56 – BGA ( 5 x 5 mm ) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 BZ B1: 52.9920 mg B2: 51.9780 mg B1: 42.9499 mg B2: 41.7903 mg Body Size (mil/mm) Package Weight – Site 2 5.0 x 5.0 mm 64.8099 mg SUMMARY The 56- BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 050202, 120301, 120612 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ56ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 1 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Silica Oxide 60676-86-0 1.2704 % weight of substance per Homogenou s material 10.9900 Acrylic 29690-82-2 1.1595 10.0300 21,880 2.1880 Epoxy 68541-56-0 0.9294 8.0400 17,539 1.7539 Bisphenol Triazol Cu Ni Au Br Sn Ag Cu Silica Fused Diester Epoxy Resin Functionalized Esters Polymeric Resin Si Au Silica Fused Epoxy Resin Phenolic Resin 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7440-22-4 7440-50-8 60676860 Trade Secret Trade Secret Trade Secret 1.7305 2.0195 4.2102 0.1699 0.0601 0.0104 5.6100 0.2301 0.0299 4.1804 2.1296 0.4197 0.7699 14.9700 17.4700 36.4200 1.4700 0.5200 0.0900 95.5700 3.9200 0.5100 54.0800 27.5500 5.4300 9.9600 32,656 38,110 79,449 3,207 1,134 196 105,864 4,342 565 78,887 40,187 7,921 14,529 3.2656 3.8110 7.9449 0.3207 0.1134 0.0196 10.5864 0.4342 0.0565 7.8887 4.0187 0.7921 1.4529 Trade Secret 7440-21-3 7440-57-5 60676860 Trade Secret Trade Secret 0.2304 4.7200 1.9000 18.8705 1.1708 1.1708 2.9800 100.0000 100.0000 88.9700 5.5200 5.5200 4,347 89,070 35,854 356,101 22,094 22,094 0.4347 8.9070 3.5854 35.6101 2.2094 2.2094 Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Package Weight (mg): Weight by mg 52.9920 PPM % weight of substance per package 23,974 2.3974 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 2 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material 1.2704 % weight of substance per Homogenous material 10.9900% 24,441 % weight of substance per package 2.4441% 29690-82-2 1.1595 10.0300% 22,308 2.2308% Epoxy 68541-56-0 0.9294 8.0400% 17,881 1.7881% Bisphenol Triazol Cu Ni Au Br Sn Ag Cu Silica Fused Bismaleimide monomer Epoxy Resin Acrylate monomer Acrylic Resin Si Cu Pd Silica Fused Epoxy Resin Carbon black Phenolic Resin 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7440-22-4 7440-50-8 60676860 1.7305 2.0195 4.2102 0.1699 0.0601 0.0104 5.6100 0.2301 0.0299 4.1804 14.9700% 17.4700% 36.4200% 1.4700% 0.5200% 0.0900% 95.5700% 3.9200% 0.5100% 54.0800% 33,293 38,853 81,000 3,269 1,156 200 107,930 4,427 575 80,426 3.3293% 3.8853% 8.1000% 0.3269% 0.1156% 0.0200% 10.7930% 0.4427% 0.0575% 8.0426% Trade Secret 2.1296 27.5500% 40,971 4.0971% Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676860 Trade Secret 1333-86-4 Trade Secret 0.4197 0.7699 0.2304 4.7200 0.8643 0.0217 18.8703 0.9209 0.0758 1.3451 5.4300% 9.9600% 2.9800% 100.0000% 97.5543% 2.4457% 88.9600% 4.3414% 0.3572% 6.3414% 8,075 14,812 4,433 90,808 16,628 417 363,044 17,717 1,458 25,878 0.8075% 1.4812% 0.4433% 9.0808% 1.6628% 0.0417% 36.3044% 1.7717% 0.1458% 2.5878% % Total: 100.0000 Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg Silica Oxide 60676-86-0 Acrylic Package Weight (mg): 51.9780 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 3 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 4 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package ASSEMBLY Site 2: PT UNISEM Batam Package Qualification Report #s 063803 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ56-PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 5 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substrate Purpose of Use Base Material Au, metal & alloy 7440-57-5 0.3986 1.7700 6,150 % weight of substan ce per package 0.6150 Ni, metal & alloy 7440-02-0 2.0989 9.3200 32,385 3.2385 Cu, metal & alloy 7440-50-8 3.9455 17.5200 60,878 6.0878 Cured Resin Phthalocyanine Blue Organic Pigment Barium Sulfate Talc Silica Aromatic Carbonyl Compound Amine Compound Additive (Trade Secret) Continuous Filament Fiber Glass Copper Inorganic Filler Trade Secret 174-14-8 4118-16-5 7727-43-7 14807-96-06 1.7385 0.0225 0.0090 0.0090 0.0045 1.0990 0.0225 0.0113 0.0203 1.3197 7.7200 0.1000 0.0400 0.0400 0.0200 4.8800 0.1000 0.0500 0.0900 5.8600 26,825 347 139 139 69 16,957 347 174 313 20,362 2.6825 0.0347 0.0139 0.0139 0.0069 1.6957 0.0347 0.0174 0.0313 2.0362 6.2673 0.4999 27.8300 2.2200 96,703 7,714 9.6703 0.7714 2.5267 11.2200 38,987 3.8987 2.5267 22.1625 0.2250 0.1125 3.8570 0.2755 0.5510 0.2755 0.5510 3.8000 0.9600 9.0440 0.1904 0.0476 0.0952 0.0952 0.0476 11.2200 98.5000 1.0000 0.5000 70.0000 5.0000 10.0000 5.0000 10.0000 100.0000 100.0000 95.0000 2.0000 0.5000 1.0000 1.0000 0.5000 38,987 341,961 3,472 1,736 59,512 4,251 8,502 4,251 8,502 58,633 14,813 139,546 2,938 734 1,469 1,469 734 3.8987 34.1961 0.3472 0.1736 5.9512 0.4251 0.8502 0.4251 0.8502 5.8633 1.4813 13.9546 0.2938 0.0734 0.1469 0.1469 0.0734 Substance Composition Bismaleimide / Triazine Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Epoxy Resin Sn Ag Cu Ag Epoxy Resin Diester Polymeric Resin Functionalized Ester Si Au Fused Silica Epoxy Resin Phenol Resin Phenol Novolac Metal Hydroxide Carbon Black CAS Number Trade Secret Trade Secret Trade Secret Trade Secret 65997-17-3 7440-50-8 24623-77-6 / 21645-51-2 / 61583-60-6 / 60676-86-0 105391-33-1 / 25722-66-1 9003-36-5 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 9003-35-4 Trade Secret 1333-86-4 Package Weight (mg): Weight by mg % weight of substance per Homogenous material 64.8099 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 6 of 12 100.000 56 – BGA ( 5 x 5 mm ) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 7 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package ASSEMBLY Site 3: Cypress Manufacturing Limited (CML) Package Qualification Report # 042801, 120610 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BZ56-CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 8 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cured Resin Glass Fabrics Copper Foil Diethylene Glycol Monoethyl Acetate Acetophenone Crystalline Silica Crystalline Solvent Naptha Sn Ag Cu Silver Bismaleimide Resin Synthetic Resin Additive Silicon Gold Silica Epoxy resin Phenol Resin Carbon Black Pigment CAS Number Trade Secret Trade Secret 7440-50-8 3.2060 2.5190 3.4350 % weight of substance per Homogenous material 28.0000 22.0000 30.0000 0.5725 Weight by mg PPM % weight of substance per package 74,646 58,650 79,977 7.4646 5.8650 7.9977 5.0000 13,329 1.3329 0.5725 0.5725 0.5725 0.2808 0.0029 0.0014 0.3210 5.0000 5.0000 5.0000 98.5000 1.0000 0.5000 75.0000 13,329 13,329 13,329 6,538 68 33 7,474 1.3329 1.3329 1.3329 0.6538 0.0068 0.0033 0.7474 0.0749 0.0214 0.0107 21.4000 2.1728 6.3483 0.4689 0.3607 17.5000 5.0000 2.5000 100.0000 100.0000 88.0000 6.5000 5.0000 1,744 498 249 498,255 50,589 147,807 10,917 8,398 0.1744 0.0498 0.0249 49.8255 5.0589 14.7807 1.0917 0.8398 0.0361 0.5000 841 0.0841 Trade Secret Trade Secret 14808-60-7 Trade Secret 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 93705-66-9 106466-55-1 1333-86-4 Package Weight (mg): 42.9499 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 9 of 12 100.0000 56 – BGA ( 5 x 5 mm ) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cured Resin Glass Fabrics Copper Foil Diethylene Glycol Monoethyl Acetate Acetophenone Crystalline Silica Crystalline Solvent Naptha Sn Ag Cu Silver Bismaleimide Resin Synthetic Resin Additive Silicon Cu Pd Silica Epoxy resin Phenol Resin Melamine Cyanurate Carbon Black Pigment Trade Secret Trade Secret 7440-50-8 3.2060 2.5190 3.4350 % weight of substance per Homogenous material 28.0000% 22.0000% 30.0000% Trade Secret 0.5725 Trade Secret 14808-60-7 Trade Secret 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 CAS Number Weight by mg Package Weight (mg): % weight of substance per package PPM 76,716 60,277 82,196 7.6716% 6.0277% 8.2196% 5.0000% 13,699 1.3699% 0.5725 5.0000% 13,699 1.3699% 0.5725 0.5725 0.2808 0.0029 0.0014 0.3210 0.0749 0.0214 0.0107 21.4000 1.0030 0.0102 6.2040 0.4689 0.2164 0.2886 0.0361 5.0000% 5.0000% 98.5000% 1.0000% 0.5000% 75.0000% 17.5000% 5.0000% 2.5000% 100.0000% 98.9948% 1.0052% 86.0000% 6.5000% 3.0000% 4.0000% 0.5000% 13,699 13,699 6,719 69 34 7,681 1,792 512 256 512,081 24,001 244 148,456 11,222 5,179 6,906 863 1.3699% 1.3699% 0.6719% 0.0069% 0.0034% 0.7681% 0.1792% 0.0512% 0.0256% 51.2081% 2.4001% 0.0244% 14.8456% 1.1222% 0.5179% 0.6906% 0.0863% 41.7903 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 10 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package Document History Page Document Title: Document Number: Rev. 56-BGA 5X5MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04908 ** *A ECN No. Orig. of Change 398232 GFJ 472024 MRB *B 680400 *C 2617585 MAHA *D DCON 2833303 MAHA *E 3375131 HLR *F 3607118 UDR *G 3884168 HLR VFR Description of Change New document Changed Package Qualification Report # 033105 to 050202 in reference to spec # 49-10001 Rev. AO Changed Cypress Logo. Added PMDD for site 2 (AIT) with SnAgCu ball finish Changed/added the following for assembly site 1: Changed CAS number of Au. Added CAS number of Br. Changed CAS number of Ag. Changed Polymetric to Polymeric. Revised PPM format. Added % weight of substance per homogeneous material. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table. Replaced CML (obsolete bookset) with WEB in distribution Deleted the % signs from the CAS numbers of Barium Sulfate, Talc, Copper, and Fused Silica on the substrate and mold compound of assembly site 2. Corrected the CAS number of Ag on the solder ball of assembly site 2.Recalculated the PPM and % weight of substance per package of assembly site 2. Added Assembly Site 3 – CML. Removed material name of Substrate for Assembly Site 2. Updated the material composition table to reflect 4 decimal places on values. Changed Assembly Site 3 from R to RA. Added B2 for Site 1 – ASEKH (G) Copper wire qualification. Reference QTP # 120301 and 120612. Added B2 for Site 3 – Autoline (CML-RA) Copper wire qualification. Reference QTP # 120610. Added CAS Number of Copper Foil and Silica Crystalline on Assembly Site 3. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 11 of 12 56 – BGA ( 5 x 5 mm ) Pb-Free Package Rev. *H ECN No. Orig. of Change 4032205 YUM *I 4090119 YUM *J 5142476 HLR DCON Description of Change Added assembly site name in the Assembly heading in site 1, 2 and 3. Changed assembly code to assembly site name in site 1, 2 and 3. Removed entire tube row in the indirect materials section. Corrected total package weight in Site 1: B1 from “52.9921 mg” to “52.9920” and assembly site 2 from “64.8100 mg to “64.8099”. Changed the substances with “------------- “to “Trade Secret. Removed “Distribution: WEB” and “Posting: None” from history page Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04908 Rev. *J Page 12 of 12