64L TQFP 10X10MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

64L-TQFP 10 x 10 mm
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
AY
338.9487 mg
Body Size (mil/mm)
Package Weight – Site 2
10 x 10 mm
N/A
SUMMARY
The 64L- TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 034101 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AY64ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04268 Rev.*I
Page 1 of 5
64L-TQFP 10 x 10 mm
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
% Weight
of
Substance
per
Package
PPM
Cu
7440-50-8
85.2223
91.4500%
251,431
25.1431%
Ni
7440-02-0
2.6373
2.8300%
7,781
0.7781%
Si
7440-21-3
0.5778
0.6200%
1,705
0.1705%
Mg
Ag
Sn
Ag
Epoxy Resin
Copper
GammaButyrolactone
Aromatichydrocarbons
Si
Au
Epoxy Resin
Phenol Resin
SiO2
Aromatic
Phosphate
Others
7439-95-4
7440-22-4
7440-31-5
7440-22-4
Trade Secret
7440-50-8
96-48-0
0.1398
4.6129
13.8300
1.7600
0.4700
0.0299
0.0299
0.1500%
4.9500%
100.0000%
75.8600%
20.2600%
1.2900%
1.2900%
412
13,609
40,803
5,192
1,387
88
88
0.0412%
1.3609%
4.0803%
0.5192%
0.1387%
0.0088%
0.0088%
Trade Secret
0.0299
1.2900%
88
0.0088%
7440-21-3
7440-57-5
85954-11-6
26834-02-6
60676-86-0
139189-30-3
15.4200
2.8100
10.5700
8.4349
187.0890
3.1921
100.0000%
100.0000%
5.0000%
3.9900%
88.5000%
1.5100%
45,494
8,290
31,185
24,885
551,969
9,418
4.5494%
0.8290%
3.1185%
2.4885%
55.1969%
0.9418%
Trade Secret
2.0929
0.9900%
6,175
0.6175%
% Total:
100.0000
Package Weight (mg):
338.9487
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04268 Rev.*I
Page 2 of 5
64L-TQFP 10 x 10 mm
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Dessicant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04268 Rev.*I
Page 3 of 5
64L-TQFP 10 x 10 mm
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
64L-TQFP 10X10mm PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04268
**
*A
ECN No. Orig. of
Change
390185
GFJ
391439
GFJ
*B
2247109 MAHA
*C
*D
*E
Dcon
2677622 HLR
2681087 HLR
3591884 HLR
*F
4031297 YUM
*G
*H
*I
4364735 HLR
4756622 HLR
5268684 HLR
Description of Change
New document
Changed the material composition (updating the die attach
adhesive used) and added CoA references for indirect materials
used.
1. Updated Cypress logo.
2. Added “% weight of substance per Homogeneous Material” and
“% Weight of Substance per Package” on the Material
Composition table.
3. Completed the RoHS Substances namely: Lead, Cadmium,
Mercury, Chromium VI, PBB and PBDE on Declaration of
Packaging Indirect Materials table.
4. Added Note 4: Actual testing performed on package family
basis. Engineering calculations were applied to derive
individual package data.
Replaced CML with WEB in distribution list.
Added CAS Number of Silver (Ag).
Corrected the package code of TQFP 64 (AZ to AY)
Updated Assembly Site 1 to reflect 4 decimal places on values of
material composition table.
Removed the Tube details on Indirect materials table
Added Assembly site name in the Assembly heading.
Changed Assembly Code to Assembly Site Name.
Changed the total package weight from 338.9490 to 338.9487
Sunset Due – No Change.
Changed the substances with “------------- “ and Proprietary to
“Trade Secret.
Changed Cypress Logo.’
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04268 Rev.*I
Page 4 of 5
64L-TQFP 10 x 10 mm
Pb-Free Package
Rev.
ECN No. Orig. of
Change
DCON
Description of Change
Removed Distribution and posting information from Document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04268 Rev.*I
Page 5 of 5