Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VDL 044 (Pb-free solder balls) 5.0 x 7.5 mm 94 mg 260°C 3 BKK Product is RoHS Compliant Chemicals Present CAS Number unit weight(mg) #1 Silicon 7440-21-3 6.1435 subtotal 6.1435 #1 Gold 7440-57-5 0.3546 subtotal 0.3546 #1 Epoxy resin Trade Secret 0.3888 #2 Polytetrafluoroethylene 9002-84-0 0.3181 subtotal 0.7069 #1 Aluminum Hydroxide 21645-51-2 2.2425 #2 Copper 7440-50-8 5.5440 #3 Gold 7440-57-5 0.0543 #4 Nickel 7440-02-0 0.3254 #5 Epoxy resin Trade Secret 41.8287 #6 SiO2 Glass Cloth 65997-17-3 4.3988 subtotal 54.3937 #1 Silica (fused) 60676-86-0 24.6783 #2 Carbon Black 1333-86-4 0.0558 #3 Epoxy resin Trade Secret 3.0116 #4 Phosphoric organic catalyst Trade Secret 0.1394 subtotal 27.8851 #1 Tin 7440-31-5 4.4823 #2 Silver 7440-22-4 0.0547 #3 Copper 7440-50-8 0.0228 #4 Nickel 7440-02-0 0.0023 subtotal 4.5622 TOTAL PACKAGE 94.0459 unit weight/package (%) 6.5325 6.5325 0.3770 0.3770 0.4134 0.3383 0.7517 2.3845 5.8950 0.0577 0.3460 44.4769 4.6772 57.8373 26.2407 0.0593 3.2023 0.1483 29.6505 4.7661 0.0582 0.0243 0.0024 4.8510 100.0000 Amount (ppm) 65,325 65,325 3,770 3,770 4,134 3,383 7,517 23,845 58,950 577 3,460 444,769 46,772 578,373 262,407 593 32,023 1,483 296,505 47,661 582 243 24 48,510 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12861 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA044 (VDL044) - BKK - Au Wire Document Number: 002-12861 Rev. ** ECN No. Orig. of Description of Change Change 5260021 AAC NEW RELEASE Document No. 002-12861 Rev. ** Page 2 of 2