ROHM BD12730G

Datasheet
Operational Amplifiers
Low Current Consumption
Input/Output Full Swing
Operational Amplifier
BD12730G
●Key Specifications
 Low Operating Supply Voltage (Single Supply)
+1.8V to +5.0V
 Wide Temperature Range:
-40°C to +85°C
 Low Input Offset Voltage
5mV (Max.)
 Slew Rate
0.4V/µs (Typ.)
 Low Input Referred Noise Voltage 10 nV/ Hz (Typ.)
 Adequate Phase Margin
75°(Typ.)
●General Description
BD12730 is a low supply voltage single operational
amplifier that operates from 1.8V to 5V. Its input and
output full swing, from ground to power supply level,
provides wide dynamic range. This amplifier features low
noise and high phase margin which makes it ideal for
audio applications, battery management and other
applications.
●Features
 Low operating supply voltage
 Input/Output Full Swing
 Low input offset voltage
 Low Power Consumption
 High Phase margin
 Low Input Referred Noise Voltage
●Package
SSOP5
W(Typ.) xD(Typ.) xH(Max.)
2.90mm x 2.80mm x 1.25mm
●Application
Audio application
Buttery management
General Purpose
●Simplified schematic
V+
-IN
class
AB control
OUT
+IN
GND
Figure 1. Simplified schematic
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BD12730G
●Pin Configuration
SSOP5
IN+
1
GND
2
IN-
5 V+
Pin No.
Symbol
1
IN+
2
GND
3
IN-
4
OUT
5
V+
+
－
3
4 OUT
●Ordering Information
B
D
1
2
7
3
Part Number
BD12730
0
G
-
Package
G: SSOP5
TR
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5)
●Line-up
Topr
-40°C to +85°C
Package
SSOP5
Operable Part Number
Reel of 3000
BD12730G-TR
●Absolute Maximum Ratings(Ta=25°C)
Parameter
Supply Voltage
Symbol
Ratings
Unit
V+
+7.0
V
*1*2
Power dissipation
Pd
Differential Input Voltage*3
Input Common-mode
Voltage Range
Operating Supply Voltage
Vid
675
±1.0
mW
V
Vicm
GND to V+
V
Vopr
+1.8 to +5.0
V
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Maximum
Junction Temperature
Tstg
-55 to +150
°C
Tjmax
+150
°C
Note: Absolute maximum rating of each item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or usage out of absolute maximum rated
temperature environment may cause deterioration of characteristics.
*1
When used at temperature above Ta＝25℃, reduce by 5.4mW/℃.
*2
Mounted on a FR4 glass epoxy PCB (70mm×70mm×1.6mm).
*3
Differential input voltage is the voltage difference between inverting input and non-inverting input.
Input terminal voltage is set to more than GND.
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Datasheet
BD12730G
●Electrical Characteristics:
○BD12730G (Unless otherwise specified V+=+5V, GND=0V, Ta=25°C)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
ICC
-
320
550
µA
Vio
-
1
5
mV
-
Ib
-
50
250
nA
-
Input Offset Current
Iio
-
5
100
nA
-
Voltage Gain
Av
60
85
-
dB
Common-mode Rejection Ratio
CMRR
55
70
-
dB
-
Supply Voltage Rejection Ratio
PSRR
70
85
-
dB
-
VOH1
4.9
4.95
-
V
VOL1
-
0.05
0.1
V
VOH2
4.75
4.85
-
V
VOL2
-
0.15
0.25
V
Isource
-
12
-
mA
OUT=0V
Output Sink Current*6
Isink
-
5
-
mA
OUT=5V
Input Common-mode
Voltage Range
Vicm
0
-
5
V
Gain Bandwidth Product
GBW
-
1
-
MHz
f=10kHz
Unity Gain Bandwidth
fT
-
1
-
MHz
RL =2kΩ
Phase margin
θ
-
75
-
deg
RL =2kΩ
-
10
-
nV/ Hz
f=1kHz
-
0.7
-
μVrms
RS=100Ω
DIN-AUDIO
-
0.4
-
V/µS
Operating Current
Input Offset Voltage*4
*4
Input Bias Current
*4
RL=∞, VIN+=2.5V
RL=2kΩ
Maximum Output Voltage 1
RL =20kΩ
Maximum Output Voltage 2
Output Source Current*6
Input Referred Noise Voltage
Slew Rate
*4
RL =2kΩ
CMRR>55dB
Vn
SR
RL =2kΩ
Absolute value.
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Datasheet
BD12730G
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name, symbol and their meaning may differ from those on other manufacturer’s document or general
documents.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Supply Voltage (V+/GND)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential Input Voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristics of IC.
1.3 Input Common-mode Voltage Range (Vicm)
Indicates the maximum voltage that can be applied to the non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the absolute maximum ratings
does not assure normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of
characteristics item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature 25°C (normal
temperature). As for the packaged product, Pd is determined by the temperature that can be permitted by the IC in the
package (maximum junction temperature) and the thermal resistance of the package
2. Electrical characteristics
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage to 0 V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
non-inverting and inverting terminals.
2.4 Input Common Mode Voltage Range (Vicm)
Indicates the input voltage range where IC operates normally.
2.5 Maximum Output Voltage (High/Low Level Output Voltage) (VOH/VOL)
Indicates the voltage range that the IC can output under specified load condition. It is typically divided into high-level
output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output voltage.
Low-level output voltage indicates the lower limit.
2.6 Voltage Gain (Av)
Indicates the amplification rate (gain) of the output voltage against the voltage difference between the non-inverting
and inverting terminals. It is normally the amplification rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.7 Operating current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
2.8 Unity Gain Bandwidth (fT)
Indicates the frequency where the voltage gain of Op-Amp is 1.
2.9 Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
2.10 Common Mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is
normally the fluctuation of DC.
CMR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.11 Supply Voltage Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.12 Equivalent Input Noise Voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier reflected back to an ideal voltage source
connected in series with the input terminal.
2.13 Slew rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
2.14 Output source current/ output sink current (Isource / Isink)
The maximum current that can be output under specific output conditions, it is divided into output source current and
output sink current. The output source current indicates the current flowing out of the IC, and the output sink current
the current flowing into the IC.
2.15 Gain Band Width (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
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Datasheet
BD12730G
●Typical Performance Curves
○BD12730G
800
400
OPERATING CURRENT [uA]
POWER DISSIPATION [mW]
85℃
BD12730G
600
400
200
350
300
25℃
250
-40℃
200
150
100
50
0
0
85
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
1
4
5
6
Figure 3.
Operating Current - Supply Voltage
400
6
5.0V
3.0V
OUTPUT VOLTAGE HIGH [V]
OPERATING CURRENT [uA]
3
SUPPLY VOLTAGE [V]
Figure 2.
Derating curve
350
2
300
250
1.8V
200
150
100
50
0
5
-40℃
25℃
4
85℃
3
2
1
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
100
1
2
3
4
5
6
SUPPLY VOLTAGE [V]
Figure 5.
Output Voltage High - Supply Voltage
(RL=20kΩ)
Figure 4.
Operating Current - Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BD12730G
6
18
5
15
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE HIGH [V]
●Typical Performance Curves (Reference data) – Continued
○BD12730G
5.0V
4
3
3.0V
2
1.8V
1
0
12
6
-40℃
3
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
100
1
Figure 6.
Output Voltage High - Ambient Temperature
(RL=20kΩ)
18
6
15
5
12
9
5.0V
6
3.0V
1.8V
3
2
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 7.
Output Voltage Low - Supply Voltage
(RL=20kΩ)
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE LOW [mV]
85℃
25℃
9
-40℃
25℃
4
85℃
3
2
1
0
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
1
100
2
3
4
5
6
SUPPLY VOLTAGE [V]
Figure 9.
Output Voltage High - Supply Voltage
(RL=2kΩ)
Figure 8.
Output Voltage Low - Ambient Temperature
(RL=20kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BD12730G
6
120
5
100
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE HIGH [V]
●Typical Performance Curves (Reference data) – Continued
○BD12730G
5.0V
4
3
3.0V
2
1.8V
1
80
85℃
40
-40℃
20
0
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
100
1
2
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 11.
Output Voltage Low - Supply Voltage
(RL=2kΩ)
Figure 10.
Output Voltage High - Ambient Temperature
(RL=2kΩ)
120
3
INPUT OFFSET VOLTAGE [mV]
OUTPUT VOLTAGE LOW [mV]
25℃
60
100
80
60
5.0V
40
3.0V
1.8V
20
0
2
-40℃
1
85℃
0
25℃
-1
-2
-3
-50
-25
0
25
50
75
100
1
AMBIENT TEMPERATURE [℃]
2
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 13.
Input Offset Voltage - Supply Voltage
Figure 12.
Output Voltage Low - Ambient Temperature
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BD12730G
5
5
4
4
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
●Typical Performance Curves (Reference data) – Continued
○BD12730G
3
3.0V
1.8V
2
1
0
5.0V
-1
-2
-3
-4
3
-40℃
2
25℃
1
0
85℃
-1
-2
-3
-4
-5
-5
-50
-25
0
25
50
75
100
-1
0
AMBIENT TEMPERATURE [℃]
Figure 14.
Input Offset Voltage - Ambient Temperature
5
6
Figure 15.
Input Common Mode Voltage Range
(V+=5V)
15
INPUT OFFSET CURRENT [nA]
60
INPUT BIAS CURRENT [nA]
1
2
3
4
INPUT VOLTAGE [V]
50
40
5.0V
3.0V
30
20
1.8V
10
0
5.0V
10
1.8V
5
3.0V
0
-5
-10
-15
-50
-25
0
25
50
75
100
-50
AMBIENT TEMPERATURE [℃]
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 16.
Input Bias Current - Ambient Temperature
Figure 17.
Input Offset Current - Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BD12730G
●Typical Performance Curves (Reference data) – Continued
○BD12730G
COMMON MODE REJECTION RATIO [dB]
100
5.0V
80
3.0V
70
1.8V
60
50
40
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
5.0V
80
70
3.0V
60
1.8V
50
40
100
-50
Figure 18.
Voltage Gain - Ambient Temperature
(RL=2kΩ)
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
Figure 19.
Common Mode Rejection Ratio - Ambient Temperature
100
80
90
60
80
40
GAIN[dB]
SUPPLY VOLTAGE REJECTION RATIO [dB]
90
200
Phase
150
Gain
100
20
50
60
0
0
50
-20
40
-40
70
-50
-25
0
25
50
75
-50
-100
2
1.E-01
100
10
AMBIENT TEMPERATURE [℃]
Figure 20.
Supply Voltage Rejection Ratio - Ambient Temperature
(V+=1.8 to 5.0V)
3
1.E+00
10
4
1.E+01
5
1.E+02
6
1.E+03
10
10
10
FREQUENCY [Hz]
7
1.E+04
10
Figure 21.
Voltage Gain・Phase - Frequency
(V+=5V, RL=2kΩ, Ta=25°C)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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PHASE [deg]
VOLTAGE GAIN [dB]
90
100
Datasheet
BD12730G
1
1
0.8
0.8
0.6
5.0V
SLEW RATE H-L [V/µs]
SLEW RATE L-H [V/µs]
●Typical Performance Curves (Reference data) – Continued
○BD12730G
3.0V
0.4
1.8V
0.2
0
0.6
5.0V
0.4
3.0V
0.2
1.8V
0
-50
-25
0
25
50
75
100
-50
-25
AMBIENT TEMPERATURE [℃]
25
50
75
100
AMBIENT TEMPERATURE [℃]
Figure 22.
Slew Rate L-H - Ambient Temperature
(RL=2kΩ)
Figure 23.
Slew Rate H-L - Ambient Temperature
(RL=2kΩ)
2
80
1.6
64
PHASE [deg]
FREQUENCY [MHz]
0
1.2
0.8
0.4
48
32
16
0
1.E+01
10
1.E+02
100
1.E+03
1000
0
10
1.E+01
1.E+04
10000
LOAD CAPACITANCE [pF]
100
1.E+02
1000
1.E+03
10000
1.E+04
LOAD CAPACITANCE [pF]
Figure 24.
Unity Gain Bandwidth - Load Capacitance
(V+=5V, Ta=25°C)
Figure 25.
Phase Margin - Load Capacitance
(V+=5V, Ta=25°C)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BD12730G
TOTAL HARMONIC DISTORTION+NOISE [%]
.
INPUT REFERRED NOISE VOLTAGE [µVrms].
●Typical Performance Curves (Reference data) – Continued
○BD12730G
1
0.8
0.6
0.4
0.2
0
1
2
3
4
5
1
0.1
1kHz
0.01
20Hz
0.001
20kHz
0.0001
1.E-02
0.01
6
SUPPLY VOLTAGE [V]
1.E-01
0.1
1.E+00
1
1.E+01
10
OUTPUT VOLTAGE [Vrm s ]
Figure 26.
Input Referred Noise Voltage - Supply Voltage
(Ta=25°C)
Figure 27.
Total Harmonic Distortion + Noise - Output Voltage
(V+=5V, RL=2kΩ, Ta=25°C)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BD12730G
●Application Information
○NULL method condition for Test Circuit 1
V+, GND, VRL, EK, Vicm Unit: V
Parameter
Input Offset Voltage
VF
S1
S2
S3
V+
GND
VRL
RL Ω
EK
VF1
ON
ON
OFF
5.0
0
-
open
-2.5
ON
ON
ON
5.0
0
2.5
2k
VF2
VF3
Supply Voltage Rejection Ratio
2.5
1
2.5
2
-4.5
Voltage Gain
Common Mode Rejection Ratio
(Input Common-mode
Voltage Range)
Vicm Calculation
-0.5
VF4
0
ON
ON
OFF
5.0
0
-
open
-2.5
VF5
3
5.0
VF6
ON
ON
5.0
OFF
VF7
0
-
open
-2.5
2.5
4
1.8
－ Calculation－
|VF1|
1. Input Offset Voltage (Vio)
Vio =
2. Large Signal Voltage Gain (Av)
Av = 20Log ∆EK × (1+RF/RS) [dB]
|VF2-VF3|
3. Common Mode Rejection Ratio (CMRR)
[V]
1+RF/RS
CMRR = 20Log ∆Vicm × (1+RF/RS) [dB]
|VF4 - VF5|
4. Supply Voltage Rejection Ratio (PSRR)
PSRR = 20Log
∆V+ × (1+ RF/RS)
[dB]
|VF6 - VF7|
0.1µF
RF=50kΩ
0.1µF
500kΩ
SW1
V+
EK
RS=50Ω
15V
Vo
Ri=10kΩ
500kΩ
0.1µF
0.1µF
DUT
NULL
SW3
RS=50Ω
1000pF
Ri=10kΩ
Vicm
50kΩ
VF
RL
GND
VRL
-15V
Figure 28. Test circuit 1
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Datasheet
BD12730G
○Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current
OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage
OFF
OFF OFF
ON
OFF OFF
Slew Rate
OFF OFF
Unity Gain Bandwidth
ON
ON
ON
ON
OFF OFF
ON
OFF
ON
ON
OFF OFF OFF
ON
OFF OFF
ON
OFF OFF OFF
ON
OFF OFF OFF
OFF OFF
ON
ON
SW3
100kΩ
R2
SW4
●
●
V+
－
SW1
SW2
＋
SW5
SW6
SW8
SW7
SW9
SW10
SW11 SW12
R1
1kΩ
GND
RL
CL
VIN-
VIN+
VRL
Vo
Figure 29. Test circuit2
Input voltage
VH
VL
t
Input wave
Output voltage
90% SR=ΔV/Δt
VH
ΔV
10%
VL
Δt
Output wave
t
Figure 30. Slew rate input output wave
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Datasheet
BD12730G
●Application example
○Voltage follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is controlled
to be equal to the input voltage (IN). This circuit also
stabilizes OUT due to high input impedance and low
output impedance. Computation for OUT is shown
below.
OUT=IN
V+
OUT
IN
GND
Figure 31. Voltage follower
○Inverting amplifier
R2
V+
R1
IN
OUT
R1//R2
For inverting amplifier, IN is amplified by a voltage gain
decided by the ratio of R1 and R2. The out-of-phase
output voltage is shown in the next expression.
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
GND
Figure 32. Inverting amplifier circuit
○Non-inverting amplifier
R1
R2
V+
OUT
For non-inverting amplifier, IN is amplified by a voltage
gain decided by the ratio of R1 and R2. OUT is in-phase
with Vin and is shown in the next expression.
OUT=(1+R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
IN
GND
Figure 33. Non-inverting amplifier circuit
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BD12730G
●Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θja°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 34. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power
dissipation (Pd).
θja = (Tjmax－Ta) / Pd °C/W
・・・・・ (Ⅰ)
The Derating curve in Figure 34. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 35 (c) shows an example of the derating curve for BD12730.
LSIの 消 費
力 [W]
Power dissipation
of 電
LSI
θja=(Tjmax-Ta)/Pd
Pd (max)
°C/W
θja2 < θja1
P2
Ambient temperature Ta[ °C ]
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj[ °C ]
0
25
50
θ ja1
75
100
125
150
Ambient temperature
周 囲 温 度 Ta [℃ ]
(a) Thermal resistance
(b) Derating curve
Figure 34. Thermal resistance and Derating Curve
POWER DISSIPATION [mW]
800
BD12730G
600
400
200
0
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
(c) BD12730G
5.4
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted
Figure 35. Derating Curve
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Datasheet
BD12730G
●Operational Notes
1) Processing of unused circuit
It is recommended to apply the connection (see Figure 36.) and set the
non-inverting input terminal at a potential within the Input Common-mode Voltage
Range (Vicm) for any unused circuit.
V+
VCC
+
Connect
to Vicm
Vicm
2) Applied voltage to the input terminal
For normal circuit operation of voltage comparator, please input a voltage for its
input terminal within Input Common-mode Voltage Range (Vicm). Then, regardless of
power supply voltage, GND can be applied to input terminals without
deterioration or destruction of its characteristics.
GND
VEE
Figure 36.
Example of an application
circuit for unused op-amp
3) Operating power supply (split power supply/single power supply)
The voltage comparator operates if a certain level of voltage is applied between
V+ and GND. Therefore, the operational amplifier can be operated under
single power supply or split power supply.
4) Power dissipation (Pd)
If the IC is used under excessive power dissipation, an increase in the chip temperature will cause deterioration of the
electrical characteristics of IC. As an example, reduction of current capability may happen. Take consideration of the
effective power dissipation and thermal design with a sufficient margin. Pd is referenced to the provided power dissipation
curve.
5) Short circuits between pins and incorrect mounting
When mounting the IC on a printed circuit board, take notice of the direction and position of the IC. If IC is mounted
erroneously, it may be damaged. Also, when a foreign object is inserted between outputs, between output and V+
terminal, or between output and GND terminal, it causes short circuit which may damage the IC.
6) Usage under strong electromagnetic field
Be careful when using the IC under strong electromagnetic field because it may malfunction.
7) Usage of IC
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the
piezo effect. Be careful with the warp on the printed circuit board.
8) Testing IC on the application board
When testing IC on the application board, in cases where the capacitor is connected to low impedance, make sure to
discharge per process because there is a possibility that the IC may be damaged due to stress. When removing IC from
the application board, it is essential to cut the supply voltage. As a countermeasure against the static electricity, observe
proper grounding during fabrication process and take due care when carrying and storing it.
9) The IC destruction caused by capacitive load
The IC may be damaged when V+ terminal and GND terminal is shorted with the charged output terminal capacitor.
When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output
capacitor, output capacitor must be kept below 0.1µF in order to prevent the damage mentioned above.
10) Decoupling capacitor
Insert a decoupling capacitor between V+ and GND for stable operation of operational amplifier.
Status of this document
The Japanese version of this document is the formal specification. A customer may use this translated version only for reference
to help in reading the formal version.
If there are any differences in the translated version of this document, the formal version takes priority.
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Datasheet
BD12730G
●Physical Dimensions Tape and Reel Information
SSOP5
5
4
1
2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
1.25Max.
)
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
S
0.95
0.1
S
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
SSOP5(TOP VIEW)
LOT Number
Part Number Marking
Product Name
BD12730
Package Type
Marking
SSOP5
K7
G
●Land pattern data
PKG
Land pitch
e
Land space
MIE
SSOP5
0.95
2.4
all dimensions in mm
Land length
Land width
≧ℓ 2
b2
1.0
0.6
SSOP5
0.95
1.0
2.4
0.95
0.6
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Datasheet
BD12730G
●Revision History
Date
Revision
Changes
30.NOV.2012
001
New Release
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Datasheet
Notice
●General Precaution
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ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
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accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
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[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
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H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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please consult with ROHM representative in case of export.
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No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
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4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
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5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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