Package Chemistry Substances Analysis Table Package Type: Dimension: W i ht off Unit U it Package: P k Weight Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball LAA 080 (SnPb solder balls) 13 x 11 mm 278 mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present #1 Silicon subtotal #1 Gold subtotal #1 Epoxy resin #2 Polytetrafluoroethylene subtotal #1 Brominated Epoxy Resins #2 Copper #3 Gold #4 Nickel #5 Epoxy resin E i #6 Silica #7 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst subtotal #1 Tin #2 Lead subtotal CAS Number unit weight (mg) 7440-21-3 16.3583 16.3583 7440-57-5 0.7736 0.7736 Trade Secret 0.2004 9002-84-0 0.1639 0.3643 Trade Secret 5.9150 7440-50-8 14.8512 7440-57-5 0.2258 7440-02-0 1.0413 Trade 31.6771 T d Secret S t 31 6771 14808-60-7 5.0050 65997-17-3 21.8400 80.5554 60676-86-0 92.2313 1333-86-4 0.2084 Trade Secret 11.2553 Trade Secret 0.5211 104.2162 7440-31-5 7440 31 5 47 9979 47.9979 7439-92-1 28.1892 76.1871 TOTAL PACKAGE 278.4549 unit weight/package (%) 5.8747 5.8747 0.2778 0.2778 0.0720 0.0589 0.1308 2.1242 5.3334 0.0811 0.3740 11.3760 11 3760 1.7974 7.8433 28.9294 33.1225 0.0749 4.0421 0.1871 37.4266 17 2372 17.2372 10.1234 27.3606 100.0000 Amount (ppm) 58,747 , 58,747 2,778 2,778 720 589 1,308 21,242 53,334 811 3,740 113,760 113 760 17,974 78,433 289,294 331,225 749 40,421 1,871 374,266 172 372 172,372 101,234 273,606 1,000,000 In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12967 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA080 (LAA080) - BKK - Au Wire - Non Pb Free Document Number: 002-12967 Rev. ** ECN No. Orig. of Description of Change Change 5269733 AAC Initial Release. Document No. 002-12967 Rev. ** Page 2 of 2