ROHM BA4580YFVM-MTR

Datasheet
Operational Amplifier Series
Automotive Low Noise
Operational Amplifiers
BA4580Yxxx-M, BA4584YFV-M
●General Description
BA4580Yxxx-M, BA4584YFV-M integrate two or four
independent Op-Amps on a single chip. These
Op-Amp have some features of low noise and low
distortion characteristics and can operate from ±2.0V
to ±16V(split supply).
BA4560Yxxx-M, BA4584YFV-M are manufactured for
automotive requirements of car navigation system, car
audio, etc.
●Key Specifications
 Wide operating supply voltage
(split supply):±2.0V to ±16V
 Wide Temperature Range:
-40℃ to +105℃
 High Slew Rate:
5V/µs(Typ.)
 Total Harmonic Distortion:
0.0005%(Typ.)
 Input Referred Noise Voltage:
5 nV/ Hz (Typ.)
●Packages
SOP8
MSOP8
SSOP-B14
●Features
 AEC-Q100 Qualified
 High voltage gain
 low noise
 low distortion
 Wide operating supply voltage
 Internal ESD protection circuit
 Wide operating temperature Range
W(Typ.) xD(Typ.) xH(Max.)
5.00mm x 6.20mm x 1.71mm
2.90mm x 4.00mm x 0.90mm
5.00mm x 6.40mm x 1.35mm
●Application
 Car Navigation System
 Car Audio
●Simplified schematic
VCC
VCC
-IN
-IN
OUT
VOUT
+IN
+IN
VEE
VEE
Figure 1. Simplified schematic (one channel only)
○Product structure:Silicon monolithic integrated circuit
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TSZ22111・14・001
○This product is not designed protection against radioactive rays.
1/27
TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Pin Configuration
BA4580YF-M : SOP8
BA4580YFVM-M : MSOP8
OUT1 1
-IN1
+IN1
VEE
2
CH1
- +
3
Pin No.
Symbol
1
OUT1
8 VCC
2
-IN1
7 OUT2
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
Pin No.
Symbol
1
OUT1
2
-IN1
3
+IN1
4
VCC
5
+IN2
6
-IN2
6 -IN2
CH2
+ -
4
5 +IN2
BA4584YFV-M : SSOP-B14
OUT1 1
14 OUT4
-IN1 2
CH1
- +
13 -IN4
CH4
+ -
+IN1 3
12 +IN4
VCC 4
11 VEE
7
OUT2
10 +IN3
8
OUT3
9 -IN3
9
-IN3
10
+IN3
11
VEE
12
+IN4
13
-IN4
14
OUT4
5
+IN2
+ CH3
- +
CH2
-IN2 6
OUT2 7
8 OUT3
Package
SOP8
MSOP8
SSOP-B14
BA4580YF-M
BA4580YFVM-M
BA4584YFV-M
●Ordering Information
B
A
4
5
8
Parts Number.
BA4580Yxxx
BA4584Yxx
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©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
x
Y
x
x
x
-
Mxx
Packaging and forming specification
M: Automotive (car navigation system, car
audio, etc.)
E2: Embossed tape and reel
(SOP8/SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
Package
F
: SOP8
FV : SSOP-B14
FVM : MSOP8
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TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Line-up
Topr
Supply voltage
-40°C to +105°C
±2.0V to ±16V
Number of
channels
Package
Dual
Quad
Orderable Parts Number
SOP8
Reel of 2500
BA4580YF-ME2
MSOP8
Reel of 3000
BA4580YFVM-MTR
SSOP-B14
Reel of 2500
BA4584YFV-ME2
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Ratings
Symbol
Supply Voltage
BA4580Y
VCC-VEE
+36
*1*4
SOP8
Power Dissipation
Pd
780
MSOP8
SSOP-B14
Differential Input Voltage *5
BA4584Y
Unit
V
-
*2*4
590
-
mW
1350*3*4
-
Vid
+36
V
Vicm
(VEE-0.3) to (VEE+36)
V
Ii
-10
mA
Operating Supply Voltage
Vopr
+4 to +32
(±2 to ±16)
V
Output current
Iout
±50
mA
Operating Temperature Range
Topr
-40 to +105
℃
Tstg
-55 to +150
℃
Tjmax
+150
℃
Input Common-mode Voltage Range
Input Current
*6
Storage Temperature Range
Maximum Junction Temperature
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature
environment may cause deterioration of characteristics.
*1 To use at temperature above Ta=25℃ reduce 6.2mW/℃.
*2 To use at temperature above Ta=25℃ reduce 4.8mW/℃.
*3 To use at temperature above Ta=25℃ reduce 10.8mW/℃.
*4 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*5 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
*6 Excessive input current will flow if a differential input voltage in excess of approximately 0.6V is applied between
the input unless some limiting resistance is used.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Electrical Characteristics
○BA4580Yxxx-M (Unless otherwise specified VCC=+15V, VEE=-15V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Condition
Input Offset Voltage *7
Vio
-
0.3
3
mV
Input Offset Current *7
Iio
-
5
200
nA
-
Input Bias Current *8
Ib
-
100
500
nA
-
Supply Current
ICC
-
6
9
mA
Maximum Output Voltage
VOM
±12
±13.5
-
V
RL≧2kΩ
Large Signal Voltage Gain
Av
90
110
-
dB
RL≧10kΩ, OUT=±10V
Vicm
±12
±13.5
-
V
Common-mode Rejection Ratio
CMRR
80
110
-
dB
RS≦10kΩ
Power Supply Rejection Ratio
PSRR
80
110
-
dB
RS≦10kΩ
SR
-
5
-
V/μs
RL≧2kΩ
GBW
-
10
-
MHz
f=10kHz
fT
-
5
-
MHz
RL=2kΩ
THD+N
-
0.0005
-
%
-
5
-
nV/ Hz
RS=100Ω, Vi=0V, f=1kHz
-
0.8
-
μVrms
RIAA, RS=2.2 kΩ, 30kHz LPF
-
110
-
dB
Input Common-mode Voltage Range
Slew Rate
Gain Band Width
Unity Gain Frequency
Total Harmonic Distortion
+Noise
Input Referred Noise Voltage
Channel Separation
*7
*8
RS≦10kΩ
RL=∞, All Op-Amps, VIN+=0V
-
Av=20dB, OUT=5Vrms
RL=2kΩ
f=1kHz, 20Hz~20kHz BPF
Vn
CS
R1=100Ω, f=1kHz
Absolute value
Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
○BA4584Y (Unless otherwise specified VCC=+15V, VEE=-15V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Input Offset Voltage *9
Vio
-
0.3
3
mV
Input Offset Current *9
Iio
-
5
200
nA
-
Input Bias Current *10
Ib
-
100
500
nA
-
Supply Current
ICC
-
11
17
mA
Maximum Output Voltage
VOM
±12
±13.5
-
V
RL≧2kΩ
Large Signal Voltage Gain
AV
90
110
-
dB
RL≧10kΩ, OUT=±10V
Vicm
±12
±13.5
-
V
Common-mode Rejection Ratio
CMRR
80
110
-
dB
RS≦10kΩ
Power Supply Rejection Ratio
PSRR
80
110
-
dB
RS≦10kΩ
SR
-
5
-
V/μs
RL≧2kΩ
GBW
-
10
-
MHz
f=10kHz
fT
-
5
-
MHz
RL=2kΩ
THD+N
-
0.0005
-
%
-
5
-
nV/ Hz
RS=100Ω, Vi=0V, f=1kHz
-
0.8
-
μVrms
RIAA, RS=2.2kΩ, 30kHz LPF
-
110
-
dB
Input Common-mode Voltage Range
Slew Rate
Gain Band Width
Unity Gain Frequency
Total Harmonic Distortion
+Noise
Input Referred Noise Voltage
Channel Separation
*9
*10
RS≦10kΩ
RL=∞, All Op-Amps, VIN+=0V
-
Av=20dB, OUT=5Vrms
RL=2kΩ
f=1kHz, 20Hz~20kHz BPF
Vn
CS
R1=100Ω, f=1kHz
Absolute value
Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document.
1. Absolute maximum ratings
Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
characteristics.
1.1 Power supply voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristics of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assure
normal operation of IC. When normal operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperature)and thermal resistance of the package.
2. Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.4 Circuit current (ICC)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.5 Output saturation voltage (VOM)
Signifies the voltage range that can be output under specific output conditions.
2.6 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and Inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
2.7 Input common-mode voltage range (Vicm)
Indicates the input voltage range where IC operates normally.
2.8 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation
of DC.
PSRR = (Change of power supply voltage) / (Input offset fluctuation)
2.10 Slew Rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage
as unit time.
2.11 Gain Band Width (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
2.12 Unity gain frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
2.13 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.14 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
2.15 Channel separation (CS)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Typical Performance Curves
○ BA4580Yxxx-M
10
SUPPLY CURRENT [mA] .
POWER DISSIPATIO N [mW] .
1000
800
BA4580YF-M
600
BA4580YFVM-M
400
200
0
0
25
50
75
105
100
AMBIENT TEMPERATURE [℃]
8
-40℃
6
4
105℃
2
0
125
±0
.
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
SUPPLY CURRENT [mA]
10.0
8.0
±15V
6.0
4.0
±7.5 V
2.0
0.0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
±5
±10
±15
SUPPLY VOLTAGE [V]
±20
Figure 3.
Supply Current - Supply Voltage
Figure 2.
Derating Curve
±2 V
25℃
100
30
25
20
15
10
5
0
0.1
Figure 4.
Supply Current - Ambient Temperature
1
LOAD RESISTANCE [kΩ]
10
Figure 5.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V,Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
20
20
15
15
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
○BA4580Yxxx-M
VOH
5
0
-5
VOL
-10
VOH
10
5
0
-5
-10
VOL
-15
-15
-20
0.1
-20
1
LOAD RESISTANCE [kΩ]
±2
10
20
20
15
15
10
5
VOH
0
-5
VOL
-10
10
VOH
5
0
-5
VOL
-10
-15
-15
-20
-50
-20
-25
0
25
50
75 100
AMBIENT TEMPERATURE [℃]
±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
Figure 7.
Maximum Output Voltage
- Supply Voltage
(RL=2kΩ,Ta=25℃)
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
Figure 6.
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+15V/-15V,Ta=25℃)
±4
0
125
5
10
15
20
25
OUTPUT CURRENT [mA]
Figure 8.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
Figure 9.
Maximum Output Voltage
- Output Current
(VCC/VEE=+15V/-15V, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
6
6
4
4
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
○BA4580Yxxx-M
-40℃
2
25℃
0
105℃
-2
-4
±7.5V
0
±15V
-2
-4
-6
-6
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
-25
0
25
50
75
100
125
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 10.
Input Offset Voltage - Supply Voltage
(Vicm=0V, OUT=0V)
Figure 11.
Input Offset Voltage - Ambient Temperature
(Vicm=0V, OUT=0V)
200
200
180
180
160
160
INPUT BIAS CURRENT [nA]
.
INPUT BIAS CURRENT [nA]
±2V
2
140
120
-40℃
100
80
60
105℃
25℃
40
140
±7.5V
120
100
80
60
±15V
±2V
40
20
20
0
0
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Figure 13.
Input Bias Current - Ambient Temperature
(Vicm=0V, OUT=0V)
Figure 12.
Input Bias Current - Supply Voltage
(Vicm=0V, OUT=0V)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
.
○BA4580Yxxx-M
30
INPUT OFFSET CURRENT [nA]
INPUT OFFSET CURRENT [nA]
30
20
105℃
10
0
25℃
-40℃
-10
-20
20
±2V
0
±15V
-10
-20
-30
-30
±0
±2
-50
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
COMMON MODE REJECTION RATIO [dB]
5
4
105℃
3
2
25℃
-40℃
1
0
-1
-2
-3
-4
-5
-4
-3
-2
-1
0
1
2
3
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 15.
Input Offset Current - Ambient Temperature
(Vicm=0V, OUT=0V)
Figure 14.
Input Offset Current - Supply Voltage
(Vicm=0V, OUT=0V)
INPUT OFFSET VOLTAGE[mV]
±7.5V
10
4
150
125
100
75
50
25
0
-50
COMMON MODE INPUT VOLTAGE[V]
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 17.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, Vicm=-12V ~ +12V)
Figure 16.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+4V/-4V, OUT=0V)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
150
10
.
125
μs]
SLEW RATE [V/
[V/µs]
POWER SUPPLY REJECTION RATIO [dB]
.
○BA4580Yxxx-M
100
75
50
5
0
-5
25
0
-10
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
125
±0
±2
Figure 19.
Slew Rate - Supply Voltage
(CL=100pF, RL=2kΩ, Ta=25℃)
Figure 18.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2V/-2V ~ +15V/-15V)
80
1
TOTAL HARMONIC DISTORTION [%]
EQUIVALENT INPUT NOISE VOLTAGE
[nV/√Hz] .
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
60
40
20
10
100
1000
FREQUENCY [Hz]
20kHz
0.01
1kHz
0.001
20Hz
0.0001
0.1
0
1
0.1
10000
1
OUTPUT VOLTAGE [Vrms]
10
Figure 21.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+15V/-15V, Av=20dB,
RL=2kΩ, 80kHz-LPF, Ta=25℃)
Figure 20.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=+15V/-15V, RS=100Ω, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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TSZ22111・15・001
11/27
TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
30
60
25
50
0
-30
40
-60
20
15
10
5
0
100
101
102
30
-90
GAIN
20
-120
10
-150
PHASE [deg]
PHASE
VOLTAGE GAIN [dB]
MAXIMUM OUTPUT VOLTAGE SWING[Vp-p]
○BA4580Yxxx-M
0
-180
1.E-01
1.E+01
1.E+02
1.E+03
102 1.E+00
103
104
105
106 1.E+04
107
103
FREQUENCY [Hz]
FREQUENCY [kHz]
Figure 22.
Maximum Output Voltage Swing – Frequency
(VCC/VEE=+15V/-15V, RL=2kΩ, Ta=25℃)
Figure 23.
Voltage Gain, Phase - Frequency
(VCC/VEE=+15V/-15V, Av=40dB, RL=2kΩ, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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TSZ02201-0RAR1G200500-1-2
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
○BA4584YFV-M
20
1400
1200
SUPPLY CURRENT[mA]
POWER DISSIPATION [mW] .
1600
BA4584YFV-M
1000
800
600
400
-40℃
15
25℃
10
5
105℃
200
0
0
105
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
0
125
.
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
SUPPLY CURRENT [mA]
15
20
25
30
35
Figure 25.
Supply Current - Supply Voltage
20
15
±15V
10
±2 V
±7.5 V
0
-50
10
SUPPLY VOLTAGE[V]
Figure 24.
Derating Curve
5
5
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
125
30
25
20
15
10
5
0
0.1
1
10
LOAD RESISTANCE [kΩ]
Figure 26.
Supply Current - Ambient Temperature
Figure 27.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
20
20
15
15
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
○BA4584YFV-M
VOH
5
0
-5
VOL
-10
VOH
10
5
0
-5
-10
VOL
-15
-15
-20
0.1
-20
1
LOAD RESISTANCE [kΩ]
±2
10
20
20
15
15
10
5
VOH
0
-5
VOL
-10
10
VOH
5
0
-5
VOL
-10
-15
-15
-20
-50
-20
-25
0
25
50
75 100
AMBIENT TEMPERATURE [℃]
±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
Figure 29.
Maximum Output Voltage
- Supply Voltage
(RL=2kΩ, Ta=25℃)
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
Figure 28.
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+15V/-15V, Ta=25℃)
±4
0
125
5
10
15
20
25
OUTPUT CURRENT [mA]
Figure 30.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
Figure 31.
Maximum Output Voltage
- Output Current
(VCC/VEE=+15V/-15V, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
6
6
4
4
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
○BA4584YFV-M
-40℃
2
25℃
0
105℃
-2
-4
±2V
2
±7.5V
0
±15V
-2
-4
-6
-6
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
-25
0
25
50
75
100
125
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 32.
Input Offset Voltage - Supply Voltage
(Vicm=0V, OUT=0V)
Figure 33.
Input Offset Voltage - Ambient Temperature
(Vicm=0V, OUT=0V)
200
180
180
160
160
INPUT BIAS CURRENT [nA]
INPUT BIAS CURRENT [nA]
.
200
140
120
-40℃
100
80
60
105℃
25℃
40
20
140
±7.5V
120
100
80
60
±15V
±2V
40
20
0
0
±0
±2
±4
±6
±8
±10 ±12 ±14 ±16
-50
-25
0
25
50
75
100
125
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 34.
Input Bias Current - Supply Voltage
(Vicm=0V, OUT=0V)
Figure 35.
Input Bias Current - Ambient Temperature
(Vicm=0V, OUT=0V)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
○BA4584YFV-M
.
30
INPUT OFFSET CURRENT [nA]
INPUT OFFSET CURRENT [nA]
30
20
105℃
10
0
25℃
-40℃
-10
-20
20
±2V
0
±15V
-10
-20
-30
-30
±0
±2
-50
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
COMMON MODE REJECTION RATIO [dB]
5
4
105℃
3
25℃
2
-40℃
1
0
-1
-2
-3
-4
-5
-4
-3
-2
-1
0
1
2
3
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 37.
Input Offset Current - Ambient Temperature
(Vicm=0V, OUT=0V)
Figure 36.
Input Offset Current - Supply Voltage
(Vicm=0V, OUT=0V)
INPUT OFFSET VOLTAGE[mV]
±7.5V
10
4
150
125
100
75
50
25
0
-50
COMMON MODE INPUT VOLTAGE[V]
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 39.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, Vicm=-12V ~ +12V)
Figure 38.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+4V/-4V, OUT=0V)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
150
10
.
125
μs]
SLEW RATE [V/
[V/µs]
POWER SUPPLY REJECTION RATIO [dB]
.
○BA4584YFV-M
100
75
50
5
0
-5
25
0
-10
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
125
±0
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
Figure 41.
Slew Rate - Supply Voltage
(CL=100pF, RL=2kΩ, Ta=25℃)
Figure 40.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2V/-2V ~ +15V/-15V)
80
1
TOTAL HARMONIC DISTORTION [%]
EQUIVALENT INPUT NOISE VOLTAGE
[nV/√Hz] .
±2
60
40
20
100
FREQUENCY [Hz]
20kHz
0.01
1kHz
0.001
20Hz
0.0001
0.1
0
1
0.1
10000
1
OUTPUT VOLTAGE [Vrms]
10
Figure 43.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+15V/-15V, Av=20dB,
RL=2kΩ, 80kHz-LPF, Ta=25℃)
Figure 42.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=+15V/-15V, RS=100Ω, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
30
60
25
50
0
-30
40
-60
20
15
10
5
101
102
-90
GAIN
20
-120
10
-150
0
-180
1.E-01
1.E+01
1.E+02
1.E+03
10-1 1.E+00
1
10
102
103 1.E+04
104
0
100
30
PHASE [deg]
PHASE
VOLTAGE GAIN [dB]
MAXIMUM OUTPUT VOLTAGE SWING[Vp-p]
○BA4584YFV-M
103
FREQUENCY [kHz]
FREQUENCY [kHz]
Figure 44.
Maximum Output Voltage Swing – Frequency
(VCC/VEE=+15V/-15V, RL=2kΩ, Ta=25℃)
Figure 45.
Voltage Gain, Phase - Frequency
(VCC/VEE=+15V/-15V, Av=40dB, RL=2kΩ, Ta=25℃)
(*) The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θja°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 46. (a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power
dissipation (Pd).
θja = (Tjmax - Ta) / Pd
℃/W
・・・・・ (Ⅰ)
The Derating curve in Figure 46. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 47. (c),(d) shows an example of the derating curve for
BA4580Yxxx-M, BA4584YFV-M.
LSIの 消 費
力 [W]
Power dissipation
of電LSI
Pd (max)
θja = ( Tjmax - Ta) / Pd
℃ /W
θja2 < θja1
P2
Ta [℃]
Ambient temperature
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj [℃]
0
25
50
θ ja1
75
100
125
150
周 囲 温 度 Ta [℃ ]
Ambient temperature
Power dissipation Pd[W]
(b) Derating curve
(a) Thermal resistance
Figure 46. Thermal resistance and derating
1600
1000
BA4584YFV-M(*13)
POWER DISSIPATIO N [mW] .
POWER DISSIPATIO N [mW] .
1400
800
BA4580YF-M(*11)
600
BA4580YFVM-M(*12)
400
1200
1000
800
600
400
200
200
0
0
0
25
50
75
100
AMBIENT TEMPERATURE [ ℃] .
0
125
(c) BA4580Yxxx-M
25
50
75
100
AMBIENT TEMPERATURE [℃] .
125
(d) BA4584YFV-M
( *11 )
( *12 )
(*13)
Unit
6.2
4.8
10.8
mW/℃
When using the unit above Ta=25℃, subtract the value above per Celsius degree .
Mounted on a FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%)
Figure 47.
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Derating curve
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TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Application Information
NULL method condition for Test circuit1
VCC, VEE, EK Unit: V
BA4580Y
Parameter
VF
S1
S2
BA4584Y
S3
calculation
VCC
VEE
EK
VCC
VEE
EK
Input Offset Voltage
VF1
ON
ON
OFF
15
-15
0
15
-15
0
1
Input Offset Current
VF2
OFF
OFF
OFF
15
-15
0
15
-15
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
15
-15
0
15
-15
0
3
ON
ON
ON
ON
ON
OFF
ON
ON
OFF
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF7
VF8
VF9
Power Supply
Rejection Ratio
VF10
15
-15
-10
15
-15
-10
15
-15
10
15
-15
10
3
-27
12
3
-27
12
27
-3
-12
27
-3
-12
4
-2
0
2
-2
0
15
-15
0
15
-15
0
4
5
6
- Calculation 1. Input Offset Voltage (Vio)
Vio 
VF1
1+ RF / RS
[V]
2. Input Offset Current (Iio)
Iio 
VF2 - VF1
Ri × (1 + RF / RS)
[A]
0.1µF
3. Input Bias Current (Ib)
Ib 
VF4 - VF3
2 × Ri × (1 + RF / RS)
RF=50kΩ
[A]
VCC
ΔEK × (1+ RF/RS)
VF5 - VF6
RS=50Ω
ΔVicm × (1+ RF/RS)
[dB]
VF8 - VF7
500kΩ
DUT
NULL
SW3
RS=50Ω
1000pF
Ri=10kΩ
RL
VF
Vicm
SW2
50kΩ
6. Power supply rejection ratio (PSRR)
VEE
-15V
Figure 48. Test circuit1 (one channel only)
ΔVcc × (1+ RF/RS)
PSRR  20 × Log
[dB]
VF10 - VF9
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TSZ22111・15・001
Vo
Ri=10kΩ
[dB]
5. Common-mode Rejection Ration (CMRR)
CMRR  20 × Log
15V
EK
4. Large Signal Voltage Gain (Av)
Av  20 × Log
0.1µF
500kΩ
SW1
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TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
Supply Current
OFF OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage (high) OFF OFF
ON
OFF OFF
ON
OFF OFF
OFF OFF OFF
ON
OFF
Maximum Output Voltage (Low) OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
OFF
Output Source Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF OFF OFF
Gain Band Width
OFF
ON
OFF OFF
ON
Input Referred Noise Voltage
ON
OFF OFF OFF
ON
ON
OFF OFF OFF
ON
ON
ON
ON
OFF OFF OFF OFF
ON
OFF OFF
ON
ON
OFF OFF OFF OFF
ON
OFF OFF OFF OFF
ON
OFF OFF OFF
Input voltage
VH
VL
Input wave
Output voltage
t
SR=ΔV/Δt
90%
VH
ΔV
C
10%
VL
Δt
Output wave
Figure 49. Test Circuit 2 (each Op-Amp)
Figure 50. Slew Rate Input Waveform
VCC
VCC
R1//R2
R1//R2
OTHER
CH
VEE
R1
VIN
R2
t
VEE
OUT1
V VOUT1
R1
R2
V
=0.5Vrms
=0.5[Vrms]
VOUT2
OUT2
40dB amplifier
20
CS
20
log
CS=
×log
VOUT1
100
OUT1
100×
OUT2
VOUT2
(R1=1kΩ, R2=100kΩ)
Figure 51. Test Circuit 3(Channel Separation)
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
Examples of circuit
○Voltage follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is
configured to be equal to the input voltage (IN). This
circuit also stabilizes the output voltage (OUT) due to
high input impedance and low output impedance.
Computation for output voltage (OUT) is shown below.
OUT=IN
VCC
OUT
IN
VEE
Figure 52. Voltage follower circuit
○Inverting amplifier
R2
VCC
R1
IN
OUT
R1//R2
For inverting amplifier, input voltage (IN) is amplified by a
voltage gain and depends on the ratio of R1 and R2. The
out-of-phase output voltage is shown in the next
expression
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
VEE
Figure 53. Inverting amplifier circuit
○Non-inverting amplifier
R1
R2
VCC
OUT
For non-inverting amplifier, input voltage (IN) is amplified by
a voltage gain, which depends on the ratio of R1 and R2.
The output voltage (OUT) is in-phase with the input voltage
(IN) and is shown in the next expression.
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
IN
VEE
Figure 54. Non-inverting amplifier circuit
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Operational Notes
1) Processing of unused circuit
It is recommended to apply connection (see the Figure 55.) and set the non
inverting input terminal at the potential within input common-mode voltage range
(Vicm), for any unused circuit.
2) Input voltage
Applying (VEE - 0.3) to (VEE + 36)V
(BA4558R) to the input terminal is possible without causing deterioration of the
electrical characteristics or destruction, irrespective of the supply voltage.
However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is within the common mode
input voltage range of the electric characteristics.
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical characteristics and temperature characteristics.
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output
current may flow under some conditions, and heating may destroy IC. It is
necessary to connect a resistor as shown in Figure 56., thereby protecting
against load shorting.
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and VEE.
Therefore, the single supply Op-Amp can be used for double supply Op-Amp as well.
VCC
+
Connect
to Vicm Vicm
VEE
Figure 55. The example of
application circuit for unused op-amp
VCC
+
protection
resistor
VEE
Figure 56. The example of
output short protection
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
7) Short-circuit between pins and wrong mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong electromagnetic field can cause operation malfunction.
9) Radiation
This IC is not designed to be radiation-resistant.
10) IC Handling
When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezo
resistance effects.
11) Inspection on set board
During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not power up the
board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can
stress the device. Pay attention to the electro static voltages during IC handling, transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the external capacitor,
connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the
circuit or terminal protection element. The element in the circuit may be damaged (thermal destruction). When using this IC
for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a
voltage comparator. Set the capacitor connected to output terminal below 0.1μF in order to prevent damage to IC.
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Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
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TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Physical Dimension, Tape and Reel Information
Package Name
MSOP8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Physical Dimension, Tape and Reel Information
Package Name
SSOP-B14
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
BA4580Yxxx-M, BA4584YFV-M
●Marking Diagram
SOP8(TOP VIEW)
MSOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
Product Name
LOT Number
BA4580Y
BA4584Y
Package Type
Marking
F-M
SOP8
FVM-M
MSOP8
80YM
80YM
FV-M
SSOP-B14
4584Y
1PIN MARK
●Land pattern data
SOP8, SSOP-B8, MSOP8
b2
e
MIE
ℓ2
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
Land pitch
e
Land space
MIE
SOP8
1.27
4.60
1.10
0.76
MSOP8
0.65
2.62
0.99
0.35
SSOP-B14
0.65
4.60
1.20
0.35
PKG
●Revision History
Date
Revision
Changes
2012. 7. 6
001
New Release
2013. 3. 25
002
Added BA4580Y
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
27/27
TSZ02201-0RAR1G200500-1-2
25.Mar.2013 Rev.002
Datasheet
Notice
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Other Precaution
1.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.