Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VBG 080 (SnPb solder spheres) 11 x 8 x 1 mm 135 mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present #1 Silicon subtotal #1 Copper #2 Palladium (Pd) subtotal #1 Epoxy resin #2 Polytetrafluoroethylene subtotal #1 Brominated Epoxy Resins #2 Copper #3 Gold #4 Nickel #5 Epoxy resin #6 Silica #7 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst subtotal #1 Tin #2 Lead subtotal CAS Number unit weight (mg) unit weight/package (%) 7440-21-3 17.1737 12.7198 17.1737 12.7198 7440-50-8 0.2064 0.1529 7440-05-3 0.0036 0.0026 0.2100 12.8727 Trade Secret 0.2178 0.1613 9002-84-0 0.1782 0.1320 0.3960 0.2933 Trade Secret 2.6693 1.9771 7440-50-8 5.7401 4.2515 7440-57-5 0.1712 0.1268 7440-02-0 0.7895 0.5847 Trade Secret 15.4669 11.4556 14808-60-7 2.2587 1.6729 65997-17-3 9.8560 7.2999 36.9517 27.3684 60676-86-0 57.6681 42.7121 1333-86-4 0.1303 0.0965 Trade Secret 7.0375 5.2123 Trade Secret 0.3258 0.2413 65.1616 48.2622 7440-31-5 9.5274 7.0565 7439-92-1 5.5954 4.1443 15.1228 11.2007 135.0158 100.0000 TOTAL PACKAGE Amount (ppm) 127,198 127,198 1,529 26 1,555 1,613 1,320 2,933 19,771 42,515 1,268 , 5,847 114,556 16,729 72,999 273,684 427,121 965 52,123 2,413 482,622 70,565 41,443 112,007 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12971 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA080 (VBG080) - BKK - CuPd Wire - Non Pb Free Document Number: 002-12971 Rev. ** ECN No. Orig. of Description of Change Change 5269788 AAC Initial Release. Document No. 002-12971 Rev. ** Page 2 of 2