Features • • • • • • • • • • • • • • • • • • • • • • • Full Range of Matrices with up to 480K Gates 0.5 µm Drawn CMOS, 3 Metal Layers, Sea of Gates RAM and DPRAM Compilers Library Optimized for Synthesis, Floor Plan and Automatic Test Generation (ATG) 3 and 5 Volts Operation; Single or Dual Supply Mode High Speed Performances – 420 ps Max NAND2 Propagation Delay at 4.5V, 670 ps at 2.7 and FO = 5 – Min 650 MHz Toggle Frequency at 4.5V and 340 MHz at 2.7V Programmable PLL Available on Request High System Frequency Skew Control through Clock Tree Synthesis Software Low Power Consumption: – 1.96 µW/Gate/MHz at 5V – 0.6 µW/Gate/MHz at 3V Integrated Power On Reset Matrices With a Max of 484 Fully Programmable Pads Standard 3, 6, 12 and 24 mA I/Os Versatile I/O Cell: Input, Output, I/O, Supply, Oscillator CMOS/TTL/PCI Interface ESD (2 KV) and Latch-up Protected I/O High Noise and EMC Immunity: – I/O with Slew Rate Control – Internal Decoupling – Signal Filtering between Periphery and Core – Application Dependent Supply Routing and Several Independent Supply Sources Wide Range of Hermetic and Plastic Packages Delivery in Die Form with 94.6 µm Pad Pitch Advanced CAD Support: Floor Plan, Proprietary Delay Models, Timing Driven Layout, Power Management Cadence®, Mentor™, Vital and Synopsys® Reference Platforms EDIF and VHDL Reference Formats Available In Commercial, Industrial and Military Quality Grades (for Space Application see MG2RT and MG2RTP Specifications) QML Q with SMD 5962-00B02 350K Used Gates 0.5 µm CMOS Sea of Gates MG2 Description The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 480K gates cover most system integration needs. The MG2 is manufactured using a 0.5 micron drawn, 3 metal layers CMOS process, called SCMOS 3/2. The base cell architecture of the MG2 series provides high routability of logic with extremely dense compiled memories: RAM and DPRAM. ROM can be generated using synthesis tools. Accurate control of clock distribution can be achieved by PLL hardware and CTS (Clock Tree Synthesis) software. New noise prevention techniques are applied in the array and in the periphery: three or more independent supplies, internal decoupling, customization dependent supply routing, noise filtering, skew controlled I/Os, low swing differential I/Os, all contribute to improve the noise immunity and reduce the emission level. The MG2 is supported by an advanced software environment based on industry standards linking proprietary and commercial tools. Verilog, Modelsim, Design Compiler are the reference front-end tools. Floor planning associated with timing driven layout provides a short back-end cycle. The MG2 library allows straight forward migration from MG1 Sea of Gates. A netlist based on this library can be simulated as either MG2, or MG2RT or MG2RTP. 4137O–AERO–06/05 Table 1. List of Available MG2 Matrices Total Gates Typical Usable Gates Total Pads Maximum Programmable I/Os (1) 44616 31200 173 150 MG2091 (1) 91464 64000 237 214 MG2194 193800 135600 333 310 MG2265 (1) 264375 185000 385 362 MG2360 361680 253100 445 422 MG2480 481143 336800 507 484 Type MG2044 Note: Libraries 1. Not available for new designs. The MG2 cell library has been designed to take full advantage of the features offered by both logic and test synthesis tools. Design testability is assured by the full support of SCAN, JTAG (IEEE 1149) and BIST methodologies. More complex macro functions are available in VHDL, for example: I2C, UART, Timer, etc. Block Generators Block generators are used to create a customer-specific simulation model and metallisation pattern for regular functions like RAM and DPRAM. The basic cell architecture allows one bit per cell for RAM and DPRAM. The main characteristics of these generators are summarized below. Table 2. Block Generator Capability Bits/Word Access Time (ns) Used Cells RAM 32k 1-36 8 20 k DPRAM 32k 1-36 8.6 23 k Function 2 Typical Characteristics (16k bits) at 5V Maximum Size (bits) MG2 4137O–AERO–06/05 MG2 I/O Buffer Interfacing I/O Flexibility All I/O buffers may be configured as input, output, bi-directional, oscillator or supply. A level translator is located close to each buffer. Inputs Input buffers with CMOS or TTL thresholds are non-inverting and feature versions with and without hysteresis. The CMOS and TTL input buffers may incorporate pull-up or pull down terminators. For special purposes, a buffer allowing direct input to the matrix core is available. Outputs Several kinds of CMOS and TTL output drivers are offered: fast buffers with 3, 6, 12 and 24 mA drive at 5V, low noise buffers with 12 mA drive at 5V. Clock Generation and PLL Clock Generation Atmel offers 6 different types of oscillators: 4 high frequency crystal oscillators and 2 RC oscillators. For all devices, the mark-space ratio is better than 40/60 and the start-up time less than 10 ms. Frequency (MHz) PLL Typical Consumption (mA) Oscillators Max 5V Max 3V 5V 3V Xtal 7M 12 7 1.2 0.4 Xtal 20M 28 17 2.5 0.8 Xtal 50M 70 40 7 2 Xtal 100M 130 75 16 5 RC 10M 10 10 2 1 RC 32M 32 32 3 1.5 Contact factory. 3 4137O–AERO–06/05 Power Supply and Noise Protection The speed and density of the SCMOS3/2 technology causes large switching current spikes, for example, when: • 16 high current output buffers switch simultaneously, • or 10% of the 480,000 gates are switching within a window of 1 ns. Sharp edges and high currents cause some parasitic elements in the packaging to become significant. In this frequency range, the package inductance and series resistance should be taken into account. It is known that an inductor slows down the settling time of the current and causes voltage drops on the power supply lines. These drops can affect the behavior of the circuit itself or disturb the external application (ground bounce). In order to improve the noise immunity of the MG core matrix, several mechanisms have been implemented inside the MG arrays. Two kinds of protection have been added: one to limit the I/O buffer switching noise and the other to protect the I/O buffers against the switching noise coming from the matrix. I/O Buffers Switching Protection Three features are implemented to limit the noise generated by the switching current: • The power supplies of the input and output buffers are separated. • The rise and fall times of the output buffers can be controlled by an internal regulator. • A design rule concerning the number of buffers connected on the same power supply line has been imposed. Matrix Switching This noise disturbance is caused by a large number of gates switching simultaneously. To allow Current Protection this without impacting the functionality of the circuit, three new features have been added: 4 • Decoupling capacitors are integrated directly on the silicon to reduce the power supply drop. • A power supply network has been implemented in the matrix. This solution reduces the number of parasitic elements such as inductance and resistance and constitutes an artificial VDD and Ground plane. One mesh of the network supplies approximately 150 cells. • A low pass filter has been added between the matrix and the input to the output buffer. This limits the transmission of the noise coming from the ground or the VDD supply of the matrix to the external world via the output buffers. MG2 4137O–AERO–06/05 MG2 Packaging Atmel offers a wide range of packaging options which are listed below: Table 3. Packaging Options Pins Lead Spacing Min./Max (mils) CQPF 132 160 25,6 25,6 MQFP 196 256 352 25 20 20 Package Type (1) Notes: 1. Contact Atmel Local Design Centers to check the availability of the matrix/package combination. 2. Contact factory. 5 4137O–AERO–06/05 Design Flows and Tools Design Flows and Modes A generic design flow for an MG2 array is illustrated below. A top down design methodology is proposed which starts with high level system description and is refined in successive design steps. At each step, structural verification is performed which includes the following tasks: • Gate level logic simulation and comparison with high level simulation results. • Design and test rules check. • Power consumption analysis. • Timing analysis (only after floor plan). The main design stages are: • System specification, preferably in VHDL form. • Functional description at RTL level. • Logic synthesis. • Floor planning and bonding diagram generation. • Test/Scan insertion, ATG and/or fault simulation. • Physical cell placement, JTAG insertion and clock tree synthesis. • Routing. To meet the various requirements of designers, several interface levels between the customer and Atmel are possible. For each of the possible design modes a review meeting is required for data transfer from the user to Atmel. In all cases the final routing and verifications are performed by Atmel. The design acceptance is formalized by a design review which authorizes Atmel to proceed with sample manufacturing. 6 MG2 4137O–AERO–06/05 MG2 Figure 1. MG2 Design Flow System Specifications RTL Simulation Logic Synthesis Floor Plan Bonding Diagram Gate Level Simulation Scan Insertion ATG and Fault Simulation Placement JTAG Insertion Clock Tree Synthesis Routing & Extract Back Annotated Simulation Sign-off Samples Manufacturing and Test 7 4137O–AERO–06/05 Design Tools and Design Kits (DK) The basic content of a design kit is described in the table below. The interface formats to and from Atmel rely on IEEE or industry standard: • VHDL for functional descriptions • VHDL or EDIF for netlists • Tabular, log or .VCD for simulation results • SDF (VITAL format) and SPF for back annotation • LEF and DEF for physical floor plan information The design kits supported for several commercial tools is outlined below. Design Kit Support • Cadence/Verilog (RTL and gate), Logic Design Planner • Mentor/Modelsim (RTL and gate), Velocity, BSD Archictect, Flex Test • Synopsys/Design Compiler, Prime Time • Vital Table 4. Design Kit Description Design Tool or Library Third Party Tools Design manual and libraries (1) Synthesis library (1) Gate level simulation library (1) Design rules analyzer Power consumption analyzer STAR COMET Floor plan library (1) Timing analyzer library (1) Package and bonding software PIM Scan path and JTAG insertion (1) ATG and fault simulation library (1) Note: 8 Atmel Software Name 1. Refer to ‘Design kits cross reference tables’ ATD-TS-WF-R0181 MG2 4137O–AERO–06/05 MG2 Electrical Characteristics Absolute Maximum Ratings Ambient temperature under bias (TA) Military .......................................................... -55°C to +125°C Junction temperature ....................................... TJ < TA + 20°C *NOTE: Stresses above those listed may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Storage temperature ...................................... -65°C to +150°C TLL/CMOS: Supply voltage VDD..............................................-0.5V to +7V I/O voltage ............................................... -0.5V to VDD + 0.5V 9 4137O–AERO–06/05 DC Characteristics Table 5. DC Characteristics - Specified at VDD = +5V ± 10% Symbol Parameter Min. Typ Max Unit Conditions VIL Input LOW voltage(3) CMOS input 0 0 – 1.5 0.8 V – Input HIGH voltage(3) CMOS input 3.5 – VDD TTL input 2.2 TTL input VIH VOL Output LOW voltage VOH Output HIGH voltage VT+ Schmitt trigger positive threshold CMOS input VDD 0.4 V IOL = 24,12, 6, 3 mA(1) – – V IOH = -24,-12, -6, -3 mA(1) – 3.6 1.8 V 1.2 1.0 – – – 1.9 0.6 – 3.9 Schmitt trigger negative threshold CMOS input TTL input Delta V CMOS hysteresis 25°C/5V TTL hysteresis 25°C/5V – – TTL input VT- V V V – – – Input low leakage IIL No pull up/down -5 Pull up -120 -69 +5 -55 -5 +5 No pull up/down -5 +5 Pull up -5 +5 Pull down 79 Pull down µA µA µA – Input High leakage IIH IOZ 3-State Output Leakage current µA – BOUT3 BOUT6 BOUT12 BOUT24 – Leakage current per cell – 1.0 10.0 nA – Operating current per cell – 0.39 0.58 µA/MHz – ICCSB 10 ±5 – Output Short circuit current ICCOP 330 – 90 180 270 540 IOS Notes: 125 µA µA µA (2) mA 1. According buffer: Bout24,Bout12, Bout6, Bout3. 2. Supplied as a design limit but not guarantedd or tested. No more than one outout may be shorted at a time for a maximum duration of 10 seconds. 3. Without Schmitt trigger. MG2 4137O–AERO–06/05 MG2 Table 6. DC Characteristics Specified at VDD = +3V ± 0.3V Symbol Parameter VIL Input LOW voltage(3) LVCMOS input LVTTL input Input HIGH voltage(3) LVCMOS input VIH LVTTL input Min. Typ Max 0 0 – 0.3VDD 0.7VDD – – LVTTL Output HIGH voltage LVTTL VOH 2.4 Schmitt trigger positive threshold LVCMOS input VT+ – – LVTTL input LVCMOS hysteresis 25°C/3V LVTTL hysteresis 25°C/3V 0.9 0.8 – V V V V 2.2 1.2 Schmitt trigger negative threshold LVCMOS input Delta V 0.4 – LVTTL input VT- VDD VDD 2.0 Output LOW voltage VOL 0.8 Unit – – 0.8 0.2 – 24 -60 V V V Conditions – – IOL = 12,6, 3, 1.5 mA(1) IOH = -10,-4, -2, -1 mA(1) – – – Input leakage No pull up/down IIL Pull up -1 -20 +1 Pull down -1 +1 -1 -1 +1 uA uA uA – Input leakage No pull up/down IIH Pull up 150 – +1 µA – – 50 100 155 310 32 Pull down IOZ 42 µA µA µA 3-State Output Leakage current (2) +1 – – BOUT3 BOUT6 BOUT12 BOUT24 IOS Output Short circuit current ICCSB Leakage current per cell – 0.6 5 nA – Operating current per cell – 0.2 0.25 µA/MHz – ICCOP Notes: mA 1. According buffer: Bout12, Bout6, Bout3 2. Supplied as a design limit but not guarantedd or tested. No more than one outout may be shorted at a time for a maximum duration of 10 seconds. 3. Without Schmitt trigger. 11 4137O–AERO–06/05 AC Characteristics Table 7. AC Characteristics TJ = 25°C, Process Typical (all values in ns) VDD Buffer Description BOUT12 Output buffer with 12 mA drive Load Transition 5V 3V Tplh 3.18 4.67 Tphl 2.35 3.33 60pf Table 8. AC Characteristics TJ = 25°C, Process Typical (all values in ns) VDD Cell Description Load BINCMOS CMOS input buffer 15 fan BINTTL INV NAND2 FDFF 12 TTL input buffer Inverter 2 - input NAND D flip-flop, Clk to Q Transition 5V 3V Tplh 0.75 1.12 Tphl 0.7 0.98 Tplh 0.88 1.29 Tphl 0.65 1.03 Tplh 0.54 0.85 Tphl 0.39 0.49 Tplh 0.57 0.89 Tphl 0.49 0.67 Tplh 0.86 1.30 Tphl 0.73 1.08 Ts 0.44 1.06 Th 0.00 0.00 16 fan 12 fan 12 fan 8 fan MG2 4137O–AERO–06/05 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. 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