ATMEL AT71201MCRER

Features
•
•
•
•
•
•
•
•
•
•
•
Full-Frame Image Sensor 4096 x 4096 Pixels
11 µm x 11 µm Photo-MOS Pixel with 100% Aperture
Image Zone: 45 x 45 mm
Frame Readout Through One, Two or Four Outputs
Data Rates Up to 4 x 40 MHz (Compatibility with 7, 4 Frames/Second)
True 12-bit High Dynamic Range
Very Low Readout Noise
Very Low Dark Current (MPP Mode)
Optimized Resolution and Responsivity in the 400 - 1100 nm Spectrum
On-chip Thermometer for Each Quarter
Additional Full-Frame Operating Modes:
– 4/3 Aspect Ratio: 4096 x 3072
– 2/1 Aspect Ratio: 4096 x 2048
– Binning 2 x 2 Pixels (Format 2048 x 2048 Pixels of 22 x 22 µm)
– Binning 4 x 4 Pixels (Format 1024x 1024 Pixels of 44 x 44 µm)
• On-request Frame Transfer Architecture:
– 2048 Active Lines, One Memory Zone with Frame Readout Through One or Two
Outputs
– 2048 Active Lines, Two Memories Zones with Frame Readout Through Two or Four
Outputs
16 M-Pixels
Sensor
AT71201M
Preliminary
Applications
Flexibility and performance makes this device suitable for digital photography, graphic
arts, medical or industrial applications and scientific analysis.
Description
Atmel's AT71201M is a full-frame sensor based on charge-coupled device (CCD)
technology. It can be used in a wide range of applications thanks to operating mode
flexibility, very high definition and high dynamic range.
The nominal photosensitive area is made up of 4096 x 4096 useful pixels and is split
into four independent zones that are driven separately by four independent four-phase
clock sets. Thus the sensor can be used in up to 12 main modes.
The large format and high definition make the device suitable for any application
requiring precision.
The high sensitivity of the 11 x 11 µm pixels with 100% fill factor provides a large
bandwidth of response with up to 1100 nm wavelength.
Two serial registers and four independent output amplifiers offer a high-frequency
functionality at 40 MSPS and up to 7.4 frames per second with a high signal to noise
ratio.
Rev. 5328A–IMAGE–05/03
1
2
VS3
VOS3
PHILS3
VTHH3
PHILB2
PHILB1
VSS1
VSS2
PHIPC3
PHIPD3
PHIPD1
PHIPC1
VSS2
PHITB
PHILB5
PHILB6
VTHH4
PHILS4
VOS4
VS4
VDR4
PHIR3
VDD3
VGS3
VTHL3
VDE
PHILB4
PHILB3
PHIFCB
PHIPC4
PHIPD4
PHIPD2
PHIPC2
VDEB
PHILB7
PHILB8
VSS2
VTHL4
VGS4
VDD4
PHIR4
VSS2
1
VDR3
2
VSS2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
25
VSS3
PHIR1
VDD1
VGS1
VTHL1
VSS2
PHILA8
PHILA7
VDEA
PHIPB2
PHIPA2
PHIPA4
PHIPB4
PHIFCA
PHILA3
PHILA4
VDE
VTHL2
VGS2
VDD2
PHIR2
VSS3
25
24
VDR1
VS1
VOS1
PHILS1
VTHH1
PHILA6
PHILA5
PHITA
VSS2
PHIPB1
PHIPA1
PHIPA3
PHIPB3
VSS2
VSS1
PHILA1
PHILA2
VTHH2
PHILS2
VOS2
VS2
VDR2
Pinout
Figure 1. AT71201M Pinout, Top View of the Sensor
24
REGISTER A
Output 1
Output 2
A Zone
B Zone
AT71201
C Zone
D Zone
Output 3
REGISTER B
Output 4
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
2
1
AT71201M
5328A–IMAGE–05/03
AT71201M
Table 1. AT71201M Pinout
Signal Name
Parameter
PHILA [1;8]
Registers A clocks
PHILB [1;8]
Registers B clocks
PHILS [1;4]
Summing clocks
PHIR [1;4]
Reset gates
PHIPA [1;4]
Image zone A clocks
PHIPB [1;4]
Image zone B clocks
PHIPC [1;4]
Image zone C clocks
PHIPD [1;4]
Image zone D clocks
PHITA
Image zone to register A transfer clock
VGS [1;4]
Register output gate biases
VOS [1;4]
Video outputs
VDD [1;4]
Amplifier drains
VS [1;4]
Amplifier sources
VDR [1;4]
Reset drains
VDE (2)
Peripheral vertical drain
VDEA
Peripheral drain along register A
VDEB
Peripheral drain along register B
VTHL [1;4]
Thermometer low 1 to 4
VTHH [1;4]
Thermometer high 1 to 4
VSS (12)
Ground connection
3
5328A–IMAGE–05/03
Block Diagram
Figure 2. AT71201M Block Diagram - Top View
ΦLs1
VGS1
ΦR1
VDR1
ΦTA
VS1
VOS1
VDD1
VTHH1
VTHL1
16 Prescans
VDEA
ΦLA5 to 8
ΦLA1 to 4
VS2
VOS2
VDD2
VTHH2
VTHL2
24 vertical
references
ΦPAj
ΦPBj
ΦLs2
VGS2
ΦR2
VDR2
ΦPAj
ΦPBj
4096 x 4096 useful pixels
VDE
VDE
(11 x 11 µm²) = 45 x 45 mm²
ΦPCj
ΦPCj
8 vertical & horizontal insulating
elements (including 4 dark ones)
ΦPDj
ΦTB
ΦTA
ΦLs3
VGS3
ΦR3
VDR3
VS3
VOS3
VDD3
VTHH3
VTHL3
ΦLB1 to 4
ΦPDj
ΦLs4
VOS4 VGS4
VDD4 ΦR4
VTHH4 VDR4
VTHL4
ΦLB5 to 8 VS4
VDEB
Thermometer
}
}
}
}
A Zone
B Zone
C Zone
D Zone
ΦTB
Readout
modes
4
AT71201M
5328A–IMAGE–05/03
AT71201M
Architectural
Overview
General Parameters
Table 2. General Parameters
Parameter
Value
Pixel size
11 x 11 µm²
Number of useful pixels per line
4096
Number of useful lines
4096
Number of extra lines
8 per register
Number of readout registers
2
Number of prescan CCD stages (per output)
16
Number of dark references (cells per line)
24
Number of outputs (2 per register)
4(1)
MPP mode/low dark current mode
Yes (image zone)
Anti-blooming functionality
no
Binning (summation) mode
Yes(2)
Pixel clocking mode
4-phase
Readout Register clocking mode
2-phase
Specific functions
Thermometer
Notes:
1. The full-frame version can be read through one, two or four outputs
2. The lines summation into the register is made by a specific timing diagram. The integration time should be adapted to prevent charge overflow.
A specific clock allows column summation.
The pixel size is 11 x 11µm2 with 100% fill factor (photo-MOS technology).
The sensor is compatible with a 180° rotation.
The image zone commands are split in 4 horizontal areas. The combination of the
ΦPij clocks allows various transfer configurations.
The serial registers are driven by 8 ΦLi clocks. An adapted combination of them allows
transfers of 100% of stages to the right side or the left side or 50% in each direction.
5
5328A–IMAGE–05/03
Organization
Top to Bottom
The AT71201M is made up of four zones (A, B, C and D) that are separately driven.
Table 3. Vertical Characteristics
Zone
Configuration
8 dummy lines (4 photosensitive ones)
A
2048 active lines, 100% photosensitive
B
2048 active lines, 100% photosensitive
C
2048 active lines, 100% photosensitive
2048 active lines, 100% photosensitive
D
8 dummy lines (4 photosensitive ones)
Corner to Center
Table 4. Horizontal Characteristics for Different Modes
Readout Mode
Characteristic
One Output
Two Outputs on Same Register
Prescan stages
16
16
Dark references
24
24
Insulating elements
8
8
4096
2048
Useful pixels
Output Amplifiers
The charge packets are clocked towards the output nodes and are converted to voltages. The potential at the output node is read through a source follower amplifier.
Figure 3. On-Chip Output Amplifiers
VDD
ΦR
M1
M3
M5
Output
node
VOS
M2
M4
M6
VS
6
AT71201M
5328A–IMAGE–05/03
AT71201M
Absolute Maximum
Ratings(1)
Table 5. Maximum Applied Voltages with Respect to VSS
Signal Name
Parameter
Min
Max
PHILA [1;8]
Registers A clocks
-0.3V
+15V
PHILB [1;8]
Registers B clocks
-0.3V
+15V
PHILS [1;4]
Summing clocks
-0.3V
+15V
PHIR [1;4]
Reset gates
-0.3V
+15V
PHIPA [1;4]
Image zone A clocks
-15V &
PHIPA [others] -15V
+15V &
PHIPA [others] +15V
PHIPB [1;4]
Image zone B clocks
-15V &
PHIPB [others] -15V
+15V &
PHIPB [others] +15V
PHIPC [1;4]
Image zone C clocks
-15V &
PHIPC [others] -15V
+15V &
PHIPC [others] +15V
PHIPD [1;4]
Image zone D clocks
-15V &
PHIPD [others] -15V
+15V &
PHIPD [others] +15V
PHITA
Image zone to register A transfer clock
-15V &
PHIPA [4] -15V
+15V &
PHIPA [4] +15V
PHITB
Image zone to register B transfer clock
-15V &
PHIPB [4] -15V
+15V &
PHIPB [4] +15V
VGS [1;4]
Ouput gates
-0.3V
+15V
VOS [1;4]
Video outputs
-0.3V
+15V
VDD [1;4]
Amplifier drains
-0.3V
+15V
VS [1;4]
Amplifier sources
-0.3V
+15V
VDR [1;4]
Reset drains
-0.3V
+15V
VDE
Peripheral drain
-0.3V
+15V
VDEA
Peripheral drain along register A
-0.3V
+15V
VDEB
Peripheral drain along register B
-0.3V
+15V
VTHL [1;4]
Thermometer low 1 to 4
-0.3V
+15V
VTHH [1;4]
Thermometer high 1 to 4
-0.3V
+15V
VSS
Ground
Note:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
7
5328A–IMAGE–05/03
Shorting VOS to any other pin, even temporally, can permanently damage the output
amplifier.
Device exposure to ESD stress could result in current leakage or performance degradation; reliability can also be affected.
To avoid degradation, sensors (including pins and package) have to be handled carefully using a grounded bracelet. When unplugged, they have to be stored in the original
case (or box).
In any case, pins of the devices must not be discharged straight to ground..
Storage Temperature Range
-40°C to +70°C
Operating Temperature Range
0°C to +70°C
Thermal Cycling
3°C/mn
DC Characteristics
Table 6. DC Characteristics
Parameters
Symbol
Typical Value
Source bias
Vsi
Amplifier drain supply
Substrate bias
Reset diode
Adjusting Range
Current
0V
[0;1] Volts
4 x -25 mA
VDDi(1)
15V
[14.5;15.5] Volts
4 x 25 mA
Vss
0V
14V
[13.5;14.5] Volts
< 5 µA
[3;4] Volts
< 5 µA
(2)
VDRi
Output gate
VGSi
3.5V
Vertical drain
VDE
8V
[6;9] Volts
(15 V max respect to ΦTi)
< 50 µA
Horizontal drain
VDEi
12V
[6;15] Volts
< 50 µA
Notes:
1. If the associated output i is not used, VDDi should be stated to 0 Volts in order to reduce global power consumption
2. VDRi voltage should always be kept lower than VDDi voltage, especially during power on
Recommendation: All DC voltages should be bypassed by adding capacitors as closed as possible to the pin connection.
8
AT71201M
5328A–IMAGE–05/03
AT71201M
Drive Clock
Characteristics
Table 7. Drive Clock Characteristics
Parameter
Symbol
Image clocks
PHIPij(1)
Transfer clocks
Register clocks
Summing clocks
Reset gate clocks
Notes:
PHITk(2)
PHILkm(2)
PHILSj(1)
PHIRj(1)
State
Minimum
Typical
Maximum
Low
-9V
-8V
-7.5V
High
+2.5V
+3V
+3.5V
Low
-6V
-5V
-4V
High
+2.5V
+3V
+3.5V
Low
0V
0V
0.5V
High
+7V
+7.5V
+8V
Low
0V
0V
0.5V
High
+7V
+7.5V
+8V
Low
0V
+2V
+3V
High
+11V
+12V
+13V
Typical Capacitance
37 nF
200 pF
180 pF
15 pF
15 pF
1. i = A to D, j = 1 to 4
2. k = A to B, m = 1 to 8
9
5328A–IMAGE–05/03
Operating Modes
For the required readout mode, the vertical and horizontal clocks must be tied together,
as following:
Figure 4. Operating Modes
4112 transfers min
NBV = 4112
VERTICAL TRANSFER
4112 transfers min 2056 transfers min
NBV = 4112
NBV = 2056
3080 transfers min
NBV = 3080
1-2-3 modes
4-5-6 modes
10-11-12 modes
ΦPA1=ΦPB1=ΦPC1=ΦPD1=
ΦPA4=ΦPB4=ΦPC2=ΦPD2=
ΦPA3=ΦPB3=ΦPC3=ΦPD3=
ΦPA2=ΦPB2=ΦPC4=ΦPD4=
ΦTA = Low Level
1
ΦP1
ΦP2
ΦP3
ΦP4
ΦTB = ΦP1
Inactive
2
ΦPA1=ΦPB1=ΦPC1=ΦPD1=
ΦPA2=ΦPB2=ΦPC4=ΦPD4=
ΦPA3=ΦPB3=ΦPC3=ΦPD3=
ΦPA4=ΦPB4=ΦPC2=ΦPD2=
ΦTA = ΦP1
ΦP1
ΦP2
ΦP3
ΦP4
ΦTB = Low Level
1
Mode1
7-8-9 modes
2
ΦPA1=ΦPB1=ΦPC1=ΦPD1=
ΦPA2=ΦPB2=ΦPC2=ΦPD2=
ΦPA3=ΦPB3=ΦPC3=ΦPD3=
ΦPA4=ΦPB4=ΦPC4=ΦPD4=
ΦTA = ΦP1
ΦTB = ΦP1
1
Mode4
ΦP1
ΦP2
ΦP3
ΦP4
ΦPA1=ΦPB1=ΦPC1=ΦPD1=
ΦPA2=ΦPB4=ΦPC2=ΦPD2=
ΦPA3=ΦPB3=ΦPC3=ΦPD3=
ΦPA4=ΦPB2=ΦPC4=ΦPD4=
ΦTA = ΦP1
2
ΦTB = ΦP1
1
Mode7
ΦP1
ΦP2
ΦP3
ΦP4
2
Symbols ΦP1, ΦP2, ΦP3, ΦP4
correspond to the clocks described
in the full-frame mode timing diagrams.
Abbreviations NBV and NBH correspond
respectively to the vertical and horizontal
number of transfers.
The unused horizontal clocks (ΦL, ΦR, ΦLS)
must be stated to their higher level.
4144 PIXELS PERIODS
NBH = 4144
4-7-10 modes
Mode10
ΦLA1=ΦLA4=ΦLA5=ΦLA7=ΦL1
ΦLA2=ΦLA3=ΦLA6=ΦLA8=ΦL2
1
Inactive
4
3
2
1
Mode2
Inactive
4
3
4
3
4
2
1
2
1
2
Mode5
Mode8
ΦLB1=ΦLB3=ΦLB5=ΦLB8=ΦL1
ΦLB2=ΦLB4=ΦLB6=ΦLB7=ΦL2
4144 PIXELS PERIODS
NBH = 4144
5-8-11 modes
Mode11
ΦLA1=ΦLA3=ΦLA5=ΦLA8=ΦL1
ΦLA2=ΦLA4=ΦLA6=ΦLA7=ΦL2
2-8-11 modes
3
1
Inactive
4
3
2
1
Mode3
Inactive
4
3
4
3
4
2
1
2
1
2
Mode6
Mode9
ΦLB1=ΦLB4=ΦLB5=ΦLB7=ΦL1
ΦLB2=ΦLB3=ΦLB6=ΦLB8=ΦL2
2096 PIXELS PERIODS
NBH = 2096
HORIZONTAL TRANSFER
1-7-10 modes
3
6-9-12 modes
Mode12
ΦLA1=ΦLA4=ΦLA5=ΦLA8=ΦL1
ΦLA2=ΦLA3=ΦLA6=ΦLA7=ΦL2
3-9-12 modes
3
10
4
3
Inactive
4
3
4
3
4
ΦLB1=ΦLB3=ΦLB5=ΦLB7 =ΦL1
ΦLB2=ΦLB4=ΦLB6=ΦLB8=ΦL2
AT71201M
5328A–IMAGE–05/03
AT71201M
Timing Diagrams
Figure 5. Full-Frame Mode Timing Diagram
PHIP1
PHIP2
PHIP3
NBH pulses
PHIP4
PHITk
(2)
PHIL1
PHIL2
(2)
PHILSj
PHIRj
... cleaning
Readout time
(NBV pulses)
Integration time
Cleaning ...
Figure 6. Line Timing Diagram
Period Tv = 9 x T0
(1)
PHIP1
PHIP2
PHIP3
PHIP4
PHITk = PHIP1
PHIL1
PHIL2
(2)
(2)
PHILSj
PHIRj
Notes:
1. T0 = Master clock period (vertical transfer)
2. See Figure 4
11
5328A–IMAGE–05/03
Figure 7. Summation Timing Diagram of 2 Lines
Period Tv = 15 x T0
(1)
PHIP1
PHIP2
PHIP3
PHIP4
PHITk = PHIP1
Line summation
PHIL1
PHIL2
(2)
(2)
PHILSj
PHIRj
Figure 8. Readout Signal
PHIP1
PHIP2
PHIP3
PHIP4
(3)
Period = FH -1
PHITk
(2)
PHIL1
PHIL2
(2)
PHILSj
PHIRj
VOSj
Reset/reference/signal levels
Notes:
1. T0 = Master clock period (vertical transfer)
2. See Figure 4
3. FH = Readout Register Frequency
12
AT71201M
5328A–IMAGE–05/03
AT71201M
Figure 9. Summation Timing Diagram
PHIP1
PHIP2
PHIP3
PHIP4
PHITk
(1)
PHIL1
PHIL2
(1)
PHILSj
PHIRj
Column summation
VOSj
Reset/Reference/Signal levels
Note:
1. See Figure 4
Figure 10. Frame Transfer Sequence
Readout time
Exposure
Time
1 Line
Transfer
Y
Lines
Summation
(Y-1) times Yes
Cleaning
Period
x
Columns
Summation
1 Stage
Transfer
(X-1) times Yes
Lines
Summation
Columns
Summation
c-1 times
l-1 times
The readout sequence corresponding to an image made of C x l pixels
•
XC = 2048 in modes 3, 6, 9, 12
•
XC = 4096 in other modes
•
Yl = 2048 in modes 1 to 6
•
Yl = 4096 in modes 7 to 9
13
5328A–IMAGE–05/03
Table 8. Time Constants of Different Phases
Time
Symbol
Minimum
Typical
Maximum
Buffer time = Waiting time between ΦPij and ΦLkm acting
Tb
100 ns
-
-
Rise Time and Fall Time of ΦPij, ΦTk
Ts
250 ns
0.5 x T0
0.5 x T0
Rise Time and Fall Time of ΦLkm, ΦLSj
Tq
3 ns
6 ns
-
Rise Time and Fall Time of ΦRj
Tr
1.5 ns
3 ns
-
T0 = master clock period (vertical transfer)
Frame Rate
Characteristics
Figure 11. Frame Rate Characteristics
14
12
Frame/sec
10
8
6
4
2
0
0
20
40
60
80
100
Integration Time (ms)
1 Output
2 Output
4 Output
4 Outputs (2 x 2 binning)
Frame rate is given for maximum readout frequency(1).
Note:
14
1. Horizontal pixel frequency, FH = 40 MHz
Vertical transfer time, To = 1.5 µs
Buffer time, Tb = 100 ns
AT71201M
5328A–IMAGE–05/03
AT71201M
Output Buffer
Table 9. Output Buffer(2)
Parameter
Symbol
Minimum
Typical
Maximum
Unit
DC output
Vref
8.0
8.6
9.2
V
Output impedance
Zout
–
88
–
Ω
Output amplifier supply current(1)
IDD
19
25
31
mA
Amplifier bandwidth (-3 dB)
BW
–
200
–
MHz
Charge to Voltage
Conversion factor
CVF
–
6.0
–
µV/
electron
Temperature conversion
VTH
–
7.5
–
mV/°C
Vertical transfer time
T0
1.5
2
–
µs
Readout register frequency
FH
–
–
40
MHz
Note:
1. Per output
2. All characteristics given for temperature = 25°C
Electro-Optical
Performances
Table 10. Electro-Optical Performances(3)
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Pixel saturation voltage
VSAT
600
750
900
mV
Readout saturation charge in binning mode
RSAT
–
1800
–
mV
Dynamic range
DR
72
74
76
dB
Readout noise
RN
–
25
–
electron
3.8
4.2
–
V/(µJ/cm²)
MTFX
MTFY(1)
–
–
45
50
–
–
%
%
PRNU(1)(2)
–
0.5
3
%
DS1
DS2
DSR
0.05
10
30
0.2
20
60
2
40
100
mV/s
mV/s
mV/s
DSNU(2)
–
0.5
1.5
mV/s
Horizontal charge transfer efficiency per CCD stage
HCTE
0.99993
0.99998
–
–
Vertical charge transfer efficiency per CCD stage
VCTE
0.99995
0.99998
–
–
Responsivity
Resolution (MTF) at 45 cycles/mm – H axis
Resolution (MTF) at 45 cycles/mm – V axis
Pixel response non-uniformity
Image zone dark signal, MPP
Image zone dark signal, non-MPP
Register dark signal, non-MPP
Image zone dark signal non-uniformity, MPP
integration
Notes:
R
(1)
1. Combined with 2 mm "BG38" IR filter type
2. Standard deviation
3. All values given at 25°C, typical voltages
15
5328A–IMAGE–05/03
Figure 12. Spectral Responsivity
14
Responsivity (V/µJ/cm²)
12
10
8
6
4
2
0
400
500
600
700
800
900
1000
1100
Wavelength (nm)
Temperature
Measurement
A current of 100 µA is forced between VTHLi and VTHHi, in the range of 0 to 70°C, the
corresponding measured voltage, is proportional to temperature:
Temperature(°C ) =
VTHHi (mV ) − VTHLi (mV )
− 613(°C )
7.5(mV / °C )
Relative thermometer accuracy is 0.13°C/mV ±10%
Absolute thermometer precision is ±10°C.
Figure 13. On Chip Thermometer
VTHHi
Resistor
VTHLi
I forced
16
AT71201M
5328A–IMAGE–05/03
AT71201M
Image grade
Table 11. Image Grade(2)
Grade
Blemishes
Total
Notes:
D-min
≤ 1500
E
Cluster 1
(1)
3
Total
≤ 100
Cluster 2
D-min
50
(1)
Column
Total
D-min
≤ 20
100
(1)
Total
D-min(1)
≤ 10
150
1. D-min: distance of pixels defects in any direction. All occurrences are non-contiguous.
2. Testing has been carried out under the following conditions:
Operating temperature = 25 °C
Illumination conditions: 3200K Halogen lamp with BG38 Infrared filter and f/3.5 aperture
Integration time in darkness = 10 seconds, test under illumination at 50% of VSAT
Standard mode, To = 1.5 µs, FH = 40 MHz
Definitions
Table 12. Defect Sizes
Type
Description
Blemish
1 x 1 pixel defect
Cluster
Blemish groupings of less than a given number of adjacent defects:
1 x 1 pixel < cluster 1 size ≤ 2 x 2 pixels
2 x 2 pixels < cluster 2 size ≤ 5 x 5 pixels
Column
One-pixel-wide column with more than seven contiguous defective pixels
Table 13. Defects in Darkness
Type
Description
Blemish/Clusters
Pixel signal deviation of more than 200 mV from the average output signal
Column
Column signal deviation of more than 50 mV from the average output signal
Table 14. Defects Under Illumination
Type
Description
Blemish/Clusters
Pixel signal deviation of more than ± 30% from the average output signal
Column
Column signal deviation of more than ± 20% from the average output signal
17
5328A–IMAGE–05/03
Ordering Information
1 2 3 4 5 6 7 8 9 10 11
AT71201
Customer specification
Technological variant
Quality assurance level
Temperature range:
C: 0°C to +70°C
Package family:
R: Pin Grid Array (PGA)
Options:
B = Mechanical mask
E = On chip color filters
Image grade:
E: Standard
H: High
Package variant:
N: Non-sealed window
R: Anti-reflective glass window
The following part numbers are available:
•
AT71201MCRER
•
AT71201MCREN
18
AT71201M
5328A–IMAGE–05/03
AT71201M
Package Drawing
71.00 ± 0.8
61.80 ± 0.7
55.80 ± 0.6
35.5 ± 0.4
1.
6.
0.46 ± 0.05
68.0 ± 0.7
6.
35.5 ± 0.4
First Pixel
Y = 12.970 ± 0.2
5.
8.5 ± 0.8
6.
6.
1.00 ± 0.01
5.66 ±0.5
54.0 ± 0.5
X = 12.970 ± 0.2
REFERENCE (Ring)
2.
Zopt. = 1.1 ± 0.08
Zmech. = 0.7 ± 0.05
(See note 3. - 4.)
1.1 ± 0.1 (Window)
2.06 ± 0.2
2.5 ± 0.25
4.57 ± 0.25
53.34 ± 0.55
5.
2.54 Typ.
2.54 Typ.
1
2
Notes:
1. Anti-reflective window 400 - 700 nm
2. Photosensitive area
3. Zopt = Optical distance between REFERENCE surface and 2
4. Zmech = Mechanical distance between REFERENCE surface and 2
5. Pin A1 index mark
6. Mechanical references/die positionning (first pixel)
60.96 ± 0.6
55.88 ± 0.6
REFERENCE: Z
REFERENCE: XY
All Dimensions In Millimeter
Die Flatness ≤ 50 µm
Die Axis Angle ≤ 0.2°
24
25
A B C D E F G H J K L M N P Q R S T U V WX
19
5328A–IMAGE–05/03
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Regional Headquarters
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: (41) 26-426-5555
Fax: (41) 26-426-5500
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Atmel Operations
Memory
2325 Orchard Parkway
San Jose, CA 95131
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
Microcontrollers
2325 Orchard Parkway
San Jose, CA 95131
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-19-60
ASIC/ASSP/Smart Cards
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743
e-mail
[email protected]
Web Site
http://www.atmel.com
Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use
as critical components in life support devices or systems.
© Atmel Corporation 2003. All rights reserved. Atmel ® and combinations thereof, are the registered
trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be the trademarks of
others.
Printed on recycled paper.
5328A–IMAGE–05/03
0M