CYPRESS QUALITY & RELIABILITY 2000 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination 4.0 PROCESS ENVIRONMENTAL TESTS 4.1 Pressure Cooker Test (PCT) 4.2 Highly Accelerated Stress Test (HAST) 4.3 Temperature Cycle Test (TC) Note: All the results reported here are for Quarter 2 2000. TOTAL QUALITY CYPRESS QUALITY & RELIABILITY 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM This report summarizes Cypress Semiconductor Product Reliability for the 2nd quarter of 2000. Cypress Semiconductor has established aggressive reliability objectives to assure that all products exhibit reliability which exceeds customer reliability requirements for purchased components. In addition, the quality standard at Cypress is zero defects which results in a culture requiring continuous improvement in quality and reliability. This report includes data from product fabricated at the San Jose, California; Round Rock, Texas; and Bloomington, Minnesota facilities. Product reliability is assured by a total quality management system. The quality management system is described in detail in the Cypress Semiconductor Quality Manual (Cypress Semiconductor Document Number 90-00001). Key reliability-related programs of the total quality management system are: (1) design rule review and approval; (2) control of raw materials and vendor quality; (3) manufacturing statistical process controls; (4) manufacturing identification of "Maverick Lot" yield limits; (5) formal training and certification of manufacturing personnel; (6) qualification of new products and manufacturing processes; (7) continuous reliability monitoring; (8) formal failure analysis and corrective action; and (9) competitive benchmarking. Product Reliability data is accumulated as a result of new product Qualification Test Plan activities (Cypress Semiconductor Document Number 25-00040) as well as from the Reliability Monitor Program (Cypress Semiconductor Document Number 25-00008). All reliability test samples are obtained from standard production material. Sample selection is based on generic product families. These generic products are designed with very similar design rules and manufactured from a core set of processes. Reliability strategy requires that every failure which occurs during reliability testing be subjected to failure analysis (Cypress Semiconductor Document Number 25-00039) to determine the failure mechanism. Corrective action is then implemented to prevent future failures. The result is continuous improvement in product reliability. Copies of the Cypress Semiconductor documents referenced herein are available through your Cypress Semiconductor sales representative. Questions about product reliability may be addressed to the undersigned. Director of Reliability Director of Quality Cypress Semiconductor Corporation 3901 North First Street San Jose, CA 95134-1599 Cypress Quality Fax: (408) 943-2165 ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- QUALITY & RELIABILITY CYPRESS 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination High Temperature Operating Life testing (HTOL), for as long as 96 hours, is used to estimate device early failure rate. Test: High Temperature Operating Life Test (HTOL) Conditions: Dynamic Operating Conditions, VCC up to VCC, nominal + 15%, 150°C or 125°C. Duration: Early Failure Rate samples are tested between 48 hours HTOL at 150°C (EFR) or up to 96 hours at 125°C (EFR2). Failure: A failure is any device that fails to meet data sheet electrical requirements. Fit Rate: Derated to 55° C ambient, with 60% upper confidence bound for 0 failures, Ea =0.7ev Early Failure Rate Summary Technology Hynix P26 P26 Ram 2 Ram 3 Ram 4 Ram 5 TSMC L28 Device hours 100992 449904 1605192 262538 4206978 # Failed FIT Rate 0 0 0 0 5 53.4 12 3.4 3738918 11 17.3 0 30.1 178944 7 Failure Mode None None None None Particle Defect, Single bit Poly particle defect, Single bit None Note: Data reported is a 4 quarter rolling average. 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination A High Temperature Operating Life test (HTOL) is used to estimate long term reliability. By operating the devices at accelerated temperature and voltage, hundreds of thousands of use hours can be compressed into hundreds of test hours. Test: High Temperature Operating Life Test (HTOL) Conditions: Dynamic Operating Conditions, VCC up to VCC, nominal + 15% 150°C or 125°C Duration: A minimum of 80 hours at 150°C or 168 hours at 125°C. Tested to 500 hours at 150°C or 1000 hours at 125°C. Failure: A failure is any device that fails to meet data sheet electrical requirements. Fit Rate: Derated to 55° C ambient, with 60% upper confidence bound for 0 failures, Ea =0.7ev Long Term Failure Rate Summary Technology CMOS FL28 HYNIX 0.35 Device Hours @150°c 115000 141896 226160 # Failed 0 0 0 FIT Failure Mode 46.7 38 23.8 None None None QUALITY & RELIABILITY CYPRESS HYNIX P26 P20 P26 Ram 2 Ram 3 Ram 4 Ram 5 258480 154300 69600 1156536 1132432 2326998 4767403 0 0 0 2 2 2 11 20.9 34.9 77.4 10.2 10.4 5.1 13.6 TSMC 0.5 TSMC L28 58320 171240 0 0 92.4 31.5 None None None EOS EOS Single bit Particle contamination and poly defects in fab, None None Note: Data reported is a 4 quarter rolling average. 4.0 PROCESS ENVIRONMENTAL TESTS Cypress Semiconductor Reliability qualifies and continuously monitors packaging reliability to ensure exceptional resistance to environmental stress. Package reliability stress testing and failure rates are summarized in the following section. 4.1 Pressure Cooker Test (PCT) Test: Pressure Cooker Test (PCT) Conditions: 15 PSIG, 121°C, No bias, for a minimum of 168 hours. Pre-Conditioning: 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading to qualified MSL level Purpose: The Pressure Cooker Test is a highly accelerated packaging stress test used to ensure environmental durability of epoxy packaged parts. Passivation cracks, ionic contamination and corrosion susceptibility are all accelerated by this stress. Failure: A failure is any device that fails to meet data sheet electrical requirements. Pressure Cooker Test Failure Rate Summary Package # Failed TQFP PPGA Sample Size 2488 849 Defects % Failure Mode None None 0 0 0 0 PLCC 2219 4 0.18 Corrosion PQFP PDIP SSOP SOIC SOJ TSOP 280 446 865 1165 1513 1282 0 0 0 3 0 0 0 0 0 0.25 0 0 None None None Wedge Cut None None Note: Data reported is a 4 quarter rolling average. 4.2 Highly Accelerated Stress Test (HAST) Cypress uses HAST to accelerate temperature, humidity, bias failure mechanisms. This change was necessary because our package reliability had improved to the point where the old 85°C/85% R.H. QUALITY & RELIABILITY CYPRESS temperature-humidity-bias testing would not induce failures. Failures are necessary to judge progress and compare packaging changes. HAST testing has been shown to be at least twenty times more accelerated then 85°C/85% R.H. temperature-humidity-bias testing. Test: Conditions: Highly Accelerated Stress Test (HAST) Present Conditions: 130°C / 85% minimum power dissipation, for a minimum of 128 hours. Pre-Conditioning: 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading to qualified MSL level Purpose: HAST is an accelerated biased humidity test that provides an acceleration of at least 20 over 85°C/85% R.H. temperature-humidity bias testing. This test provides rapid feedback regarding the quality of the epoxy package process. Failure: A failure is any device that fails to meet data sheet electrical requirements. Highly Accelerated Stress Test (HAST) Failure Rate Summary Package TQFP PPGA PLCC PQFP PDIP SSOP SOIC SOJ Sample Size 1199 695 1245 149 45 526 794 1513 TSOP 223 Failure Defects % 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0.06 1 0.12 Failure Mode None None None None None None None Lifted ball bond Corroded metallization Note: Data reported is a 4 quarter rolling average. 4.3 Temperature Cycle Test (TC) Differences in thermal expansion coefficients are accentuated by cycling devices through temperature extremes. If the materials do not expand and contract equally, large stresses can develop. Test: Condition: Pre-Condition: Purpose: Duration: Failure: Temperature Cycle MIL-STD-883D, Method 1010, Condition C, -65°C to 150°C. JEDEC 22-A104 Condition B, -40°C to 125°C 5 cycles Temperature Cycles –65/+150, 24 hr Bake 125°C, Moisture loading to qualified MSL level The Temperature Cycle test stresses mechanical integrity by exposing a device to alternating temperature extremes. Weakness and thermal expansion mismatches in die interconnections, die attach, and wire bonds are often detected with this acceleration test. 300 cycles minimum at Condition C, 1000 cycles at Condtion B A failure is any device that fails to meet data sheet electrical requirements. QUALITY & RELIABILITY CYPRESS Temperature Cycling Failure Rate Summary Package TQFP PPGA PLCC PDIP PQFP SSOP SOIC SOJ TSOP Sample Size 2463 2279 1892 319 374 1030 1208 2428 2314 # Failed Defects % 2 0 0 1 0 0 0 0 0 Note: Data reported is a 4 quarter rolling average. 0.08 0 0 0.31 0 0 0 0 0 Failure Mode Wedge cut None None Top side crack None None None None None