Document No. 002-03343 Rev. ** ECN #: 4916295 Cypress Semiconductor Product Qualification Report QTP#152102 VERSION** September 2015 FingerPrint1 Device Family S8PFHD-10R Technology, Fab 4 CMI CYFPA1I FINGERPRINT GENERATION 1 PROGRAMMABLE SYSTEM-ON-CHIP (PSOC®) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos (HSTO) Reliability Engineer Reviewed By: Zhaomin Ji (ZIJ) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 PRODUCT QUALIFICATION HISTORY QTP Number 083401 113905 123502 144805 152006 152102 Description of Qualification Purpose Qualify SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC Krypton Device Qualify device 8C20400BC S8P12-10P Technology Fabricated at Fab4 (CMI) Qualification of PSoC4A Device 8C44200AC, S8PF-10R Technology in CMI (Fab 4) Qualification of PSoC4A-M Device 8C46000A, S8PFHD-10P Technology in CMI (Fab4) Qualification of CTM1 and MM1 Mask Changes on PSoC4A-M Qualification of FingerPrint Generation 1 (FPG1) device 8C2F100A / 8F2F100A, , S8PFHD-10R Technology in CMI (Fab4) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 22 Date Jan 09 Jan 12 Apr 13 May 15 Jun 15 Aug 15 Document No. 002-03343 Rev. ** ECN #: 4916295 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualification of FingerPrint Generation 1 (FPG1) device 8C2F100A / 8F2F100A, , S8PFHD-10R Technology in CMI (Fab4) Marketing Part #: CYFPA1I Device Description: 1.8V core, Commercial/ Industrial Fingerprint Generation 1 Programmable IC (KGD) Cypress Division: Cypress Semiconductor – Programmable Systems Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Passivation Type and Thickness: Metal Composition: Metal 1: 100Å Ti / 3200Al – 0.5%Cu / 300Å TiW Metal 2: 100Å Ti / 3200Al – 0.5%Cu / 350Å TiW Metal 3: 150Å Ti / 7200Al – 0.5%Cu / 350Å TiW Metal 4: 150Å Ti / 7200Al – 0.5%Cu / 350Å TiW Metal 5: 300Å CoTi / 12,000Al –0.5%Cu/ 300Å TiW 1K Oxide/ 6K Nitride Generic Process Technology/Design Rule (-drawn): S8 / 0.13u Gate Oxide Material/Thickness (MOS): SiO2 / 32A & SiO2 / 120A Name/Location of Die Fab (prime) Facility: Fab 4, CMI-Minnesota Die Fab Line ID/Wafer Process ID: S8PFHD-10R PACKAGE AVAILABILITY PACKAGE WIRE MATERIAL ASSEMBLY FACILITY SITE QTP NUMBER N/A – Die Sales N/A – Die Sales CML-R N/A – Die Sales Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: TQFP Package Outline, Type, or Name: 10X10X1.4MM 64L TQFP / 51-85051 Mold Compound Name/Manufacturer: SUMITOMO G631H Mold Compound Flammability Rating: UL 94 V-0 Mold Compound Alpha Emission Rate: Oxygen Rating Index: >28% Lead Frame Designation: n/a (not low alpha) 54% AY64 Lead Frame Material: Cu Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Hitachi Die Attach Material: FH-900 DAF Bond Diagram Designation 001-95176 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil CuPd Thermal Resistance Theta JA C/W: 56.04C/ Package Cross Section Yes/No: No Assembly Process Flow: 001-89431 Name/Location of Assembly (prime) facility: ASE MSL Level 3 Reflow Profile 260 ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 200C, 4hrs MIL-STD-883, Method 883-2011 Acoustic Microscopy Age Bond Strength Bond Pull MIL-STD-883 – Method 2011, Electrostatic Discharge Charge Device Model (ESD-CDM) Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Machine Model (ESD-MM) 150°C, No Bias JESD22-A117 and JESD22-A103 Test to determine the existence and extent of cracks, Criteria: No Package Crack 125°C, 8.5V JESD78 500V/1,000V/1,250V JESD22-C101 1,100V/1,600V/2,200V /3,300V JESD22, Method A114 200V, 220V, 275V, 330V JESD22-A115 Endurance Test MIL-STD-883, Method 883-1033/ JESD22-A117 Data Retention Dye Penetrant Test Dynamic Latch-up High Accelerated Saturation Test (HAST) High Temperature Operating Life Early Failure Rate High Temperature Operating Life Early Failure Rate, Regulator On High Temperature Operating Life Latent Failure Rate High Temperature Steady State life JEDEC STD 22-A110: 130°C, 85% RH, 5.25V/5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Dynamic Operating Condition, Vcc Max=2.1V/2.07V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=5V, 125°C/150°C Dynamic Operating Condition, Vcc Max=2.07V/6V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=2.1V/2.07V, 150°C JESD22-A-108 Static Operating Condition, Vcc Max=2.1V, 150°C JESD22-A-108 Result P/F P P P P P P P P P P P P P P P Internal Visual MIL-STD-883-2014 P Low Temperature Operating Life Dynamic Operating Condition, -30°C, 2.1V JESD22-A108 P Low Temperature Storage Life -40°C, No Bias P Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P SEM Analysis MIL-STD-883, Method 2018 P Static Latch-up Temperature Cycle Thermal Shock 85C/125C, +/-140mA 85C, +/-180mA 85C, +/- 200mA JESD 78 MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and JESD22-A106, Condition C, -55°C to 125°C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 22 P P P Document No. 002-03343 Rev. ** ECN #: 4916295 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 1,550 Devices 0 N/A N/A 0 PPM 1 High Temperature Operating Life Long Term Failure Rate 838,000 DHRs 0 0.7 170 6 FIT 2 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 1 Early Failure Rate was computed from QTPs 152102 2 Long Term Failure Rate was computed from QTPs 083401, 113905, 123502, 144805 and 152102 LFR Data. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP COMP3 0 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex 6 0 COMP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 STRESS: ESD-MACHINE MODEL, (220V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 STRESS: ESD-MACHINE MODEL, (275V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 STRESS: ESD-MACHINE MODEL, (330V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 8 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. 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Page 9 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data ER114031 Device Fab Lot # Assy Lot # Assy Lot Duration Samp 1000 100 Rej Failure Mechanism STRESS: LOW TEMPERATURE STORAGE, -40C, No Bias CY8C20236A (8C202662A) 4137730 611155459 L-KOREA 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 10 0 STRESS: BOND PULL STRESS: DATA RETENTION, 150C CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 80 0 4130520 611147744 G-TAIWAN COMP 15 0 4130520 611147744 G-TAIWAN 168 80 0 CML-RA COMP 9 0 COMP 3 0 COMP 8 0 STRESS: DYE PENETRANT TEST CY8CTMA443 (8C20401A) STRESS : ENDURANCE CY8CTMA443 (8C20401A) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA443 (8C20401B) 4140358 611153802 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (1100V) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (1600V) CY8CTMA443 (8C20401B) 4140358 611153801 CML-RA STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 128 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 128 78 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8CTMA443 (8C20401A) 4130520 611147745 G-TAIWAN 48 45 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 12 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 48 1492 0 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 1074 2 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 418 1 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4141585 611156224 G-TAIWAN 48 1500 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 48 1000 0 CY8CTMA443 (8C20401A) 4131142 611148870 G-TAIWAN 48 500 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 80 116 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 116 0 4130520 611147744 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY8CTMA443 (8C20401A) STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 168 77 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 288 77 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 288 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 288 80 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 500 83 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 1000 83 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 79 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 79 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 1000 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: THERMAL SHOCK (COND. B, -55C TO 125C) CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 200 80 0 G-TAIWAN COMP 2 0 COMP 6 0 STRESS: THERMAL JUNCTION MEASUREMENT CY8CTMA443 (8C20401A) 4130520 611147744 STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 123502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION, PLASTIC, 150C CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 500 70 0 CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 1000 70 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 168 80 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 500 80 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C4245 (8CC44200A) 4251883 611302905 TAIWAN-G COMP 9 0 CY8C4245 (8CC44200A) 4251883 611303718 TAIWAN-G COMP 9 0 CY8C4245 (8CC44200A) 4251883 611302173 CML-RA COMP 9 0 611302905 TAIWAN-G COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (1000V) CY8C4245 (8CC44200A) 4251883 CY8C4245 (8CC44200A) 4251883 611303718 TAIWAN-G COMP 3 0 CY8C4245 (8CC44200A) 4251883 611302173 CML-RA COMP 3 0 611302905 TAIWAN-G COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (1250V) CY8C4245 (8CC44200A) 4251883 CY8C4245 (8CC44200A) 4251883 611303718 TAIWAN-G COMP 3 0 CY8C4245 (8CC44200A) 4251883 611302173 CML-RA 3 0 9 0 TAIWAN-G COMP 3 0 TAIWAN-G COMP 6 0 TAIWAN-G COMP 2 0 TAIWAN-G COMP 2 0 COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C4245 (8CC44200A) 4251883 611302905 TAIWAN-G COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: STATIC LATCH-UP (85C, 140mA) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: STATIC LATCH-UP (85C, 180mA) CY8C4245 (8CC44200A) 4251883 611302905 STRESS: STATIC LATCH-UP (125C, 140mA) CY8C4245 (8CC44200A) 4251883 611302905 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 123502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C4245 (8CC44200A) 4251883 611303750 TAIWAN-G 48 189 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 48 1111 0 CY8C4245 (8CC44200A) 4251883 611307128N TAIWAN-G 48 1093 0 CY8C4245 (8CC44200A) 4251883 611308275 TAIWAN-G 48 1049 0 CY8C4245 (8CC44200A) 4251883 611308282 TAIWAN-G 48 1049 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 2.07V, Vcc Max) CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 48 39 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 80 151 0 CY8C4245 (8CC44200A) 4251883 611302906 TAIWAN-G 500 151 0 TAIWAN-G COMP 32 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CY8C4245 (8CC44200A) 4251883 611303750 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 168 77 0 CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 500 77 0 CY8C4245 (8CC44200A) 4251883 611301729 TAIIWAN-G 1000 76 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 144805 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN COMP 15 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 48 50 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C4247AZI (8CP46002AC) STRESS: 4452162 611506313 G-TAIWAN 48 1506 0 ESD-CHARGE DEVICE MODEL CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 500 9 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 750 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 1000 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 1250 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 1500 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 1750 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 1100 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 2200 8 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 3300 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 4000 3 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 5000 3 0 611506313 G-TAIWAN 200 5 0 STRESS: ESD-CHARGE MACHINE MODEL CY8C4247AZI (8CP46002AC) 4452162 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 80 116 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 500 116 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 168 80 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 288 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 144805 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRE/POST LFR PARAMETER ASSESSMENT CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN COMP 10+2 0 611506313 G-TAIWAN COMP 6 0 611506313 G-TAIWAN COMP 3 0 611506313 G-TAIWAN COMP 3 0 611506313 G-TAIWAN COMP 3 0 STRESS: STATIC LATCH-UP (85C, 140mA) CY8C4247AZI (8CP46002AC) 4452162 STRESS: STATIC LATCH-UP (85C, 200mA) CY8C4247AZI (8CP46002AC) 4452162 STRESS: STATIC LATCH-UP (125C, 140mA) CY8C4247AZI (8CP46002AC) 4452162 STRESS: STATIC LATCH-UP (85C, 300mA) CY8C4247AZI (8CP46002AC) 4452162 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 500 80 0 CY8C4247AZI (8CP46002AC) 4452162 611506313 G-TAIWAN 1000 80 0 4452162 611506313 G-TAIWAN COMP EQUIVALENT 4452162 611506313 G-TAIWAN COMP EQUIVALENT 4452162 611506313 G-TAIWAN COMP EQUIVALENT YIELD: CLASS CY8C4247AZI (8CP46002AC) YIELD: E-TEST CY8C4247AZI (8CP46002AC) YIELD: SORT CY8C4247AZI (8CP46002AC) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 18 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 152006 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism YIELD: E-TEST CY8C4247AZI (8C46000AC) 4520468 N/A G-TAIWAN COMP EQUIVALENT 4520468 N/A G-TAIWAN COMP EQUIVALENT YIELD: SORT CY8C4247AZI (8C46000AC) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 19 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 152102 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ESD-CHARGE DEVICE MODEL CYFPA1EFR- (8CP2F1001AC) 4524636 611522431 CML-R 500 9 0 CYFPA1EFR- (8CP2F1001AC) 4524636 611522431 CML-R 750 3 0 CYFPA1EFR- (8CP2F1001AC) 4524636 611522431 CML-R 1000 3 0 CYFPA1EFR- (8CP2F1001AC) 4524636 611522431 CML-R 1250 3 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 500 9 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 750 3 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 1000 3 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 1250 3 0 700-00022- (700-00022) 4524636-09 4524636-09 L-AMKOR 500 9 0 700-00022- (700-00022) 4524636-09 4524636-09 L-AMKOR 750 3 0 700-00022- (700-00022) 4524636-09 4524636-09 L-AMKOR 1000 3 0 700-00022- (700-00022) 4524636-09 4524636-09 L-AMKOR 1250 3 0 700-00022- (700-00022) 4524636-09 4524636-09 L-AMKOR 1500 3 0 700-00022- (700-00022) 4524636-09 4524636-09 L-AMKOR 1750 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 1100 3 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 2200 8 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 3300 3 0 700-00021- (700-00021) 4524636-10 4524636-10 L-AMKOR 4000 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 2.07V, Vcc Max) CYFPA1EFR- (8CP2F1001AC) 4524636 611522431 CML-R 48 1550 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CYFPA1EFR- (8CP2F1001AC) 4451954 611504971 CML-R 80 123 0 CYFPA1EFR- (8CP2F1001AC) 4451954 611504971 CML-R 500 123 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 20 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Reliability Test Data QTP #: 152102 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYFPA1EFR- (8CP2F1001AC) 4502024 611513396 CML-R 168 160 0 CYFPA1EFR- (8CP2F1001AC) 4502024 611513396 CML-R 288 159 0 CYFPA1EFR- (8CP2F1001AC) 4502024 611513397 CML-R 168 160 0 CYFPA1EFR- (8CP2F1001AC) 4502024 611513397 CML-R 288 159 0 CYFPA1EFR- (8CP2F1001AC) 4502024 611513398 CML-R 168 160 0 CYFPA1EFR- (8CP2F1001AC) 4502024 611513398 CML-R 288 159 0 CML-R COMP 10+2 0 CML-R COMP 6 0 L-AMKOR COMP 6 0 CML-R COMP 3 0 L-AMKOR COMP 3 0 CML-R COMP 3 0 L-AMKOR COMP 3 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CYFPA1EFR- (8CP2F1001AC) 4451954 611504971 STRESS: STATIC LATCH-UP (+/-140mA 85C) CYFPA1EFR- (8CP2F1001AC) 4524636 700-00021- (700-00021) 4524636-10 4524636-10 611522431 STRESS: STATIC LATCH-UP (+/-200mA 85C) CYFPA1EFR- (8CP2F1001AC) 4524636 700-00021- (700-00021) 4524636-10 4524636-10 611522431 STRESS: STATIC LATCH-UP (+/-140mA 125C) CYFPA1EFR- (8CP2F1001AC) 4524636 611522431 700-00021- (700-00021) 4524636-10 4524636-10 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CYFPA1EFR- (8CP2F1001AC) 4451954 611504971 CML-R 500 80 0 CYFPA1EFR- (8CP2F1001AC) 4451954 611504971 CML-R 1000 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 21 of 22 Document No. 002-03343 Rev. ** ECN #: 4916295 Document History Page Document Title: Document Number: QTP#152102: FINGERPRINT1 DEVICE FAMILY "CYFPA1I" S8PFHD-10R TECHNOLOGY, FAB 4 CMI 002-03343 Rev. ECN Orig. of No. Change ** 4916295 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 22 of 22