CY2XL11:100 MHz LVDS Clock Generator

CY2XL11
100 MHz LVDS Clock Generator
100 MHz LVDS Clock Generator
Features
Functional Description
■
One low-voltage differential signaling (LVDS) output pair
■
Output frequency: 100 MHz
■
External crystal frequency: 25 MHz
■
Low RMS phase jitter at 100 MHz, using 25 MHz crystal
(637 kHz to 10 MHz): 0.53 ps (typical)
■
Pb-free 8-Pin TSSOP package
■
Supply voltage: 3.3 V or 2.5 V
■
Commercial temperature range
The CY2XL11 is a PLL based high performance clock generator
with a crystal oscillator interface and one LVDS output pair. It is
optimized to generate PCI Express, FC, and other highperformance clock frequencies. It also produces an output
frequency that is four times the crystal frequency. It uses
Cypress’s low-noise VCO technology to achieve less than 1 ps
typical RMS phase jitter, that meets high-performance systems’
jitter requirements.
For a complete list of related documentation, click here.
Logic Block Diagram
XIN
External
Crystal
Crystal
Oscillator
Output
Divider
Low-Noise PLL
CLK
CLK#
XOUT
OE
Cypress Semiconductor Corporation
Document Number: 001-42886 Rev. *H
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised November 28, 2014
CY2XL11
Contents
Pinouts .............................................................................. 3
Pin Definitions .................................................................. 3
Frequency Table ............................................................... 4
Absolute Maximum Conditions ....................................... 4
Operating Conditions ....................................................... 4
DC Electrical Characteristics .......................................... 5
AC Electrical Characteristics .......................................... 6
Crystal Characteristics .................................................... 6
Switching Waveforms ...................................................... 7
Termination Circuits ......................................................... 8
Ordering Information ........................................................ 9
Ordering Code Definitions ........................................... 9
Document Number: 001-42886 Rev. *H
Package Drawing and Dimensions ............................... 10
Acronyms ........................................................................ 11
Document Conventions ................................................. 11
Units of Measures ..................................................... 11
Document History Page ................................................. 12
Sales, Solutions, and Legal Information ...................... 13
Worldwide Sales and Design Support ....................... 13
Products .................................................................... 13
PSoC® Solutions ...................................................... 13
Cypress Developer Community ................................. 13
Technical Support ..................................................... 13
Page 2 of 13
CY2XL11
Pinouts
Figure 1. 8-pin TSSOP pinout
VDD
VSS
XOUT
XIN
1
2
3
4
8
7
6
5
VDD
CLK
CLK#
OE
Pin Definitions
Pin Number
Pin Name
I/O Type
Description
1, 8
VDD
Power
3.3 V or 2.5 V power supply. All supply current flows through pin 1
2
VSS
Power
Ground
3, 4
XOUT, XIN
5
OE
CMOS input
Output enable. When HIGH, the output is enabled. When LOW, the output is
high-impedance
6,7
CLK#, CLK
LVDS output
Differential clock output
XTAL output and input Parallel resonant crystal interface
Document Number: 001-42886 Rev. *H
Page 3 of 13
CY2XL11
Frequency Table
Input Crystal Frequency (MHz)
PLL Multiplier Value
Output Frequency (MHz)
25
4
100
Absolute Maximum Conditions
Parameter
Description
Condition
Min
Max
Unit
VDD
Supply voltage
–
–0.5
4.4
V
VIN[1]
Input voltage, DC
Relative to VSS
–0.5
VDD + 0.5
V
TS
Temperature, storage
Non operating
–65
150
C
TJ
Temperature, junction
–
–
135
C
ESDHBM
ESD protection (human body
model)
JEDEC STD 22-A114-B
2000
–
V
UL–94
Flammability rating
At 1/8 inch
V–0
JA[2]
Thermal resistance, junction to
ambient
0 m/s airflow
100
1 m/s airflow
91
2.5 m/s airflow
87
C/W
Operating Conditions
Parameter
VDD
Description
Min
Max
Unit
3.3 V supply voltage
3.135
3.465
V
2.5 V supply voltage
2.375
2.625
V
TA
Ambient temperature
–5
70
C
TPU
Power up time for all VDD to reach minimum specified voltage (ensure power
ramps is monotonic)
0.05
500
ms
Notes
1. The voltage on any input or IO pin cannot exceed the power pin during power up.
2. Simulated using Apache Sentinel TI software. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has 4-layers of copper
(2/1/1/2 oz.). The internal layers are 100% copper planes, while the top and bottom layers have 50% metalization. No vias are included in the model.
Document Number: 001-42886 Rev. *H
Page 4 of 13
CY2XL11
DC Electrical Characteristics
Parameter
IDD[4]
Description
Test Conditions
Min
Typ
Max
Unit
Power supply current with output VDD = 3.465 V, OE = VDD,
terminated
output terminated
–
–
120
mA
VDD = 2.625 V, OE = VDD,
output terminated
–
–
115
mA
VOD[6]
LVDS differential output voltage
VDD = 3.3 V or 2.5 V,
RTERM = 100  between CLK and
CLK#
247
–
454
mV
VOD[6]
Change in VOD between
complementary output states
VDD = 3.3 V or 2.5 V,
RTERM = 100  between CLK and
CLK#
–
–
50
mV
VOS[7]
LVDS offset output voltage
VDD = 3.3 V or 2.5 V,
RTERM = 100  between CLK and
CLK#
1.125
–
1.375
V
VOS
Change in VOS between comple- VDD = 3.3 V or 2.5 V,
mentary output states
RTERM = 100  between CLK and
CLK#
–
–
50
mV
IOZ
Output leakage current
Three-state output, unterminated,
measured on one pin while floating
the other pin, OE = VSS
–35
–
35
A
VIH
Input high voltage, OE pin
–
0.7 × VDD
–
–
V
VIL
Input low voltage, OE pin
–
–
–
0.3 × VDD
V
IIH
Input high current, OE pin
OE = VDD
–
–
115
µA
IIL
Input low current, OE pin
OE = VSS
–50
–
–
µA
CIN
Input capacitance, OE pin
–
–
15
–
pF
CINX
Pin capacitance, XIN & XOUT
–
–
4.5
–
pF
Notes
3. Outputs are terminated with 100 between CLK and CLK#. Refer to Figure 8 on page 8.
4. IDD includes ~4 mA of current that is dissipated externally in the output termination resistor.
5. Not 100% tested, guaranteed by design and characterization.
6. Refer to Figure 2 on page 7.
7. Refer to Figure 3 on page 7.
Document Number: 001-42886 Rev. *H
Page 5 of 13
CY2XL11
AC Electrical Characteristics
Parameter [8]
Description
Min
Typ
Max
Unit
–
–
100
–
MHz
Output rise or fall time
20% to 80% of full output swing
–
0.5
1.0
ns
RMS phase jitter (random)
FOUT = 100 MHz,
(637 kHz–10 MHz)
–
0.53
–
ps
TDC[11]
Duty cycle
Measured at zero crossing point
45
–
55
%
TOHZ[12]
Output disable time
Time from falling edge on OE to
stopped outputs (Asynchronous)
–
–
100
ns
TOE[12]
Output enable time
Time from rising edge on OE to
outputs at a valid frequency
(Asynchronous)
–
–
120
ns
TLOCK
Startup time
Time for CLK to reach valid
frequency measured from the time
VDD = VDD(min.)
–
–
5
ms
Min
Max
Unit
FOUT
Output frequency
TR, TF[9]
TJitter()[10]
Test Conditions
Crystal Characteristics
Parameter
Description
Mode of oscillation
Fundamental
–
F
Frequency
25
25
MHz
ESR
Equivalent series resistance
–
50

CS
Shunt capacitance
–
7
pF
Notes
8. Outputs are terminated with 100 between CLK and CLK#. Refer to Figure 8 on page 8.
9. Refer to Figure 4 on page 7.
10. Refer to Figure 7 on page 8.
11. Refer to Figure 5 on page 7.
12. Refer to Figure 6 on page 7.
Document Number: 001-42886 Rev. *H
Page 6 of 13
CY2XL11
Switching Waveforms
Figure 2. Output Voltage Swing
CLK#
VOD1
VOD2
CLK
VOD = VOD1 - VOD2
Figure 3. Output Offset Voltage
CLK
50
V OS
50
CLK#
Figure 4. Output Rise or Fall Time
CLK#
CLK
80%
80%
20%
20%
TR
TF
Figure 5. Duty Cycle Timing
CLK
TDC =
CLK#
TPW
TPERIOD
TPW
TPERIOD
Figure 6. Output Enable and Disable Timing
OE
VIL
TOHZ
VIH
TOE
CLK
High Impedance
CLK#
Document Number: 001-42886 Rev. *H
Page 7 of 13
CY2XL11
Switching Waveforms (continued)
Figure 7. RMS Phase Jitter
Phase noise
Noise Power
Phase noise mark
Offset Frequency
f1
RMS Jitter =
f2
Area Under the Masked Phase Noise Plot
Termination Circuits
Figure 8. LVDS Termination
CLK
100
CLK#
Document Number: 001-42886 Rev. *H
Page 8 of 13
CY2XL11
Ordering Information
Part Number
Package Description
Product Flow
CY2XL11ZXC
8-pin TSSOP
Commercial, 0 °C to 70 °C
CY2XL11ZXCT
8-pin TSSOP – Tape and Reel
Commercial, 0 °C to 70 °C
CY2XL11ZXI
8-pin TSSOP
Industrial, –40 °C to +85 °C
CY2XL11ZXIT
8-pin TSSOP – Tape and Reel
Industrial, –40 °C to +85 °C
Ordering Code Definitions
CY 2X L11
Z
X
X
X
X = blank or T
blank = Tube; T = Tape and Reel
Temperature Range: C = Commercial
Pb-free
Package Type: Z = 8-pin TSSOP
Part Identifier
Family
Company ID: CY = Cypress
Document Number: 001-42886 Rev. *H
Page 9 of 13
CY2XL11
Package Drawing and Dimensions
Figure 9. 8-pin TSSOP (4.40 mm Body) Package Outline, 51-85093
51-85093 *E
Document Number: 001-42886 Rev. *H
Page 10 of 13
CY2XL11
Acronyms
Acronym
Document Conventions
Description
Units of Measures
CLKOUT
Clock Output
CMOS
Complementary Metal Oxide Semiconductor
°C
degree Celsius
DPM
Die Pick Map
kHz
kilohertz
EPROM
Erasable Programmable Read Only Memory
k
kilohm
LVDS
Low-Voltage Differential Signaling
MHz
megahertz
NTSC
National Television System Committee
M
megaohm
OE
Output Enable
µA
microampere
PAL
Phase Alternate Line
PD
Power Down
PLL
Phase Locked Loop
TTL
Transistor-Transistor Logic
Document Number: 001-42886 Rev. *H
Symbol
Unit of Measure
µs
microsecond
µV
microvolt
µVrms
microvolts root-mean-square
mA
milliampere
mm
millimeter
ms
millisecond
mV
millivolt
nA
nanoampere
ns
nanosecond
nV
nanovolt

ohm
ppm
parts per million
v
volt
Page 11 of 13
CY2XL11
Document History Page
Document Title: CY2XL11, 100 MHz LVDS Clock Generator
Document Number: 001- 42886
Rev.
ECN No.
Submission
Date
Orig. of
Change
**
2117527
See ECN
WWZ /
KVM /
AESA
New data sheet
*A
2669117
03/05/2009
KVM /
AESA
Changed Data Sheet Status to Final
Changed crystal and output frequency
Removed MSL spec
Changed IIL value from -20 uA to -50 uA
Changed IIH value from 20 uA to 115 uA
Changed phase jitter value from 1 to 0.53 ps
Changed junction temp from 125C to 135C
Changed IDD from 150 mA to 120 mA
Rise / fall time changed to 350 ps to 500ps
*B
2700242
04/30/2009
KVM /
PYRS
Typo correction
Reformatted AC and DC tables
Added IDD spec for 2.5V
Added CINX and TLOCK specs
Changed CIN from 7pF to 15pF
*C
2718433
06/12/2009
WWZ /
HMT
No change. Submit to ECN for product launch.
*D
2764787
09/18/2009
KVM
Add clause to IOZ Test Conditions
Change VOD limits from 250/450 mV to 247/454 mV
Add max limit for TR, TF: 1.0 ns
Change TOE max from 100 ns to 120 ns
Change TLOCK max from 10 ms to 5 ms
*E
3067416
10/20/20
BASH
Added the industrial part in Ordering Information table.
Added Ordering Code Definition.
Description of Change
Updated package diagram.
Added Acronyms and Units of Measures.
*F
3199831
03/18/11
CXQ
No change. Sunset review spec.
*G
4334627
04/06/2014
CINM
Updated Package Drawing and Dimensions:
spec 51-85093 – Changed revision from *C to *D.
Updated in new template.
Completing Sunset Review.
*H
4582584
11/07/2014
CINM
Added related documentation hyperlink in page 1.
Updated the part number CY2XL11ZXI(T) to CY2XL11ZXIT, in Ordering
Information.
Updated Package Drawing and Dimensions from 51-85093 *D to 51-85093 *E.
Document Number: 001-42886 Rev. *H
Page 12 of 13
CY2XL11
Sales, Solutions, and Legal Information
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closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2008-2014. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-42886 Rev. *H
Revised November 28, 2014
All products and company names mentioned in this document may be the trademarks of their respective holders.
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