28L - PDIP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 PZ 3,960.9510 mg Body Size (mil/mm) Package Weight – Site 2 600 mils 4,612.6501 mg SUMMARY The28L-600 mils PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Millennium Microtech Thailand (MMT) Package Qualification Report # 092014 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 <5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-PZ28MMT As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-03208 Rev. *G Page 1 of 5 28L - PDIP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Copper 7440-50-8 1,301.9211 % weight of substance per Homogene ous 97.0200% Ferrous Zinc 7439-89-6 7440-66-6 34.8897 2.6838 2.6000% 0.2000% 8,809 677 0.88% 0.07% Phosphorus Lead Nickel Gold Palladium Epoxy Resin Silver (Ag) Aromatic Amine Si Au Impurity (Ag,Ca, Cu,Fe,Mg) Silica Fused Epoxy Resin Epoxy, Cresol Phenol resin Carbon Black 7723-14-0 7439-92-1 7440-02-0 7440-57-5 7440-05-3 Trade Secret 7440-22-4 Trade Secret 7440-21-3 7440-57-5 2.0129 0.4026 24.1486 0.6703 1.0611 0.6300 2.8000 0.0700 9.8000 0.9799 0.0010 0.1500% 0.0300% 93.3100% 2.5900% 4.1000% 18.0000% 80.0000% 2.0000% 100.0000% 99.9900% 0.0100% 508 99 6,097 169 268 159 708 19 2,475 249 0 0.05% 0.01% 0.61% 0.02% 0.03% 0.02% 0.07% 0.00% 0.25% 0.02% 0.00% 2,238.4678 154.7328 51.5776 128.9440 5.1578 86.8000% 6.0000% 2.0000% 5.0000% 0.2000% 565,132 39,064 13,019 32,553 1,304 56.51% 3.91% 1.30% 3.26% 0.13% Substance Composition CAS Number Trade Secret 60676-86-0 Trade Secret 29690-82-2 Trade Secret 1333-86-4 Package Weight (mg): Weight by mg 3,960.9510 328,691 %Weight of Substan ce per package % 32.87% PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-03208 Rev. *G Page 2 of 5 28L - PDIP Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2) Package Qualification Report # 122903 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 <5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-PZ28Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-03208 Rev. *G Page 3 of 5 28L - PDIP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Purpose of Use Material Lead frame Base Material External Plating Lead Finish Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Copper (Cu) Iron (Fe) Zinc (Z) Phosphorus (P) Silver (Ag) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 853.0892 21.0099 1.0505 0.2626 1.4886 % weight of substance per Homogenous material 97.2846 2.3959 0.1198 0.0299 0.1698 Tin (Sn) 7440-31-5 32.0750 100.0000 6,954 0.6954 Trade Secret 7440-22-4 0.1410 1.4096 7.0000 70.0000 30 305 0.003 0.0305 Trade Secret 0.0604 3.0000 13 0.0013 Trade Secret 0.1007 5.0000 22 0.0022 Trade Secret 0.1007 5.0000 22 0.0022 Trade Secret 0.2014 10.0000 44 0.0044 7440-21-3 7440-50-8 6.0762 0.2651 100.0000 100.0000 1,317 57.4663 0.1317 0.0057 Trade Secret 277.1489 7.5000 60,085 6.0085 60676-86-0 1333-86-4 3,177.9745 18.4766 86.0000 0.5000 688,969 4,006 68.8969 0.4006 Trade Secret 73.9064 2.0000 16,023 1.6023 Trade Secret 147.8128 4.0000 32,045 3.2045 Package Weight (mg): 4,612.6501 % Total: 100.0000 Substance Composition Resin Silver Mixed aryl allyl glycidyl compounds Amine Gamma Butyrolactone Diglycidylether of bisphenol-F Silicon Copper (Cu) Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin CAS Number Weight by mg % weight of substance per package PPM 184,945 4,555 228 57 323 18.4945 0.4555 0.0228 0.0057 0.0323 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-03208 Rev. *G Page 4 of 5 28L - PDIP Pb-Free Package Document History Page Document Title: Document Number: Rev. 28L - PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03208 ** *A ECN No. Orig. of Change 385878 EML 1092426 MRB *B 2721039 ZJL *C *D Dcon 3278144 HLR 3925886 VFR *E 4055149 YUM *F 4420788 HLR *G 5341217 HLR DCON Description of Change New document 1. Updated Cypress Logo 2. Added on the material composition the percent weight per homogeneous material and weight of substance 3. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials. Added note 4: the package were based on Engineering calculation and performed on a package family basis 1. Included PMDD for MMT location X. 2. Deleted PMDD of Omedata location O. 3. Changed from CML to WEB in distribution. Sunset Due – No Change. Added PMDD for Site 2 – Amkor Technology Philippines; reference QTP # 122903 Added assembly site name in the Assembly heading in site 1 and 2. Changed the assembly code to assembly site name in site 1 and 2. Update material composition in Assembly Site 1 to reflect 4 decimal on values. Corrected the total package weight of Assembly Site 1 from 3960.9509mg to 3960.9510mg. Changed Cypress Logo. Changed the substances with “------------- “and Proprietary to “Trade Secret". Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-03208 Rev. *G Page 5 of 5