Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball TLA 084 (Pb-free solder balls) 8 x 11.6 mm 187.1 mg 260°C 3 BKK Product is RoHS Compliant CAS Number unit weight (mg) Chemicals Present #1 Silicon 7440-21-3 26.0506 subtotal 26.0506 #1 Copper 7440-50-8 1.4105 # 2 Palladium 7440-05-3 0.0244 subtotal 1.4348 #1 Epoxy resin Trade Secret 0.6246 #2 Polytetrafluoroethylene 9002-84-0 0.0449 #3 Silica (fused) 60676-86-0 0.1424 0.8120 subtotal #1 Copper 7440-50-8 12.7717 #2 Gold 7440-57-5 0.0052 #3 Nickel 7440-02-0 0.0476 #4 Epoxy resin Trade Secret 14.4550 #5 Aluminum Hydroxide 21645-51-2 5.5494 #6 SiO2 Glass Cloth 65997-17-3 10.8854 43.7142 subtotal #1 Silica (fused) 60676-86-0 85.9700 #2 Carbon Black 1333-86-4 0.2529 #3 Epoxy resin Trade Secret 14.0081 #4 Phosphoric organic catalyst Trade Secret 0.3034 #5 Metal Oxides Trade Secret 0.6068 101.1412 subtotal #1 Tin 7440-31-5 13.4371 #2 Silver 7440-22-4 0.4177 #3 Copper 7440-50-8 0.0696 13.9245 subtotal 187.0773 PACKAGE TOTAL unit weight/package (%) 13.9251 13.9251 0.7539 0.0130 0.7670 0.3339 0.0240 0.0761 0.4340 6.8269 0.0028 0.0254 7.7267 2.9664 5.8187 23.3669 45.9543 0.1352 7.4878 0.1622 0.3244 54.0638 7.1827 0.2233 0.0372 7.4432 100.0000 Amount (ppm) 139,251 139,251 7,539 130 7,670 3,339 240 761 4,340 68,269 28 254 77,267 29,664 58,187 233,669 459,543 1,352 74,878 1,622 3,244 540,638 71,827 2,233 372 74,432 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12974 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA084 (TLA084) - BKK - CuPd Wire Document Number: 002-12974 Rev. ** ECN No. Orig. of Description of Change Change 5269861 AAC Initial Release. Document No. 002-12974 Rev. ** Page 2 of 2