24- BGA (6 x 8 mm) with 5x5 Ball Matrix Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FAB B1: 88.9905 mg Package Weight – Site 3 Body Size (mil/mm) Package Weight – Site 2 6 X 8 mm Package Weight – Site 4 SUMMARY The 24-BGA package is compliant to RoHS. Cypress (Legacy Spansion Part) ordering part numbers containing an “H” (e.g. S25FL164K0XBHI020) meet the Directive of 2002/95/ EC (Rohs) requirement. *** ASSEMBLY Site 1: Cypress Bangkok (SB) Package Qualification Report # 153705, #153701 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) Material analysis report As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03789 Rev *A Page 1 of 4 24- BGA (6 x 8 mm) with 5x5 Ball Matrix Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material PPM % weight of substance per package Copper Gold Nickel Epoxy resin Aluminum Hydroxide SiO2 Glass Cloth Tin Silver Copper Silica Organic filler Acrylic resin Diluent Elastomer Organic peroxide Silicon Copper Palladium Silica (fused) Carbon Black Epoxy resin Phosphoric organic catalyst 7440-50-8 7440-57-5 7440-02-0 9003-36-5 7.3114 0.0472 0.7262 7.6727 22.6393% 0.1463% 2.2488% 23.7582% 82,159 531 8,161 86,219 8.2159% 0.0531% 0.8161% 8.6219% 21645-51-2 5.5841 17.2908% 62,749 6.2749% 65997-17-3 7440-31-5 7440-22-4 7440-50-8 Trade secret Trade secret Trade secret Trade secret Trade secret Trade secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 1333-86-4 Trade secret 10.9533 3.8341 0.1192 0.0199 0.0085 0.0424 0.0954 0.0530 0.0106 0.0021 3.9942 0.0278 0.0005 41.2149 0.1212 6.7156 33.9166% 96.5000% 3.0000% 0.5000% 4.0000% 20.0000% 45.0000% 25.0000% 5.0000% 1.0000% 100.0000% 98.3000% 1.7000% 85.0000% 0.2500% 13.8500% 123,084 43,084 1,339 223 95 476 1,072 595 119 24 44,884 312 5 463,138 1,362 75,464 12.3084% 4.3084% 0.1339% 0.0223% 0.0095% 0.0476% 0.1072% 0.0595% 0.0119% 0.0024% 4.4884% 0.0312% 0.0005% 46.3138% 0.1362% 7.5464% Trade secret 0.1455 0.3000% 1,635 0.1635% Metal Oxides Trade secret 0.2909 0.6000% 3,269 0.3269% Package Weight (mg): 88.9905 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03789 Rev *A Page 2 of 4 24- BGA (6 x 8 mm) with 5x5 Ball Matrix Pb-Free Package II. Type Tape & Reel Tray Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM PBDE PPM Analysis Report (Note2) < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 CoA-DESS-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03789 Rev *A Page 3 of 4 24- BGA (6 x 8 mm) with 5x5 Ball matrix Pb-Free Package Document History Page Document Title: 24 - BGA (6X8MM) with 5x5 Ball Matrix PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 002-03789 Rev. ** *A ECN No. Orig. of Change 4939253 CHAL 4989529 CHAL SLLO Description of Change New document Add QTP#153701 - QSPI in FAB024 Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 002-03789 Rev *A Page 4 of 4