Large Current External FET Controller Type Switching Regulators Step-up/down, High-efficiency Switching Regulators (Controller type) No.13028EBT02 BD8303MUV ● General Description ROHM’s highly-efficient step-up/down switching regulator BD8303MUV generates step-up/down output including 3.3 V / 5 V from 1 cell of lithium battery, 4 batteries, or 2 cells of Li batteries with just one inductor. This IC adopts an original step-up/down drive system and creates a higher efficient power supply than conventional Sepic-system or H-bridge system switching regulators. ● Features 1)Highly-efficient step-up/down DC/DC converter to be constructed just with one inductor. 2) Supports a wide range of power supply voltage range (input voltage: 2.7 V - 14.0 V) 3) Supports high-current application with external Nch FET. 4) Incorporates soft-start function. 5) Incorporates timer latch system short protecting function. 6) High heat radiation surface mounted package QFN16 pin, 3 mm × 3 mm ● Application General portable equipment like DVC, single-lens reflex cameras, portable DVDs, or mobile PCs ● Absolute Maximum Ratings Parameter Symbol Rating Unit 15 7 V V 7 V 20 V Power dissipation Operating temperature range Storage temperature range VCC VREG Between BOOT 1, 2 and SW 1, 2 Between BOOT 1, 2 and GND SW1, 2 Pd Topr Tstg 15 620 －25 to +85 －55 to +150 V mW °C °C Junction temperature Tjmax +150 °C Maximum applied power voltage When installed on a 70.0 mm × 70.0 mm × 1.6 mm glass epoxy board. The rating is reduced by 4.96 mW/°C at Ta = 25°C or more. ● Operating Conditions (Ta = 25°C) Parameter Symbol Power supply voltage Output voltage Oscillation frequency VCC VOUT fosc Standard value MIN TYP 2.7 － 1.8 － 0.2 0.6 MAX 14 12 1.0 Unit V V MHz * These specifications are subject to change without advance notice for modifications and other reasons. www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 1/15 2013.07 - Rev.B Technical Note BD8303MUV ● Electrical Characteristics (Unless otherwise specified, Ta = 25 °C, VCC = 7.4 V) Parameter Symbol Minimum Target Value Typical Maximum [Low voltage input malfunction preventing circuit] Detection threshold voltage VUV Hysteresis range ΔVUVhy 50 [Oscillator] Oscillation frequency fosc 480 [Regulator] Output voltage VREG 4.7 [Error AMP] INV threshold voltage VINV 0.9875 Input bias current IINV -50 Soft-start time Tss 2.4 Output source current IEO 10 Output sink current IEI 0.6 [PWM comparator] SW1 Max Duty Dmax1 85 SW2 Max Duty Dmax2 85 SW2 Min Duty Dmin2 5 [Output] HG1, 2 High side ON resistance RONHp HG1, 2 Low side ON resistance RONHn LG1, 2 High side ON resistance RONLp LG1, 2 Low side ON resistance RONLn HG1-LG1 dead time Tdead1 50 HG2-LG2 dead time Tdead2 50 [STB] Operation VSTBH 2.5 STB pin control voltage No-operation VSTBL -0.3 STB pin pull-down resistance 250 RSTB [Circuit current] Standby VCC pin ISTB current Circuit current at operation Icc1 VCC Circuit current at operation Icc2 BOOT1,2 www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 2/15 Unit Conditions 2.4 100 2.6 200 V mV VREG monitor 600 720 kHz RT=51kΩ 5.1 5.5 V 1.00 0 4.0 20 1.3 1.0125 50 5.6 30 3 V nA msec μA mA 90 90 10 95 95 15 % % % 4 4 4 4 100 100 8 8 8 8 200 200 Ω Ω Ω Ω nsec nsec 400 VCC 0.3 700 V V kΩ - 1 μA 650 1000 μA VINV=1.2V 120 240 μA VINV=1.2V Vcc=12.0V , IINV=6.0V RT=51kΩ VINV=0.8V , VFB =1.5V VINV=1.2V , VFB =1.5V HG1 ON LG2 ON LG2 OFF 2013.07 - Rev.B Technical Note BD8303MUV ● Reference Data 1.050 6.0 1.050 1.000 0.975 VREG VOLTAGE [V] VREF VOLTAGE [V] VREF VOLTAGE [V] 5.0 1.025 1.025 1.000 0.975 4.0 3.0 2.0 1.0 0.950 0 5 10 0.950 15 0.0 -40 VCC VOLTAGE [V] 0 40 80 120 0 5 AMBIENT TEMPERATURE[℃] Fig.2 Standard voltage Temperature property Fig.1 Standard voltage Power supply property 5.300 10 15 VCC VOLTAGE [V] Fig.3 VREG voltage Power supply property 700 800 680 5.100 5.000 4.900 VREF VOLTAGE [V] VREF VOLTAGE [V] VREF VOLTAGE [V] 5.200 700 600 500 4.800 660 640 620 600 580 560 540 520 400 4.700 -40 0 40 80 500 0 120 5 10 15 AMBIENT TEMPERATURE[℃] VCC VOLTAGE [V] Fig.4 VREG voltage – Temperature property Fig.5 Oscillation frequency – Power supply property VCC CURRENT [uA] 600 500 400 300 200 700 650 600 550 100 0 5 10 15 VCC VOLTAGE [V] Fig.7 ICC - Power supply property www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 120 140 120 100 80 60 40 20 0 500 0 80 Fig.6 Oscillation frequency Temperature property BOOT PIN CURRENT [uA] 750 700 40 160 900 800 0 AMBIENT TEMPERATURE[℃] 800 1000 VCC CURRENT [uA] -40 -40 0 40 80 120 0 1 2 3 4 5 6 VCC VOLTAGE [V] BOOT PIN VOLTAGE [V] Fig.8 ICC - Temperature property Fig.9 IBOOT - Power supply property 3/15 2013.07 - Rev.B Technical Note BD8303MUV 5.050 100 5.050 5.025 5.000 4.975 80 5.025 EFFICIENCY [%] VOUT VOLTAGE [V] VOUT VOLTAGE [V] 90 5.000 4.975 70 60 50 40 30 20 10 4.950 0 4.950 0 5 10 15 0 VCC VOLTAGE [V] 500 1000 0 1500 LOAD CURRENT [mA] Fig.10 Line regulation 500 1000 1500 LOAD CURRENT [mA] Fig.12 MAX Duty / MIN Duty temperature property Fig.11 Load regulation STB(5.0V/div) VOUT(100mV/div) SW1 oscillation waveform (2.0V/div) VOUT(2.0V/div) ILOAD(500mA/div) SW2 oscillation waveform (2.0V/div) Input current (200mA/div) Fig.13 Starting waveform (Example of Application Circuit [2]) L=10uH, Cout = 47 uH, fosc = 750 kHz, unloaded Fig.14 Oscillation waveform VCC = 5.0 V, Vout = 5.0 V I LOAD = 1000 mA Fig.15 Load variation waveform (Example of Application Circuit [2]) VCC = 7.4 V, Vout = 5.0 V, I LOAD = 200 mA1000 mA :40 mA/usec 100 100 90 90 90 80 80 80 70 60 50 40 30 EFFICIENCY [%] 100 EFFICIENCY [%] EFFICIENCY [%] 500usec/div 500usec/div 70 60 50 40 30 70 60 50 40 30 20 20 20 10 10 10 0 0 0 1000 2000 3000 LOAD CURRENT [mA] 0 0 500 1000 1500 LOAD CURRENT [mA] Fig.16 Efficiency data (VOUT = 3.3 V) Example of Application Circuit [1] Fig.17 Efficiency data (VOUT = 5.0 V) Example of Application Circuit [2] 0 500 1000 1500 2000 LOAD CURRENT [mA] Fig.18 Efficiency data (VOUT = 8.4 V) Example of Application Circuit [3] ● Package Heat Reduction Curve POWER DISSIPATION [mW] 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE[℃] Fig.19 heat reduction curve (IC alone) When used at Ta = 25°C or more, it is reduced by 4.96 mW/°C. www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 4/15 2013.07 - Rev.B Technical Note BD8303MUV Pin No. Pin Name Function 1 RT Oscillation frequency set terminal 2 INV Error AMP input terminal 3 FB Error AMP output terminal 4 GND Ground terminal 5 STB HG1 BOOT1 VREG VCC ● Description of Pins RT SW1 INV LG1 6 BOOT2 PGND 7 HG2 LG2 8 SW2 9 LG2 10 PGND 11 LG1 12 SW1 13 HG1 14 BOOT1 15 VREG ON/OFF terminal Output side high-side driver input terminal Output side high-side FET gate drive terminal Output side coil connecting terminal Output side low-side FET gate drive terminal Driver part ground terminal Input side low-side FET gate drive terminal Input side coil connecting terminal Input side high-side FET gate drive terminal Input side high-side driver input terminal 5 V internal regulator output terminal 16 VCC Power input terminal FB SW2 HG2 BOOT2 STB GND Fig. 20 Pin layout ● Block Diagram OSC HG1 VREG VCC UVLO RT BOOT1 VBAT PRE DRIVER VREG VOUT SW1 VREF VREF 1.0V + ERROR AMP TIMMING CONTROL PWM CONTROL FB=H PGND TIMMING CONTROL SCP LG2 OSC x 8200 count PRE DRIVER BOOT2 STB ON/OFF LOGIC HG2 GND LG1 VREG FB PRE DRIVER SOFT START OSC x 2400 count SW2 INV PRE DRIVER VREG ON/OFF Fig. 21 Block diagram www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 5/15 2013.07 - Rev.B Technical Note BD8303MUV ● Description of Blocks 1. VREF This block generates ERROR AMP reference voltage. The reference voltage is 1.0 V. 2. VREG 5.0 V output voltage regulator. Used as power supply for IC internal circuit and BOOT pin supply. Follows power supply voltage when it is 5.0 V or below and also drops output voltage. For external oscillation preventive capacitor, 1.0 uF is recommended. 3. UVLO Circuit for preventing low voltage malfunction Prevents malfunction of the internal circuit at activation of the power supply voltage or at low power supply voltage. Monitors VREG pin voltage to turn off DC/DC converter output by changing output voltage of HG1, 2 and LG1, 2 pin to L-logic when VREG voltage is 2.4 V or below, and reset the timer latch of the internal SCP circuit and soft-start circuit. 4. SCP Timer latch system short-circuit protection circuit When the INV pin is the set 1.0 V or lower voltage, the internal SCP circuit starts counting. The internal counter is in synch with OSC; the latch circuit activates after the counter counts about 8200 oscillations to turn off DC/DC converter output (about 13.6 msec when RT = 51 kΩ). To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again. 5. OSC Oscillation circuit to change frequency by external resistance of the RT pin (1 pin). When RT = 51 kΩ, operation frequency is set at 600 kHz. 6. ERROR AMP Error amplifier for detecting output signals and output PWM control signals The internal reference voltage is set at 1.0 V. 7. PWM COMP Voltage-pulse width converter for controlling output voltage corresponding to input voltage Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width and outputs to the driver. Also controls Max Duty and Min Duty. Max Duty and Min Duty are set at the primary side and the secondary side of the inductor respectively, which are as follows: Primary side (SW1) Secondary side (SW 2) HG1 Max Duty HG1 Min Duty LG2 Max Duty LG2 Min Duty : About 90 %, : 0% : About 90 %, : About 10 %, 8. SOFT START Circuit for preventing in-rush current at startup by bringing the output voltage of the DC/DC converter into a soft-start Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after about 2400 oscillations (About 4 msec when RT = 51 kΩ). 9. Nch DRIVER CMOS inverter circuit for driving external Nch FET. Dead time is provided for preventing feedthrough during switching of HG1 = L → LG1 = H, HG2 = L → LG2 = H and LG1 = L → HG1 = H, LG2 = L → HG2 = H. The dead time is set at about 100 nsec in the internal circuit. 10. ON/OFF LOGIC Voltage applied on STB pin (5 pin) to control ON/OFF of IC. Turned ON when a voltage of 2.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied. Incorporates approximately 400 kΩ pull-down resistance. www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 6/15 2013.07 - Rev.B Technical Note BD8303MUV ● Example of Application Circuit * Example of application circuit: VCC = 2.7 – 5.5V, Vout = 3.3V, Iout = 100 mA – 2000 mA VCC = 2.7 V – 5.5 V Insert a filter as required. RB521CS-30 1μF 22μF 0.1μF RB521CS-30 INV 10000p HG1 RT 43k BOOT1 VCC VREG 0.1μF 51k 47μF RTQ045N03 RTQ045N03 LG2 SW2 STB BOOT2 GND 150p SW1 VOUT (set at 3.3 V) PGND HG2 6.2k 100k (TDK SLF10165) RTQ045N03 LG1 FB 7.5k RTQ045N03 4.7μH 0.1μF ON/OFF Fig. 22 Example of application circuit (1) * Example of application circuit: VCC=2.7 – 14 V, Vout＝5.0 V, Iout＝100 mA – 1500 mA VCC = 2.7 V –14 V Insert a filter as required. 1μF RB521CS-30 0.1μF 47μF RB521CS-30 4700p INV HG1 BOOT1 RT 30k VREG VCC 0.1μF 51k 47μF RTQ045N03 SW2 LG2 HG2 GND PGND BOOT2 120k 120p SW1 VOUT (set at 5.0 V) RTQ045N03 STB 4.7k (TDK SLF10165) RTQ045N03 LG1 FB 5.1k RTQ045N03 4.7μH 0.1μF ON/OFF Fig. 23 Example of application circuit (2) www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 7/15 2013.07 - Rev.B Technical Note BD8303MUV * Example of application circuit: VCC=4.0 – 14 V, Vout＝8.4 V, Iout＝100 mA – 1500 mA VCC = 4.0V – 14V Insert a filter as required. 1μF RB521CS-30 47μF 0.1μF RB521CS-30 4700p INV HG1 BOOT1 VCC RT 27k VREG 0.1μF 100k 47μF×2 RSS065N03 RSS065N03 LG2 SW2 STB BOOT2 GND 100p SW1 VOUT (set at 8.4 V) PGND HG2 3.9k 200k (TDK SLF10165) RSS065N03 LG1 FB 7.5k RSS065N03 4.7μH 0.1μF ON/OFF Fig. 24 Example of application circuit (3) * Example of application circuit:VCC=5– 14 V, Vout＝12 V, Iout＝100 mA – 1500 mA VCC = 5 V – 14 V Insert a filter as required. 1μF RB521CS-30 10μF 0.1μF RB521CS-30 RTQ045N03 10μH INV HG1 BOOT1 VCC RT 30k VREG 0.1μF 27k (TDK SLF10165) RTQ045N03 SW1 47μF LG1 RTQ045N03 1500p FB RTQ045N03 SW2 LG2 HG2 180p GND PGND BOOT2 15k 330k STB 5.1k VOUT12V 0.1μF ON/OFF Fig. 25 Example of application circuit (4) www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 8/15 2013.07 - Rev.B Technical Note BD8303MUV ● Selection of parts for applications (1) Output inductor A shielded inductor that satisfies the current rating (current value, Ipeak as shown in the drawing below) and has a low DCR (direct current resistance component) is recommended. Inductor values affect output ripple current greatly. Ripple current can be reduced as the coil L value becomes larger and the Δ IL switching frequency becomes higher as the equations shown below. Ipeak =Iout ×(Vout/VIN) /η＋ ∆IL/2 [A] Vout (Vin-Vout) ⊿IL= × Vin |(Vin-Vout)| L (Vout-Vin) f [A] (in step-down mode) × Vin × Vout L (2) 1 Vout×2×0.8 × (Vin+Vout) ⊿IL= ⊿IL= 1 × L Fig. 26Ripple current (1) × [A] ((in step-up/down mode) (3) f 1 [A] (in step-up mode) (4) f (η: Efficiency, ∆IL: Output ripple current, f: Switching frequency) As a guide, output ripple current should be set at about 20 to 50% of the maximum output current. * Current over the coil rating flowing in the coil brings the coil into magnetic saturation, which may lead to lower efficiency or output oscillation. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. (2) Output capacitor A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple. There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias property into consideration. Output ripple voltage when ceramic capacitor is used is obtained by the following equation. 1 ＋ Vpp=⊿IL× ⊿IL×RESR [V] ・・・ (5) 2π×f×Co Vpp = ∆IL × 1 + ∆IL × RESR [V] … (5) 2π×f×Co Setting must be performed so that output ripple is within the allowable ripple voltage. (3) External FET An external FET which satisfies the following items and has small Ciss (input capacitance), Qg (total gate charge quantity) and ON resistance should be selected. There must be an adequate margin between the turn OFF time of MOS and the dead time to prevent through-current. Drain-source voltage rating: (Output voltage + BodyDiode Vf of MOS or higher) Gate-source voltage rating: 7.0 V or higher Drain-source current rating: IPEAK of Output inductor paragraph or higher www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 9/15 2013.07 - Rev.B Technical Note BD8303MUV (5) BOOT-SW capacitor The capacitor between BOOT and SW should be designed so that the gate drive voltage will not be below Vgs necessary for the FET to use, taking circuit current input to the BOOT pin into consideration. There must be an adequate margin between the maximum rating and gate drive voltage. Gate drive voltage = (VREG voltage) − (Vf of Di) − (Voltage drop by BOOT pin consumption) [V] Voltage drop by BOOT pin consumption ＝ (Iboot × (1 / fosc) + Qg of external FET) / Cboot [V] (6) (7) (6) REG-BOOT diode A Schottky diode which satisfies the following items and has less forward pressure drop (Vf) should be selected. Average rectified current: There must be an adequate margin against the current consumed by MOSFET switching. DC inverse voltage: Input voltage or higher (3) Setting of oscillation frequency Oscillation frequency can be set using a resistance value connected to the RT pin (1 pin). Oscillation frequency is set at 600 kHz when RT = 51 kΩ, and frequency is inversely proportional to RT value. See Fig. 27 for the relationship between RT and frequency. Soft-start time changes along with oscillation frequency. See Fig. 28 for the relationship between RT and soft-start time. 100 SOFT START TIME [msec] SWITCHNG FREQUENCY [kHz] 10000 1000 100 10 10 1 10 100 1000 10 RT PIN RESISTANCE [kΩ] Fig. 27 Oscillation resistance frequency 100 1000 RT PIN RESISTANCE [kΩ] – RT pin Fig. 28 Soft-start time – RT pin resistance * Note that the above example of frequency setting is just a design target value, and may differ from the actual equipment. (4) Output voltage setting The internal reference voltage of the ERROR AMP is 1.0 V. Fig. 29. Output voltage should be obtained by referring to Equation (8) of VOUT ERROR AMP R1 INV (R1+R2) Vo= ×1.0 [V] … (8) R2 R2 VREF 1.0V Fig. 29 Setting of feedback resistance www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 10/15 2013.07 - Rev.B Technical Note BD8303MUV (9) Determination of external phase compensation Condition for stable application The condition for feedback system stability under negative feedback is as follows: - Phase delay is 135 °or less when gain is 1 (0 dB) (Phase margin is 45° or higher) Since DC/DC converter application is sampled according to the switching frequency, the GBW of the whole system (frequency at which gain is 0 dB) must be set to be equal to or lower than 1/5 of the switching frequency. In summary, target property of applications is as follows: - Phase delay must be 135°or lower when gain is 1 (0 dB) (Phase margin is 45° or higher). - The GBW at that time (frequency when gain is 0 dB) must be equal to or lower than 1/5 of the switching frequency. For this reason, switching frequency must be increased to improve responsiveness. One of the points to secure stability by phase compensation is to cancel secondary phase delay (-180°) generated by LC resonance by the secondary phase lead (i.e. put two phase leads). Since GBW is determined by the phase compensation capacitor attached to the error amplifier, when it is necessary to reduce GBW, the capacitor should be made larger. -20dB/decade (A) A GAIN C [dB] (B) 0 R FB 0° PHASE [degree] -90° Phase margin -180° Fig.30 General integrator 1 Error AMP is a low-pass filter because phase compensation such as (1) and (2) is performed. For DC/DC converter application, R is a parallel feedback resistance. Point (A) fp= [Hz] 2πRCA 1 Point (B) fGBW=2πRC [Hz] (9) (10) Fig.31 Frequency property of integrator Phase compensation when output capacitor with low ESR such as ceramic capacitor is used is as follows: When output capacitor with low ESR (several tens of mΩ) is used for output, secondary phase lead (two phase leads) must be put to cancel secondary phase lead caused by LC. One of the examples of phase compensation methods is as follows: VOUT 1 C1 R1 Phase lead fz1= R4 C2 R3 Phase lead fz2 = FB 2πR1C1 1 2πR4C2 [Hz] (11) [Hz] (12) [Hz] (13) 1 R2 Phase delay fp1 = 2πR3C1 1 LC resonance frequency = 2π√(LC) Fig.32 Example of setting of phase compensation [Hz] (14) For setting of phase-lead frequency, both of them should be put near LC resonance frequency. When GBW frequency becomes too hjgh due to the secondary phase lead, it may get stabilized by putting the primary phase delay in a frequency slightly higher than the LC resonance frequency to compensate it. www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 11/15 2013.07 - Rev.B Technical Note BD8303MUV ● Example of Board Layout Fig.33 Example of Board Layout www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 12/15 2013.07 - Rev.B Technical Note BD8303MUV ● I/O Equivalence Circuit RT INV VREG VREG VREG VREG RT INV GND GND FB STB VREG VREG VCC VCC FB STB GND GND BOOT1,2 HG1,2 SW1,2 LG1,2 PGND VCC VREG GND BOOT1,2 VREG VCC GND PGND SW1,2 VREG LG1,2 HG1,2 PGND Fig.34 I/O equivalence circuit www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 13/15 2013.07 - Rev.B Technical Note BD8303MUV ● Precautions for Use 1) Absolute Maximum Rating We dedicate much attention to the quality control of these products, however the possibility of deterioration or destruction exists if the impressed voltage, operating temperature range, etc., exceed the absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. If a special mode exceeding the absolute maximum rating is expected, please review matters and provide physical safety means such as fuses, etc. 2) GND Potential Keep the potential of the GND pin below the minimum potential at all times. 3) Thermal Design Work out the thermal design with sufficient margin taking power dissipation (Pd) in the actual operation condition into account. 4) Short Circuit between Pins and Incorrect Mounting Attention to IC direction or displacement is required when installing the IC on a PCB. If the IC is installed in the wrong way, it may break. Also, the threat of destruction from short-circuits exists if foreign matter invades between outputs or the output and GND of the power supply. 5) Operation under Strong Electromagnetic Field Be careful of possible malfunctions under strong electromagnetic fields. 6) Common Impedance When providing a power supply and GND wirings, show sufficient consideration for lowering common impedance and reducing ripple (i.e., using thick short wiring, cutting ripple down by LC, etc.) as much as you can. 7) Thermal Protection Circuit (TSD Circuit) This IC contains a thermal protection circuit (TSD circuit). The TSD circuit serves to shut off the IC from thermal runaway and does not aim to protect or assure operation of the IC itself. Therefore, do not use the TSD circuit for continuous use or operation after the circuit has tripped. 8) Rush Current at the Time of Power Activation Be careful of the power supply coupling capacity and the width of the power supply and GND pattern wiring and routing since rush current flows instantaneously at the time of power activation in the case of CMOS IC or ICs with multiple power supplies. 9) IC Terminal Input This is a monolithic IC and has P+ isolation and a P substrate for element isolation between each element. P-N junctions are formed and various parasitic elements are configured using these P layers and N layers of the individual elements. For example, if a resistor and transistor are connected to a terminal as shown on Fig.-8: ○ The P-N junction operates as a parasitic diode when GND > (Terminal A) in the case of a resistor or when GND > (Pin B) in the case of a transistor (NPN) ○ Also, a parasitic NPN transistor operates using the N layer of another element adjacent to the previous diode in the case of a transistor (NPN) when GND > (Pin B). The parasitic element consequently rises under the potential relationship because of the IC’s structure. The parasitic element pulls interference that could cause malfunctions or destruction out of the circuit. Therefore, use caution to avoid the operation of parasitic elements caused by applying voltage to an input terminal lower than the GND (P board), etc. Transistor (NPN) B E C ～ ～ Resistor (Pin B) (Pin A) GND N N N N P P＋ P＋ N Ｎ (Pin A) P＋ ～ ～ P P＋ N Parasitic Element P Substrate P Substrate Parasitic Element Parasitic Element GND GND Fig.35 Example of simple structure of Bipolar IC www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ 14/15 2013.07 - Rev.B Technical Note BD8303MUV Ordering part number B D 8 Part No. 3 0 Part No. 3 M U V - E Package MUV: VQFN016V3030 2 Packaging and forming specification E2: Embossed tape and reel VQFN016V3030 3.0 ± 0.1 <Tape and Reel information> Embossed carrier tape Tape 3.0 ± 0.1 <Dimension> Direction of feed 1.0MAX 1PIN MARK + 0.03 − 0.02 0.02 1.4 ± 0.1 0.5 1.4 ± 0.1 0.4 ± 0.1 1234 8 12 0.75 1234 13 1234 5 1234 4 16 1234 1 1234 C0.2 (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand) (0.22) S 0.08 S 3000pcs E2 Quantity 9 0.25 + 0.05 − 0.04 www.rohm.com c 2009 ROHM Co., Ltd. All rights reserved. ○ (Unit:mm) Reel 15/15 1pin Direction of feed ※When you order , please order in times the amount of package quantity. 2013.07 - Rev.B Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.