131 WLCSP BOP 5.099X4.695X0.6MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

131– WLCSP BOP
(5.099 x 4.695 x 0.6 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FB
23.4852 mg
Body Size (mil/mm)
Package Weight – Site 2
5.099x4.695x0.6mm
24.7957 mg
SUMMARY
The 131- WLCSP BOP Pb-Free package is compliant to RoHS. Packages from different assembly sites are likely to
have different materials composition. However, Cypress guarantees that product ordered with a part number
containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive.
ASSEMBLY Site 1: Amkor Technology Hsin-chu Taiwan (T5)
Package Qualification Report # 103501 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed
in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
157
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
157
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
CoA-FB131Amkor Taiwan
(T5)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78187 Rev. *D
Page 1 of 5
131– WLCSP BOP
(5.099 x 4.695 x 0.6 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
UBM
Purpose of
Use
Solder Ball
Pad
Solder Ball
External
Plating
Polyimide
Stress Buffer
Die
Circuit
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogeneous
material
% weight
of
substance
per
package
PPM
Ti
7440-32-6
0.0011
0.8065
47
0.0047
W
7440-33-7
0.0047
3.4457
200
0.0200
Ni
7440-02-0
Au
Sn
Ag
Cu
Polyamide
n-Methylpyrrolidone
Acrylate Ester
Methanol
Additive
Silicon
7440-57-5
7440-31-5
7440-22-4
7440-50-8
63428-84-2
872-50-4
140-88-5
67-56-1
Trade Secret
7440-21-3
0.0847
0.0459
5.6345
0.3354
0.0438
0.1318
0.1318
0.0330
0.0165
0.0165
17.0055
62.0968
33.6510
95.5000
3.9000
0.6000
40.0000
40.0000
10.0000
5.0000
5.0000
100.0000
3,607
1,954
239,917
14,281
1,865
5,612
5,612
1,405
703
703
724,094
0.3607
0.1954
23.9917
1.4281
0.1865
0.5612
0.5612
0.1405
0.0703
0.0703
72.4094
% Total:
100.0000
Package Weight (mg):
23.4852
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
PBDE
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78187 Rev. *D
Page 2 of 5
131– WLCSP BOP
(5.099 x 4.695 x 0.6 mm)
Pb-Free Package
ASSEMBLY Site 2: Deca Technologies Inc. Philippines (Decatech)
Package Qualification Report # 114702 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed
in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
<5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
CoA-FB131Decatech
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78187 Rev. *D
Page 3 of 5
131– WLCSP BOP
(5.099 x 4.695 x 0.6 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Solder Ball
Pad
UBM
Solder Ball
External
Plating
Polybenzoxazole
Top Surface
Laminate
Die
Stress Buffer
Mark
Surface
Circuit
Substance
Composition
CAS Number
Ti
7440-32-6
W
7440-33-7
Cu
7440-50-8
Cu
Sn
Ag
Cu
Proprietary
7440-50-8
7440-31-5
7440-22-4
7440-50-8
Trade Secret
Trade Secret
Proprietary
Silicon
7440-21-3
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
material
0.0010
0.3461
40
0.0040
0.0170
5.6775
686
0.0686
0.0162
0.2649
5.7732
0.2405
0.0301
0.1765
5.4072
88.5693
95.5000
4.0000
0.5000
100.0000
653
10,683
232,831
9,699
1,214
5,612
0.0653
1.0683
23.2831
0.9699
0.1214
0.7118
1.2708
17.0055
100.0000
100.0000
51,251
685,825
5.1251
68.5825
24.7957
% weight of
substance
per
package
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
< 2.0
< 2.0
< 2.0
Carrier tape
< 2.0
< 2.0
Plastic Reel
< 2.0
Shielding bag
< 5.0
Material
PBB
PPM
PBDE
PPM
< 2.0
-
-
< 2.0
< 2.0
-
-
< 2.0
< 2.0
< 2.0
-
-
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
SHAEC11016683-09
SHAEC11016683-14, A01
CAN10—
39969.001CoAPLRL-R
10234807 (12)
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78187 Rev. *D
Page 4 of 5
131– WLCSP BOP
(5.099 x 4.695 x 0.6 mm)
Pb-Free Package
Document History Page
Document Title: 131 - WLCSP BOP 5.099X4.695x0.6MM PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
Document Number:
001-78187
Rev.
**
*A
*B
ECN No. Orig. of
Change
3567896 MLA
3633319 MLA
4064282 YUM
*C
4756653 HLR
*D
5268684 HLR
DCON
Description of Change
New release
Add new qualified site per QTP 114702.
Added assembly site name in the assembly heading in site 1 and
2.
Changed assembly code to assembly site name in site 1 and 2.
Removed Tray in the Indirect Materials section.
Changed the % composition of Solder Ball on Assembly Site 2
from Sn96%Ag4.0%Cu0.5% to Sn95.5%Ag4.0%Cu0.5%
Changed the substances with “------------- “ and Proprietary to
“Trade Secret.
Changed Cypress Logo.
Removed Distribution and posting information from Document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78187 Rev. *D
Page 5 of 5