84- BGA (6 x 6 x 1mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BZ 56.6699 mg Body Size (mil/mm) Package Weight – Site 2 6 x 6 x 1.0mm N/A SUMMARY The 84L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 112210 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ84CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-75235 Rev. *D Page 1 of 4 84- BGA (6 x 6 x 1mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition CAS Number Cured Resin Glass Fabrics Trade Secret Trade Secret Copper Foil 7440-50-8 Diethylene Glycol Monoethyl Ether Acetate Acetophenone Derirative Silica Crystalline Solvent naptha Sn Ag Cu Ag Bismaleimide Polymer/Synthetic Resin Additive Si Au SiO2 Epoxy Resin (1) Epoxy Resin (2) Phenol Resin Trade Secret 7.8400 % weight of substance per Homogenous material 28.0000 138,345 % weight of substance per package 13.8345% 6.1600 22.0000 108,699 10.8699% 8.4000 30.0000 148,227 14.8227% 1.4000 5.0000 24,704 2.4704% 1.4000 1.4000 1.4000 0.5171 0.0053 0.0026 0.5686 0.0711 5.0000 5.0000 5.0000 98.5000 1.0000 0.5000 80.0000 10.0000 24,704 24,704 24,704 9,125 97 49 10,034 1,254 2.4704% 2.4704% 2.4704% 0.9125% 0.0093% 0.0046% 1.0034% 0.1254% 0.0498 0.0213 8.9385 2.1742 14.3628 0.9793 0.3264 0.6529 7.0000 3.0000 100.0000 100.0000 88.0000 6.0000 2.0000 4.0000 878 376 157,728 38,366 253,446 17,280 5,760 11,520 0.0878% 0.0376% 15.7728% 3.8366% 25.3446% 1.7280% 0.5760% 1.1520% Weight by mg PPM Trade Secret 14808-60-7 Trade Secret 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 93705-66-9 Trade Secret 106466-55-1 Package Weight (mg): 56.6699 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-75235 Rev. *D Page 2 of 4 84- BGA (6 x 6 x 1mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Cadmium PPM Cr VI PPM Mercury PPM PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Lead PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-75235 Rev. *D Page 3 of 4 84- BGA (6 x 6 x 1mm) Pb-Free Package Document History Page Document Title: 84 - BGA (6X6X1MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-75235 Rev. ** *A *B ECN No. Orig. of Change 3471178 HLR 3833306 HLR 4058267 YUM *C *D 4617357 HLR 5083865 HLR MEL Description of Change Initial Release Added CAS Number for Copper Added assembly site name in the Assembly heading. Changed Assembly code to assembly site name. Sunset Due – No Change Changed the substances with “------------- “to “Trade Secret. Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-75235 Rev. *D Page 4 of 4