120L – Exposed Pad TQFP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 AE 508.2302 mg Body Size (mm) Package Weight – Site 2 14x14x1.0mm 404.6868 mg SUMMARY The 120leadl-exposed pad TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site: Amkor Technology Seoul Korea Package Qualification Report # 084305 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AE120Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-51990 Rev. *F Page 1 of 6 120L – Exposed Pad TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose Substance Composition CAS Number Encapsulation Multi-Aromatic Resin SiO2 Carbon black Frame Base Material Cu Cr Sn Zn Frame Plating Bond Surface Ag Die Circuit Si Die Attach Adhesive Resin Ag Anhydride Wire Interconnect Au Lead Finish External Sn Plating Trade Secret Mold Compound 60676-86-0 1333-86-4 7440-50-8 7440-47-3 7440-31-5 7440-66-6 7440-22-4 7440-21-3 Trade Secret 7440-22-4 25550-51-0 7440-57-5 7440-31-5 % weight of substance per Homogenous material 38.6573 11.5000% Weight by mg 295.8120 1.6808 137.9377 0.4169 0.3475 0.2780 1.0400 13.9000 0.6600 2.3100 0.3300 5.5900 9.2700 88.0000% 0.5000% 99.2500% 0.3000% 0.2500% 0.2000% 100.0000% 100.0000% 20.0000% 70.0000% 10.0000% 100.0000% 100.0000% Package Weight (mg): 508.2302 % weight of substance per package PPM 76,063 7.6063 582,044 3,307 271,408 820 684 547 2,046 27,350 1,299 4,545 649 10,999 18,240 58.2044 0.3307 27.1408 0.0820 0.0684 0.0547 0.2046 2.7350 0.1299 0.4545 0.0649 1.0999 1.8240 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-51990 Rev. *F Page 2 of 6 120L – Exposed Pad TQFP Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (ATP1) Package Qualification Report # 145010 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AE120ATP1 As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-51990 Rev. *F Page 3 of 6 120L – Exposed Pad TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Purpose Of Use Base Material External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg PPM % Weight of Substance per Package Cu 7440-50-8 96.4462% 335,194 33.5194% Fe 7439-89-6 3.2695 2.3246% 8,079 0.8079% Zn 7440-66-6 0.1670 0.1187% 413 0.0413% P Ag Sn 7723-14-0 7440-22-4 7440-31-5 0.0417 1.5202 9.2726 0.0297% 1.0809% 100.0000% 103 3,756 22,913 0.0103% 0.3756% 2.2913% Polymer 1,4Butanedioldiglycidyl Ether Phenolic Resin Ethylene glycol monobutyl ether acetate Silver Silicon Cu Pd Epoxy Resin A Epoxy Resin B Silica Fused Carbon Black Phenol Resin 9003-36-5 2425-79-8 0.6115 0.0685 11.0000% 2.0000% 1,511 169 0.1511% 0.0169% 9003-35-4 112-07-2 0.0685 0.1962 2.0000% 5.0000% 169 485 0.0169% 0.0485% 3.5384 10.8108 0.4790 0.0109 19.4257 5.0121 201.5094 1.2530 11.7834 80.0000% 100.0000% 97.8970% 2.1030% 8.0000% 2.0000% 84.0000% 0.5000% 5.5000% 8,744 26,714 1,184 27 48,002 12,385 497,939 3,096 29,117 0.8744% 2.6714% 0.1184% 0.0027% 4.8002% 1.2385% 49.7939% 0.3096% 2.9117% 7440-22-4 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret 60676-86-0 1333-86-4 Trade Secret Package Weight (mg): 135.6484 % Weight of Substance per Homogenous Material 404.6868 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-51990 Rev. *F Page 4 of 6 100.0000 120L – Exposed Pad TQFP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-51990 Rev. *F Page 5 of 6 120L – Exposed Pad TQFP Pb-Free Package Document History Page Document Title: 120L - EXPOSED PAD TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-51990 Rev. ECN No. ** *A 2682970 3606244 Orig. of Change MLA HLR *B *C 3984750 4055294 HLR YUM *D 4679347 VFR *E 4753255 VFR *F 5285407 HLR MEL Description of Change New release Added Note 4 on Footer Section Updated Assembly Sites 1 to reflect 4 decimal places on values of material composition table. Removed Tube material on Indirect Materials table. Added assembly site name in the assembly heading. Changed Assembly code to assembly site name. Added PMDD for Assembly Site 2 – Amkor Technology Philippines under QTP # 145010 Revise PMDD for Assembly Site 2 to align with mold compound and epoxy materials MSDS. Corrected the typo error on the QTP # for Site 2 from 045010 to 145010. Changed Cypress Logo. Changed the substances with Proprietary CAS Number to “Trade Secret". Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-51990 Rev. *F Page 6 of 6