Q1 - 2005

Product Reliability
Cypress
2005 Q1 RELIABILITY REPORT
TABLE OF CONTENTS
1.0
OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM
2
2.0
EARLY FAILURE RATE
3
3.0
LONG TERM FAILURE RATE
4
4.0
PRESSURE COOKER TEST (PCT)
5
5.0
HIGHLY ACCELERATED STRESS TEST (HAST)
6
6.0
TEMPERATURE CYCLE (TCT)
7
7.0
FAILURE MECHANISM AND CORRECTIVE ACTION
8
APPENDIX A: FAILURE RATE CALCULATION
9
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
13
APPENDIX C: EQUIVALENCE OF STRESS TEST CONDITIONS
15
APPENDIX D: RELIABILITY DATA
16
Note: The results reported herein are for 1st Quarter 2005.
2005 Q1 RELIABILITY REPORT
Page 1 of 50
Product Reliability
Cypress
1.
OVERVIEW OF CYPRESS SEMICONDUCTOR, INC. TOTAL QUALITY
MANAGEMENT SYSTEM
This report summarizes Cypress Semiconductor Product Reliability for the period of the 1sr quarter of 2005. It
includes data from devices fabricated at the Round Rock, Texas; Minnesota and Fab foundry facilities and
packaged-device data from assembly sites at Cypress Philippines and sub-contractors.
Cypress Semiconductor has established aggressive reliability objectives to assure that all products exhibit
reliability, which exceeds customer reliability requirements for purchased components. The quality standard at
Cypress is zero defects resulting in a culture requiring continuous improvement in quality and reliability.
Product reliability is assured by a total quality management system. The quality management system is
described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number
90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review
and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4)
manufacturing identification of "Maverick Lot" yield limits; (5) formal training and certification of manufacturing
personnel; (6) qualification of new products and manufacturing processes; (7) continuous reliability monitoring;
(8) formal failure analysis and corrective action; and (9) competitive benchmarking.
Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress
Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress
Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard
production material. Sample selection is based on generic product families. These generic products are
designed with very similar design rules and manufactured from a core set of processes.
Reliability strategy requires that every failure that occurs during reliability testing be subjected to failure
analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism.
Corrective action is then implemented to prevent future failures, resulting in continuous improvement in product
reliability.
Copies of the Cypress Semiconductor documents referenced herein are available through your Cypress
Semiconductor sales representative. Questions about product reliability may be addressed to the undersigned.
Sabbas Daniel
Director of Reliability
Francis Courreges
Vice-President for Quality
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134-1599
Cypress Quality Fax: (408) 943-2165
2005 Q1 RELIABILITY REPORT
Page 2 of 50
Product Reliability
Cypress
2.
EARLY FAILURE RATE
Early Failure Rate Determination: High Temperature Operating Life testing (HTOL), for as long as 96 hours, is
used to estimate device early failure rate. This stress will typically correspond to the first 2000 hours of device
operation in a system environment. The remainder of the device’s lifetime is characterized with extended LFR
testing (See Section 3)
Test
:
Conditions :
Duration
:
Failure
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal + 15%, 150°C or 125°C.
48 hours HTOL at 150°C or 96 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Table 1. Early Failure Rate Summary
Technology
B53
C8
FL28
P26
POWER 165
PROMOS017
R28
R4
R5
R6
R7
R8
R9
S4
STARM
TSMC 150
TSMC 180
Grand Total
Device Hours
118,521
315,230
9,677
49,920
517,682
368,913
174,336
65,590
428,705
18,912
729,019
1,374,183
1,700,135
432,008
12,774
112,227
39,948
6,467,780
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
Insufficient
17
Insufficient
Insufficient
10
15
31
Insufficient
13
Insufficient
7
4
3
12
Insufficient
Insufficient
Insufficient
1
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample.
2005 Q1 RELIABILITY REPORT
Page 3 of 50
Product Reliability
Cypress
3.
LONG TERM FAILURE RATE
Long Term Failure Rate Determination A High Temperature Operating Life test (HTOL) is used to estimate
long-term reliability. By operating the devices at accelerated temperature and voltage, hundreds of thousands
of use hours can be compressed into hundreds of test hours.
Test
:
Conditions :
Duration
:
Failure
Fit Rate
:
:
High Temperature Operating Life Test (HTOL)
Dynamic Operating Conditions, VCC nominal +15% 150°C or 125°C.
A minimum of 80 hours at 150°C or 168 hours at 125°C
Generally 500 hours at 150°C or 1000 hours at 125°C.
(Refer to Appendix C for derating factor calculation)
A failure is any device that fails to meet data sheet electrical requirements.
Derated to 55° C ambient, with 60% upper confidence bound for 0 failures,
Ea =0.7ev (Refer to Appendix A)
Table 2. Long Term Failure Rate Summary
Technology
B53
C8
FL28
POWER 165
R28
R4
R5
R6
R7
R8
R9
S4
STARM
Grand Total
Device Hours
174,253
438,347
48,387
61,935
352,600
226,948
427,122
72,660
917,726
372,020
1,434,012
417,989
8,129
4,952,129
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FIT Rate
31
12
Insufficient
Insufficient
15
24
13
Insufficient
6
14
4
13
Insufficient
1
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
Notes: Insufficient data – interpret as insufficient accumulated life-time hours to project a 60%
confidence bound for a zero-fails sample
2005 Q1 RELIABILITY REPORT
Page 4 of 50
Product Reliability
Cypress
4.
PRESSURE COOKER TEST (PCT)
The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure environmental
durability of epoxy-packaged parts. Passivation cracks, ionic contamination, and corrosion susceptibility are all
accelerated by this stress.
Test
Conditions
Pre-Conditioning
:
:
:
Failure
:
Pressure Cooker Test (PCT)
15 PSIG, 121°C, No bias, for a minimum of 168 hours.
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture
loading to qualified MSL level
A failure is any device that fails to meet data sheet electrical
requirements.
Table 3. Pressure Cooker Test Failure Rate Summary
Package
TQFP
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (1.27)
PBGA (Cavity/Heatsink)
FBGA (0.75-0.8, Pb-Free)
FVBGA (0.75-0.8, 0.3mm)
FBGA (1.0, Pb-Free)
PBGA (1.27, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
PLCC
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
PQFP
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (Gull Wing, Exposed Pad)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
TSOP/ TSSOP
TSOP I
TSOP (Exposed Pad)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSSOP (Pb-Free)
Grand Total
Sample Size
1,156
43
50
245
817
288
148
56
46
539
49
98
47
140
444
50
100
637
345
50
818
94
195
465
50
50
192
585
50
1,018
50
144
386
50
100
394
9,989
# Failed Defects %
1
0.09
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0.01
Failure Mode
Break at neck
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Note 1 : Corrective actions on section 7.
2005 Q1 RELIABILITY REPORT
Page 5 of 50
1
Product Reliability
Cypress
5.
HIGHLY ACCELERATED STRESS TEST (HAST)
Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This change was
necessary because our package reliability had improved to the point where the old 85°C/85% R.H.
Temperature-humidity-bias testing would not induce failures. Failures are necessary to judge progress and
compare packaging changes. HAST testing has been shown to be at least twenty times more accelerated then
85°C/85% R.H. temperature-humidity-bias testing.
Test:
Conditions:
Highly Accelerated Stress Test (HAST)
Present Conditions: 130°C / 85% RH minimum power dissipation, for a
minimum of 128 hours.
Pre-Conditioning: 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading
to qualified MSL level
Failure:
A failure is any device that fails to meet data sheet electrical requirements.
Table 4. Highly Accelerated Stress Test (HAST) Failure Rate Summary
Package
TQFP
TQFP (10x10)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
FVBGA (0.75-0.8, 0.3mm)
PBGA (1.27, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
PLCC
SSOP
PDIP
PDIP (Pb-Free)
SOIC (GullWing)
SOIC (Gull Wing, Exposed Pad)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
TSOP/ TSSOP
TSOP I
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q1 RELIABILITY REPORT
Sample Size
834
42
95
261
98
196
285
46
140
330
247
50
578
144
149
289
44
50
132
568
50
790
50
395
44
98
191
6,196
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 6 of 50
Product Reliability
Cypress
6.
TEMPERATURE CYCLE TEST (TCT)
Differences in thermal expansion coefficients are accentuated by cycling devices through temperature
extremes. If the materials do not expand and contract equally, large stresses can develop. The Temperature
Cycle test stresses mechanical integrity by exposing a device to alternating temperature extremes. Weakness
and thermal expansion mismatches in die interconnections, die attach, and wire bonds are often detected with
this acceleration test.
Test:
Condition:
Pre-Condition:
Duration:
Failure:
Temperature Cycle
MIL-STD-883D, Method 1010, Condition B, -55°C to 125°C
MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C
(Refer to Appendix C for derating factor calculation)
5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading
to qualified MSL level
300 cycles minimum at Condition C, 1000 cycles minimum at Condition B
A failure is any device that fails to meet data sheet electrical requirements.
Table 5. Temperature Cycling Failure Rate Summary
Package
TSOP
PLCC
TQFP
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
FBGA (1.0)
PBGA (1.27)
PBGA (Cavity/Heatsink)
FBGA (0.75-0.8, Pb-Free)
FVBGA (0.75-0.8, 0.3mm)
FBGA (1.0, Pb-Free)
PBGA (1.27, Pb-Free)
VFBGA (0.75-0.8, Pb-Free)
FLIPCHIP (Build-Up Substrate w/ HS)
PLCC
QFN (Punch Type)
QFN (Punch Type, Pb-Free)
PQFP
SSOP
PDIP
SOIC (GullWing)
SOIC (Gull Wing, Exposed Pad)
SOIC (GullWing, 450 footprint)
SSOP (Pb-Free)
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SOIC (GullWing, Pb-Free)
SOIC (J lead)
SOIC (J lead, Pb-Free)
TSOP/ TSSOP
TSOP I
TSOP (Exposed Pad)
TSOP II
TSOP (Pb-Free)
TSOP II (Pb-Free)
TSSOP (Pb-Free)
Grand Total
2005 Q1 RELIABILITY REPORT
Sample Size
301
277
1,444
44
50
149
1,037
868
145
91
45
798
100
143
93
294
190
495
150
100
901
492
1,310
334
195
477
50
50
195
583
50
1,548
50
243
486
49
147
397
14,371
# Failed
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Defects %
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Failure Mode
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Page 7 of 50
Product Reliability
Cypress
7. FAILURE MECHANISM AND CORRECTIVE ACTION
Failure Mechanism :
Wire Break at neck
PCT failure, TQFP
Solution : Improved delamination controls at Assembly
Neck breaking is the severing of the wire from its ball bond due to a fracture in the neck. Die-to-plastic
delamination resulted in neck breaks, since any movement of the delaminated plastic with respect to the die
would tend to pull away the wires from the die.
Top die delamination was induced by weak adhesion between the die surface and mold compound.
Contaminants on the surface of the die prevent good adhesion with the plastic material and lead to
delamination.
Delamination controls at assembly were installed :
a. N2 purge during die attach cure to prevent contamination as a result of out-gassing
b. Dust control
c. Plasma cleaning before encapsulation
2005 Q1 RELIABILITY REPORT
Page 8 of 50
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION
Thermal Acceleration Factors
Acceleration factors (AF) for thermal stresses (Early Failure Rate, Latent Failure Rate, Data Retention and
High Temperature Storage) are calculated from the Arrhenius equation)
AF = exp Ea
k
1 - 1
Tu Tt
where :
Ea = Activation Energy of the defect mechanism
K = Boltzmann’s constant = 8.62 x 10 –5 eV/Kelvin
Tt is the junction temperature of the device under stress
Tu is the junction temperature of the device at use conditions
While there is no substitute for experimentally determining the activation energy, obtaining this information is
very difficult because few devices fail stress tests. In the absence of experimental data, the following literature
values are used.
Activation
Failure Mechanism
Charge Gain
Energy Ea
(eV)
0.3-0.6
Charge Loss (defects)
0.6
Charge Loss (Ionic contamination, edge bits)
0.9
Charge loss (intrinsic wear out)
0.3-0.6
Electromigration
0.6-1.0
Intermetallic Growth
1.0
Ionic Contamination
1.0-1.4
Silicon Bulk Defects
0.5
Oxide Defects
Unknown/Non-Visual Defect (NVD)
0.3
0.45
2005 Q1 RELIABILITY REPORT
Page 9 of 50
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Temperature-Humidity Acceleration Factors
Cypress estimates acceleration factors for temperature-humidity stresses (Pressure Cooker Test and Highly
Accelerated Stress Test) from a model developed by Hallberg and Peck (“Quality and Reliability Engineering
International”. Vol. 7, 1991).
-3
AF = RHt
RHu
exp Ea
k
1 - 1
T u Tt
where :
Tu = use environment junction temperature (°K)
Tt = test environment junction temperature (°K)
Ea = failure mechanism activation energy (0.9 for corrosion)
o
k = Boltzman’s Constant (8.62 x 10 –5 eV/ Kelvin)
RHu = use environment relative humidity
RHt = test environment relative humidity
AF = acceleration factor
The Hallberg and Peck model requires the stress junction temperature and relative humidity as well as the use
temperature and relative humidity. To estimate the use relative humidity, we assume that the device room
o
o
temperature is 35 C (95 F) and the room relative humidity is 100%. From any Handbook of Chemistry and
o
Physics, the vapor pressure of water VP (water) at 35 C is 41.175 mm Hg. If we assume that the device will
o
o
operate with a junction temperature of 70 C (VP (water) at 70 C is 233.7 mm Hg), the junction relative
humidity (RHj) is
RHj
= 100%
41.175
233.7
= 17.6%
o
The operating conditions of the devices are then 70 C and 17.6% relative humidity.
o
Our Pressure Cooker Test (PCT) submits the devices to a temperature of 121 C and 100% relative humidity.
Using the Hallberg and Peck model, the acceleration factor for the PCT stress can be calculated:
-3
AF =
2005 Q1 RELIABILITY REPORT
17.6
100
exp 0.9
k
1_ - 1_
343 394
= 9, 433
Page 10 of 50
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
The acceleration factor for HAST is calculated similarly, except that junction temperature heating effects must
be included when estimating the relative humidity at the die surface.
Assuming an average junction
o
temperature rise of 5 C, the relative humidity at the die surface during 130 C HAST testing can be calculated.
o
VP (130 C) = 2026.10 mm Hg
o
VP (135 C) = 2347.26 mm Hg
RHj
= 85%
2026.10
2347.26
= 73.4%
-3
AF =
17.6
73.4
exp 0.9
k
1_ - 1_
343 408
= 9,261
o
Similarly, for 140 C HAST testing,
o
VP (140 C) = 2710.92 mm Hg
o
VP (145 C) = 3116.76 mm Hg
RHj
= 85%
2710.92
3116.76
= 73.9%
-3
AF =
2005 Q1 RELIABILITY REPORT
17.6
73.9
exp 0.9
k
1_ - 1_
343 418
= 17,433
Page 11 of 50
Product Reliability
Cypress
APPENDIX A: FAILURE RATE CALCULATION (cont.)
Failure Rate Calculation
For all but LFR test, Cypress reports the failure rate in terms of ppm. Early life reliability is reported in terms of
ppm defective expected during the first year of use under typical use conditions. No upper confidence bound
will be used for this estimate. The ppm defective is the ratio of the number of rejects to the number of samples
and expressed in ppm.
PPM =
Total Rejects x 1,000,000
Total Samples
Intrinsic, or later life reliability, shall be reported using the exponential model, in terms of FITs, with a 60%
upper confidence bound for 0 failures or the demonstrated FIT estimate in the case there are failures.
FR (FIT) =χ2α, 2n +2 /(2 * AF * Device Hours) * 10 9
where:
χ2 α,2n +2 = Chi square factor for 2n +2 degrees of freedom at 60% confidence level.
n = number of failure.
AF = Thermal Acceleration factor and is calculated per Arrhenius equation assuming a 0.7eV activation energy.
Voltage acceleration factor is not included in failure rate calculation even though voltage acceleration may be
used during stress. Typical use conditions shall be considered to be 55°C ambient with a 15°C temperature
rise at the junction. Thus, use junction temperature is 70°C.
2005 Q1 RELIABILITY REPORT
Page 12 of 50
Product Reliability
Cypress
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS
Two acceleration factor (AF) models are used to model temperature cycle failures. The model proposed by
Zelenka [1] and others uses the epoxy molding temperature (Tmold = 170 °C) and the minimum temperature
reached during temperature cycling , (Tmin).
m
AFbrittle =
Tmold - Tmin,stress
Tmold - Tmin,stress
The model constant, m, is experimentally calculated for each failure mechanism. The acceleration factor is
labeled ‘brittle’ because the derivation of this equation assumes brittle fracture mechanics. Basically, the
model assumed that cracks advance a little every time the maximum stress is reached. The maximum stress
is assumed to be proportional to the difference in temperature between the minimum and maximum stress
temperatures. For plastic-encapsulated devices, the stress is minimum during molding, (Tmold), and a
maximum during the lowest temperature reached during temperature cycling, (Tmin).
The model constant, m, is a function of the failure mechanism.
Thin film cracking
Al/Au Intermetallic fractures
Chip-out (cratering) bond failures
m = 12 (Blish and Vaney [2])
m=4
m = 7 (Dunn and McPherson [3])
For ductile materials, dislocation movement dominates the fracture mechanics and a different model is used.
The second, and most widely accepted model, use the difference between the minimum and maximum
temperatures during temperature cycle testing (Tmin and Tmax ) to calculate an acceleration factor.
m
AFductile =
Tmax, stress - Tmin,stress
Tmax,use - Tmin,use
The model constant, ‘m’, is again experimentally calculate for each failure mechanism.
Coffin and Manson [4] developed this model from empirical observations of metal fatigue. In ductile materials,
if the applied stress is high enough, dislocation are produced. At the high temperature condition of the
temperature cycling stress, dislocations are forced towards one metal surface. At the low temperature , the
dislocations try to glide back to their original position, but many cannot because they became entangled with
other dislocations. After many cyles, these tangles grow until cracking, and finally failure, occurs. Both
minimum and maximum temperatures are important, because both contribute to dislocation movement and
entanglement. This model is recommended for any failures involving ductile materials. Model constants for
ductile failure mechanism follow.
Wirebond breakage
Solder Fatigue
2005 Q1 RELIABILITY REPORT
m = 5.16 (Cypress experimentation)
m = 2 (Blish and Vaney [2])
Page 13 of 50
Product Reliability
Cypress
APPENDIX B: TEMPERATURE CYCLING STRESS MODELS (cont.)
Our commercial devices are specified to operate between 0°C and 70 °C. Using this information, the
acceleration factor, AF, between use and Military Condition C stress testing (-65°C to 150°C), for the brittle,
thin film cracking failure mechanism and ductile, wire bond breakage failure mechanism can be calculated.
12
AF brittle
=
170 - (-65)
170 - 0
AF ductile
=
150 - (-65)
70 - 0
=
49
5.16
=
327
References:
[1] R.L. Zelenka, IEEE/IRPS, pp. 30-34, 1991
[2] R.C. Blish and P.R. Vaney, IEEE/IRPS, pp 22-29, 1991
[3] C.F. Dunn and J.W. McPherson, IEEE/IRPS, pp 252-258, 1990
[4] S.S. Manson, thermal Stress and Low-Cycle Fatigue, (Robert Krieger : Malabar, Florida), 1981.
2005 Q1 RELIABILITY REPORT
Page 14 of 50
Product Reliability
Cypress
APPENDIX C: EQUIVALENCE OF DIFFERENT STRESS TEST CONDITIONS
During stress testing, more than one set of test conditions were used. To account for this difference, stress
test hours or cycles at the lower stress condition were derated and then added to the total for the most severe
stress test condition.
Dynamic (HTOL)
HTOL (EFR/LFR) test is performed at 150 °C and 125 °C. Using the Arrhenius equation (Appendix A) and an
activation energy of 0.7 eV, the derating factor, DF, between 125°C and 150 °C can be calculated.
DF (between 125C and 150C) = exp
0.6 ____1 _______ - ______1______
k 150 + 15 + 273
125 + 15 + 273
= 0.326
Derating calculation assumes a 15 °C rise due to junction heating.
Temperature Cycling
Two different temperature cycling conditions were used to measure reliability, -65°C to 150°C and –55°C to
125°C. Using the brittle failure mechanism model with m = 12, the derating factor between -65°C to 150°C and
–55°C to 125°C is calculated.
12
DF
=
170 - (-55)
170 – (-65)
=
1.685
Using the ductile failure mechanism model with m = 5.16, the derating factor between -65°C to 150°C and –
55°C to 125°C is obtained.
5.16
DF
=
125 - (-55)
150 - (-65)
=
2.501
HAST
The derating factor between two HAST conditions, 140 °C / 85%RH and 130 °C / 85% RH is simply the ratio of
the acceleration factors (See Appendix A)
DF
2005 Q1 RELIABILITY REPORT
=
9,261_
17, 433
=
0.531
Page 15 of 50
Product Reliability
Cypress
APPENDIX D: RELIABILITY DATA
From: 3/29/2004
To: 3/31/2005
EFR Summary
Technology
Temp
Division
Family
Device
Volt
SS
Rej
Hours
FA
Results
B53
125C
DCD
COM
7B9293CC-GBLI
125C
DCD
COM
7B9293CC-GBLI
125C
DCD
COM
7B9254CC-GBLC
125C
DCD
COM
7B9293CC-GBLI
125C
DCD
COM
7B9293CC-GBLI
125C
DCD
COM
7B9293CC-GBLI
125C
PCD
COM
7B9293CC-GBLI
125C
PCD
COM
7B9293CC-GBLI
125C
PCD
COM
7B9293CC-GBLI
125C
PCD
COM
7B9254CC-GBLC
125C
PCD
COM
7B9293CC-GBLI
125C
PCD
COM
7B9293CC-GBLI
125C
TTD
TDP
7B993AC-GAI
125C
TTD
TDP
7B993AC-GAI
125C
TTD
TDP
7B993AC-GAC
125C
TTD
TDP
7B993AC-GAC
Summary for 'Technology' = B53 (16 detail records)
3.65
3.65
3.65
3.65
3.65
3.65
3.65
3.65
3.65
3.65
3.65
3.65
3.30
3.30
4.00
4.00
504
504
1,003
504
504
504
504
504
504
1,003
504
504
289
149
300
150
7,934
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
48
96
6
12
24
24
12
6
96
48
6
96
72
96
72
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
2.35
2.35
2.35
2.35
2.35
2.35
3.80
2.35
3.80
2.35
2.35
2.35
2.35
2.35
2.35
2.35
3.80
276
169
89
126
500
304
514
276
514
304
196
126
500
89
150
505
645
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
96
C8
PCD
PCD
PCD
PCD
PCD
PCD
PCD
TTD
TTD
TTD
TTD
TTD
TTD
TTD
TTD
TTD
PCD
2005 Q1 RELIABILITY REPORT
DDR2
DDR2
DDR2
TDP
DDR2
DDR2
USB
DDR2
USB
DDR2
DDR2
TDP
DDR2
DDR2
DDR2
TDP
USB
7C87741A
7C87740A
7C87741A
7C82877A
7C87741A
7C87741A
7C682005AC-RSPC
7C87741A
7C682005AC-RSPC
7C87740A
7C87741A
7C82877A
7C87741A
7C87741A
7C87740A
7C82877A
7C682005BC-RSPC
Page 16 of 50
Product Reliability
Cypress
Technology
C8
Temp
Division
Family
Device
125C
PCD
USB
7C682005BC-RSPC
125C
TTD
TDP
7C828771BC-GBZI
125C
TTD
TDP
7C828771BC-GBZI
150C
TTD
TDP
7C8C864AC-GBPC
150C
TTD
TDP
7C8C864AC-GBPC
150C
TTD
TDP
7C8C864AC-GBPC
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
150C
TTD
CY284KOTP
Summary for 'Technology' = C8 (31 detail records)
Volt
SS
3.80
2.35
2.35
2.35
2.35
2.35
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
Rej
Hours
FA
645
510
508
296
391
391
135
135
135
130
135
135
135
68
9,032
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
96
96
96
48
48
48
48
48
48
48
48
48
48
48
Results
FL28
125C
DCD
CPLD
7C371ET-XJC
125C
DCD
CPLD
7C371ET-XJC
Summary for 'Technology' = FL28 (2 detail records)
5.75
5.75
200
150
350
0
0
0
96
72
150C
PCD
USB
7C65113ET-OSC
150C
PCD
USB
7C65113ET-OSC
Summary for 'Technology' = P26 (2 detail records)
5.75
5.75
545
495
1,040
0
0
0
48
48
125C
MPD
SPDRM
K128K6C9BW-RAB
125C
MPD
SPDRM
K256K6C9BW-RAB
125C
MPD
SPDRM
K128K6C9BW-RAB
125C
MPD
SPDRM
K512K6C9AW
125C
MPD
SPDRM
K512K6C9AW
150C
MPD
SPDRM
K256K6C9BW-RAB
Summary for 'Technology' = POWER 165 (6 detail records)
3.80
3.80
3.80
3.63
3.63
3.80
3,676
50
2,986
195
192
3,118
10,217
0
0
0
0
0
0
0
96
96
96
96
72
96
125C
MPD
MPWR
U0166TFF7AZ-GBV
125C
MPD
MPWR
U0166TFF7AZ-GBV
125C
MPD
MPWR
U0166TFF7AZ-GBV
125C
MPD
SPDRA
U0166TFF7AZ-GBV
125C
MPD
SPDRA
U0166TFF7AZ-GBV
125C
MPD
SPDRM
U0166TFF7BZ-GBV
125C
MPD
SPDRM
U0166TFF7AZ-GBV
125C
MPD
SPDRM
U0166TFF7AZ-GBV
125C
MPD
SPDRM
U0166TFF7BZ-GBV
125C
MPD
SPDRM
U0166TFF7AZ-GBV
125C
MPD
SPDRM
U0166TFF7AZ-GBV
Summary for 'Technology' = PROMOS017 (11 detail records)
2.10
2.10
2.10
2.52
2.52
2.10
2.10
2.10
2.10
2.10
2.10
3
3,757
3
531
530
2,718
578
491
1,349
1,251
1,238
12,449
0
0
0
0
0
0
0
0
0
0
0
0
12
96
12
6
90
96
96
96
96
96
96
P26
POWER 165
PROMOS017
2005 Q1 RELIABILITY REPORT
Page 17 of 50
Product Reliability
Cypress
Technology
R28
Temp
Division
Family
Device
Volt
SS
Rej
Hours
FA
150C
TTD
SPCM
7C136GT-MJC
150C
TTD
SPCM
7C421DT-MJC
150C
TTD
SPCM
7C421DT-MJC
150C
TTD
SPCM
7C421DT-MJC
150C
PCD
SPCM
7C421DT-MJC
150C
PCD
SPCM
7C136GT-MJC
150C
PCD
SPCM
7C421DT-MJC
150C
PCD
SPCM
7C421DT-MJC
150C
DCD
SPCM
7C433DT-XJC
150C
DCD
SPCM
7C433DT-XJC
Summary for 'Technology' = R28 (10 detail records)
5.75
5.75
5.75
5.75
5.75
5.75
5.75
5.75
3.80
3.80
799
354
355
108
354
799
108
355
300
150
3,682
0
0
0
0
0
0
0
0
0
0
0
48
48
48
48
48
48
48
48
48
32
125C
MPD
MPWR
7C62256EC-RSNI
125C
MPD
MPWR
7C62256EC-RSNI
125C
MPD
MPWR
7C62256EC-RSNC
125C
MPD
MPWR
7C62256EC-RSNC
125C
MPD
MPWR
7C62256EC-RSNC
125C
MPD
MPWR
7C62256EC-RSNC
125C
DCD
SPCM
7C0253FC-RAC
125C
DCD
SPCM
7C0253FC-RAC
150C
TTD
PTG
7C82122AC-TZC
150C
TTD
PTG
7C82122AC-TZC
Summary for 'Technology' = R4 (10 detail records)
5.75
5.75
5.75
5.75
5.25
5.25
5.50
5.50
3.80
3.80
150
298
150
300
150
300
150
150
300
150
2,098
0
0
0
0
0
0
0
0
0
0
0
72
96
72
96
72
96
96
72
48
32
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
50
216
336
409
258
336
216
409
216
120
120
120
1,028
38
260
260
182
260
160
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
48
24
6
48
96
6
24
48
48
12
24
48
96
96
96
110
96
110
96
Results
R4
R5
MPD
DCD
DCD
DCD
DCD
DCD
DCD
DCD
DCD
DCD
DCD
DCD
DCD
TTD
TTD
TTD
TTD
TTD
DCD
2005 Q1 RELIABILITY REPORT
FAST
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
SPCM
FTG
FTG
FTG
FTG
FTG
SPCM
7C1021FC-RZSI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C04301CC-GBGI
7C05793AC-**GBB
7C828437AC-RSPC
7C828437AC-RSPC
7C828437AC-RSPC
7C828437AC-RSPC
7C828437AC-RSPC
7C05793AC-**GBB
Page 18 of 50
Product Reliability
Cypress
Technology
R5
Eval
Division
Family
Device
Volt
SS
Rej
Hours
FA
125C
DCD
SPCM
7C05793AC-**GBB
125C
DCD
SPCM
7C05793AC-**GBB
125C
DCD
SPCM
7C05793AC-**GBB
125C
TTD
USB
7C65640CC-LFC
125C
TTD
USB
7C65640CC-LFC
150C
MPD
FAST
7C1021FC-RZSI
150C
DCD
SPCM
7C05793AC-**GAC
150C
DCD
SPCM
7C05793AC-**GAC
150C
DCD
SPCM
7C05793AC-**GAC
150C
DCD
SPCM
7C05793AC-**GAC
150C
MPD
SYNC
7C1329DC-GACB
150C
MPD
FAST
7C1349CC-RZSCB
150C
MPD
MPWR
7C62128HC-RSC
150C
MPD
SYNC
7C1329DC-RACB
150C
MPD
SYNC
7C1329DC-RACB
150C
DCD
SPCM
7C05793AC-GACB
150C
DCD
SPCM
7C05793AC-GACB
Summary for 'Technology' = R5 (36 detail records)
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
5.75
3.80
3.80
3.80
3.80
1,028
492
177
489
504
150
1,860
1,001
1
973
150
150
147
150
299
150
12,715
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
96
96
96
96
96
48
48
48
48
48
32
20
32
32
48
32
48
150C
MPD
SYNC
7C13542AC-RACB
150C
MPD
SYNC
7C13542AC-RACB
Summary for 'Technology' = R6 (2 detail records)
2.88
2.88
147
296
443
0
0
0
32
48
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
150C
150C
150C
150C
150C
150C
150C
150C
5.75
2.07
2.07
2.07
2.30
2.07
2.07
3.45
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
999
576
615
692
299
150
300
300
500
538
672
673
300
149
300
150
200
269
675
675
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
96
48
48
48
96
72
96
96
48
48
48
48
48
32
48
32
48
48
48
48
Results
R6
R7
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
2005 Q1 RELIABILITY REPORT
MPWR
SYNC
SYNC
SYNC
MPWR
MPWR
MPWR
MPWR
FAST
FAST
FAST
FAST
SYNC
SYNC
FAST
FAST
FAST
FAST
FAST
FAST
7C62137CC-GBVI
7C1313RC-**GBBC
7C1313RC-**GBBC
7C1313RC-**GBBC
7C62357CC-RABAI
7C62347CC-RABAI
7C62347CC-RABAI
7C62147DC-RABAI
7C1341RC-RZSC
7C1341RC-RZSC
7C1341GC-RZSC
7C1321GC-RZSC
7C13613RC-RACB
7C13613RC-RACB
7C1349RC-RVI
7C1349RC-RVI
7C1341RC-RZSC
7C1341RC-RZSC
7C1321GC-RZSC
7C1321GC-RZSC
Page 19 of 50
Product Reliability
Cypress
Technology
R7
Eval
Division
Family
Device
Volt
SS
Rej
Hours
FA
150C
MPD
FAST
7C1321GC-RZSC
150C
MPD
FAST
7C1321GC-RZWC
150C
MPD
FAST
7C1320GC-RZSI
150C
MPD
FAST
7C1320GC-RZSI
150C
MPD
FAST
7C1320GC-RZSI
150C
MPD
SYNC
7C1321GC-RZSCB
150C
MPD
SYNC
7C1370RC-RAC
150C
MPD
SYNC
7C1380CC-RACB
150C
MPD
SYNC
7C1380CC-RACB
150C
MPD
SYNC
7C13542BC-RACB
150C
MPD
SYNC
7C13542BC-RACB
150C
MPD
MPWR
7C13542BC-RACB
150C
MPD
MPWR
7C13542BC-RACB
150C
MPD
SYNC
7C13542BC-RACB
150C
MPD
SYNC
7C13542BC-RACB
150C
MPD
SYNC
7C13600BC-RACB
150C
MPD
MPWR
7C13542BC-RACB
150C
MPD
MPWR
7C13542BC-RACB
150C
MPD
SYNC
7C13600BC-RACB
150C
MPD
SYNC
7C13600BC-RACB
150C
MPD
FAST
7C1341FC-RZSC
Summary for 'Technology' = R7 (41 detail records)
2.30
2.30
2.30
2.30
2.30
2.30
2.30
3.80
3.80
2.88
2.88
2.88
2.88
2.88
2.88
2.30
2.88
2.88
2.30
2.30
2.30
675
645
840
839
839
3,382
1,390
299
150
269
150
297
150
288
149
141
300
150
150
299
150
20,584
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
48
48
24
24
24
48
48
48
32
48
32
48
32
48
32
32
48
32
32
48
32
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2,211
2,430
2,438
1,835
1,841
3,232
3,467
743
743
3,467
741
741
743
3,232
741
743
741
2,078
2,091
2,094
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
96
72
96
72
96
96
96
12
12
96
84
84
12
96
84
12
84
96
96
96
Results
R8
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
2005 Q1 RELIABILITY REPORT
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
MPWR
7R62357DC-GBVIB
7R62357DC-GBVIB
7R62357DC-GBVIB
7R62357DC-GBVIB
7R62357DC-GBVIB
7C2157DC-RZSI
7C62147EC-**GBV
7C62167DC-GBVIB
7C62167DC-GBVIB
7C62147EC-**GBV
7C62167DC-GBVIB
7C62167DC-GBVIB
7C62167DC-GBVIB
7C2157DC-RZSI
7C62167DC-GBVIB
7C62167DC-GBVIB
7C62167DC-GBVIB
7C62127DC-RZSI
7C62127DC-RZSI
7C62127DC-RZSI
Page 20 of 50
Product Reliability
Cypress
Technology
R8
Temp
Division
Family
Device
Volt
SS
Rej
Hours
FA
125C
MPD
MPWR
7R62357DC-RABVI
125C
MPD
MPWR
7R62357DC-RABVI
125C
MPD
MPWR
7R62357DC-RABVI
125C
MPD
MPWR
7C62147EC-**RZSI
125C
MPD
MPWR
7C62157DC-RABVI
125C
MPD
MPWR
7C62157DC-RABVI
125C
MPD
MPWR
7C62157DC-RABVI
125C
MPD
MPWR
7C62157DC-RABVI
150C
MPD
MPWR
7C62128JC-RZAI
150C
MPD
MPWR
7C62128JC-RZAI
150C
MPD
MPWR
7C62128JC-RZAI
Summary for 'Technology' = R8 (31 detail records)
2.40
2.40
2.40
2.40
2.40
2.40
2.40
2.40
5.75
5.75
5.75
1,396
2,454
1,120
683
1,510
2,194
254
1,677
150
298
150
48,238
0
0
0
0
0
0
0
0
0
0
0
0
96
96
96
96
96
96
96
96
32
48
32
125C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
1,803
2,597
193
951
953
1,246
193
193
193
952
1,533
1,479
3,135
2,138
216
1,387
2,020
1,479
1,533
2,362
2,447
3,135
560
447
833
2,369
2,227
1,909
1,893
1,618
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
96
48
12
24
12
48
12
12
12
12
12
36
12
48
48
48
48
36
12
48
48
12
48
48
48
48
48
12
36
48
Results
R9
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPS
MPS
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
MPD
2005 Q1 RELIABILITY REPORT
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
SYNC
7C1312DC-GBBC
7C1460BC-RAZCB
7C1370EC-RACB
7C1370EC-RACB
7C1370EC-RACB
7C1370EC-RAC
7C1370EC-RACB
7C1370EC-RACB
7C1370EC-RACB
7C1370EC-RACB
7C1350GC-RAC
7C1350GC-RAC
7C1350GC-RAC
7C13540CC-RAZC
7C1370EC-RAZC
7C1370EC-RAZC
7C1350GC-RAZC
7C1350GC-RAC
7C1350GC-RAC
7C1347GC-RAZCB
7C1347GC-RAZCB
7C1350GC-RAC
7C1470AC-RAZCB
7C1470AC-RAZCB
7C1470AC-RAZCB
7C13600CC-RAZCB
7C13600CC-RAZCB
7C1370EC-RAZC
7C1370EC-RAZC
7C1370EC-RAZC
Page 21 of 50
Product Reliability
Cypress
Technology
R9
Temp
Division
Family
Device
Volt
SS
Rej
Hours
FA
150C
MPD
SYNC
7C1370EC-RAZC
150C
MPD
SYNC
7C1460BC-RAZCB
150C
MPD
SYNC
7C1460BC-RAZCB
150C
MPD
SYNC
7C1460BC-RAZCB
Summary for 'Technology' = R9 (34 detail records)
2.25
2.25
2.25
2.25
1,576
442
1,903
274
48,189
0
0
0
0
0
48
48
48
48
125C
CMS
CMS
8C27443BT-TSPI
125C
CMS
PSOC
8C29466AT-OPZI
125C
CMS
PSOC
8C29466AT-OPZI
125C
CMS
PSOC
8C29466AT-OPZI
125C
CMS
PSOC
8C29466AT-OPZI
125C
CMS
PSOC
8C29466AT-OPZI
125C
CMS
PSOC
8C21334AT-TSPI
125C
CMS
PSOC
8C27443BT-TSPE
125C
CMS
PSOC
8C27443BT-TSPE
125C
CMS
PSOC
8C27443BT-TSPE
125C
CMS
PSOC
8C27443BT-TSPE
125C
CMS
PSOC
8C27443BT-TSPE
125C
CMS
PSOC
8C27443BT-TSPE
125C
CMS
PSOC
8C24423BT-**TSPE
125C
CMS
PSOC
8C24423BT
125C
PCD
USB
7C6391AT-OPZC
125C
CMS
PSOC
8C24423BT-TSPE
125C
CMS
PSOC
8C24423BT-TSPE
125C
CMS
PSOC
8C24423BT-TSPE
125C
CMS
PSOC
8C24423BT-TSPE
150C
TTD
PTG
7C822382AT-TZZC
150C
TTD
PTG
7C822382AT-TZZC
150C
TTD
PTG
7C80330AT-MSZC
150C
TTD
PTG
7C841410AT-RAZC
150C
TTD
PTG
7C841410AT-RAZC
Summary for 'Technology' = S4 (25 detail records)
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.75
5.50
5.50
5.50
5.50
3.80
3.80
3.80
3.80
3.80
150
1,005
1,002
1,002
1,000
1,005
1,007
428
420
420
420
427
428
829
1,005
1,015
653
852
859
576
368
637
1,010
300
150
16,968
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
72
96
96
96
96
96
96
48
48
48
48
48
48
48
96
96
12
12
12
12
48
48
48
48
32
125C
DCD
COM
7B923AT-MJC
125C
DCD
COM
7B923AT-MJC
Summary for 'Technology' = STARM (2 detail records)
5.75
5.75
300
150
450
0
0
0
96
72
125C
125C
125C
125C
125C
125C
1.80
1.80
1.80
1.80
1.80
1.80
184
152
189
177
101
134
0
0
0
0
0
0
96
96
96
96
96
96
Results
S4
STARM
TSMC 150
DCD
DCD
DCD
DCD
DCD
DCD
2005 Q1 RELIABILITY REPORT
NPS
NPS
NPS
NPS
NPS
NPS
7C76040CJ-GBLCB
7C76040CJ-GBLCB
7C76040CJ-GBLCB
7C76040CJ-GBLCB
7C76040CJ-GBLCB
7C76040CJ-GBLCB
Page 22 of 50
Product Reliability
Cypress
Technology
TSMC 150
Temp
Division
Family
Device
Volt
SS
Rej
Hours
FA
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040FJ-GBLC
125C
DCD
NPS
7C76040FJ-GBLC
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
125C
DCD
NPS
7C76040CJ-GBLCB
Summary for 'Technology' = TSMC 150 (18 detail records)
1.80
1.80
2.10
2.10
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
128
196
551
551
152
134
101
128
196
184
189
177
3,624
0
0
0
0
0
0
0
0
0
0
0
0
0
96
96
96
96
96
96
96
96
96
96
96
96
125C
DCD
NPS
7C7040AH-GBHC
125C
DCD
NPS
7C7040AH-GBHC
125C
DCD
NPS
7C7040AH-GBHC
Summary for 'Technology' = TSMC 180 (3 detail records)
Grand Total
1.73
1.73
1.73
346
549
395
1,290
199,603
0
0
0
0
0
96
96
96
Results
TSMC 180
2005 Q1 RELIABILITY REPORT
Page 23 of 50
Product Reliability
Cypress
LFR SUMMARY
Technology
B53
Temp
Division
Family
Device
Volt
SS
Rej
Duration
125C
DCD
125C
DCD
125C
DCD
125C
PCD
125C
PCD
125C
PCD
125C
TTD
125C
TTD
125C
TTD
125C
TTD
Summary for 'Technology' =
COM
7B9293CC-GBLI
COM
7B9254CC-GBLC
COM
7B9293CC-GBLI
COM
7B9293CC-GBLI
COM
7B9254CC-GBLC
COM
7B9293CC-GBLI
TDP
7B993AC-GAI
TDP
7B993AC-GAI
TDP
7B993AC-GAC
TDP
7B993AC-GAC
B53 (10 detail records)
3.65
3.65
3.65
3.65
3.65
3.65
3.30
3.30
4.00
4.00
180
192
180
180
192
180
145
149
150
150
1,698
0
0
0
0
0
0
0
0
0
0
0
332
168
168
332
168
168
832
168
168
832
125C
PCD
125C
PCD
125C
PCD
125C
PCD
125C
PCD
125C
PCD
125C
TTD
125C
TTD
125C
TTD
125C
TTD
125C
TTD
125C
TTD
125C
TTD
150C
TTD
Summary for 'Technology' =
USB
DDR2
DDR2
USB
DDR2
USB
USB
DDR2
DDR2
USB
DDR2
DDR2
TDP
3.80
2.35
2.35
3.80
2.35
3.80
3.80
2.35
2.35
3.80
2.35
2.35
2.35
3.80
200
150
150
208
253
208
200
150
253
208
196
150
123
135
2,584
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
168
168
832
928
1000
72
168
832
1000
72
1000
168
168
110
125C
DCD
CPLD
7C371ET-XJC
125C
DCD
CPLD
7C371ET-XJC
Summary for 'Technology' = FL28 (2 detail records)
5.75
5.75
150
150
300
0
0
0
832
168
125C
MPD
SPDRM
K512K6C9AW
125C
MPD
SPDRM
K512K6C9AW
Summary for 'Technology' = POWER 165 (2 detail records)
3.63
3.63
192
192
384
0
0
0
168
832
150C
150C
150C
150C
5.75
5.75
5.75
5.75
120
120
355
120
0
0
0
0
80
420
80
420
FA
Results
C8
7C682001AC-RAC
7C87740A
7C87740A
7C682005AC-RSP
7C87741A
7C682005AC-RSP
7C682001AC-RAC
7C87740A
7C87741A
7C682005AC-RSP
7C87741A
7C87740A
7C82877A
CY284KOTP
C8 (14 detail records)
FL28
POWER 165
R28
TTD
TTD
TTD
TTD
2005 Q1 RELIABILITY REPORT
SPCM
SPCM
SPCM
SPCM
7C136GT-MJC
7C421DT-MJC
7C421DT-MJC
7C136GT-MJC
Page 24 of 50
Product Reliability
Cypress
Technology
R28
Temp
Division
Family
Device
Volt
SS
Rej
Duration
150C
PCD
150C
PCD
150C
PCD
150C
PCD
150C
DCD
150C
DCD
Summary for 'Technology' =
SPCM
7C421DT-MJC
SPCM
7C136GT-MJC
SPCM
7C136GT-MJC
SPCM
7C421DT-MJC
SPCM
7C433DT-XJC
SPCM
7C433DT-XJC
R28 (10 detail records)
5.75
5.75
5.75
5.75
3.80
3.80
120
120
120
355
150
150
1,730
0
0
0
0
0
0
0
420
420
80
80
80
420
125C
MPD
125C
MPD
125C
MPD
125C
DCD
125C
DCD
125C
MPD
125C
MPD
150C
TTD
150C
TTD
Summary for 'Technology' =
MPWR
7C62256EC-RSNC
MPWR
7C62256EC-RSNC
MPWR
7C62256EC-RSNC
SPCM
7C0253FC-RAC
SPCM
7C0253FC-RAC
MPWR
7C62256EC-RSNI
MPWR
7C62256EC-RSNI
PTG
7C82122AC-TZC
PTG
7C82122AC-TZC
R4 (9 detail records)
5.75
5.75
5.25
5.50
5.50
5.75
5.75
3.80
3.80
145
150
150
150
150
150
150
150
150
1,345
0
0
0
0
0
0
0
0
0
0
832
168
168
832
168
168
832
420
80
125C
DCD
125C
DCD
125C
DCD
125C
DCD
125C
DCD
125C
DCD
125C
TTD
125C
TTD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
DCD
150C
DCD
150C
MPD
150C
MPD
Summary for 'Technology' =
SPCM
7C04301CC-GBGI
SPCM
7C04301CC-GBGI
SPCM
7C04301CC-GBGI
SPCM
7C04301CC-GBGI
SPCM
7C04301CC-GBGI
SPCM
7C04301CC-GBGI
FTG
7C828437AC-RSP
FTG
7C828437AC-RSP
SYNC
7C1329DC-GACB
FAST
7C1349CC-RZSCB
MPWR
7C62128HC-RSC
MPWR
7C62128HC-RSC
SYNC
7C1329DC-RACB
SYNC
7C1329DC-RACB
SPCM
7C05793AC-GACB
SPCM
7C05793AC-GACB
FAST
7C1021FC-RZSI
FAST
7C1021FC-RZSI
R5 (18 detail records)
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
3.80
5.75
5.75
3.80
3.80
3.80
3.80
3.80
3.80
180
179
180
179
180
180
150
150
150
150
147
147
150
150
150
150
149
150
2,871
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
168
168
36
832
464
332
832
168
80
20
408
80
420
80
80
420
420
80
150C
MPD
SYNC
7C13542AC-RACB
150C
MPD
SYNC
7C13542AC-RACB
Summary for 'Technology' = R6 (2 detail records)
2.88
2.88
147
145
292
0
0
0
80
420
FA
Results
R4
R5
R6
2005 Q1 RELIABILITY REPORT
Page 25 of 50
Product Reliability
Cypress
Technology
R7
Temp
Division
Family
Device
Volt
SS
Rej
Duration
125C
MPD
125C
MPD
125C
MPD
125C
MPD
125C
MPD
125C
MPD
125C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
Summary for 'Technology' =
MPWR
7C62347CC-RABAI
MPWR
7C62347CC-RABAI
FAST
7C1061AC-GZSCB
MPWR
7C62147DC-RABAI
MPWR
7C62147DC-RABAI
FAST
7C1341RC-RZSC
FAST
7C1341RC-RZSC
SYNC
7C1380CC-RACB
SYNC
7C1380CC-RACB
SYNC
7C13542BC-RACB
SYNC
7C13542BC-RACB
MPWR
7C13542BC-RACB
MPWR
7C13542BC-RACB
SYNC
7C13542BC-RACB
SYNC
7C13542BC-RACB
SYNC
7C13600BC-RACB
SYNC
7C13600BC-RACB
MPWR
7C13542BC-RACB
MPWR
7C13542BC-RACB
SYNC
7C13600BC-RACB
SYNC
7C13600BC-RACB
FAST
7C1341FC-RZSC
FAST
7C1341FC-RZSC
SYNC
7C13613RC-RACB
SYNC
7C13613RC-RACB
FAST
7C1349RC-RVI
FAST
7C1349RC-RVI
FAST
7C1341RC-RZSC
FAST
7C1341RC-RZSC
R7 (29 detail records)
2.07
2.07
2.45
3.45
3.45
2.30
2.30
3.80
3.80
2.88
2.88
2.88
2.88
2.88
2.88
2.30
2.30
2.88
2.88
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
150
150
150
150
150
150
150
150
150
150
150
150
150
149
149
141
141
150
150
150
150
150
150
149
149
150
150
150
150
4,328
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
832
168
832
819
181
80
420
80
420
80
420
80
420
420
80
80
420
420
80
420
80
80
420
80
420
80
420
420
80
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
Summary for 'Technology' =
MPWR
7C62157DC-RZSI
MPWR
7C62157DC-RZSI
MPWR
7C62157DC-RZWI
MPWR
7C62128JC-RZAI
MPWR
7C62128JC-RZAI
MPWR
7C62128JC-RZAI
MPWR
7C62128JC-RZAI
R8 (7 detail records)
2.40
2.40
2.40
5.75
5.75
5.75
5.75
400
400
55
150
150
150
149
1,454
0
0
0
0
0
0
0
0
420
80
408
420
80
80
420
150C
150C
150C
SYNC
SYNC
SYNC
2.25
2.25
2.25
170
400
170
0
0
0
332
500
88
FA
Results
R8
R9
MPD
MPD
MPD
2005 Q1 RELIABILITY REPORT
7C1370EC-RACB
7C1370EC-RAC
7C1370EC-RACB
Page 26 of 50
Product Reliability
Cypress
Technology
R9
Temp
Division
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
150C
MPD
Summary for 'Technology' =
S4
CMS
125C
CMS
125C
CMS
125C
CMS
125C
CMS
125C
CMS
125C
CMS
125C
CMS
125C
TTD
150C
TTD
150C
TTD
150C
TTD
150C
TTD
150C
0
Summary for 'Technology' =
Family
Device
Volt
SS
Rej
Duration
SYNC
7C1370EC-RACB
SYNC
7C1470AC-RAZCB
SYNC
7C1470AC-RAZCB
SYNC
7C1470AC-RAZCB
SYNC
7C1460BC-RAZCB
SYNC
7C1460BC-RAZCB
SYNC
7C1460BC-RAZCB
SYNC
7C1460BC-RAZCB
SYNC
7C1460BC-RAZCB
SYNC
7C1460BC-RAZCB
R9 (13 detail records)
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
2.25
170
394
397
397
437
272
400
398
442
274
4,321
0
0
0
0
0
0
0
0
0
0
0
80
500
500
500
332
332
168
332
168
168
PSOC
8C29466AT-OPZI
PSOC
8C29466AT-OPZI
PSOC
8C29466AT-OPZI
PSOC
8C29466AT-OPZI
PSOC
8C27443BT-TSPE
PSOC
8C27443BT-TSPE
PSOC
8C27443BT-TSPE
CMS
8C27443BT-TSPI
PTG
7C822382AT-TZZC
PTG
7C822382AT-TZZC
PTG
7C80330AT-MSZC
PTG
7C80330AT-MSZC
PTG
7C841410AT-RAZC
S4 (13 detail records)
5.50
5.50
5.50
5.50
5.50
5.50
5.50
5.50
3.80
3.80
3.80
3.80
3.80
614
600
615
600
80
82
78
150
120
120
130
129
150
3,468
0
0
0
0
0
0
0
0
0
0
0
0
0
0
332
168
168
332
1000
1000
1000
168
420
80
80
420
80
5.75
150
150
24,475
0
0
0
168
FA
Results
STARM
125C
DCD
COM
7B923AT-MJC
Summary for 'Technology' = STARM (1 detail record)
Grand Total
2005 Q1 RELIABILITY REPORT
Page 27 of 50
Product Reliability
Cypress
PCT SUMMARY
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
Results
TQFP
A100
A100
R-CML
R-CML
C9TC
C9TC
168
168
40
30
0
0
A100
A100
A100
R-CML
R-CML
R-CML
C9TC
C9TC
C9TC
168
168
168
30
30
30
0
0
0
A100
A100
GO-CHPMS
G-TAIWAN
7C1347BC-GOACB
7C02893BC-GACB
168
168
47
49
0
1 MR042029-1P1 Break at neck associated with top die delam
A100
A100
GO-CHPMS
R-CML
7C1347FC-GOACB
7C13542BC-RACB
168
168
49
42
0
0
A100
A100
R-CML
R-CML
7C13542BC-RACB
713542BC-RACB
176
168
7
50
0
0
A100
A100
RA-CML
R-CML
7C13542BC-RACB
7C1339BC-**RAIB
168
168
50
65
0
0
A100
A100
R-CML
R-CML
7C1347FC-RACB
7C1380CC-RACB
168
168
50
50
0
0
A100
A100
R-CML
R-CML
7C13803CC-RACB
7C1370EC-RACB
168
168
50
50
0
0
A100
A100
A100
R-CML
R-CML
R-CML
7C1370EC-RAC
7C1470AC-RACB
7C1350GC-RAC
168
168
168
50
43
50
0
0
0
A100
A48
G-TAIWAN
G-TAIWAN
7B993AC-GAI
7C679234
176
168
50
45
0
0
A32
A52
SI-SIGNETI
Q-KOREA
7C829947AR-SIAC
7B9973AC-QAC
176
168
50
50
0
0
A52
A52
Q-KOREA
SI-SIGNETI
7B9973AC-QACB
7C8Z9973CI-SIAC
168
168
50
49
0
0
1,156
1
Summary for 'Family' = TQFP (22 detail records)
TQFP (10x10)
AS64
G-TAIWAN
7C4245AT-GASZCB
Summary for 'Family' = TQFP (10x10) (1 detail record)
168
43
0
0
AT120
176
50
0
50
0
TQFP (Thermal)
L-SEOL
7B9532BC-LATI
Summary for 'Family' = TQFP (Thermal) (1 detail record)
TQFP (Pb-Free)
AZ100
R-CML
7C1470AC-RAZC
168
50
0
AZ100
R-CML
7C1470AC-RAZC
168
51
0
2005 Q1 RELIABILITY REPORT
Page 28 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
Results
TQFP (Pb-Free)
AZ100
R-CML
7C1460BC-RAZC
168
44
0
AZ128
AZ128
G-TAIWAN
G-TAIWAN
7C681000AC-GAZC
7C681000AC-GAZC
168
168
50
50
0
0
245
0
Summary for 'Family' = TQFP (Pb-Free) (5 detail records)
FBGA (0.75-0.8)
BA36
BA48
BA48
G-TAIWAN
RA-CML
RA-CML
7C62138CC-GBAI
7C621464BC-RABAI
7C62147DC-RABAI
176
168
168
39
44
42
0
0
0
BA48
BA48
G-TAIWAN
G-TAIWAN
7C62347CC-GBAIB
7C62347CC-GBAIB
168
176
50
49
0
0
BA48
BA48
RA-CML
RA-CML
7C62347CC-RABAI
7C62137CC-RABAI
176
168
45
49
0
0
BA48
BA48
G-TAIWAN
G-TAIWAN
7C62337BC-GBAI
7C62337BC-GBAI
176
168
50
50
0
0
BA48
BA48
G-TAIWAN
T-TAIWAN
7C1321GC-GBAI
7C62347CC-TBAI
176
168
46
49
0
0
BA48
BA48
T-TAIWAN
T-TAIWAN
7C62347CC-TBAI
7C62347CC-TBAI
176
168
48
49
0
0
BA48
BA48
T-TAIWAN
T-TAIWAN
7C62347CC-TBAI
7C62347CC-TBAI
176
168
49
50
0
0
BA48
GK-GAPT
7C623472CC-GKBAI
BA48
G-TAIWAN
7C1069AC-GBAC
Summary for 'Family' = FBGA (0.75-0.8) (17 detail records)
176
168
58
50
817
0
0
0
BB144
G-TAIWAN
7C08333AC-GBBC
168
48
0
BB165
BB165
G-TAIWAN
G-TAIWAN
7C1313AC-GBBCB
7R1371CC-GBBCB
176
168
49
49
0
0
BB165
BB165
G-TAIWAN
G-TAIWAN
7C1470AC-GBBC
7C1470AC-GBBC
168
168
50
48
0
0
BB172
G-TAIWAN
7C08523AC-GBBCB
Summary for 'Family' = FBGA (1.0) (6 detail records)
168
44
288
0
0
BG119
G-TAIWAN
7C13732RC-GBGC
168
50
0
BG272
BG272
G-TAIWAN
G-TAIWAN
7C04301CC-GBGI
7C04301CC-GBGI
168
168
48
50
0
0
148
0
39
0
FBGA (1.0)
PBGA (1.27)
Summary for 'Family' = PBGA (1.27) (3 detail records)
PBGA (Cavity/Heatsink)
BL256
G-TAIWAN
7B9254CC-GBLC
2005 Q1 RELIABILITY REPORT
168
Page 29 of 50
Product Reliability
Cypress
Buildkit
PBGA (Cavity/Heatsink)
BL256
Assy Site
G-TAIWAN
Device
Readout
7B9254CC-GBLC
168
FVBGA (0.75-0.8, 0.3mm)
BV48
BV48
Rej
FA
17
0
56
0
168
46
46
0
0
Summary for 'Family' = PBGA (Cavity/Heatsink) (2 detail records)
FBGA (0.75-0.8, Pb-Free)
BP96
G-TAIWAN
7C8C864AC-GBPC
Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
SS
G-TAIWAN
G-TAIWAN
7C62167DC-GBVI
7C62147EC-**GBVI
168
168
50
50
0
0
BV48
BV48
R-CML
RA-CML
K128K6C9BW-RABVI
K256K6C9BW-RABVI
168
168
45
50
0
0
BV48
BV48
RA-CML
G-TAIWAN
7R62357DC-RABVI
7C62357DC-GBVIB
168
168
49
50
0
0
BV48
BV48
G-TAIWAN
G-TAIWAN
7R62357DC-GBVIB
7R62357DC-GBVIB
168
168
49
48
0
0
BV48
BV48
G-TAIWAN
G-TAIWAN
7C62167DC
7C62137CC-GBVI
168
176
50
50
0
0
168
48
539
0
0
168
49
0
49
0
168
50
0
168
48
98
0
0
168
47
0
47
0
BV48
G-TAIWAN
7C62137CC-GBVI
Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (11 detail records)
FBGA (1.0, Pb-Free)
BW100
G-TAIWAN
7B9291CC-GBWC
Summary for 'Family' = FBGA (1.0, Pb-Free) (1 detail record)
PBGA (1.27, Pb-Free)
BY119
G-TAIWAN
7R1370CC-GBYCB
BY119
G-TAIWAN
7R1370CC-GBYCB
Summary for 'Family' = PBGA (1.27, Pb-Free) (2 detail records)
VFBGA (0.75-0.8, Pb-Free)
BZ52
G-TAIWAN
7C82877A
Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (1 detail record)
Results
PLCC
J52S
J52S
O-INDNS
O-INDNS
7C131GT-OJC
7C146GT-OJC
168
168
45
45
0
0
J52S
M-PHIL
7C136HT-MJIB
Summary for 'Family' = PLCC (3 detail records)
168
50
140
0
0
QFN (Punch Type)
LF56
L-SEOL
7C65640CC-LLFC
168
50
0
LF56
LF56
LF56
L-SEOL
L-SEOL
L-SEOL
7C680135EC-LLFC
7C56540CC-LLFC
7C680135EC-LLFC
176
168
176
50
48
50
0
0
0
2005 Q1 RELIABILITY REPORT
Page 30 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
QFN (Punch Type)
LF56
T-TAIWAN
7C66113GT-TLFC
176
50
0
LF56
LF56
T-TAIWAN
T-TAIWAN
7C68000AC-TLFC
7C68000AC-TLFC
176
168
47
50
0
0
LF56
LF56
T-TAIWAN
T-TAIWAN
7C68000AC-TLFC
7C68000AC-TLFC
168
176
49
3
0
0
168
47
444
0
0
LY48
L-SEOL
7B6934AC-LLYC
Summary for 'Family' = QFN (Punch Type, Pb-Free) (1 detail record)
168
50
50
0
0
N52
7C136GT-GNC
176
50
0
N52
G-TAIWAN
7C136GT-GNC
Summary for 'Family' = PQFP (2 detail records)
168
50
100
0
0
O2013
M-PHIL
7C826580AT-MOC
168
50
0
O2024
O2824
M-PHIL
T-TAIWAN
7B8314AC-MOI
7C828400BC-TOC
176
168
44
45
0
0
O2824
O483
T-TAIWAN
R-CML
7C828400BC-TOC
7C8349AT-ROC
176
168
49
50
0
0
O483
O483
O483
R-CML
R-CML
R-CML
7C828342DR-ROC
7C828342DR-ROC
7C828342DR-ROC
168
176
168
22
35
4
0
0
0
O483
O483
R-CML
R-CML
7C828342DR-ROC
7C828342DR-ROC
176
168
18
28
0
0
O483
O483
R-CML
RA-CML
8C27643AT-ROI
P7C8323AT-RAOC
168
168
50
49
0
0
O56
O563
R-CML
R-CML
CY284KOTP
7C828409DC-ROC
168
168
46
50
0
0
O563
O563
R-CML
RA-CML
7C68003AC-ROC
7C828409DC-RAOC
176
168
50
47
0
0
637
0
LF56
T-TAIWAN
7C68000AC-TLFC
Summary for 'Family' = QFN (Punch Type) (10 detail records)
QFN (Punch Type, Pb-Free)
Results
PQFP
G-TAIWAN
SSOP
Summary for 'Family' = SSOP (16 detail records)
PDIP
P183
P183
X-ALPHA
X-ALPHA
7C63720AT-XPC
7C63720AT-XPC
176
176
50
50
0
0
P283
P286
P286
O-INDNS
O-INDNS
O-INDNS
7C185JT-OPCB
7C62256EC-OPC
7C62256EC-OPC
168
168
168
50
50
50
0
0
0
2005 Q1 RELIABILITY REPORT
Page 31 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
Results
PDIP
P286
X-ALPHA
7C62256EC-XPC
176
50
0
P406
O-INDNS
7C63413CT-OPC
Summary for 'Family' = PDIP (7 detail records)
168
45
345
0
0
PZ283
168
50
0
50
0
PDIP (Pb-Free)
O-INDNS
8C29466AT-OPZI
Summary for 'Family' = PDIP (Pb-Free) (1 detail record)
SOIC (GullWing)
S0815
SI-SIGNETI
7C825814BR-SLSC
168
44
0
S0815
S0815
SL-INDIA
RA-CML
7C825814BR-SLSC
W18101CK-RASC
168
168
50
45
0
0
S0815
S0815
RA-CML
R-CML
PW18001BK-RASC
P7C80723AT-RASC
168
176
45
49
0
0
S1615
S1615
T-TAIWAN
M-PHIL
7C83300DT-OSC
7C83300DT-MSC
168
168
45
50
0
0
S1615
S1615
M-PHIL
M-PHIL
7C80727AT-MSC
7C80727AT-MSC
168
168
50
50
0
0
S183
S183
M-PHIL
RA-CML
7C63720AT-MSC
7C63720AT-RASC
176
168
50
50
0
0
S203
S243
R-CML
O-INDNS
7C63001GT-RSC
7B9910AT-OSC
176
168
50
45
0
0
S283
S3245
S3245
O-INDNS
R-CML
R-CML
7C185NT-OSC
7C62128HC-RSC
7C62128HC-RSI
168
176
168
45
50
50
0
0
0
768
0
49
45
0
0
94
0
Summary for 'Family' = SOIC (GullWing) (17 detail records)
SOIC (Gull Wing, Exposed Pad)
SE283
SE286
M-PHIL
M-PHIL
7B6934AC-MSEC
7B6934AC-MSEC
168
168
Summary for 'Family' = SOIC (Gull Wing, Exposed Pad) (2 detail
SOIC (GullWing, 450 footprint)
SN283
SN283
R-CML
R-CML
7C62256EC-RSNC
7C62256EC-RSNI
176
168
50
50
0
0
SN283
SN283
O-INDNS
O-INDNS
7C622563EC-OSNC
7C6264NT-OSNC
168
168
50
45
0
0
195
0
48
50
0
0
Summary for 'Family' = SOIC (GullWing, 450 footprint) (4 detail records)
SSOP (Pb-Free)
SP16
SP16
2005 Q1 RELIABILITY REPORT
M-PHIL
M-PHIL
W198BF-MSPC
W198BF-MSPC
168
168
Page 32 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
Results
SSOP (Pb-Free)
SP20
T-TAIWAN
8C21334AT-TSPI
168
45
0
SP483
SP563
RA-CML
R-CML
7C8405EC-RASPC
7C8CRS480BC-RSPC
168
168
45
47
0
0
SP563
SP563
R-CML
R-CML
7C828437AC-RSPC
7C682005AC-RSPC
168
176
45
57
0
0
SP563
R-CML
7C682020AC-RSPC
SP563
R-CML
7C682020AC-RSPC
Summary for 'Family' = SSOP (Pb-Free) (9 detail records)
176
176
65
63
465
0
0
0
SQ241
176
50
0
50
0
168
50
50
0
0
QSOP (Pb-Free)
R-CML
7C63740AT-RSQC
Summary for 'Family' = QSOP (Pb-Free) (1 detail record)
SOIC (GullWing, 450 footprint, Pb-Free)
SY283
R-CML
7C62256EC-RSYC
Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (1 detail
SOIC (GullWing, Pb-Free)
SZ324
R-CML
7C62142EC-RSZI
176
45
0
M-PHIL
M-PHIL
7C80330AT-MSZC
7C83500DT-MSZC
168
168
48
49
0
0
SZ815
R-CML
7C80722AT-RASZC
Summary for 'Family' = SOIC (GullWing, Pb-Free) (4 detail records)
168
50
192
0
0
V243
V283
O-INDNS
R-CML
7C1975MC-OVC
7C1399HC-RVI
176
168
50
50
0
0
V323
V324
R-CML
R-CML
7C188BT-RVCB
7C1319GC-RVC
168
168
50
50
0
0
V324
V324
O-INDNS
O-INDNS
7C1019FC-OVCB
7C1319FC-OVCB
168
168
45
45
0
0
V324
V364
O-INDNS
R-CML
7C109MC-OVC
7C1549CC-RVIB
176
176
50
45
0
0
V364
V364
R-CML
R-CML
7C1349FC-RVI
7C1349RC-RVC
168
168
50
50
0
0
V444
V444
R-CML
R-CML
7C1021FC-RVC
7C1321GC-RVC
168
168
50
50
0
0
585
0
50
50
0
0
SZ815
SZ815
SOIC (J lead)
Summary for 'Family' = SOIC (J lead) (12 detail records)
SOIC (J lead, Pb-Free)
VZ444
R-CML
7C1321GC-RVZC
Summary for 'Family' = SOIC (J lead, Pb-Free) (1 detail record)
2005 Q1 RELIABILITY REPORT
168
Page 33 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
Results
TSOP/ TSSOP
Z16
M-PHIL
7C841400AT-MZI
168
50
0
Z16
Z16
M-PHIL
T-TAIWAN
7C84100AT-MZC
7C80726AT-TZC
168
168
49
42
0
0
Z16
Z16
T-TAIWAN
T-TAIWAN
7C841400AT-TZC
7C83900AT-TZC
168
168
45
50
0
0
Z24
Z28
Z28
RA-CML
R-CML
R-CML
7C822313BC-RAZC
7C62256EC-RZC
7C1399HC-RZC
168
168
176
45
50
50
0
0
0
Z32
Z32
GQ-KOREA
T-TAIWAN
7C62128JC-GQZCB
7C62128HC-TZC
176
176
50
49
0
0
Z32
Z48
T-TAIWAN
R-CML
7C62128JC-TZI
7C828339AR-RZC
168
168
50
50
0
0
Z48
Z56
G-TAIWAN
R-CML
7C62164DC-GZIB
7C828409DC-RZC
168
176
44
49
0
0
Z56
Z56
R-CML
R-CML
7C828409FC-RZC
7C828409DC-RZC
168
168
50
45
0
0
Z56
Z56
R-CML
R-CML
7C828346LR-RZC
7C828346LR-RZC
168
168
50
50
0
0
Z56
Z56
R-CML
R-CML
7C828346LR-RZC
7C828346LR-RZC
168
168
50
50
0
0
Z56
R-CML
7C883462AR-RZC
Summary for 'Family' = TSOP/ TSSOP (21 detail records)
176
50
1,018
0
0
ZA32
R-CML
7C62128JC-RZAI
Summary for 'Family' = TSOP I (1 detail record)
168
50
50
0
0
TSOP I
TSOP (Exposed Pad)
ZE20
M-PHIL
7C8A1083AT-MZEC
176
45
0
ZE20
ZE20
M-PHIL
M-PHIL
7C8A103AT-MZEC
7C8A103AT-MZEC
168
168
50
49
0
0
144
0
Summary for 'Family' = TSOP (Exposed Pad) (3 detail records)
TSOP II
ZS32
ZS32
T-TAIWAN
T-TAIWAN
7C1019FC-TZSCB
7C1319GC-TZSI
176
176
44
48
0
0
ZS32
ZS32
T-TAIWAN
T-TAIWAN
7C1319GC-TZSC
7C1319GC-TZSC
168
176
50
49
0
0
ZS44
ZS44
R-CML
R-CML
7C1320GC-RZSI
7C1321GC-RZSC
168
168
50
50
0
0
2005 Q1 RELIABILITY REPORT
Page 34 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
Readout
SS
Rej
FA
Results
TSOP II
ZS44
R-CML
7C2157DC-RZSI
168
45
0
ZS54
ZS54
G-TAIWAN
T-TAIWAN
7C1069AC-GQZSCB
7C1061AC-GZSCB
168
168
50
50
0
0
436
0
168
50
50
0
0
168
168
50
50
0
0
100
0
Summary for 'Family' = TSOP II (9 detail records)
TSOP (Pb-Free)
ZT28
R-CML
7C62256EC-RZTC
Summary for 'Family' = TSOP (Pb-Free) (1 detail record)
TSOP II (Pb-Free)
ZW444
ZW544
G-TAIWAN
7C62146EC-RZWI
100 7C1069AC-GZWC
Summary for 'Family' = TSOP II (Pb-Free) (2 detail records)
TSSOP (Pb-Free)
ZZ08
ZZ16
T-TAIWAN
T-TAIWAN
7C80601AT-TZZC
7C825823AC-TZZC
176
176
50
48
0
0
ZZ16
ZZ24
T-TAIWN
T-TAIWAN
7C822382AT-TZZC
7C822313BC-TZZC
168
168
50
49
0
0
ZZ24
ZZ56
T-TAIWAN
R-CML
7C822313BC-TZZC
7C828411DC-RZZC
176
168
50
50
0
0
ZZ56
ZZ56
R-CML
R-CML
7C828411DC-RZZC
7C828411DC-RZZC
168
168
48
49
0
0
394
9989
0
1
Summary for 'Family' = TSSOP (Pb-Free) (8 detail records)
Grand Total
2005 Q1 RELIABILITY REPORT
Page 35 of 50
Product Reliability
Cypress
HAST SUMMARY
Buildkit
Assy Site
Device
SS
Rej
FA
Results
TQFP
A100
A100
GO-CHPMS
G-TAIWAN
7C1347BC-GOACB
7C02893BC-GACB
43
44
0
0
A100
A100
G-TAIWAN
GO-CHPMS
7C1353BC-GACB
7C1347FC-GOACB
43
47
0
0
A100
A100
R-CML
R-CML
7C682001AC-RAC
7C682001AC-RAC
47
47
0
0
A100
A100
R-CML
R-CML
7C13542BC-RACB
713542BC-RACB
40
50
0
0
A100
A100
RA-CML
R-CML
7C13542BC-RACB
7C1339BC-**RAIB
49
44
0
0
A100
A100
R-CML
R-CML
7C1347FC-RACB
7C1380CC-RACB
46
48
0
0
A100
A100
A100
R-CML
R-CML
R-CML
7C1370EC-RAC
7C1470AC-RACB
7C1470AC-RACB
50
47
44
0
0
0
A100
A32
G-TAIWAN
SI-SIGNETI
7B993AC-GAI
7C829947AR-SIAC
49
46
0
0
50
834
0
0
A52
Q-KOREA
7B9973AC-QACB
Summary for 'Family' = A (18 detail records)
TQFP (10x10)
AS64
42
0
Summary for 'Family' = AS (1 detail record)
G-TAIWAN
7C4245AT-GASZCB
42
0
AZ100
AZ100
46
49
0
0
Summary for 'Family' = AZ (2 detail records)
BA48
RA-CML
7C621464BC-RABAI
95
43
0
0
BA48
BA48
RA-CML
G-TAIWAN
7C62147DC-RABAI
7C62337BC-GBAI
45
47
0
0
BA48
BA48
BA48
T-TAIWAN
GO-CHPMS
G-TAIWAN
7C62347CC-TBAI
7C623472CC-GKBAI
7C1069AC-GBAC
31
50
45
0
0
0
261
0
TQFP (Pb-Free)
FBGA (0.750.8)
R-CML
R-CML
7C1470AC-RAZC
7C1470AC-RAZC
Summary for 'Family' = BA (6 detail records)
2005 Q1 RELIABILITY REPORT
Page 36 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
SS
Rej
FA
Results
FBGA (1.0)
BB144
G-TAIWAN
7C08333AC-GBBC
50
0
BB165
BB165
G-TAIWAN
G-TAIWAN
7C1470AC-GBBC
7C1470AC-GBBC
48
50
0
0
148
0
Summary for 'Family' = BB (3 detail records)
FVBGA (0.75-0.8, 0.3mm)
BV48
BV48
BV48
G-TAIWAN
G-TAIWAN
RA-CML
7C62127DC-GBVI
7C62167DC-GBVI
7R62357DC-RABVI
48
44
45
0
0
0
BV48
BV48
G-TAIWAN
G-TAIWAN
7C62357DC-GBVIB
7C62167DC
11
48
0
0
196
0
Summary for 'Family' = BV (5 detail records)
PBGA (1.27, Pb-Free)
BY119
BY119
G-TAIWAN
G-TAIWAN
7R1370CC-GBYC
7R1370CC-GBYC
47
48
0
0
BY119
BY119
G-TAIWAN
G-TAIWAN
7R1370CC-GBYC
7R1370CC-GBYC
47
48
0
0
BY119
BY388
G-TAIWAN
G-TAIWAN
7R1370CC-GBYC
7C39485EH-GBYC
47
12
0
0
BY388
G-TAIWAN
7C39485EH-GBYC
Summary for 'Family' = BY (7 detail records)
36
285
0
0
46
46
0
0
VFBGA (0.75-0.8, Pb-Free)
BZ52
G-TAIWAN
C72SSTU877V
Summary for 'Family' = BZ (1 detail record)
PLCC
J52
O-INDNS
7C131GT-OJC
45
0
J52
J52
O-INDNS
M-PHIL
7C146GT-OJC
7C136HT-MJIB
45
50
0
0
140
0
Summary for 'Family' = J (3 detail records)
SSOP
O28
O483
T-TAIWAN
R-CML
7C828400BC-TOC
7C8349AT-ROC
49
44
0
0
O483
O561
R-CML
T-TAIWAN
7C828342DR-ROC
7C828409DC-TOC
45
49
0
0
O563
O563
R-CML
R-CML
7C828409DC-ROC
7C682000AC-ROC
46
47
0
0
50
330
0
0
O563
RA-CML
7C828409DC-RAOC
Summary for 'Family' = O (7 detail records)
2005 Q1 RELIABILITY REPORT
Page 37 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
SS
Rej
FA
Results
PDIP
P183
X-ALPHA
7C63720AT-XPC
50
0
P183
P283
X-ALPHA
O-INDNS
7C63720AT-XPC
7C185JT-OPCB
47
50
0
0
P286
P286
O-INDNS
X-ALPHA
7C62256EC-OPC
7C62256EC-XPC
50
50
0
0
Summary for 'Family' = P (5 detail records)
247
PDIP (Pb-Free)
PZ283
50
0
Summary for 'Family' = PZ (1 detail record)
O-INDNS
8C29466AT-OPZI
50
0
S0815
S0815
SI-SIGNETI
SL-INDIA
7C825814BR-SLSC
7C825814BR-SLSC
45
50
0
0
S0815
S1615
R-CML
O-INDNS
P7C80723AT-RASC
7C83300DT-OSC
47
45
0
0
S1615
S183
M-PHIL
M-PHIL
7C80727AT-MSC
7C63720AT-MSC
47
50
0
0
S183
S203
RA-CML
R-CML
P7C63720AT-RASC
7C63001GT-RSC
48
50
0
0
S243
S283
O-INDNS
O-INDNS
7B9910AT-OSC
7C185NT-OSC
45
45
0
0
16
43
531
0
0
0
SOIC (GullWing)
S3245
R-CML
7C62128HC-RSC
S3245
R-CML
7C62128HC-RSI
Summary for 'Family' = S (13 detail records)
SOIC (Gull Wing, Exposed Pad)
SE283
SE283
SE286
M-PHIL
7B6934AC-MSEC
49
0
M-PHIL
M-PHIL
7B6934AC-MSEC
7B6934AC-MSEC
50
45
0
0
144
0
50
50
0
0
49
149
0
0
Summary for 'Family' = SE (3 detail records)
SOIC (GullWing, 450 footprint)
SN283
SN283
R-CML
R-CML
7C62256EC-RSNC
7C62256EC-RSNI
SN283
O-INDNS
7C622563EC-OSNC
Summary for 'Family' = SN (3 detail records)
SSOP (Pb-Free)
SP16
M-PHIL
W198BF-MSPC
50
0
SP16
M-PHIL
W198BF-MSPC
50
0
2005 Q1 RELIABILITY REPORT
Page 38 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
SS
Rej
FA
Results
SSOP (Pb-Free)
SP483
RA-CML
7C8405EC-RASPC
44
0
SP563
SP563
R-CML
R-CML
7C682020AC-RSPC
7C682020AC-RSPC
50
50
0
0
SP563
R-CML
7C682005AC-RSPC
Summary for 'Family' = SP (6 detail records)
45
289
0
0
SQ24
R-CML
7C63740AT-RSQC
Summary for 'Family' = SQ (1 detail record)
44
44
0
0
50
0
50
0
QSOP (Pb-Free)
SOIC (GullWing, 450 footprint, Pb-Free)
SY283
R-CML
7C62256EC-RSYC
Summary for 'Family' = SY (1 detail record)
SOIC (GullWing, Pb-Free)
SZ3245
SZ3245
R-CML
R-CML
7C62142EC-RSZI
7C62142EC-RSZI
24
25
0
0
SZ815
SZ815
M-PHIL
R-CML
7C83500DT-MSZC
7C80722AT-RASZC
44
39
0
0
132
0
Summary for 'Family' = SZ (4 detail records)
SOIC (J lead)
V243
V283
O-INDNS
R-CML
7C1975MC-OVC
7C1399HC-RVI
42
50
0
0
V323
V324
V324
R-CML
R-CML
O-INDNS
7C188BT-RVCB
7C1319GC-RVC
7C1019FC-OVCB
49
50
44
0
0
0
V324
V324
O-INDNS
O-INDNS
7C1319FC-OVCB
7C109MC-OVC
45
50
0
0
V364
V364
R-CML
R-CML
7C1549CC-RVIB
7C1349FC-RVI
44
50
0
0
V364
V444
R-CML
R-CML
7C1349RC-RVC
7C1021FC-RVC
49
45
0
0
V444
R-CML
7C1321GC-RVC
Summary for 'Family' = V (12 detail records)
50
568
0
0
50
0
50
0
SOIC (J lead, Pb-Free)
VZ444
R-CML
7C1321GC-RVZC
Summary for 'Family' = VZ (1 detail record)l
2005 Q1 RELIABILITY REPORT
Page 39 of 50
Product Reliability
Cypress
Buildkit
Assy Site
Device
SS
Rej
FA
Results
TSOP/ TSSOP
Z16
T-TAIWAN
7C80726AT-TZC
42
0
Z16
Z24
T-TAIWAN
RA-CML
7C841400AT-TZC
7C822313BC-RAZC
45
44
0
0
Z28
Z28
R-CML
R-CML
7C62256EC-RZC
7C1399HC-RZC
38
42
0
0
Z32
Z32
Z32
GQ-KOREA
T-TAIWAN
T-TAIWAN
7C62128JC-GQZCB
7C62128HC-TZC
7C62128JC-TZI
24
50
50
0
0
0
Z48
Z48
R-CML
G-TAIWAN
7C828339AR-RZC
7C62164DC-GZI
50
49
0
0
Z56
Z56
R-CML
R-CML
7C828409DC-RZC
7C828409FC-RZC
50
40
0
0
Z56
Z56
R-CML
R-CML
7C828409DC-RZC
7C828346LR-RZC
22
49
0
0
Z56
Z56
R-CML
R-CML
7C828346LR-RZC
7C828346LR-RZC
50
47
0
0
Z56
Z56
R-CML
R-CML
7C828346LR-RZC
7C883462AR-RZC
50
48
0
0
790
0
ZA32
R-CML
7C62128JC-RZAI
ZA32
R-CML
7C62128JC-RZAI
Summary for 'Family' = ZA (2 detail records)
45
5
50
0
0
0
ZS324
T-TAIWAN
7C1019FC-TZSCB
44
0
ZS324
ZS324
T-TAIWAN
T-TAIWAN
7C1319GC-TZSI
7C1319GC-TZSC
50
49
0
0
ZS324
ZS324
T-TAIWAN
T-TAIWAN
7C1319GC-TZSC
7C1319GC-TZSC
1
48
0
0
ZS444
ZS444
R-CML
R-CML
7C1321GC-RZSC
7C1321GC-RZSC
43
50
0
0
ZS444
ZS544
R-CML
G-TAIWAN
7C1321GC-RZSC
7C1069AC-GQZSCB
45
49
0
0
ZS54A
T-TAIWAN
7C1061AC-GZSCB
Summary for 'Family' = ZS (10 detail records)
16
395
0
0
ZT28
R-CML
7C62256EC-RZTC
Summary for 'Family' = ZT (1 detail record)
44
44
0
0
Summary for 'Family' = Z (18 detail records)
TSOP I
TSOP II
TSOP (Pb-Free)
2005 Q1 RELIABILITY REPORT
Page 40 of 50
Product Reliability
Cypress
Buildkit
TSOP II (Pb-Free)
ZW444
Assy Site
G-TAIWAN
Device
7C62146EC-RZWI
ZW544
98 7C1069AC-GZWCB
Summary for 'Family' = ZW (2 detail records)
SS
Rej
FA
48
0
50
98
0
0
TSSOP (Pb-Free)
ZZ08
T-TAIWAN
7C80601AT-TZZC
44
0
ZZ16
ZZ24
ZZ24
T-TAIWAN
T-TAIWAN
T-TAIWAN
7C825823AC-TZZC
7C822313BC-TZZC
7C822313BC-TZZC
47
50
50
0
0
0
191
6,196
0
0
Summary for 'Family' = ZZ (4 detail records)
Grand Total
2005 Q1 RELIABILITY REPORT
Results
Page 41 of 50
Product Reliability
Cypress
TCT Summary
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
TQFP
A100
R-CML
C9TC
A100
R-CML
C9TC
A100
R-CML
C9TC
A100
R-CML
C9TC
A100
R-CML
C9TC
PZ08
Z-HANA
M1831C-ZZC
PZ08
Z-HANA
M1831C-ZZC
PZ08
Z-HANA
M1831C-ZZC
Summary for 'Family' = TQFP (8 detail records)
150C
150C
150C
150C
150C
125C
125C
125C
-65C
-65C
-65C
-65C
-65C
-55C
-55C
-55C
300
300
300
300
300
170
1000
500
30
30
30
40
21
50
50
50
301
0
0
0
0
0
0
0
0
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
PM45
Z-HANA
M9270C-ZJC
Summary for 'Family' = PLCC (11 detail records)
125C
125C
125C
125C
125C
125C
125C
125C
125C
125C
-55C
-55C
-55C
-55C
-55C
-55C
-55C
-55C
-55C
-55C
500
5000
1000
1500
1000
500
500
500
1000
1000
18
18
18
49
20
20
49
18
49
18
277
0
0
0
0
0
0
0
0
0
0
0
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
A100
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
50
48
50
50
45
46
50
50
45
50
50
48
46
50
50
49
43
34
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PLCC
TQFP
2005 Q1 RELIABILITY REPORT
GO-CHPMS
G-TAIWAN
G-TAIWAN
GO-CHPMS
R-CML
R-CML
RA-CML
R-CML
R-CML
R-CML
R-CML
R-CML
R-CML
R-CML
R-CML
R-CML
R-CML
R-CML
7C1347BC-GOACB
7C02893BC-GACB
7C1353BC-GACB
7C1347FC-GOACB
7C13542BC-RACB
713542BC-RACB
7C13542BC-RACB
7C1339BC-**RAIB
7C1339BC-**RAIB
7C1339BC-**RAIB
7C1347FC-RACB
7C1380CC-RACB
7C13803CC-RACB
7C1370EC-RACB
7R1380CC-RACB
7C1470AC-RACB
7C1470AC-RACB
7C1470AC-RACB
Page 42 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
TQFP
A100
R-CML
7C1470AC-RACB
A100
R-CML
7C1350GC-RAC
A100
G-TAIWAN
7B993AC-GAI
A32
SI-SIGNETI
7C829947AR-SIAC
A44
G-TAIWAN
8C27543AT-GAI
A44
G-TAIWAN
8C27543AT-GAI
A44
G-TAIWAN
8C26643DT-GAI
A44
G-TAIWAN
8C26643DT-GAI
A44
R-CML
7C37620BF-RAC
A52
Q-KOREA
7B9973AC-QAC
A52
Q-KOREA
7B9973AC-QACB
A52
SI-SIGNETI
7C8Z9973CI-SIAC
Summary for 'Family' = TQFP (30 detail records)
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
300
300
43
50
49
50
50
50
50
50
50
50
50
48
1,444
0
0
0
0
0
0
0
0
0
0
0
0
0
AS64
G-TAIWAN
7C4245AT-GASZCB
Summary for 'Family' = TQFP (10x10) (1 detail record)
150C
-65C
300
44
44
0
0
AT120
L-SEOL
7B9532BC-LATI
150C
Summary for 'Family' = TQFP (Thermal) (1 detail record)
-65C
300
50
50
0
0
AZ100
R-CML
7C1460BC-RAZC
150C
AZ128
G-TAIWAN
7C681000AC-GAZC
150C
AZ128
G-TAIWAN
7C681000AC-GAZC
150C
Summary for 'Family' = TQFP (Pb-Free) (3 detail records)
-65C
-65C
-65C
300
300
300
49
50
50
149
0
0
0
0
BA36
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
BA48
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
50
49
50
48
49
50
50
47
49
50
49
48
50
50
50
50
49
49
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TQFP (10x10)
TQFP (Thermal)
TQFP (Pb-Free)
FBGA (0.75-0.8)
2005 Q1 RELIABILITY REPORT
G-TAIWAN
RA-CML
RA-CML
RA-CML
RA-CML
G-TAIWAN
G-TAIWAN
RA-CML
G-TAIWAN
G-TAIWAN
G-TAIWAN
G-TAIWAN
T-TAIWAN
T-TAIWAN
T-TAIWAN
T-TAIWAN
T-TAIWAN
GO-CHPMS
7C62138CC-GBAI
7C621464BC-RABAI
7C621464BC-RABAI
7C621464BC-RABAI
7C62147DC-RABAI
7C62347CC-GBAIB
7C62347CC-GBAIB
7C62137CC-RABAI
7C62337BC-GBAI
7C62337BC-GBAI
7C62337BC-GBAI
7C1321GC-GBAI
7C62347CC-TBAI
7C62347CC-TBAI
7C62347CC-TBAI
7C62347CC-TBAI
7C62347CC-TBAI
7C623472CC-GKBAI
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
Page 43 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
FBGA (0.75-0.8)
BA48
G-TAIWAN
7C1069AC-GBAC
150C
BA48
G-TAIWAN
7C1069AC-GBAC
150C
BA48
G-TAIWAN
7C62147CC-GBAIB
150C
Summary for 'Family' = FBGA (0.75-0.8) (21 detail records)
-65C
-65C
-65C
300
300
300
50
50
50
1,037
0
0
0
0
BB100
G-TAIWAN
7B9291CC-GBBC
BB144
G-TAIWAN
7C08323AC-GBBC
BB144
G-TAIWAN
7C08323AC-GBBC
BB144
G-TAIWAN
7C08333AC-GBBC
BB165
G-TAIWAN
7C1313AC-GBBCB
BB165
G-TAIWAN
7C1313AC-GBBCB
BB165
G-TAIWAN
7R1371CC-GBBCB
BB165
G-TAIWAN
7R1371CC-GBBCB
BB165
G-TAIWAN
7R1371CC-GBBCB
BB165
G-TAIWAN
7C1470AC-GBBC
BB165
G-TAIWAN
7C1470AC-GBBC
BB165
G-TAIWAN
7C1470AC-GBBC
BB165
G-TAIWAN
7C1470AC-GBBC
BB165
G-TAIWAN
7C1470AC-GBBC
BB172
G-TAIWAN
7C08523AC-GBBCB
BB484
G-TAIWAN
7C08643AC-GBBCB
BB484
G-TAIWAN
7C08643AC-**GBBC
BB484
G-TAIWAN
7C08643AC-**GBBC
Summary for 'Family' = FBGA (1.0) (18 detail records)
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
49
50
50
48
47
43
50
50
50
45
50
48
48
49
41
50
50
50
868
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-65C
-65C
-65C
300
300
300
50
48
47
145
0
0
0
0
-65C
-65C
300
300
45
46
91
0
0
0
-65C
300
45
45
0
0
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
49
50
48
48
45
50
0
0
0
0
0
0
FBGA (1.0)
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
150C
PBGA (1.27)
BG119
G-TAIWAN
7C13732RC-GBGC
150C
BG272
G-TAIWAN
7C04301CC-GBGI
150C
BG272
G-TAIWAN
7C04301CC-GBGI
150C
Summary for 'Family' = PBGA (1.27) (3 detail records)
PBGA (Cavity/Heatsink)
BL256
G-TAIWAN
7B9254CC-GBLC
150C
BL256
G-TAIWAN
7B9254CC-GBLC
150C
Summary for 'Family' = PBGA (Cavity/Heatsink) (2 detail records)
FBGA (0.75-0.8, Pb-Free)
BP96
G-TAIWAN
7C8C864AC-GBPC
150C
Summary for 'Family' = FBGA (0.75-0.8, Pb-Free) (1 detail record)
FVBGA (0.75-0.8, 0.3mm)
BV48
G-TAIWAN
7C62127DC-GBVI
150C
BV48
R-CML
7C62167DC-GBVI
150C
BV48
R-CML
U0166B9AZ-**RABVI 150C
BV48
R-CML
U0166B9AZ-**RABVI 150C
BV48
G-TAIWAN
U0166B9AZ-**RABVI 150C
BV48
R-CML
7C62147EC-**GBVI
150C
2005 Q1 RELIABILITY REPORT
Page 44 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
FVBGA (0.75-0.8, 0.3mm)
BV48
RA-CML
K128K6C9BW-RABVI 150C
-65C
BV48
RA-CML
K256K6C9BW-RABVI 150C
-65C
BV48
Loc
7R62357DC-RABVI
150C
-65C
BV48
RA-CML
7R62357DC-RABVI
150C
-65C
BV48
RA-CML
7R62357DC-RABVI
150C
-65C
BV48
G-TAIWAN
7C62357DC-GBVIB
150C
-65C
BV48
G-TAIWAN
7R62357DC-GBVIB
150C
-65C
BV48
G-TAIWAN
7R62357DC-GBVIB
150C
-65C
BV48
G-TAIWAN
7C62167DC
150C
-65C
BV48
G-TAIWAN
7C62137CC-GBVI
150C
-65C
BV48
G-TAIWAN
7C62137CC-GBVI
150C
-65C
Summary for 'Family' = FVBGA (0.75-0.8, 0.3mm) (17 detail records)
FBGA (1.0, Pb-Free)
BW100
G-TAIWAN
7B9291CC-GBWC
150C
-65C
BW484
G-TAIWAN
7C39782AH-GBWC
150C
-65C
Summary for 'Family' = FBGA (1.0, Pb-Free) (2 detail records)
PBGA (1.27, Pb-Free)
BY119
G-TAIWAN
7R1370CC-GBYCB
150C
-65C
BY119
G-TAIWAN
7R1370CC-GBYCB
150C
-65C
BY388
G-TAIWAN
7C39485EH-GBYC
150C
-65C
Summary for 'Family' = PBGA (1.27, Pb-Free) (3 detail records)
VFBGA (0.75-0.8, Pb-Free)
BZ52
G-TAIWAN
7C82877A
150C
-65C
BZ52
G-TAIWAN
7C82877A
150C
-65C
Summary for 'Family' = VFBGA (0.75-0.8, Pb-Free) (2 detail records)
FLIPCHIP (Build-Up
FG388
GQ-KOREA
7C71050BJ-GQFGCB 125C
-55C
FG388
GQ-KOREA
7C71050BJ-GQFGCB 125C
-55C
FG388
GQ-KOREA
7C71050BJ-GQFGCB 125C
-55C
FG388
GQ-KOREA
7C71050BJ-GQFGCB 125C
-55C
FG388
GQ-KOREA
7C71050BJ-GQFGCB 125C
-55C
FG388
GQ-KOREA
7C71050BJ-GQFGCB 125C
-55C
Summary for 'Family' = FLIPCHIP (Build-Up Substrate w/ HS) (6 detail
PLCC
J52
O-INDNS
7C131GT-OJC
150C
-65C
J52
O-INDNS
7C146GT-OJC
150C
-65C
J52
M-PHIL
7C136HT-MJIB
150C
-65C
J84
M-PHIL
7C025DT-MJCB
150C
-65C
Summary for 'Family' = PLCC (4 detail records)
QFN (Punch Type)
LF48
L-SEOL
8C27643AT-LLFI
150C
-65C
LF5
L-SEOL
7C65640CC-LLFC
150C
-65C
LF56
L-SEOL
7C680135EC-LLFC
150C
-65C
LF56
L-SEOL
7C56540CC-LLFC
150C
-65C
2005 Q1 RELIABILITY REPORT
Cycles
SS
Rejs
300
300
300
300
300
300
300
300
300
300
300
47
49
45
50
48
32
48
46
50
50
43
798
0
0
0
0
0
0
0
0
0
0
0
0
300
300
50
50
100
0
0
0
300
300
300
45
50
48
143
0
0
0
0
300
300
47
46
93
0
0
0
1000
500
500
1000
500
1000
52
47
48
48
52
47
294
45
45
50
50
190
0
0
0
0
0
0
0
0
0
0
0
0
47
50
50
50
0
0
0
0
300
300
300
300
300
300
300
300
FA
Results
Page 45 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
QFN (Punch Type)
LF56
L-SEOL
7C680135EC-LLFC
150C
-65C
LF56
T-TAIWAN
7C66113GT-TLFC
150C
-65C
LF56
T-TAIWAN
7C68000AC-TLFC
150C
-65C
LF56
T-TAIWAN
7C68000AC-TLFC
150C
-65C
LF56
T-TAIWAN
7C68000AC-TLFC
150C
-65C
LF56
T-TAIWAN
7C68000AC-TLFC
150C
-65C
Summary for 'Family' = QFN (Punch Type) (10 detail records)
QFN (Punch Type, Pb-Free)
LY48
L-SEOL
7B6934AC-LLYC
150C
-65C
LY48
L-SEOL
7B6934AC-LLYC
150C
-65C
LY48
L-SEOL
7B6934AC-LLYC
150C
-65C
Summary for 'Family' = QFN (Punch Type, Pb-Free) (3 detail records)
PQFP
N52
G-TAIWAN
7C136GT-GNC
150C
-65C
N52
G-TAIWAN
7C136GT-GNC
150C
-65C
Summary for 'Family' = PQFP (2 detail records)
SSOP
O20
M-PHIL
7C826580AT-MOC
150C
-65C
O28
T-TAIWAN
7C828400BC-TOC
150C
-65C
O28
T-TAIWAN
7C828400BC-TOC
150C
-65C
O28
T-TAIWAN
8C26443DT-TOI
150C
-65C
O483
R-CML
7C8349AT-ROC
150C
-65C
O483
R-CML
7C828342DR-ROC
150C
-65C
O483
R-CML
7C828342DR-ROC
150C
-65C
O483
R-CML
7C828342DR-ROC
150C
-65C
O483
R-CML
7C828342DR-ROC
150C
-65C
O483
R-CML
8C27643AT-ROI
150C
-65C
O483
R-CML
8C27643AT-ROI
150C
-65C
O483
RA-CML
P7C8323AT-RAOC
150C
-65C
O56
RA-CML
CY284KOTP
150C
-65C
O561
T-TAIWAN
7C828409DC-TOC
150C
-65C
O563
R-CML
7C68003AC-ROC
150C
-65C
O563
RA-CML
7C828409DC-RAOC
150C
-65C
O563
RA-CML
7C828409DC-RAOC
150C
-65C
O563
RA-CML
7C828409DC-RAOC
150C
-65C
O563
RA-CML
7C828409DC-RAOC
150C
-65C
Summary for 'Family' = SSOP (19 detail records)
PDIP
P183
X-ALPHA
7C63720AT-XPC
150C
-65C
P183
X-ALPHA
7C63720AT-XPC
150C
-65C
P283
O-INDNS
7C185JT-OPCB
150C
-65C
P286
O-INDNS
7C62256EC-OPC
150C
-65C
P286
O-INDNS
7C62256EC-OPC
150C
-65C
2005 Q1 RELIABILITY REPORT
300
300
300
300
300
300
50
50
49
50
49
50
495
0
0
0
0
0
0
0
300
300
300
50
50
50
150
0
0
0
0
300
300
50
50
100
0
0
0
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
50
45
49
50
50
43
44
39
43
50
48
50
46
47
50
47
50
50
50
901
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
300
300
300
300
300
50
50
50
50
50
0
0
0
0
0
Page 46 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
PDIP
P286
X-ALPHA
7C62256EC-XPC
P406
O-INDNS
7C63413CT-OPC
P486
X-ALPHA
7C132GT-XPC
P486
X-ALPHA
7C132GT-XPC
P486
X-ALPHA
7C132GT-XPC
P486
X-ALPHA
7C132GT-XPC
P486
X-ALPHA
8C26643DT-XPI
Summary for 'Family' = PDIP (12 detail records)
150C
150C
125C
125C
125C
125C
150C
-65C
-65C
-55C
-55C
-55C
-55C
-65C
300
300
5000
1000
1000
5000
300
50
45
0
50
49
0
48
492
0
0
S0815
M-PHIL
7C8531BM-MSC
150C
S0815
SI-SIGNETI
7C825814BR-SLSC
150C
S0815
SL-INDIA
7C825814BR-SLSC
150C
S0815
RA-CML
W18101CK-RASC
150C
S0815
RA-CML
W18101CK-RASC
150C
S0815
RA-CML
PW18001BK-RASC
150C
S0815
R-CML
P7C80723AT-RASC
150C
S1615
T-TAIWAN
7C83300DT-OSC
150C
S1615
M-PHIL
7C83300DT-MSC
150C
S1615
M-PHIL
7C83300DT-MSC
150C
S1615
M-PHIL
7C80727AT-MSC
150C
S1615
M-PHIL
7C80727AT-MSC
150C
S183
M-PHIL
7C63720AT-MSC
150C
S183
RA-CML
P7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S183
RA-CML
7C63720AT-RASC
150C
S203
O-INDNS
8C26233DT-OSI
150C
S203
R-CML
7C63001GT-RSC
150C
S243
O-INDNS
7B9910AT-OSC
150C
S283
O-INDNS
7C185NT-OSC
150C
S3245
R-CML
7C62128HC-RSC
150C
S3245
R-CML
7C62128HC-RSI
150C
Summary for 'Family' = SOIC (GullWing) (27 detail records)
SOIC (Gull Wing, Exposed
SE283
M-PHIL
7B6934AC-MSEC
150C
SE283
M-PHIL
7B6934AC-MSEC
150C
SE283
M-PHIL
7B6934AC-MSEC
125C
SE283
M-PHIL
7B6934AC-MSEC
125C
SE286
M-PHIL
7B6934AC-MSEC
150C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
50
50
48
50
44
45
47
45
49
50
49
48
45
50
50
50
50
50
50
50
50
50
50
45
45
50
50
1,310
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-65C
-65C
-55C
-55C
-65C
300
300
100
162
300
50
50
49
50
45
0
0
0
0
0
0
0
0
0
SOIC (GullWing)
2005 Q1 RELIABILITY REPORT
Page 47 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
SOIC (Gull Wing, Exposed
SE286
M-PHIL
7B6934AC-MSEC
150C
-65C
SE286
334 7B6934AC-MSEC
150C
-65C
Summary for 'Family' = SOIC (Gull Wing, Exposed Pad) (7 detail records)
SOIC (GullWing, 450
SN283
R-CML
7C62256EC-RSNC
150C
-65C
SN283
R-CML
7C62256EC-RSNI
150C
-65C
SN283
O-INDNS
7C622563EC-OSNC
150C
-65C
SN283
O-INDNS
7C6264NT-OSNC
150C
-65C
Summary for 'Family' = SOIC (GullWing, 450 footprint) (4 detail records)
SSOP (Pb-Free)
SP16
M-PHIL
W198BF-MSPC
150C
-65C
SP16
M-PHIL
W198BF-MSPC
150C
-65C
SP20
T-TAIWAN
8C21334AT-TSPI
150C
-65C
SP28
M-PHIL
W40S111DF-MSPC
150C
-65C
SP483
RA-CML
7C8405EC-RASPC
150C
-65C
SP563
R-CML
7C8CRS480BC-RSP
150C
-65C
SP563
R-CML
7C828437AC-RSPC
150C
-65C
SP563
R-CML
7C682020AC-RSPC
150C
-65C
SP563
R-CML
7C682005AC-RSPC
150C
-65C
SP563
R-CML
7C682020AC-RSPC
150C
-65C
Summary for 'Family' = SSOP (Pb-Free) (10 detail records)
QSOP (Pb-Free)
SQ24
R-CML
7C63740AT-RSQC
150C
-65C
Summary for 'Family' = QSOP (Pb-Free) (1 detail record)
SOIC (GullWing, 450
SY28
50 7C62256EC-RSYC
150C
-65C
Summary for 'Family' = SOIC (GullWing, 450 footprint, Pb-Free) (1 detail
SOIC (GullWing, Pb-Free)
SZ3245
R-CML
7C62142EC-RSZI
150C
-65C
SZ815
M-PHIL
7C80330AT-MSZC
150C
-65C
SZ815
M-PHIL
7C83500DT-MSZC
150C
-65C
SZ815
R-CML
7C80722AT-RASZC
150C
-65C
Summary for 'Family' = SOIC (GullWing, Pb-Free) (4 detail records)
SOIC (J lead)
V243
O-INDNS
7C1975MC-OVC
150C
-65C
V283
R-CML
7C1399HC-RVI
150C
-65C
V323
R-CML
7C188BT-RVCB
150C
-65C
V324
R-CML
7C1319GC-RVC
150C
-65C
V324
O-INDNS
7C1019FC-OVCB
150C
-65C
V324
O-INDNS
7C1319FC-OVCB
150C
-65C
V324
O-INDNS
7C109MC-OVC
150C
-65C
V364
R-CML
7C1349CC-RVCB
150C
-65C
V364
R-CML
7C1549CC-RVIB
150C
-65C
2005 Q1 RELIABILITY REPORT
Cycles
SS
Rejs
300
300
45
45
334
0
0
0
300
300
300
300
50
50
50
45
195
0
0
0
0
0
300
300
300
300
300
300
300
300
300
300
49
50
45
50
45
48
45
50
45
50
477
0
0
0
0
0
0
0
0
0
0
0
300
50
50
0
0
300
50
50
0
0
300
300
300
300
50
48
50
47
195
0
0
0
0
0
300
300
300
300
300
300
300
300
300
50
50
50
50
45
45
50
50
43
0
0
0
0
0
0
0
0
0
FA
Results
Page 48 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
SOI (J Lead)
V364
R-CML
7C1349FC-RVI
150C
V444
R-CML
7C1021FC-RVC
150C
V444
R-CML
7C1321GC-RVC
150C
Summary for 'Family' = SOIC (J lead) (12 detail records)
SOIC (J lead, Pb-Free)
R-CML
7C1321GC-RVZC
150C
Summary for 'Family' = SOIC (J lead, Pb-Free) (1 detail record)
TSOP/ TSSOP
Z16
M-PHIL
7C841400AT-MZI
150C
Z16
M-PHIL
7C841400AT-MZI
150C
Z16
M-PHIL
7C84100AT-MZC
150C
Z16
M-PHIL
7C84100AT-MZC
150C
Z16
T-TAIWAN
7C80726AT-TZC
150C
Z16
T-TAIWAN
7C841400AT-TZC
150C
Z16
T-TAIWAN
7C83900AT-TZC
150C
Z16
T-TAIWAN
7C83900AT-TZC
150C
Z24
RA-CML
7C822313BC-RAZC
150C
Z24
RA-CML
7C822313BC-RAZC
150C
Z24
RA-CML
7C822313BC-RAZC
150C
Z28
R-CML
7C62256EC-RZC
150C
Z28
R-CML
7C1399HC-RZC
150C
Z32
GQ-KOREA
7C62128JC-GQZCB
150C
Z32
T-TAIWAN
7C62128HC-TZC
150C
Z32
T-TAIWAN
7C62128JC-TZI
150C
Z48
R-CML
7C828339AR-RZC
150C
Z48
G-TAIWAN
7C62164DC-GZIB
150C
Z48
G-TAIWAN
7C62164DC-GZIB
150C
Z48
G-TAIWAN
7C62164DC-GZIB
150C
Z56
R-CML
7C828409DC-RZC
150C
Z56
R-CML
7C828409FC-RZC
150C
Z56
R-CML
7C828409DC-RZC
150C
Z56
R-CML
7C828346LR-RZC
150C
Z56
R-CML
7C828346LR-RZC
150C
Z56
R-CML
7C828346LR-RZC
150C
Z56
R-CML
7C828346LR-RZC
150C
Z56
R-CML
7C828346LR-RZC
150C
Z56
R-CML
7C828346LR-RZC
150C
Z56
R-CML
7C883462AR-RZC
150C
Z56
R-CML
7C883462AR-RZC
150C
Z56
R-CML
7C883462AR-RZC
150C
Summary for 'Family' = TSOP/ TSSOP (32 detail records)
2005 Q1 RELIABILITY REPORT
-65C
-65C
-65C
300
300
300
50
50
50
583
0
0
0
0
-65C
300
50
50
0
0
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
50
49
49
50
46
45
50
50
45
45
45
50
49
47
50
50
47
45
45
45
49
50
50
50
50
49
50
50
50
49
50
49
1,548
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Page 49 of 50
Product Reliability
Cypress
BldKit
Assy Site
Device
Condition
Cycles
SS
Rejs
FA
Results
TSOP I
Z28
R-CML
7C62128JC-RZAI
150C
Summary for 'Family' = TSOP I (1 detail record)
TSOP (Exposed Pad)
ZE20
M-PHIL
7C8A1083AT-MZEC
150C
ZE20
M-PHIL
7C8A103AT-MZEC
150C
ZE20
M-PHIL
7C8A103AT-MZEC
150C
ZE20
M-PHIL
7C8A103AT-MZEC
150C
ZE20
M-PHIL
7C8A103AT-MZEC
150C
Summary for 'Family' = TSOP (Exposed Pad) (5 detail records)
TSOP II
ZS32
T-TAIWAN
7C1019FC-TZSCB
150C
ZS32
T-TAIWAN
7C1319GC-TZSI
150C
ZS32
T-TAIWAN
7C1319GC-TZSC
150C
ZS32
T-TAIWAN
7C1319GC-TZSC
150C
ZS44
R-CML
7C1321GC-RZSC
150C
ZS44
Loc
7C1321GC-RZSC
150C
ZS44
R-CML
7C1321GC-RZSC
150C
ZS44
R-CML
7C2157DC-RZSI
150C
ZS54
G-TAIWAN
7C1069AC-GQZSCB
150C
ZS54
T-TAIWAN
7C1061AC-GZSCB
150C
Summary for 'Family' = TSOP II (10 detail records)
TSOP (Pb-Free)
ZT28
R-CML
7C62256EC-RZTC
150C
Summary for 'Family' = TSOP (Pb-Free) (1 detail record)
TSOP II (Pb-Free)
ZW44
R-CML
7C62146EC-RZWI
150C
ZW54
G-TAIWAN
7C1069AC-GZWC
150C
ZW54
G-TAIWAN
7C1069AC-GZWCB
150C
Summary for 'Family' = TSOP II (Pb-Free) (3 detail records)
TSSOP (Pb-Free)
ZZ08
T-TAIWAN
7C80601AT-TZZC
150C
ZZ16
T-TAIWAN
7C825823AC-TZZC
150C
ZZ16
T-TAIWN
7C822382AT-TZZC
150C
ZZ24
T-TAIWAN
7C822313BC-TZZC
150C
ZZ24
T-TAIWAN
7C822313BC-TZZC
150C
ZZ56
R-CML
7C828411DC-RZZC
150C
ZZ56
R-CML
7C828411DC-RZZC
150C
ZZ56
R-CML
7C828411DC-RZZC
150C
Summary for 'Family' = TSSOP (Pb-Free) (8 detail records)
Grand Total
2005 Q1 RELIABILITY REPORT
-65C
300
50
50
0
0
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
46
50
49
49
49
243
0
0
0
0
0
0
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
300
300
44
50
50
49
50
50
49
45
50
49
486
0
0
0
0
0
0
0
0
0
0
0
-65C
300
49
49
0
0
-65C
-65C
-65C
300
300
300
50
48
49
147
0
0
0
0
-65C
-65C
-65C
-65C
-65C
-65C
-65C
-65C
300
300
300
300
300
300
300
300
50
48
50
50
50
50
50
49
397
14,371
0
0
0
0
0
0
0
0
0
0
Page 50 of 50