131– WLCSP BOP (5.099 x 4.695 x 0.6 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FB 23.4852 mg Body Size (mil/mm) Package Weight – Site 2 5.099x4.695x0.6mm 24.7957 mg SUMMARY The 131- WLCSP BOP Pb-Free package is compliant to RoHS. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that product ordered with a part number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive. ASSEMBLY Site 1: Amkor Technology Hsin-chu Taiwan (T5) Package Qualification Report # 103501 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 157 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 157 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report CoA-FB131Amkor Taiwan (T5) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78187 Rev. *D Page 1 of 5 131– WLCSP BOP (5.099 x 4.695 x 0.6 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material UBM Purpose of Use Solder Ball Pad Solder Ball External Plating Polyimide Stress Buffer Die Circuit Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous material % weight of substance per package PPM Ti 7440-32-6 0.0011 0.8065 47 0.0047 W 7440-33-7 0.0047 3.4457 200 0.0200 Ni 7440-02-0 Au Sn Ag Cu Polyamide n-Methylpyrrolidone Acrylate Ester Methanol Additive Silicon 7440-57-5 7440-31-5 7440-22-4 7440-50-8 63428-84-2 872-50-4 140-88-5 67-56-1 Trade Secret 7440-21-3 0.0847 0.0459 5.6345 0.3354 0.0438 0.1318 0.1318 0.0330 0.0165 0.0165 17.0055 62.0968 33.6510 95.5000 3.9000 0.6000 40.0000 40.0000 10.0000 5.0000 5.0000 100.0000 3,607 1,954 239,917 14,281 1,865 5,612 5,612 1,405 703 703 724,094 0.3607 0.1954 23.9917 1.4281 0.1865 0.5612 0.5612 0.1405 0.0703 0.0703 72.4094 % Total: 100.0000 Package Weight (mg): 23.4852 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78187 Rev. *D Page 2 of 5 131– WLCSP BOP (5.099 x 4.695 x 0.6 mm) Pb-Free Package ASSEMBLY Site 2: Deca Technologies Inc. Philippines (Decatech) Package Qualification Report # 114702 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 <5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report CoA-FB131Decatech As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78187 Rev. *D Page 3 of 5 131– WLCSP BOP (5.099 x 4.695 x 0.6 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Solder Ball Pad UBM Solder Ball External Plating Polybenzoxazole Top Surface Laminate Die Stress Buffer Mark Surface Circuit Substance Composition CAS Number Ti 7440-32-6 W 7440-33-7 Cu 7440-50-8 Cu Sn Ag Cu Proprietary 7440-50-8 7440-31-5 7440-22-4 7440-50-8 Trade Secret Trade Secret Proprietary Silicon 7440-21-3 Package Weight (mg): Weight by mg % weight of substance per Homogeneous material 0.0010 0.3461 40 0.0040 0.0170 5.6775 686 0.0686 0.0162 0.2649 5.7732 0.2405 0.0301 0.1765 5.4072 88.5693 95.5000 4.0000 0.5000 100.0000 653 10,683 232,831 9,699 1,214 5,612 0.0653 1.0683 23.2831 0.9699 0.1214 0.7118 1.2708 17.0055 100.0000 100.0000 51,251 685,825 5.1251 68.5825 24.7957 % weight of substance per package PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape < 2.0 < 2.0 < 2.0 Carrier tape < 2.0 < 2.0 Plastic Reel < 2.0 Shielding bag < 5.0 Material PBB PPM PBDE PPM < 2.0 - - < 2.0 < 2.0 - - < 2.0 < 2.0 < 2.0 - - < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) SHAEC11016683-09 SHAEC11016683-14, A01 CAN10— 39969.001CoAPLRL-R 10234807 (12) Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-78187 Rev. *D Page 4 of 5 131– WLCSP BOP (5.099 x 4.695 x 0.6 mm) Pb-Free Package Document History Page Document Title: 131 - WLCSP BOP 5.099X4.695x0.6MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-78187 Rev. ** *A *B ECN No. Orig. of Change 3567896 MLA 3633319 MLA 4064282 YUM *C 4756653 HLR *D 5268684 HLR DCON Description of Change New release Add new qualified site per QTP 114702. Added assembly site name in the assembly heading in site 1 and 2. Changed assembly code to assembly site name in site 1 and 2. Removed Tray in the Indirect Materials section. Changed the % composition of Solder Ball on Assembly Site 2 from Sn96%Ag4.0%Cu0.5% to Sn95.5%Ag4.0%Cu0.5% Changed the substances with “------------- “ and Proprietary to “Trade Secret. Changed Cypress Logo. Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. 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