °C to +85 °C
tPHL, tPLH
propagation delay
nA and nB to nY
see Figure 5
Tamb = −40 °C to +125 °C
tPHL, tPLH
propagation delay
nA and nB to nY
see Figure 5
[1]
Typical values are measured at VCC = 3.3 V.
[2]
Typical values are measured at VCC = 5.0 V.
[3]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
[4]
The condition is VI = GND to VCC.
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
9 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
Table 11: Dynamic characteristics type 74AHCT2G32
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr = tf ≤ 3.0 ns; see Figure 6.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tamb = 25 °C
tPHL, tPLH
propagation delay
nA and nB to nY
power dissipation
capacitance
CPD
see Figure 5
VCC = 4.5 V to 5.5 V; CL = 15 pF
[1]
-
3.3
6.9
ns
VCC = 4.5 V to 5.5 V; CL = 50 pF
[1]
-
4.8
7.9
ns
[2] [3]
-
17
-
pF
VCC = 4.5 V to 5.5 V; CL = 15 pF
1.0
-
8.0
ns
VCC = 4.5 V to 5.5 V; CL = 50 pF
1.0
-
9.0
ns
VCC = 4.5 V to 5.5 V; CL = 15 pF
1.0
-
9.0
ns
VCC = 4.5 V to 5.5 V; CL = 50 pF
1.0
-
10.0
ns
CL = 50 pF; fi = 1 MHz
Tamb = −40 °C to +85 °C
tPHL, tPLH
propagation delay
nA and nB to nY
see Figure 5
Tamb = −40 °C to +125 °C
tPHL, tPLH
propagation delay
nA and nB to nY
see Figure 5
[1]
Typical values are measured at VCC = 5.0 V.
[2]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
[3]
The condition is VI = GND to VCC.
13. Waveforms
VI
VM
nA, nB input
GND
t PHL
t PLH
VOH
VM
nY output
VOL
mna224
74AHC2G32: VM = 0.5 x VCC; VI = GND to VCC.
74AHCT2G32: input VM = 1.5 V and output VM = 0.5 x VCC; VI = GND to 3.0 V.
Fig 5. The input (nA and nB) to output (nY) propagation delays.
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
10 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
VCC
PULSE
GENERATOR
VI
VO
D.U.T.
RT
CL
mna101
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance (See Section 12 for the value).
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig 6. Load circuitry for switching times.
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
11 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
14. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
SOT505-2
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Fig 7. Package outline TSSOP8
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
12 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
SOT765-1
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Fig 8. Package outline VSSOP8
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
13 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
15. Revision history
Table 12:
Revision history
Document ID
Release date
Data sheet status
Change notice
Order number
Supersedes
74AHC_AHCT2G32_1
20040223
Product data
-
9397 750 12532
-
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
14 of 16
74AHC2G32; 74AHCT2G32
Philips Semiconductors
Dual 2-input OR gate
16. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
18. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
19. Contact information
For additional information, please visit http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 12532
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 23 February 2004
15 of 16
Philips Semiconductors
74AHC2G32; 74AHCT2G32
Dual 2-input OR gate
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
9
10
11
12
13
14
15
16
17
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information . . . . . . . . . . . . . . . . . . . . 15
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 23 February 2004
Document order number: 9397 750 12532
Published in The Netherlands