24L - TSSOP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 ZZ 95.5902 mg Package Weight – Site 3 B1: 93.2201 mg B2: 111.8387 mg Body Size (mil/mm) Package Weight – Site 2 4.4 mm B1: 87.6724 mg B2: 92.5632 mg SUMMARY The 24L-TSSOP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 040807 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZZ24-CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 1 of 9 24L - TSSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au Epoxy resin Phenol resin Brominated epoxy resin Antimony trioxide Silica Others 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 ---------------------- 32.3207 0.8694 0.0500 0.0700 0.1930 0.0035 0.0035 0.1600 0.0180 % weight of substance per Homogenous material 97.0300 2.6100 0.1500 0.2100 96.5200 1.7400 1.7400 80.0000 9.0000 ---------------------- 0.0100 ---------------------------------------------------------------7440-21-3 7440-57-5 129915-35-1 26834-02-6 ---------------------1309-64-4 7631-86-9 ---------------------- CAS Number Package Weight (mg): 338,051 9,056 522 697 1,961 99 32 1,775 200 % weight of Substance per package 33.8118 0.9095 0.0523 0.0732 0.2019 0.0036 0.0036 0.1674 0.0188 5.0000 111 0.0105 0.0040 0.0040 0.0040 2.9700 0.8400 2.8977 2.8977 0.5807 2.0000 2.0000 2.0000 100.0000 100.0000 4.9900 4.9900 1.0000 44 44 44 31,070 8,744 30,377 30,377 6,075 0.0042 0.0042 0.0042 3.1070 0.8788 3.0314 3.0314 0.6075 0.2904 50.8229 0.5807 0.5000 87.5200 1.0000 3,038 531,604 6,075 0.3037 53.1676 0.6075 Weight by mg 95.5902 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 0.5 < 0.5 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 2 of 9 24L - TSSOP Pb-Free Package ASSEMBLY Site 2: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report # 043102 / 120605 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZZ24-OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 3 of 9 24L - TSSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: USING GOLD WIRE Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Si Ni Mg Tin 7440-50-8 7440-21-3 7440-02-0 7439-95-4 7440-31-5 22.9105 0.1744 0.7645 0.0430 1.5000 % weight of substance per Homogenous material 95.9000% 0.7300% 3.2000% 0.1800% 100.0000% Silver Epoxy resin Metal GammaButyrolactone Aromatic hydrocarbons Silicon Gold Epoxy resin Phenol resin( 1 ) Phenol resin( 2 ) Carbon black 7440-22-4 Proprietary Proprietary 96-48-0 0.1633 0.0460 0.0069 0.0069 Proprietary Silica Substance Composition Others 261,436 1,976 8,724 477 17,110 % weight of Substance per package 26.1320% 0.1989% 0.8720% 0.0490% 1.7109% 71.0000% 20.0000% 3.0000% 3.0000% 1,782 502 75 75 0.1863% 0.0525% 0.0079% 0.0079% 0.0069 3.0000% 75 0.0079% 7440-21-3 7440-57-5 Trade secret Trade secret Trade secret 1333-86-4 5.1700 0.8800 2.8000 1.4000 1.4000 0.1120 100.0000% 100.0000% 5.0000% 2.5000% 2.5000% 0.2000% 58,971 10,038 31,938 15,969 15,969 1,278 5.8970% 1.0037% 3.1937% 1.5969% 1.5969% 0.1277% 60676-86-0 49.1680 87.8000% 560,830 56.0815% -------------------- 1.1200 2.0000% 12,775 1.2775% CAS Number Package Weight (mg): Weight by mg 87.6724 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 4 of 9 100.0000 24L - TSSOP Pb-Free Package B2: USING COPPER WIRE Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition 24.7461 0.8478 0.1921 0.0464 0.6624 2.2231 % weight of substance per Homogenous material 93.4000% 3.2000% 0.7250% 0.1750% 2.5000% 100.0000% 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 0.1020 0.0055 0.0083 0.0055 0.0083 0.0069 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 29690-82-2 Trade Secret Trade Secret 1333-86-4 60676-86-0 76361-86-9 14808-60-7 CAS Number Copper Nickel Silicon Magnesium Silver Tin 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-31-5 Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Silicon Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline Package Weight (mg): 267,343 9,159 2,075 501 7,156 24,017 % weight of Substance per package 26.7343% 0.9159% 0.2075% 0.0501% 0.7156% 2.4017% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 5.0000% 1,102 59 90 59 90 75 0.1102% 0.0059% 0.0090% 0.0059% 0.0090% 0.0075% 0.0007 0.0007 2.3558 0.1934 3.0579 3.0579 0.5000% 0.5000% 100.0000% 100.0000% 5.0000% 5.0000% 8 8 25,451 2,089 33,036 33,036 0.0008% 0.0008% 2.5451% 0.2089% 3.3036% 3.3036% 3.0579 3.0579 0.1835 42.4438 6.1158 0.1835 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 33,036 33,036 1,982 458,538 66,072 1,982 3.3036% 3.3036% 0.1982% 45.8538% 6.6072% 0.1982% % Total: 100.0000 Weight by mg 92.5632 PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 0.5 < 0.5 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 5 of 9 24L - TSSOP Pb-Free Package ASSEMBLY Site 3: Amkor Technology Philippines (P1/P2) Package Qualification Report # 032101 / 122204 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZZ24Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 6 of 9 24L - TSSOP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING Au WIRE Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Ni Si Mg Ag Tin 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-31-5 39.7412 1.2409 0.2707 0.0583 0.3290 2.3400 % weight of substance per Homogenous material 95.4400 2.9800 0.6500 0.1400 0.7900 100.0000 Resin Ag Metal Oxide Amine Gamma Butyrolactone Silicon Gold Multi-aromatic Resin SiO2 Filler Proprietary 7440-22-4 Proprietary Proprietary 96-48-0 0.1491 0.4970 0.0213 0.0213 0.0213 7440-21-3 7440-57-5 Proprietary 60676-86-0 Substance Composition CAS Number Package Weight (mg): 426,303 13,302 2,896 644 3,540 25,102 % weight of Substance per package 42.6316 1.3311 0.2903 0.0625 0.3529 2.5102 21.0000 70.0000 3.0000 3.0000 3.0000 1,609 5,364 215 215 215 0.1599 0.5331 0.0228 0.0228 0.0228 2.3800 0.5200 7.3008 100.0000 100.0000 16.0000 25,531 5,578 78,309 2.5531 0.5578 7.8318 38.3292 84.0000 411,178 41.1169 Weight by mg 93.2201 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 7 of 9 100.0000 24L - TSSOP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING Cu WIRE Material Lead frame Lead Finish Die Attach Die Wire Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Mold Compound Encapsulation Copper (Cu) Iron (Fe) Zinc (Zn) Phosphorus (P) Silver (Ag) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 45.4357 1.1190 0.0559 0.0140 0.7361 % weight of substance per Homogenous material 95.9355 2.3627 0.1181 0.0295 1.5542 Tin (Sn) 7440-31-5 2.7249 100.0000 24,366 2.4366 ----------------------------------7440-22-4 ------------------ 0.0176 0.0101 0.1938 0.0101 7.0000 4.0000 77.0000 4.0000 158 90 1,733 90 0.0158 0.0090 0.1733 0.0090 ------------------ 0.0101 4.0000 90 0.0090 ------------------ 0.0101 4.0000 90 0.0090 7440-21-3 7440-50-8 -----------------60676-86-0 -----------------1333-86-4 0.8880 0.1353 5.4430 50.8015 3.9311 0.3024 100.0000 100.0000 9.0000 84.0000 6.5000 0.5000 7,940 1,210 48,668 454,239 35,149 2,704 0.7940 0.1210 4.8668 45.4239 3.5149 0.2704 Package Weight (mg): 111.8387 % Total: 100.0000 Substance Composition Epoxy Resin A Epoxy Resin B Silver (Ag) Lactone Polyoxypropylenedi amine 2,6-Diglycidyl phenyl allyl ether oligomer Silicon Copper (Cu) Epoxy Resin SiO2 Filler Phenol Resin Carbon Black CAS Number Weight by mg % weight of substance per package PPM 406,261 10,005 500 125 6,582 40.6261 1.0005 0.0500 0.0125 0.6582 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 0.5 < 0.5 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 1.0 < 1.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 5.0 < 5.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 8 of 9 24L - TSSOP Pb-Free Package Document History Page Document Title: Document Number: Rev. ECN No. ** *A 24L-TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03033 Description of Change 385324 1504683 Orig. of Change YXP HLR *B 2569067 HLR Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. *C 2767000 MAHA *D *E 2789763 3350819 MAHA HLR *F 3607050 COPI *G 3925886 VFR *H 4032168 YUM *I 4491859 HLR Added data for assembly site 2. Changed CML to WEB in distribution list. Added data for assembly site 3. Changed the values on the material composition table to 4 decimal points. Removed the Tray and End Pin on the Indirect Materials table. Added PMDD for Assembly Site 2-B2 - OSE Taiwan Copper Qualification under QTP # 120605. Added B.2 for Site 3: Amkor-M Copper wire qualification, reference QTP # 122204. Added Assembly site name in the Assembly heading in site 1, 2 and 3. Changed Assembly code to Assembly site name in site 1, 2 and 3. Changed the atomic symbol of Zinc from “Z” to “Zn”. Corrected the package weight of assembly site 1 from 95.5900mg to 95.5902mg and assembly site 3.B1 material composition from 93.2200mg to 93.2201mg. New document. Updated Cypress Logo. Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition for Assembly Site 1. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table for Assembly Site 1. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03033 Rev. *I Page 9 of 9