Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VBH 084 (SnPb solder balls) 11.6 x 8.0 mm 0 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present CAS Number unit weight (mg) unit weight/package (%) Amount (ppm) #1 Silicon 7440-21-3 20.3772 14.1826 141,826 subtotal 20 3772 20.3772 14 1826 14.1826 141 826 141,826 #1 Copper 7440-50-8 0.3441 0.2395 2,395 # 2 Palladium 7440-05-3 0.0060 0.0041 41 0.3500 0.2436 2,436 subtotal #1 Epoxy resin Trade Secret 0.2241 0.1560 1,560 #2 Polytetrafluoroethylene 9002-84-0 0.1849 0.1287 1,287 0.4090 0.2846 2,846 subtotal #1 Brominated Epoxy Resins Trade Secret 2.8149 1.9592 19,592 #2 Copper 7440-50-8 8.9801 6.2502 62,502 #3 Gold 7440-57-5 0.1934 0.1346 1,346 #4 Nickel 7440-02-0 0.8920 0.6208 6,208 #5 Epoxy resin Trade Secret 15.9649 11.1117 111,117 #6 Silica 14808-60-7 2.3819 1.6578 16,578 #7 SiO2 Glass Cloth 65997-17-3 10.3936 7.2340 72,340 41.6208 28.9683 289,683 subtotal #1 Silica (fused) 60676-86-0 55.2850 38.4787 384,787 #2 Carbon Black 1333-86-4 0.1626 0.1132 1,132 #3 Epoxy resin Trade Secret 9.0082 6.2698 62,698 #4 Phosphoric organic catalyst Trade Secret 0.1951 0.1358 1,358 #5 Metal Oxides Trade Secret 0 3902 0.3902 0 2716 0.2716 2 716 2,716 subtotal 65.0412 45.2690 452,690 #1 Tin 7440-31-5 10.0037 6.9626 69,626 #2 Lead 7439-92-1 5.8752 4.0892 40,892 subtotal 15.8789 11.0518 110,518 TOTAL PACKAGE WEIGHT 143.6771 100.0000 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material be accurate to within 20 percent The report does not include materials not intentionally added to our products (impurities) or material concentrations less than 1 ppm. Document No. 002-12976 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA084 (VBH084) - BKK - CuPd Wire - Non Pb Free Document Number: 002-12976 Rev. ** ECN No. Orig. of Description of Change Change 5270096 AAC Initial Release. Document No. 002-12976 Rev. ** Page 2 of 2