BLF6G27-45; BLF6G27S-45 WiMAX power LDMOS transistor Rev. 03 — 15 December 2008 Product data sheet 1. Product profile 1.1 General description 45 W LDMOS power transistor for base station applications at frequencies from 2500 MHz to 2700 MHz. Table 1. Typical performance RF performance at Tcase = 25 °C in a class-AB production test circuit. Mode of operation 1-carrier N-CDMA[1] Gp ηD ACPR885k ACPR1980k (W) (dB) (%) (dBc) (dBc) 7 18 24 −49[2] −64[2] f VDS PL(AV) (MHz) (V) 2500 to 2700 28 [1] Single carrier N-CDMA with pilot, paging sync and 6 traffic channels (Walsh codes 8 - 13). PAR = 9.7 dB at 0.01 % probability on CCDF. Channel bandwidth is 1.23 MHz. [2] Measured within 30 kHz bandwidth. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features n Typical 1-carrier N-CDMA performance (single carrier N-CDMA with pilot, paging, sync and 6 traffic channels [Walsh codes 8 - 13]. PAR = 9.7 dB at 0.01 % probability on CCDF. Channel bandwidth is 1.23 MHz), a supply voltage of 28 V and an IDq of 350 mA: n Qualified up to a maximum VDS operation of 32 V n Integrated ESD protection n Excellent ruggedness n High efficiency n Excellent thermal stability n Designed for broadband operation n Internally matched for ease of use n Low gold plating thickness on leads n Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 1.3 Applications n RF power amplifiers for base stations and multi carrier applications in the 2500 MHz to 2700 MHz frequency range 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol BLF6G27-45 (SOT608A) 1 drain 2 gate 3 source 1 1 [1] 2 3 3 2 sym112 BLF6G27S-45 (SOT608B) 1 drain 2 gate 3 source 1 [1] 1 3 2 3 2 sym112 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLF6G27-45 - flanged ceramic package; 2 mounting holes; 2 leads SOT608A BLF6G27S-45 - ceramic earless flanged package; 2 leads SOT608B 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Max Unit VDS drain-source voltage - 65 V VGS gate-source voltage −0.5 +13 V ID drain current - 20 A Tstg storage temperature −65 +150 °C Tj junction temperature - 200 °C BLF6G27-45_BLF6G27S-45_3 Product data sheet Min © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 2 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Type Rth(j-case) thermal resistance from Tcase = 80 °C; BLF6G27-45 junction to case PL = 34 W (CW) BLF6G27S-45 Typ Unit 1.7 K/W 1.7 K/W 6. Characteristics Table 6. Characteristics Tj = 25 °C per section; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 0.5 mA 65 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 60 mA 1.4 1.9 2.4 V IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 µA IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V 8.8 10.4 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 140 nA gfs forward transconductance VDS = 10 V; ID = 2.5 A - 4.3 - S RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 2.1 A - 0.24 0.385 Ω Crs feedback capacitance VGS = 0 V; VDS = 28 V; f = 1 MHz - 1.1 - pF 7. Application information Table 7. Application information Mode of operation: Single carrier N-CDMA with pilot, paging, sync and 6 traffic channels (Walsh codes 8 - 13). PAR 9.7 dB at 0.01 % probability on CCDF; channel bandwidth = 1.23 MHz; f = 2700 MHz; RF performance at VDS = 28 V; IDq = 350 mA; Tcase = 25 °C; unless otherwise specified; in a class-AB production circuit. Symbol Parameter PL(AV) average output power Gp power gain PL(AV) = 7 W 16.5 18 RLin input return loss PL(AV) = 7 W - −10 −5 dB ηD drain efficiency PL(AV) = 7 W % ACPR885k adjacent channel power ratio (885 kHz) ACPR1980k adjacent channel power ratio (1980 kHz) [1] Conditions Min Typ Max Unit - 7 - W dB 22 24 PL(AV) = 7 W [1] - −49 −46 dBc PL(AV) = 7 W [1] - −64 −61 dBc Measured within 30 kHz bandwidth. 7.1 Ruggedness in class-AB operation The BLF6G27-45 and BLF6G27S-45 are capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; IDq = 350 mA; PL = 45 W (CW); f = 2600 MHz. BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 3 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 7.2 Single carrier N-CDMA performance 001aah406 22 50 ηD (%) Gp (dB) 001aah407 −30 ACPR (dBc) 40 −40 18 30 −50 16 20 −60 ACPR885k 14 10 −70 ACPR1500k 12 10−1 0 ACPR1980k −80 10−1 20 Gp ηD 1 102 10 (1) (2) (1) (2) (2) (1) 1 PL(AV) (W) 102 10 PL(AV) (W) VDS = 28 V; IDq = 350 mA; f = 2600 MHz; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; channel bandwidth = 1.23 MHz; instantaneous bandwidth = 30 kHz. VDS = 28 V; IDq = 350 mA; f = 2600 MHz; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; channel bandwidth = 1.23 MHz; instantaneous bandwidth = 30 kHz. (1) Low frequency component (2) High frequency component Fig 1. Power gain and drain efficiency as functions of average load power; typical values Fig 2. Adjacent channel power ratio as function of average load power; typical values BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 4 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 7.3 Two-tone 001aah408 19.5 Gp (dB) 001aah409 −15 IMD3 (dBc) (5) −25 (4) 18.5 −35 (3) (2) −45 (1) −55 (1) (2) (5) (3) (4) 17.5 16.5 1 102 10 −65 1 PL(PEP) (W) PL(PEP) (W) VDS = 28 V; f1 = 2598.75 MHz; f2 = 2601.25 MHz; 2.5 MHz tone spacing. VDS = 28 V; f1 = 2598.75 MHz; f2 = 2601.25 MHz; 2.5 MHz tone spacing. (1) IDq = 250 mA (1) IDq = 250 mA (2) IDq = 300 mA (2) IDq = 300 mA (3) IDq = 350 mA (3) IDq = 350 mA (4) IDq = 400 mA (4) IDq = 400 mA (5) IDq = 500 mA (5) IDq = 500 mA Fig 3. Power gain as function of peak envelope load power; typical values Fig 4. Third order intermodulation distortion as function of peak envelope load power; typical values BLF6G27-45_BLF6G27S-45_3 Product data sheet 102 10 © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 5 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 7.4 Continuous wave 001aah410 20 Gp Gp (dB) ηD (%) 16 001aah411 20 60 Gp (dB) 16 40 ηD (1) (2) (3) 12 (4) 12 20 (5) 0 8 1 10 (6) 8 102 1 102 10 PL(CW) (W) PL (W) IDq = 350 mA; f = 2600 MHz; Tcase = 25 °C; VDS = 28 V. IDq = 350 mA; f = 2600 MHz; Tcase = 25 °C. (1) VDS = 32 V (2) VDS = 28 V (3) VDS = 24 V (4) VDS = 20 V (5) VDS = 16 V (6) VDS = 12 V Fig 5. Power gain and drain efficiency as functions of CW load power; typical values Fig 6. Power gain as function of CW load power; typical values BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 6 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 7.5 Single carrier N-CDMA broadband performance at 7 W average 001aah412 19 ηD (%) Gp (dB) Gp 18 001aah413 −40 27 ACPR (dBc) 26 (1) (2) −50 ACPR885k 25 17 (1) (2) ηD 16 ACPR1500k 24 −60 (1) (2) 23 15 14 2500 2550 2600 ACPR1980k −70 2500 22 2700 2650 2550 2600 f (MHz) 2650 2700 f (MHz) VDS = 28 V; IDq = 350 mA; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; instantaneous bandwidth = 30 kHz. VDS = 28 V; IDq = 350 mA; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; instantaneous bandwidth = 30 kHz. (1) Low frequency component (2) High frequency component Fig 7. Power gain and drain efficiency as functions of frequency; typical values Fig 8. Adjacent channel power ratio as function of frequency; typical values 001aah417 19 Gp (dB) 0 RLin (dB) Gp 18 −4 17 −8 RLin −12 16 15 2500 2550 2600 −16 2700 2650 f (MHz) VDS = 28 V; IDq = 350 mA; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; instantaneous bandwidth = 30 kHz. Fig 9. Power gain and input return loss as functions of frequency BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 7 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 7.6 Single carrier N-CDMA broadband performance at 20 W average 001aah414 18 Gp (dB) 17 45 ηD (%) Gp 43 001aah415 −30 (1) (2) ACPR (dBc) ACPR885k −40 16 41 ηD (1) (2) ACPR1500k 39 15 −50 (1) (2) 37 14 13 2500 2550 2600 35 2700 2650 −60 2500 ACPR1980k 2550 2600 f (MHz) VDS = 28 V; IDq = 350 mA; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; instantaneous bandwidth = 30 kHz. 2650 2700 f (MHz) VDS = 28 V; IDq = 350 mA; single carrier N-CDMA; PAR = 9.7 dB at 0.01 % probability; instantaneous bandwidth = 30 kHz. (1) Low frequency component (2) High frequency component Fig 10. Power gain and drain efficiency as functions of frequency; typical values Fig 11. Adjacent channel power ratio as function of frequency; typical values BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 8 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 8. Test information C10 C11 L1 C4 VGG C14 C7 C6 VDD +28 V R2 C5 R1 C9 50 Ω output Q1 C3 50 Ω input C1 C2 C8 C12 C13 001aah416 See Table 8 for list of components. Fig 12. Test circuit for operation at 2500 MHz to 2700 MHz BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 9 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor short (0 Ω) VGG C14 C6 VDD R2 L1 C11 C10 C4 C5 C7 Q1 R1 C3 C1 C9 C2 C8 C13 C12 BLF6G27-45 Input-Rev3 BLF6G27-45 Output-Rev3 001aah418 Striplines are on a double copper-clad Taconic RF35 Printed-Circuit Board (PCB) with εr = 3.5 and thickness = 0.76 mm. See Table 8 for list of components. Fig 13. Component layout for 2500 MHz to 2700 MHz test circuit Table 8. List of components For test circuit, see Figure 12 and Figure 13. Component Description Value C1 multilayer ceramic chip capacitor 0.3 pF [1] Remarks C2 multilayer ceramic chip capacitor 0.5 pF [1] C3, C4, C7, C8 multilayer ceramic chip capacitor 11 pF [1] C5, C10, C11, C12, C13 multilayer ceramic chip capacitor 4.7 µF C4532X7R1H475M C6 tantalum capacitor 10 µF; 35 V Kemet (Farnell) C9 multilayer ceramic chip capacitor 8.2 pF C14 electrolytic capacitor 470 µF; 63 V L1 ferrite SMD bead - Ferroxcube BDS 3/3/4.6-4S2 or equivalent R1 resistor 22 Ω package 0603 R2 resistor 12 Ω package 1206 Q1 BLF6G27-45 or BLF6G27S-45 - [1] American Technical Ceramics type 100B or capacitor of same quality. BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 10 of 16 NXP Semiconductors BLF6G27-45; BLF6G27S-45 WiMAX power LDMOS transistor Table 9. Measured test circuit impedances f Zi Zo (GHz) (Ω) (Ω) 2.50 11.1 − j11.0 18.4 − j9.1 2.55 10.6 − j10.8 16.9 − j9.2 2.60 10.1 − j10.5 15.6 − j9.2 2.65 9.6 − j10.2 14.4 − j9.1 2.70 9.1 − j9.8 13.3 − j8.9 BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 11 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 9. Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT608A D A F 3 D1 U1 B q c C 1 H E1 p U2 E w1 M A M B M 2 A w2 M C M b Q 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 4.62 3.76 7.24 6.99 0.15 0.10 10.21 10.29 10.01 10.03 inches 0.182 0.148 0.285 0.006 0.275 0.004 0.402 0.405 0.394 0.395 OUTLINE VERSION D D1 F H p Q q U1 U2 w1 w2 10.21 10.29 10.01 10.03 1.14 0.89 15.75 14.73 3.30 2.92 1.70 1.35 15.24 20.45 20.19 9.91 9.65 0.25 0.51 0.402 0.405 0.394 0.395 0.045 0.620 0.035 0.580 0.130 0.115 0.067 0.600 0.053 0.805 0.795 0.390 0.010 0.020 0.380 E E1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 01-02-22 02-02-11 SOT608A Fig 14. Package outline SOT608A BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 12 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor Ceramic earless flanged package; 2 leads SOT608B D A F 3 D1 A U1 c 1 U2 H E E1 2 w1 b M A Q M 0 5 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions) UNIT A b c mm 4.62 3.76 7.24 6.99 0.15 0.10 inch 0.182 0.285 0.006 0.402 0.405 0.402 0.405 0.045 0.620 0.067 0.403 0.403 0.020 0.148 0.275 0.004 0.394 0.395 0.394 0.395 0.035 0.580 0.053 0.393 0.393 OUTLINE VERSION D D1 E E1 10.21 10.29 10.21 10.29 10.01 10.03 10.01 10.03 F H Q 1.14 0.89 15.75 14.73 1.70 1.35 U1 U2 10.24 10.24 9.98 9.98 REFERENCES IEC JEDEC JEITA w1 0.51 EUROPEAN PROJECTION ISSUE DATE 06-11-27 06-12-06 SOT608B Fig 15. Package outline SOT608B BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 13 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 10. Abbreviations Table 10. Abbreviations Acronym Description CCDF Complementary Cumulative Distribution Function CW Continuous Wave LDMOS Laterally Diffused Metal-Oxide Semiconductor N-CDMA Narrowband Code Division Multiple Access PAR Peak-to-Average power Ratio RF Radio Frequency SMD Surface Mounted Device VSWR Voltage Standing-Wave Ratio WiMAX Worldwide Interoperability for Microwave Access 11. Revision history Table 11. Revision history Document ID Release date Data sheet status BLF6G27-45_BLF6G27S-45_3 20081215 Modifications: • Product data sheet Change notice Supersedes - BLF6G27-45_BLF6G27S-45_2 Changed the maximum junction temperature in Table 4 on page 2. BLF6G27-45_BLF6G27S-45_2 20080207 Preliminary data sheet - BLF6G27-45_BLF6G27S-45_1 BLF6G27-45_BLF6G27S-45_1 20080129 Preliminary data sheet - - BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 14 of 16 BLF6G27-45; BLF6G27S-45 NXP Semiconductors WiMAX power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BLF6G27-45_BLF6G27S-45_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 15 December 2008 15 of 16 NXP Semiconductors BLF6G27-45; BLF6G27S-45 WiMAX power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 3 Ruggedness in class-AB operation. . . . . . . . . . 3 Single carrier N-CDMA performance . . . . . . . . 4 Two-tone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Continuous wave . . . . . . . . . . . . . . . . . . . . . . . 6 Single carrier N-CDMA broadband per formance at 7 W average . . . . . . . . . . . . . . . . . 7 Single carrier N-CDMA broadband performance at 20 W average . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 December 2008 Document identifier: BLF6G27-45_BLF6G27S-45_3