28L - SSOP Pb- Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 SP B1: 236.0585 mg B2: 243.5388 mg B3: 243.2456 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 3 B1: 228.4105 mg B2: 224.2700 mg Package Weight – Site 4 209 mil B1: 223.9939 mg B2: 223.1139 mg B3: 228.6370 mg B4: 228.8000 mg 237.1707 SUMMARY The 28L-SSOP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the requirements of Directive 2002/95/EC (RoHS). ASSEMBLY Site 1: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report #s 030604/042702/111402/120410 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP28OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 1 of 17 28L - SSOP Pb- Free Package B1. MATERIAL COMPOSITION (Note 3) Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 43.3957 % weight of substance per Homogenous material 99.9900 183,834 18.3804 0.0043 0.0100 18 0.0184 3.5000 100.0000 14,827 1.4824 Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret 0.0705 0.0235 0.3760 14.5185 0.9599 4.3303 4.3303 4.3303 15.0000 5.0000 80.0000 100.0000 100.0000 2.5000 2.5000 2.5000 299 100 1,593 61,504 4,066 18,344 18,344 18,344 0.0299 0.0100 0.1593 6.1494 0.4066 1.8341 1.8341 1.8341 Trade Secret 1.7321 1.0000 7,338 0.7336 7631-86-9 1333-86-4 Trade Secret 156.4086 0.3464 1.7321 90.3000 0.2000 1.0000 662,584 1,468 7,338 66.2475 0.1467 0.7336 Package Weight (mg): 236.0585 % Total: 100.0000 Substance Composition CAS Number Copper 7440-50-8 Silver 7440-22-4 Tin 7440-31-5 Epoxy Resin Metal Silver Si Au Epoxy Resin1 Epoxy Resin2 Phenol Resin Aromatic Phosphate Silica Carbon Black Others Weight by mg % weight of substance per package PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 2 of 17 28L - SSOP Pb- Free Package B2. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Copper Fe P Zn Pb Ag 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 7440-22-4 63.7781 1.5547 0.0546 0.0827 0.0066 0.6814 96.4025% 2.3500% 0.0825% 0.1250% 0.0100% 1.0300% 261,880 6,384 224 340 27 2,798 % weight of substance per package 26.1880% 0.6384% 0.0224% 0.0340% 0.0027% 0.2798% Tin 7440-31-5 4.7828 100.0000% 19,639 1.9639% Silver Flake Epoxy Acrylate Substituted Polyamine Bisphenol F 2-Ethylhexyl Glycidyl Ether Si Au Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused Silica Fused Silica,crystalline 7440-22-4 15625-89-5 0.6173 0.0586 79.0000% 7.5000% 2,535 241 0.2535% 0.0241% 68490-66-4 0.0078 1.0000% 32 0.0032% 28064-14-4 0.0586 7.5000% 241 0.0241% 2461-15-6 0.0391 5.0000% 160 0.0160% 13.6551 0.5494 7.8806 100.0000% 100.0000% 5.0000% 56,070 2,256 32,359 5.6070% 0.2256% 3.2359% 7.8806 5.0000% 32,359 3.2359% 7.8806 7.8806 0.4728 109.3827 15.7612 0.4728 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 32,359 32,359 1,942 449,139 64,717 1,942 3.2359% 3.2359% 0.1942% 44.9139% 6.4717% 0.1942% % Total: 100.0000 Substance Composition CAS Number 7440-21-3 7440-57-5 Trade Secret 29690-82-2 Trade Secret Trade Secret 1333-86-4 60676-86-0 76361-86-9 14808-60-7 Package Weight (mg): Weight by mg % weight of substance per Homogenous material 243.5388 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 3 of 17 28L - SSOP Pb- Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE AND PURE SN FINISH Material Leadframe Lead Finish Die Attach Die Wire Mold Compound Copper Fe P Zn Pb Ag 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 7440-22-4 63.7781 1.5547 0.0546 0.0827 0.0066 0.6814 96.4025% 2.3500% 0.0825% 0.1250% 0.0100% 1.0300% 262,196 6,391 224 340 27 2,801 % weight of substance per package 26.2196% 0.6391% 0.0224% 0.0340% 0.0027% 0.2801% Tin 7440-31-5 4.7828 100.0000% 19,662 1.9662% Ag Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Cu Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused Silica Fused Silica,crystalline 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 0.5782 0.0313 0.0469 0.0313 0.0469 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 2,377 128 193 128 193 0.2377% 0.0128% 0.0193% 0.0128% 0.0193% Trade Secret 0.0391 5.0000% 161 0.0161% 461-58-5 0.0039 0.5000% 16 0.0016% Trade Secret 0.0039 0.5000% 16 0.0016% 7440-21-3 7440-50-8 Trade Secret 13.6551 0.2562 7.8806 100.0000% 100.0000% 5.0000% 56,137 1,053 32,398 5.6137% 0.1053% 3.2398% 7.8806 5.0000% 32,398 3.2398% 7.8806 7.8806 0.4728 109.3827 15.7612 0.4728 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 32,398 32,398 1,944 449,682 64,795 1,944 3.2398% 3.2398% 0.1944% 44.9682% 6.4795% 0.1944% % Total: 100.0000 Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material 29690-82-2 Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 Package Weight (mg): 243.2456 PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube HIC Others Material Cover tape Carrier tape End Pin End Plug Humidity Indicator Shielding bag Lead PPM Cadmium PPM Cr VI PPM Mercury PPM <2.0 <2.0 <2.0 <2.0 <10.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 5.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 4.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 1.0 <2.0 PBB PPM PBDE PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-ENDP-R CoA-EPLG-R CoA-HIC-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 4 of 17 28L - SSOP Pb- Free Package ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report #s 063711, 121405, 131804, 144202 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP28CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 5 of 17 28L - SSOP Pb- Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu 7440-50-8 59.8476 % weight of substance per Homogenous material 97.4400 Fe 7439-89-6 1.4679 P 7723-14-0 Zn Ni Pd Au Ag Proprietary Bismeleide Propreitary Polymer Methacrylate Acrylate Ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by mg % weight of substance per package PPM 267,184 26.7184 2.3900 6,553 0.6553 0.0369 0.0600 165 0.0165 0.0614 0.6081 0.0110 0.0110 0.6500 0.1000 96.5200 1.7400 1.7400 81.2500 274 2,715 49 49 2,902 0.0274 0.2715 0.0049 0.0049 0.2902 Trade Secret 0.0600 7.5000 268 0.0268 Trade Secret 0.0300 3.7500 134 0.0134 Trade Secret Trade Secret 0.0200 0.0200 2.5000 2.5000 89 89 0.0089 0.0089 Trade Secret 0.0200 2.5000 89 0.0089 7440-21-3 7440-57-5 Trade Secret Proprietary Proprietary 10.2300 1.6400 132.8592 7.4640 8.9568 100.0000 100.0000 89.0000 5.0000 6.0000 45,671 7,322 593,138 33,322 39,987 4.5671 0.7322 59.3138 3.3322 3.9987 Package Weight (mg): 223.9939 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 6 of 17 28L - SSOP Pb- Free Package B2. MATERIAL COMPOSITION (Note 3) Using Cu Wire Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Weight by mg CAS Number Cu 7440-50-8 59.8476 Fe 7439-89-6 1.4679 P 7723-14-0 Zn Ni Pd Au Ag Proprietary Bismeleide Propreitary Polymer Methacrylate Acrylate Ester Organic Peroxide Si Cu SiO2 Phenol Resin Epoxy Resin 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 % weight of substance per Homogenous material 97.4498% % weight of substance per package PPM 268,238 26.8238% 2.3902% 6,579 0.6579% 0.0369 0.0601% 165 0.0165% 0.0614 0.6081 0.0110 0.0110 0.6500 0.1000% 96.5085% 1.7458% 1.7458% 81.2500% 275 2,726 49 49 2,913 0.0275% 0.2726% 0.0049% 0.0049% 0.2913% Trade Secret 0.0600 7.5000% 269 0.0269% Trade Secret 0.0300 3.7500% 134 0.0134% Trade Secret Trade Secret 0.0200 0.0200 2.5000% 2.5000% 90 90 0.0090% 0.0090% Trade Secret 0.0200 2.5000% 90 0.0090% 7440-21-3 7440-50-8 Trade Secret Proprietary Proprietary 10.2300 0.7600 132.8592 7.4640 8.9568 100.0000% 100.0000% 0.8900 0.0500 0.0600 45,851 3,406 595,477 33,454 40,145 4.5851% 0.3406% 59.5477% 3.3454% 4.0145% Package Weight (mg): 223.1139 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 7 of 17 28L - SSOP Pb- Free Package B3. MATERIAL COMPOSITION (Note 3) Using CuPd Wire Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary Bismeleide Propreitary Polymer Methacrylate Acrylate Ester Organic Peroxide Si Cu Pd SiO2 Phenol Resin Epoxy Resin 59.8486 1.5689 0.0379 0.0634 0.6089 0.0128 0.0111 0.8500 % weight of substance per Homogenous material 97.2851% 2.5503% 0.0616% 0.1031% 96.2231% 2.0228% 1.7541% 82.5243% 261,763 6,862 166 277 2,663 56 49 3,718 26.1763% 0.6862% 0.0166% 0.0277% 0.2663% 0.0056% 0.0049% 0.3718% Trade Secret 0.0700 6.7961% 306 0.0306% Trade Secret 0.0400 3.8835% 175 0.0175% Trade Secret Trade Secret 0.0300 0.0200 2.9126% 1.9417% 131 87 0.0131% 0.0087% Trade Secret 0.0200 1.9417% 87 0.0087% 7440-21-3 7440-50-8 7440-05-3 Trade Secret Proprietary Proprietary 13.5300 0.9400 0.0200 133.9896 7.9890 8.9868 100.0000% 97.9167% 2.0833% 88.7552% 5.2919% 5.9529% 59,177 4,111 87 586,037 34,942 39,306 5.9177% 0.4111% 0.0087% 58.6037% 3.4942% 3.9306% % Total: 100.0000 CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Package Weight (mg): Weight by mg 228.6370 % weight of substance per package PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 8 of 17 28L - SSOP Pb- Free Package B4. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Leadframe *** Lead Finish Die Attach Weight by mg % weight of substance per Homogenous material PPM % weight of substance per package 7440-50-8 59.8476 97.4498% 261,572 26.1572 Fe 7439-89-6 1.4679 2.3902% 6,416 0.6416 P 7723-14-0 0.0369 0.0161 Zn Ni Pd Au Ag Ag Proprietary Bismeleide Propreitary Polymer Methacrylate Acrylate Ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 0.0614 0.5041 0.0110 0.0110 0.1040 0.9280 0.0601% 0.1000% 80.0032% 1.7458% 1.7458% 16.5053% 78.7776% 161 268 2,203 48 48 454 4,056 0.0268 0.2203 0.0048 0.0048 0.0454 0.4056 Trade Secret 0.0910 398 0.0398 Trade Secret 0.0630 275 0.0275 Trade Secret Trade Secret 0.0320 0.0320 140 140 0.0140 0.0140 Trade Secret 0.0320 140 0.0140 7440-21-3 7440-57-5 Trade Secret Proprietary Proprietary 15.8800 1.9560 131.9214 7.1645 8.6562 69,406 8,549 576,580 31,313 37,833 6.9406 0.8549 57.6580 3.1313 3.7833 Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Package Weight (mg): 7.7250% 5.3480% 2.7165% 2.7165% 2.7165% 100.0000% 100.0000% 89.2917% 4.8493% 5.8590% % Total: 228.8000 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube HIC Others Material Cover tape Carrier tape End Pin End Plug Humidity Indicator Shielding bag Lead PPM <2.0 <2.0 <2.0 <2.0 <10.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 <2.0 < 5.0 <2.0 Cr VI PPM <2.0 <2.0 <2.0 <2.0 < 4.0 <2.0 Mercury PPM <2.0 <2.0 <2.0 <2.0 < 1.0 <2.0 PBB PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 PBDE PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-ENDP-R CoA-EPLG-R CoA-HIC-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 9 of 17 28L - SSOP Pb- Free Package ASSEMBLY Site 3: Amkor Technology Philippines (P1/P2) Package Qualification Report # 054603/072108, 040606, 063503 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP28Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 10 of 17 28L - SSOP Pb- Free Package B1. MATERIAL COMPOSITION (Note 3) Using NiPdAu Lead Finish Material Purpose of Use Base Material Leadframe Frame Plating Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu 7440-50-8 63.3165 % weight of substance per Homogenous material 97.5000 Fe 7439-89-6 1.5261 2.3500 P 7723-14-0 0.0195 Zn Ni Pd Au Ni Pd Au Ag Resin Metal Oxide Amine Gamma Butyroclatone Si Au Ca Be SiO2 Resin Carbon Black Epoxy Cresol Novolac Phenol Resin 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret 0.0779 1.2277 0.0262 0.0060 0.4947 0.0122 0.0031 1.2810 0.3843 0.0549 0.0549 Trade Secret Weight by mg % weight of substance per package PPM 277,205 27.7205 6,681 0.6681 0.0300 85 0.0085 0.1200 97.4400 2.0800 0.4800 97.0000 2.4000 0.6000 70.0000 21.0000 3.0000 3.0000 341 5,375 115 26 2,166 54 13 5,608 1,682 240 240 0.0341 0.5375 0.0115 0.0026 0.2166 0.0054 0.0013 0.5608 0.1682 0.0240 0.0240 0.0549 3.0000 240 0.0240 7440-21-3 7440-57-5 7440-70-2 7440-41-7 60676-86-0 Trade Secret Trade Secret 9.8200 0.5799 0.0003 0.0003 128.5442 11.2103 0.7474 100.0000 99.9900 0.0500 0.0500 86.0000 7.5000 0.5000 42,993 2,539 1 1 562,777 49,079 3,272 4.2993 0.2539 0.0001 0.0001 56.2777 4.9079 0.3272 Trade Secret 2.9894 2.0000 13,088 1.3088 Trade Secret 5.9788 4.0000 26,176 2.6176 Package Weight (mg): 228.4105 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 11 of 17 28L - SSOP Pb- Free Package B2. MATERIAL COMPOSITION (Note3) Using Pure Sn Lead Finish Material Lead frame Lead Finish Die Attach Die Wire Mold Compound Purpose of Use Base Material Frame Plating External Plating Adhesive Circuit Interconnect Encapsulation 57.3203 % weight of substance per Homogenous material 97.5000 255,586 25.5586 7439-89-6 1.3816 2.3500 6,160 0.6160 7723-14-0 0.0176 0.0300 79 0.0079 Zn Ag 7440-66-6 7440-22-4 0.0705 0.8100 0.1200 100.0000 315 3,612 0.0315 0.3612 Sn 7440-31-5 3.7200 100.0000 16,587 1.6587 Resin Ag Metal Oxide Amine Gamma Butyrolactone Silicon Au Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin Trade Secret 7440-22-4 Trade Secret Trade Secret 0.0609 0.2030 0.0087 0.0087 21.0000 70.0000 3.0000 3.0000 272 905 39 39 0.0272 0.0905 0.0039 0.0039 Trade Secret 0.0087 3.0000 39 0.0039 7440-21-3 7440-57-5 0.6400 0.6700 100.0000 100.0000 2,854 2,987 0.2854 0.2987 11.9513 7.5000 53,290 5.3290 60676-86-0 1333-86-4 137.0410 0.7968 86.0000 0.5000 611,054 3,553 61.1054 0.3553 29690-82-2 3.1870 2.0000 14,211 1.4211 Trade Secret 6.3740 4.0000 28,421 2.8421 Package Weight (mg): 224.2700 % Total: 100.0000 Substance Composition CAS Number Cu 7440-50-8 Fe P Trade Secret Weight by mg % weight of substance per package PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube HIC Others Material Cover tape Carrier tape End Pin End Plug Humidity Indicator Shielding bag Lead PPM Cadmium PPM Cr VI PPM Mercury PPM <2.0 <2.0 <2.0 <2.0 <10.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 5.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 4.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 1.0 <2.0 PBB PPM PBDE PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-ENDP-R CoA-EPLG-R CoA-HIC-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 12 of 17 28L - SSOP Pb- Free Package ASSEMBLY Site 4: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 133002 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP28JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 13 of 17 28L - SSOP Pb- Free Package B1. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Purpose of Use Base Material External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper 7440-50-8 Iron 7439-89-6 Lead 7439-92-1 Phosphorus Zinc Silver 7723-14-0 7440-66-6 7440-22-4 Sn 7440-31-5 Acrylic resin Polybutadiene derivative Butadiene copolymer Acrylate Epoxy resin Peroxide Additive Silver Si Cu Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica(Amorpho us) A Silica(Amorpho us) B Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-50-8 7440-05-3 Trade secret 29690-82-2 Trade secret 1333-86-4 60676-86-0 7631-86-9 Package Weight (mg): Weight by mg % weight of substance per Homogenous material % weight of substance per package PPM 97.0990 294,776 29.4776 1.6560 2.3000 6,982 0.6982 0.0007 0.0720 0.0576 0.3024 0.0010 0.1000 0.0800 0.4200 3 0.0003 304 243 1,275 0.0304 0.0243 0.1275 3.2000 0.0480 100.0000 8.0000 13,492 202 1.3492 0.0202 0.0300 5.0000 126 0.0126 0.0060 0.0240 0.0120 0.0030 0.0090 0.4680 4.4700 0.4920 0.0080 12.5120 1.5640 6.2560 1.5640 1.0000 4.0000 2.0000 0.5000 1.5000 78.0000 100.0000 98.4000 1.6000 8.0000 1.0000 4.0000 1.0000 25 0.0025 101 51 13 38 1,973 18,847 2,074 34 52,755 6,594 26,378 6,594 0.0101 0.0051 0.0013 0.0038 0.1973 1.8847 0.2074 0.0034 5.2755 0.6594 2.6378 0.6594 128.2480 82.0000 540,743 54.0743 6.2560 4.0000 26,378 2.6378 % Total: 100.0000 69.9120 237.1707 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 14 of 17 28L - SSOP Pb- Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube HIC Others Material Cover tape Carrier tape End Pin End Plug Humidity Indicator Shielding bag Lead PPM Cadmium PPM Cr VI PPM Mercury PPM <2.0 <2.0 <2.0 <2.0 <10.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 5.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 4.0 <2.0 <2.0 <2.0 <2.0 <2.0 < 1.0 <2.0 PBB PPM PBDE PPM <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 <0.0005 <0.0005 <0.0005 <0.0005 < 100.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-ENDP-R CoA-EPLG-R CoA-HIC-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 15 of 17 28L - SSOP Pb- Free Package Document History Page Document Title: Document Number: Rev. 28L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04103 ** *A ECN No. Orig. of Change 388679 EML 432396 MRB *B 504079 RCF *C 566675 MRB *D 602666 MRB *E 2714243 MAHA *F 2727501 MAHA *G *H *I 3219898 HLR 3364696 NKZ 3044365 HLR *J 3377158 EBZ Description of Change New document Added referencing to the automotive qualification report number 042702 for assembly site 1. Added Assembly site 2 Declaration of Package Units, Banned Substances and Material Composition and update package weight for site 2 (224 mg) 1. Added Assembly site 3 Declaration of Package Units 2. Added on the material composition the percent weight per homogeneous material and weight of substance per package. 3. Added Lead, CrIV, PBB and PBDE on the Declaration of Packaging/Indirect Materials. 4. Updated Cypress logo 5. Added note 4: the package were based on Engineering calculation and performed on a package family basis 1. Updated the declaration of packaging indirect materials. 2. Added on the material composition the percent weight per homogeneous material and weight of substance per package on Assembly site 1 and 2. Corrected the CAS numbers of silver and tin for assembly site 1. DCon: Change from CML to WEB in the distribution list. Added the following for assembly site 3: 1. Package weight for B2 2. Qualification report reference 040606 3. Table B2: Pure Sn lead finish Corrected the total package weight for B1 on Assembly Site 3. Added reference QTP 072108 in Assembly 3. Added reference QTP no. 063503 on Assembly Site 3. Updated the material composition table to reflect 4 decimal places on values. Changed the % composition of Leadfinish for Assembly Site 2. Removed Ag on Bonding Wire for Assembly Site 3 – NiPdAu.Added Declaration of Packaging Materials for Assembly Site 1 and 2. Added package weight B2 for Site 1. Added QTP#111402 for Assembly Site- 1. Added B2: Material Composition table for Site-1. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 16 of 17 28L - SSOP Pb- Free Package Document History Page Document Title: Document Number: Rev. 28L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04103 *K ECN Orig. of No. Change 3619102 COPI *L 3651970 COPI *M 3860998 JARG *N 4005063 AWP *O 4065631 YUM *P *Q 4107143 HLR 5074477 RODP DCON *R 5155355 RODP Description of Change Added PMDD site 4. CML-RA Copper wire qualification under QTP # 121405. Added PMDD B3 for Site 1 – OSE Taiwan Copper wire qualification under QTP # 120410. Changed Package Weight of Site 1:B1 to 4 decimal places on page 1 as indicated on the corresponding material composition table. Added PMDD under Site 4 for CML-RA Copper-Palladium (Cu-Pd) wire qualification under QTP # 131804-B2. Added coding identification: B1 for Cu & B2 for Cu-Pd. Added assembly site name in the assembly heading in site 1, 2 and 3. Changed assembly code to assembly site name in site 1, 2 and 3. Added Assembly Site 4 – JCET. QTP No. 133002 Added PMDD B4 for Site 2: CML Au wire qualification for automotive under QTP # 144202 Removed Distribution: WEB and Posting: None in the document history page. To correct the lead finish of leadframe under B4 for Site 2 by adding Ag plating. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-04103 Rev.*R Page 17 of 17