Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball TNA063 (Pb-free solder balls) 11x9x1.2 mm 205 mg 260°C 3 BKK Product is RoHS Compliant Chemicals Present CAS Number unit weight(mg) #1 Silicon 7440-21-3 44.3453 subtotal 44 3453 44.3453 #1 Gold 7440-57-5 0.5976 0.5976 subtotal #1 Epoxy resin Trade secret 3.7219 #2 Silica (fused) 60676-86-0 0.9305 4.6523 subtotal #1 Aluminum Hydroxide 21645-51-2 13.0244 #2 Copper 7440-50-8 19.1729 #3 Gold 7440-57-5 26.7615 #4 Nickel 7440-02-0 0.6526 #5 Epoxy resin Trade secret 9.8489 #6 SiO2 Glass Cloth 65997-17-3 25.5479 95.0083 subtotal #1 Silica (fused) 60676-86-0 36.0186 #2 Carbon Black 1333-86-4 0.1059 #3 Epoxy resin Trade secret 5.8689 #4 Phosphoric organic catalyst Trade secret 0.1271 # 5 Metal Oxides Trade secret 0.2542 42.3748 subtotal #1 Tin 7440 31 5 7440-31-5 17 3913 17.3913 #2 Silver 7440-22-4 0.5407 #3 Copper 7440-50-8 0.0901 18.0221 subtotal 205.0004 TOTAL PACKAGE unit weight/package (%) Amount (ppm) 21.6318 216,318 21 6318 21.6318 216 318 216,318 0.2915 2,915 0.2915 2,915 1.8155 18,155 0.4539 4,539 2.2694 22,694 6.3534 63,534 9.3526 93,526 13.0543 130,543 0.3183 3,183 4.8043 48,043 12.4624 124,624 46.3454 463,454 17.5700 175,700 0.0517 517 2.8629 28,629 0.0620 620 0.1240 1,240 20.6706 206,706 8 4836 8.4836 84 836 84,836 0.2637 2,637 0.0440 440 8.7912 87,912 100.0000 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm concentrations less than 1 ppm. Document No. 002-12921 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA063 (TNA063) - BKK - Au Wire Document Number: 002-12921 Rev. ** ECN No. Orig. of Description of Change Change 5266717 AAC Initial Release. Document No. 002-12921 Rev. ** Page 2 of 2