Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball LSE 064 (SnPb solder balls) 13 x 11 mm 320 mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present #1 Silicon subtotal #1 Gold subtotal #1 Epoxy resin #2 Polytetrafluoroethylene #3 Silica (fused) subtotal #1 Brominated Epoxy Resins #2 Copper #3 Gold #4 Nickel #5 Epoxy resin #6 Silica #7 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst #5 Metal Oxides subtotal #1 Tin #2 Lead subtotal CAS Number unit weight(mg) 7440-21-3 67.5645 67.5645 7440-57-5 1.1628 1.1628 Trade Secret 4.9774 9002-84-0 1.7464 60676-86-0 0.4061 7.1300 Trade Secret 4.3377 7440-50-8 15.6957 7440-57-5 0.0683 7440-02-0 0.3723 Trade Secret 21 1924 21.1924 14808-60-7 3.6703 65997-17-3 16.0160 61.3527 60676-86-0 103.1462 1333-86-4 0.3034 Trade Secret 16.8068 Trade Secret 0.3640 Trade Secret 0.7281 121.3485 7440-31-5 38.3983 7439-92-1 22.5514 60.9497 TOTAL PACKAGE 319.5081 unit weight/package (%) 21.1464 21.1464 0.3639 0.3639 1.5578 0.5466 0.1271 2.2315 1.3576 4.9125 0.0214 0.1165 6 6328 6.6328 1.1487 5.0127 19.2022 32.2828 0.0949 5.2602 0.1139 0.2279 37.9798 12.0179 7.0582 19.0761 100.0000 Amount (ppm) 211,464 211,464 3,639 3,639 15,578 5,466 1,271 22,315 13,576 49,125 214 1,165 66 328 66,328 11,487 50,127 192,022 322,828 949 52,602 1,139 2,279 379,798 120,179 70,582 190,761 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12949 Rev.** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (LSE064) - BKK - Au Wire - Non Pb Free Document Number: 002-12949 Rev. ** ECN No. Orig. of Description of Change Change 5268420 AAC Initial Release. Document No. 002-12949 Rev.** Page 2 of 2