Package Chemistry Substances Analysis Table FAA 064 (Pb-free solder balls) 13 x 10 mm 211 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 22.7321 subtotal 22 7321 22.7321 #1 Gold 7440-57-5 0.5956 subtotal 0.5956 #1 Epoxy resin Trade Secret 0.1847 #2 Polytetrafluoroethylene 9002-84-0 0.1511 subtotal 0.3359 #1 Brominated Epoxy Resins Trade Secret 5.1790 #2 Copper 7440-50-8 11.4225 #3 Gold 7440-57-5 0.0664 #4 Nickel 7440-02-0 0.3063 #5 Epoxy resin Trade Secret 19.4397 #6 Silica 14808-60-7 4.3822 #7 SiO2 Glass Cloth 65997-17-3 19.1225 subtotal 59.9188 #1 Silica (fused) 60676-86-0 95.0501 #2 Carbon Black 1333-86-4 0.2148 #3 Epoxy resin Trade Secret 11.5993 #4 Phosphoric organic catalyst Trade Secret 0.5370 subtotal 107.4013 #1 Tin 7440 31 5 7440-31-5 19 0263 19.0263 #2 Silver 7440-22-4 0.5915 #3 Copper 7440-50-8 0.0986 subtotal 19.7163 TOTAL PACKAGE 210.7000 unit weight/package (%) 10.7889 10 7889 10.7889 0.2827 0.2827 0.0877 0.0717 0.1594 2.4580 5.4212 0.0315 0.1454 9.2263 2.0798 9.0757 28.4379 45.1116 0.1019 5.5051 0.2549 50.9736 9 0300 9.0300 0.2807 0.0468 9.3575 100.0000 Amount (ppm) 107,889 107 889 107,889 2,827 2,827 877 717 1,594 24,580 54,212 315 1,454 92,263 20,798 90,757 284,379 451,116 1,019 55,051 2,549 509,736 90 300 90,300 2,807 468 93,575 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material ppm. concentrations less than 1 pp Document No. 002-12928 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (FAA064) - BKK - Au Wire Document Number: 002-12928 Rev. ** ECN No. Orig. of Description of Change Change 5267128 AAC Initial Release. Document No. 002-12928 Rev. ** Page 2 of 2