Package Chemistry Substances Analysis Table RSD 056 (Pb-free solder balls) 6.2 x 7.7 x 1 mm 76.1 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball Chemicals Present CAS Number unit weight(mg) #1 Silicon 7440-21-3 10.4442 subtotal 10 4442 10.4442 #1 Copper 7440-50-8 0.0053 #2 Palladium (Pd) 5/3/7440 0.0000 subtotal 0.0053 #1 Epoxy resin Trade secret 1.4520 #2 Polytetrafluoroethylene 9002-84-0 0.0001 #3 Silica (fused) 60676-86-0 0.6221 subtotal 2.0742 #1 Copper 7440-50-8 7.6995 #2 Gold 7440-57-5 0.0046 #3 Nickel 7440-02-0 0.0382 #4 Cured thermosetting resin Trade Secret 8.2321 #5 Continuous Filament Fiber Gla 65997-17-3 3.3599 subtotal 19.3344 #1 Silica (fused) 60676-86-0 32.6541 #2 Carbon Black 1333-86-4 0.0960 #3 Epoxy resin Trade secret 5.3207 #4 Phosphoric organic catalyst Trade secret 0.1152 #5 Metal Oxides Trade secret 0.2305 subtotal 38 4166 38.4166 #1 Tin 7440-31-5 5.7153 #2 Silver 7440-22-4 0.0580 #3 Copper 7440-50-8 0.0290 subtotal 5.8023 TOTAL PACKAGE 76.0771 unit weight/package (%) Amount (ppm) 13.7285 137,285 13 7285 13.7285 137 285 137,285 0.0070 70 0.0000 0 0.0070 70 1.9086 19,086 0.0001 1 0.8178 8,178 2.7264 27,264 10.1207 101,207 0.0060 60 0.0503 503 10.8208 108,208 4.4165 44,165 25.4142 254,142 42.9224 429,224 0.1262 1,262 6.9938 69,938 0.1515 1,515 0.3030 3,030 50 4970 50.4970 504 970 504,970 7.5125 75,125 0.0763 763 0.0381 381 7.6269 76,269 100.0000 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent The report does not include materials not intentionally added to our products (impurities) or thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12909 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA056 (RSD056) - BKK - CuPd Wire Document Number: 002-12909 Rev. ** ECN No. Orig. of Description of Change Change 5265652 AAC Initial Release. Document No. 002-12909 Rev. ** Page 2 of 2