Package Chemistry Substances Analysis Table VBG 080 (Pb-free solder spheres) 11 x 8 x 1 mm 134 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball Chemicals Present CAS Number unit weight (mg) unit weight/package (%) Amount (ppm) #1 Silicon 7440-21-3 17.1737 12.8615 128,615 subtotal 17 1737 17.1737 12 8615 12.8615 128 615 128,615 #1 Gold 7440-57-5 0.6015 0.4505 4,505 subtotal 0.6015 0.4505 4,505 #1 Epoxy resin Trade Secret 0.2178 0.1631 1,631 #2 Polytetrafluoroethylene 9002-84-0 0.1782 0.1335 1,335 0.3960 0.2966 2,966 subtotal #1 Brominated Epoxy Resins Trade Secret 2.6693 1.9991 19,991 #2 Copper 7440-50-8 5.7401 4.2988 42,988 #3 Gold 7440-57-5 0.1712 0.1282 1,282 #4 Nickel 7440-02-0 0.7895 0.5912 5,912 #5 Epoxy resin Trade Secret 15.4669 11.5832 115,832 #6 Silica 14808-60-7 2.2587 1.6915 16,915 #7 SiO2 Glass Cloth 65997-17-3 9.8560 7.3812 73,812 36.9517 27.6733 276,733 subtotal #1 Silica (fused) 60676-86-0 57.6681 43.1879 431,879 #2 Carbon Black 1333-86-4 0.1303 0.0976 976 #3 Epoxy resin Trade Secret 7.0375 5.2704 52,704 #4 Phosphoric organic catalyst Trade Secret 0.3258 0.2440 2,440 65.1616 48.7999 487,999 subtotal #1 Tin 7440 31 5 7440-31-5 12 7802 12.7802 9 5712 9.5712 95 712 95,712 #2 Silver 7440-22-4 0.3973 0.2975 2,975 #3 Copper 7440-50-8 0.0662 0.0496 496 13.2437 9.9183 99,183 subtotal 133.5283 100.0000 1,000,000 TOTAL PACKAGE Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. l l h Document No. 002-12969 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA080 (VBG080) - BKK - Au Wire Document Number: 002-12969 Rev. ** ECN No. Orig. of Description of Change Change 5269758 AAC Initial Release. Document No. 002-12969 Rev. ** Page 2 of 2