19-4971; Rev 1; 2/10 TION KIT EVALUA BLE IL AVA A µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Features The MAX8893A/MAX8893B/MAX8893C power-management integrated circuits (PMICs) are designed for a variety of portable devices including cellular handsets. The PMICs include a high-efficiency step-down DC-DC converter, five low-dropout linear regulators (LDOs) with programmable output voltages, individual power-on/ off control inputs, a load switch, and a USB high-speed switch. These devices maintain high efficiency with a low no-load supply current, and the small 3.0mm x 2.5mm WLP package makes them ideal for portable devices. S High-Efficiency Step-Down Converter Guaranteed 500mA Output Current The step-down DC-DC converter utilizes a proprietary 4MHz hysteretic PWM control scheme that allows for ultra-small external components. Internal synchronous rectification improves efficiency and eliminates the external Schottky diode that is required in conventional stepdown converters. Its output voltage is programmable by the I2C serial interface and output current is guaranteed up to 500mA. S Two Low Supply Current LDOs with Programmable Output Voltages LDO1, LDO4, and LDO5 offer low 45FVRMS output noise and low dropout of only 100mV at 100mA. They deliver up to 300mA, 150mA, and 200mA continuous output currents, respectively. LDO2 and LDO3 each deliver 300mA continuous output current with very low ground current. All LDO output voltages are programmable by the I2C serial interface. Three standard versions of the PMIC are available with different LDO default startup voltages (see Table 1). The MAX8893A/MAX8893B/MAX8893C are available in a 3.0mm x 2.5mm, 30-bump WLP package. Applications Cellular Handsets Smartphones and PDAs Up to 4MHz Switching Frequency Programmable Output Voltage from 0.8V to 2.4V Dynamic Voltage Scaling with Programmable Ramp Rate S Three Low-Noise LDOs with Programmable Output Voltages S Low On-Resistance Load Switch S USB High-Speed Switch with ±15kV ESD S Individual Enable Control for All Regulators and Switches S I2C Serial Interface S Overcurrent and Thermal Protection for All LDOs S 3.0mm x 2.5mm x 0.64mm, 30-Bump WLP Ordering Information PART TEMP RANGE PIN-PACKAGE MAX8893AEWV+ -40NC to +85NC 30-Bump WLP (3.0mm x 2.5mm) MAX8893BEWV+ -40NC to +85NC 30-Bump WLP (3.0mm x 2.5mm) MAX8893CEWV+ -40NC to +85NC 30-Bump WLP (3.0mm x 2.5mm) +Denotes a lead(Pb)-free/RoHS-compliant package. Typical Operating Circuit appears at end of data sheet. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX8893A/MAX8893B/MAX8893C General Description MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP ABSOLUTE MAXIMUM RATINGS IN1, IN2, BATT, COM1, COM2 to AGND..............-0.3V to +6.0V BUCK, LS, ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, REFBP, LDO2, LDO3, SCL, SDA, ENUSB, CB, NC1, NC2, NO1, NO2 to AGND........................... -0.3V to (VBATT + 0.3V) LDO1, LDO4, LDO5 to AGND................... -0.3V to (VIN2 + 0.3V) PGND to AGND.....................................................-0.3V to +0.3V LX Current...................................................................... 1.5ARMS LX to AGND (Note 1)................................. -0.3V to (VIN1 + 0.3V) Continuous Power Dissipation (TA = +70NC) 30-Bump, 3.0mm x 2.5mm WLP (derate 20.0mW/NC above +70NC).............................................................1600mW Junction-to-Ambient Thermal Resistance (θJA) (Note 2).........................................................................50NC/W Operating Temperature Range........................... -40NC to +85NC Junction Temperature......................................................+150NC Storage Temperature Range............................. -65NC to +150NC Bump Temperature (soldering) Infrared (15s)................................................................+200NC Vapor Phase (20s)........................................................+215NC Note 1: LX has internal clap diodes to PGND and IN1. Applications that forward bias these diodes should take care not to exceed the IC’s package-dissipation limits. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS Input Supply Range MIN TYP 2.7 MAX UNIT 5.5 V Shutdown Supply Current VCB = 0V or VIN, VENUSB = VIN, VENLS = VENBUCK = VENLDO1 = VENLDO2 = VENLDO3 = VENLDO45 = 0V 0.6 5 FA No-Load Supply Current No load on BUCK, LDO1, LDO2, LDO3, LDO4, and LDO5, VENUSB = 0V, VENLS = VIN 160 200 FA Light-Load Supply Current BUCK on with 500FA load, all LDOs on with no load, VENUSB = 0V, VENLS = VIN 315 FA UNDERVOLTAGE LOCKOUT Undervoltage Lockout (Note 5) VIN_ rising 2.85 3.05 VIN_ falling 2.70 2.35 2.55 TA rising 160 NC 10 NC V THERMAL SHUTDOWN Thermal Shutdown Threshold Thermal Shutdown Hysteresis REFERENCE Reference Bypass Output Voltage REF Supply Rejection 0.786 2.7V P VIN P 5.5V 0.800 0.814 0.2 V mV/V LOGIC AND CONTROL INPUTS Input Low Level ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V Input High Level ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V 0.4 1.4 2 _______________________________________________________________________________________ V V µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER Logic Input Current CONDITIONS SDA, SCL, 0V < VIN < 5.5V MIN TA = +25NC TYP -1 TA = +85NC MAX +1 0.1 UNIT FA ENUSB Pullup Resistor to BATT 400 800 1600 kI ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, Pulldown Resistor to AGND 400 800 1600 kI 0.776 0.800 STEP-DOWN DC-DC CONVERTER (BUCK) Supply Current ILOAD = 0A, no switching 25 FA 0.824 0.90 0.97 1.00 1.03 1.10 1.20 1.30 1.40 Programmable Output Voltage 1.50 ILOAD = 100mA, programmable output voltage 0.8V to 2.4V in 100mV steps 1.60 V 1.70 1.80 1.90 2.00 2.10 2.20 Output-Voltage Line Regulation LX Leakage Current Current Limit 2.231 2.300 2.369 2.328 2.400 2.472 VIN = 2.7V to 5.5V VLX = 0V or 5.5V 0.3 TA = +25NC -1 TA = +85NC %/V +1 0.1 p-MOSFET switch 600 990 1500 n-MOSFET rectifier 400 700 1300 FA mA p-MOSFET switch, ILX = -40mA 0.65 n-MOSFET rectifier, ILX = 40mA 0.4 Rectifier Off Current Threshold ILXOFF 30 mA Minimum On- and Off-Times tON, tOFF 70 Shutdown Output Resistance BUCK_ADEN = 1, VENBUCK = 0V 300 ns I On-Resistance I _______________________________________________________________________________________ 3 MAX8893A/MAX8893B/MAX8893C ELECTRICAL CHARACTERISTICS (continued) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP ELECTRICAL CHARACTERISTICS (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN TYP MAX UNIT 5.5 V LDO1 Input Voltage Range 2.7 1.552 1.600 1.648 1.70 1.80 1.90 2.00 2.10 2.20 2.30 Programmable Output Voltage 2.40 ILOAD = 25mA, programmable output voltage 1.6V to 3.3V in 100mV steps V 2.50 2.60 2.70 2.80 2.90 2.910 3.000 3.090 3.1 3.2 Output Voltage Accuracy 3.201 3.300 3.399 VIN = 5.5V with ILOAD = 1mA, and VIN = 3.2V with ILOAD = 300mA (MAX8893A) 2.716 2.800 2.884 VIN = 5.5V with ILOAD = 1mA, and VIN = 3.0V with ILOAD = 300mA (MAX8893B) 2.522 2.600 2.678 VIN = 5.5V with ILOAD = 1mA, and VIN = 2.7V with ILOAD = 300mA (MAX8893C) 1.746 1.800 1.854 Output Current 300 V mA Current Limit VLDO1 = 0V 550 mA Dropout Voltage ILOAD = 200mA, TA = +25NC 200 mV Load Regulation 1mA < ILOAD < 300mA VENLDO1 = VBATT 25 mV Power-Supply Rejection DVLDO1/DVIN2 10Hz to 10kHz, CLDO1 = 1FF, ILOAD = 30mA 75 dB Output Noise Voltage 100Hz to 100kHz, CLDO1 = 1FF, ILOAD = 30mA 45 FVRMS Output Capacitor for Stable Operation (Note 6) 0mA < ILOAD < 300mA 1.4 2.2 0mA < ILOAD < 150mA 0.7 1.0 Ground Current ILOAD = 500FA 21 FA Startup Time from Shutdown CLDO1 = 2.2FF, ILOAD = 300mA 40 Shutdown Output Resistance LDO1_ADEN = 1, VENLDO1 = 0V 300 Fs I 4 _______________________________________________________________________________________ FF µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN TYP MAX UNIT 5.5 V 1.200 1.236 LDO2 Input Voltage Range 2.7 1.164 1.30 1.40 1.50 1.60 1.70 1.80 1.90 2.00 2.10 Programmable Output Voltage ILOAD = 25mA, programmable output voltage 1.2V to 3.3V in 100mV steps 2.134 2.200 2.266 2.30 V 2.40 2.50 2.60 2.70 2.80 2.90 3.00 3.10 3.20 Output Voltage Accuracy VIN = 5.5V with ILOAD = 1mA, and VIN = 3.0V with ILOAD = 300mA 3.201 3.300 3.399 2.522 2.600 2.678 V 300 mA Output Current Current Limit VLDO2 = 0V 550 mA Dropout Voltage ILOAD = 200mA, TA = +25NC 200 mV Load Regulation 1mA < ILOAD < 300mA VENLDO2 = VBATT 25 mV Power-Supply Rejection DVLDO2/DVBATT 10Hz to 10kHz, CLDO2 = 1FF, ILOAD = 30mA 60 dB Output Noise Voltage 100Hz to 100kHz, CLDO2 = 1FF, ILOAD = 30mA 80 FVRMS Output Capacitor for Stable Operation (Note 6) 0mA < ILOAD < 300mA 1.4 2.2 0mA < ILOAD < 150mA 0.7 1.0 Ground Current ILOAD = 500FA Startup Time from Shutdown Shutdown Output Resistance FF 21 FA CLDO2 = 1FF, ILOAD = 300mA 40 LDO2_ADEN = 1, VENLDO2 = 0V 300 Fs I _______________________________________________________________________________________ 5 MAX8893A/MAX8893B/MAX8893C ELECTRICAL CHARACTERISTICS (continued) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP ELECTRICAL CHARACTERISTICS (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN TYP MAX UNIT 5.5 V LDO3 Input Voltage Range 2.7 1.552 1.600 1.648 1.70 1.80 1.90 2.00 2.10 2.20 2.30 Programmable Output Voltage 2.40 ILOAD = 25mA, programmable output voltage 1.6V to 3.3V in 100mV steps V 2.50 2.60 2.70 2.80 2.90 2.910 3.000 3.090 3.10 3.20 Output Voltage Accuracy VIN = 5.5V with ILOAD = 1mA, and VIN = 3.7V with ILOAD = 300mA 3.201 3.300 3.399 3.201 3.300 3.399 V 300 mA Output Current Current Limit VLDO3 = 0V 550 mA Dropout Voltage ILOAD = 200mA, TA = +25NC 200 mV Load Regulation 1mA < ILOAD < 300mA VENLDO3 = VBATT 25 mV Power-Supply Rejection DVLDO3/DVBATT 10Hz to 10kHz, CLDO3 = 1FF, ILOAD = 30mA 60 dB Output Noise Voltage 100Hz to 100kHz, CLDO3 = 1FF, ILOAD = 30mA 80 FVRMS Output Capacitor for Stable Operation (Note 6) 0mA < ILOAD < 300mA 1.4 2.2 0mA < ILOAD < 150mA 0.7 1.0 Ground Current ILOAD = 500FA Startup Time from Shutdown Shutdown Output Resistance FF 21 FA CLDO3 = 2.2FF, ILOAD = 300mA 40 LDO3_ADEN = 1, VENLDO3 = 0V 300 Fs I 6 _______________________________________________________________________________________ µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) LDO4 Input Voltage Range 2.7 0.776 5.5 0.800 V 0.824 0.90 1.00 1.10 1.20 1.30 1.358 1.400 1.442 1.50 1.60 1.70 1.80 1.90 Programmable Output Voltage 2.00 ILOAD = 25mA, programmable output voltage 0.8V to 3.3V in 100mV steps V 2.10 2.20 2.30 2.40 2.50 2.60 2.70 2.80 2.90 3.00 3.10 3.20 Output Voltage Accuracy 3.201 3.300 3.399 VIN = 5.5V with ILOAD=1mA, and VIN = 3.4V with ILOAD = 150mA (MAX8893A) 2.910 3.000 3.090 VIN = 5.5V with ILOAD = 1mA, and VIN = 3.7V with ILOAD = 150mA (MAX8893B/MAX8893C) 3.201 3.300 3.399 V Output Current 150 mA Current Limit VLDO4 = 0V 360 mA Dropout Voltage ILOAD = 100mA 100 mV Load Regulation 1mA < ILOAD < 150mA, VENLDO4 = VBATT 25 mV Power-Supply Rejection DVLDO4/DVIN2 10Hz to 10kHz, CLDO4 = 1FF, ILOAD = 30mA 75 dB Output Noise Voltage 100Hz to 100kHz, CLDO4 = 1FF, ILOAD = 30mA 45 FVRMS Output Capacitor for Stable Operation 0mA < ILOAD < 150mA (Note 6) 1.0 FF 0.7 _______________________________________________________________________________________ 7 MAX8893A/MAX8893B/MAX8893C ELECTRICAL CHARACTERISTICS (continued) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP ELECTRICAL CHARACTERISTICS (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN TYP MAX UNIT Ground Current ILOAD = 500FA 21 FA Startup Time from Shutdown CLDO4 = 1.0FF, ILOAD = 150mA 40 Shutdown Output Resistance LDO4_ADEN = 1, VENLDO4 = 0V 300 Fs I LDO5 Input Voltage Range 2.7 0.776 5.5 0.800 V 0.824 0.90 1.00 1.10 1.20 1.30 1.358 1.400 1.442 1.50 1.60 1.70 1.80 1.90 Programmable Output Voltage 2.00 ILOAD = 100mA, programmable output voltage 0.8V to 3.3V in 100mV steps V 2.10 2.20 2.30 2.40 2.50 2.60 2.70 2.80 2.90 3.00 3.10 3.20 Output Voltage Accuracy 3.201 3.300 3.399 VIN = 5.5V with ILOAD = 1mA, and VIN = 3.4V with ILOAD = 150mA (MAX8893A) 0.970 1.000 1.030 VIN = 5.5V with ILOAD = 1mA, and VIN = 3.4V with ILOAD = 150mA (MAX8893B) 2.716 2.800 2.884 VIN = 5.5V with ILOAD = 1mA, and VIN = 3.4V with ILOAD = 150mA (MAX8893C) 2.910 3.000 3.090 Output Current 200 V mA Current Limit VLDO5 = 0V 460 mA Dropout Voltage ILOAD = 100mA 100 mV 8 _______________________________________________________________________________________ µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN TYP MAX UNIT Load Regulation 1mA < ILOAD < 150mA VENLDO5 = VBATT 25 mV Power-Supply Rejection DVLDO5/DVIN2 10Hz to 10kHz, CLDO5 = 1FF, ILOAD = 30mA 75 dB Output Noise Voltage 100Hz to 100kHz, CLDO5 = 1FF, ILOAD = 30mA 45 FVRMS Output Capacitor for Stable Operation (Note 6) 0mA < ILOAD < 200mA 1.4 2.2 0mA < ILOAD < 150mA 0.7 1.0 Ground Current ILOAD = 500FA 21 FA Startup Time from Shutdown CLDO5 = 2.2FF, ILOAD = 200mA 40 Shutdown Output Resistance LDO5_ADEN = 1, VENLDO5 = 0V 300 Fs I FF USB HIGH-SPEED SWITCH Operating Power-Supply Range 2.7 Supply Current VENUSB = 0V, VCB = 0V or VBATT Fault Protection Trip Threshold (VFP) COM_ only, TA = +25NC On-Resistance (RON) 5.5 VBATT = 3.0V 0.6 VBATT = 5.5V 3 VIN + 0.6 VCOM_ = 0V to VBATT VIN + 1.0 5 10 5.5 On-Resistance Match Between Channels (DRON) VBATT = 3.0V, VCOM_ = 2V (Note 7) 0.1 On-Resistance Flatness (RFLAT) VBATT = 3.0V, VCOM_ = 0V to VIN (Note 8) 0.1 Off-Leakage Current (ICOM_(OFF)) On-Leakage Current (ICOM_(ON)) VBATT = 4.5V, VCOM_ = 0V or 4.5V, VNO_, VNC_ = 4.5V or 0V -250 VBATT = 5.5V, VCOM_ = 0V or 5.5V, VNO_, VNC_ with 50FA sink current to AGND VBATT = 5.5V, VCOM_ = 0V or 5.5V, VNO_, and VNC_ are unconnected FA VIN + 0.8 VCOM_ = 3.6V, VBATT = 3.0V -250 V 1 V I I I +250 nA 180 FA +250 nA USB HIGH-SPEED SWITCH AC PERFORMANCE On-Channel -3dB Bandwidth (BW) RL = RS = 50I, signal = 0dBm VNO_, VNC_ = 0dBm, RL = RS = 50I, Figure 1 f = 10MHz -48 Off-Isolation (VISO) f = 250MHz -20 f = 500MHz -17 VNO_, VNC_ = 0dBm, RL = RS = 50I, Figure 1 (Note 9) f = 10MHz -73 f = 250MHz -54 f = 500MHz -33 Crosstalk (VCT) 950 MHz dB dB USB HIGH-SPEED SWITCH LOGIC INPUT (CB) Input Logic-High (VIH) 1.4 Input Logic-Low (VIL) Input Leakage Current (IIN) -250 V 0.4 V +250 nA _______________________________________________________________________________________ 9 MAX8893A/MAX8893B/MAX8893C ELECTRICAL CHARACTERISTICS (continued) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP ELECTRICAL CHARACTERISTICS (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN TYP MAX UNIT USB HIGH-SPEED SWITCH DYNAMIC Turn-On Time (tON) VNO_ or VNC_ = 1.5V, RL = 300I, CL = 35pF, V/ENUSB = VBATT to 0V, Figure 2 1 5 Fs Turn-Off Time (tOFF) VNO_ or VNC_ = 1.5V, RL = 300I, CL = 35pF, V/ENUSB = 0V to VBATT, Figure 2 1 5 Fs Propagation Delay (tPLH, tPHL) RL = RS = 50I, Figure 3 Fault Protection Response Time (tFP) VCOM_ = 0V to 5V step, RL = RS = 50I, VBATT = 3.3V, Figure 4 Fault Protection Recovery Time (tFPR) VCOM_ = 5V to 0V step, RL = RS = 50I, VBATT = 3.3V, Figure 4 Output Skew Between Switches (tSK) Skew between switch 1 and 2, RL = RS = 50I, Figure 3 (Note 6) 40 ps NO_ or NC_ Off-Capacitance (CNO(OFF) or CNC(OFF)) f = 1MHz, Figure 5 (Note 6) 2 pF 100 0.5 ps 5.0 Fs 100 Fs COM Off-Capacitance (CCOM(OFF)) (Note 6) f = 1MHz, Figure 5 5.5 f = 240 MHz, Figure 5 4.8 COM On-Capacitance (CCOM(ON)) (Note 6) f = 1MHz, Figure 5 6.5 f = 240 MHz, Figure 5 5.5 Total Harmonic Distortion Plus Noise VCOM_ = 1VP-P, VBIAS = 1V, RL = RS = 50I, f = 20Hz to 20kHz 0.03 % Human Body Model ±2 kV Human Body Model ±15 IEC 61000-4-2 Air-Gap Discharge ±15 IEC 61000-4-2 Contact Discharge ±8 pF pF USB HIGH-SPEED SWITCH—ESD PROTECTION ENUSB, CB, NC1, NC2, NO1, NO2 COM1, COM2 kV I2C SERIAL INTERFACE (Figure 8) Clock Frequency 400 kHz Bus-Free Time Between START and STOP (tBUF) 1.3 Fs Hold Time Repeated START Condition (tHD_STA) 0.6 Fs SCL Low Period (tLOW) 1.3 Fs SCL High Period (tHIGH) 0.6 Fs Setup Time Repeated START Condition (tSU_STA) 0.6 Fs SDA Hold Time (tHD_DAT) 0 Fs SDA Setup time (tSU_DAT) 100 ns Setup Time for STOP Condition (tSU_STO) 0.6 Fs 10 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 3, 4) PARAMETER CONDITIONS MIN Maximum Pulse Width of Spikes Suppressed TYP MAX 50 UNIT ns LOAD SWITCH (LS) Input Supply Operating Range (VBUCK) After VBUCK starts up On-Resistance (RDS(ON)) VBUCK = 1.0V, ILS = 300mA, TA = +25NC VLS = 2.4V, RL = 400I, VENLS = 1.8V, Register LSTOD = 0 (Note 6) Turn-On Delay Time (tON_DLY) VLS = 2.4V, RL = 400I, VENLS = 1.8V, Register LSTOD = 1 VLS = 2.4V, RL = 400I, VENLS = 1.8V, Register LSRT = 0 VLS = 2.4V, RL = 400I, VENLS = 1.8V, Register LSRT = 1 LS Rise Time (tR) VLS = 2.4V, RL = 400I, VENLS = 1.8V, Register LSRT = 2 VLS = 2.4V, RL = 400I, VENLS = 1.8V, Register LSRT = 3 Turn-Off Delay Time (tOFF_DLY) VLS = 2.4V, RL = 400I, VENLS = 1.8V VLS = 2.4V, RL = 400I, VENLS = 1.8V LS Fall Time (tF) Shutdown Output Resistance 0.8 50 CL = 0.1FF 0.85 CL = 1FF 0.85 CL = 3FF 0.85 CL = 0.1FF 30 CL = 1FF 34 CL = 3FF 37 CL = 0.1FF 10 CL = 1FF (Note 6) 10 CL = 3FF (Note 6) 10 CL = 0.1FF 25 CL = 1FF 27 CL = 3FF 30 CL = 0.1FF 100 CL = 1FF 100 CL = 3FF 100 CL = 0.1FF 300 CL = 1FF 300 CL = 3FF 300 CL = 0.1FF 11 CL = 1FF 11 CL = 3FF 11 CL = 0.1FF 15 CL = 1FF 150 CL = 3FF 447 VLS = 2.4V, VENLS = 0V, LS_ADEN = 1 100 2.4 V 100 mI Fs Fs Fs Fs 200 I Note 3: VIN1, VIN2, and VBATT are connected together and single input is referred to as VIN. Note 4: All units are 100% production tested at TA = +25NC. Limits over the operating temperature range are guaranteed by design. Note 5: When the input voltage is greater than 2.85V (typ), the UVLO comparator trips, and the threshold is reduced to 2.35V (typ). This allows the system to start normally even if the input voltage decays to 2.35V. Note 6: Not production tested; guaranteed by design. Note 7: DRON(MAX) = |RON(CH1) - RON(CH2)|. Note 8: Flatness is defined as the difference between the maximum and minimum value of on-resistance, as measured over specified analog signal ranges. Note 9: Between any two switches. ______________________________________________________________________________________ 11 MAX8893A/MAX8893B/MAX8893C ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) NO-LOAD SUPPLY CURRENT vs. TEMPERATURE NO-LOAD SUPPLY CURRENT vs. SUPPLY VOLTAGE 150 STEP-DOWN AND ALL LDOs ENUSB = BATT, ENLS = GND 100 VBATT = 3.0V 180 170 160 150 VBATT = 4.2V 140 VBATT = 3.7V 130 120 50 110 STEP-DOWN ONLY 100 2.5 3.0 3.5 4.0 4.5 5.0 10 35 60 TEMPERATURE (°C) USB SWITCH ON-RESISTANCE vs. COM VOLTAGE USB SWITCH ON-RESISTANCE vs. COM VOLTAGE 5.5 MAX8893A toc03 TA = +25°C 4.5 VBATT = 3.0V VBATT = 3.7V VBATT = 4.2V 3.0 85 TA = +85°C 5.0 ON-RESISTANCE (I) 5.0 3.5 -15 SUPPLY VOLTAGE (V) 5.5 4.0 -40 5.5 TA = +60°C 4.5 MAX8893A toc04 0 ON-RESISTANCE (I) MAX8893A toc02 190 TA = +35°C 4.0 TA = +10°C TA = -15°C 3.5 TA = -40°C 3.0 FAULT PROTECTION VBATT = 3.7V 2.5 2.5 1 2 3 4 5 0 6 1 2 3 4 COM VOLTAGE (V) COM VOLTAGE (V) COM LEAKAGE CURRENT vs. TEMPERATURE LOGIC THRESHOLD VOLTAGE vs. SUPPLY VOLTAGE MAX8893A toc05 45 43 41 39 37 1.4 1.2 THRESHOLD VOLTAGE (V) 0 5 MAX8893A toc06 SUPPLY CURRENT (µA) 200 200 SUPPLY CURRENT (µA) STEP-DOWN AND ALL LDOs ENUSB = GND, ENLS = BATT MAX8893A toc01 250 COM LEAKAGE CURRENT (nA) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP RISING 1.0 0.8 0.6 FALLING 0.4 0.2 0 35 -40 -15 10 35 TEMPERATURE (°C) 60 85 2.5 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V) 12 ������������������������������������������������������������������������������������� 5.0 5.5 µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP LOAD SWITCH ON-RESISTANCE vs. BATTERY VOLTAGE LOAD SWITCH ON-RESISTANCE vs. TEMPERATURE MAX8893A toc08 80 ON-RESISTANCE (mI) 80 ON-RESISTANCE (mI) 90 MAX8893A toc07 90 70 60 50 70 60 50 VBUCK = 1.0V VBUCK = 1.0V, ILS = 500mA 40 -40 -15 10 35 60 40 85 2.5 TEMPERATURE (°C) 3.0 3.5 4.0 4.5 5.0 LOAD SWITCH TURN-ON/OFF WAVEFORM LOAD SWITCH TURN-ON/OFF WAVEFORM MAX8893A toc09 MAX8893A toc10 VENLS 2V/div VLS ILS 2V/div VENLS 500mV/div VLS 200mA/div ILS 500mV/div 2I LOAD CLS = 1.0µF 10I LOAD, CLS = 1.0µF 20µs/div 20µs/div LOAD SWITCH VOLTAGE DROP vs. LOAD CURRENT STEP-DOWN EFFICIENCY vs. LOAD CURRENT VBUCK = 1.0V 80 EFFICIENCY (%) 30 20 VBATT = 3.0V 90 70 500mA/div MAX8893A toc12 100 MAX8893A toc11 40 VBUCK - VLS (mV) 5.5 BATTERY VOLTAGE (V) VBATT = 3.7V 60 50 VBATT = 4.2V 40 30 10 20 10 0 VBUCK = 1.0V 0 0 100 200 300 LOAD CURRENT (mA) 400 500 0.1 1.0 10 100 1000 LOAD CURRENT (mA) ______________________________________________________________________________________ 13 MAX8893A/MAX8893B/MAX8893C Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) STEP-DOWN SWITCHING FREQUENCY vs. LOAD CURRENT STEP-DOWN OUTPUT VOLTAGE vs. LOAD CURRENT 3600 1.01 OUTPUT VOLTAGE (V) 3200 2800 2400 2000 1600 1200 800 VBATT = 3.7V VBATT = 4.2V 1.00 0.99 VBATT = 3.0V 0.98 VBATT = 3.7V VBUCK = 1.0V 400 MAX8893A toc14 1.02 MAX8893A toc13 4000 SWITCHING FREQUENCY (kHz) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP VBUCK = 1.0V 0.97 0 0 100 200 300 400 0 500 100 200 300 400 LOAD CURRENT (mA) LOAD CURRENT (mA) STEP-DOWN LIGHT-LOAD SWITCHING WAVEFORMS STEP-DOWN MEDIUM-LOAD SWITCHING WAVEFORMS MAX8893A toc15 500 MAX8893A toc16 20mV/div (AC-COUPLED) VBUCK 50mV/div (AC-COUPLED) VBUCK 2V/div VLX IL 100mA/div 1mA LOAD, VBUCK = 1.0V VLX IL 2V/div 100mA/div 40mA LOAD, VBUCK = 1.0V 10µs/div 400ns/div STEP-DOWN HEAVY-LOAD SWITCHING WAVEFORMS STEP-DOWN STARTUP AND SHUTDOWN WAVEFORM MAX8893A toc17 MAX8893A toc18 20mV/div (AC-COUPLED) VBUCK VLX 2V/div 2V/div VENBUCK VBUCK 500mV/div 500mA LOAD, VBUCK = 1.0V IL 300mA LOAD, VBUCK = 1.0V 400ns/div 200mA/div IIN 100mA/div 100µs/div 14 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP STEP-DOWN LOAD TRANSIENT WAVEFORM STEP-DOWN LINE TRANSIENT WAVEFORM MAX8893A toc20 MAX8893A toc19 4V 500mV/div VBATT 3.5V VBUCK 50mV/div 20mA/div (AC-COUPLED) VBUCK 300mA 5mA IOUT 5mA 200mA/div 10I LOAD 10µs/div 20µs/div LDO1 DROPOUT VOLTAGE vs. LOAD CURRENT LDO1 OUTPUT-VOLTAGE ERROR vs. LOAD CURRENT 100 50 -10 -20 -30 -40 -50 0 0 50 100 150 200 250 50 0 300 100 150 200 250 LOAD CURRENT (mA) LOAD CURRENT (mA) LDO1 OUTPUT VOLTAGE vs. INPUT VOLTAGE LDO1 LINE TRANSIENT WAVEFORM 300 MAX8893A toc24 MAX8893A toc23 2.80 2.75 OUTPUT VOLTAGE (V) MAX8893A toc22 MAX8893A toc21 150 0 OUTPUT-VOLTAGE ERROR (mV) DROPOUT VOLTAGE (mV) 200 4V VBATT 500mV/div 3.5V 2.70 2.65 10mV/div (AC-COUPLED) VLDO1 2.60 2.55 300mA LOAD 10I LOAD 2.50 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 10µs/div INPUT VOLTAGE (V) ______________________________________________________________________________________ 15 MAX8893A/MAX8893B/MAX8893C Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) LDO1 STARTUP AND SHUTDOWN WAVEFORM LDO1 LOAD TRANSIENT WAVEFORM MAX8893A toc25 MAX8893A toc26 300mA 5mA IOUT 5mA VENLOD1 2V/div VLDO1 1V/div 200mA/div 200mV/div (AC-COUPLED) VLDO1 300mA LOAD, VLDO1 = 2.8V 500mA/div IIN 20µs/div 100µs/div LDO2 DROPOUT VOLTAGE vs. LOAD CURRENT LDO2 OUTPUT-VOLTAGE ERROR vs. LOAD CURRENT 100 50 0 MAX8893A toc28 MAX8893A toc27 150 0 OUTPUT-VOLTAGE ERROR (mV) DROPOUT VOLTAGE (mV) 200 -10 -20 -30 -40 -50 0 50 100 150 200 250 300 50 0 100 150 200 250 LOAD CURRENT (mA) LOAD CURRENT (mA) LDO2 OUTPUT VOLTAGE vs. INPUT VOLTAGE LDO2 LINE TRANSIENT WAVEFORM 300 MAX8893A toc30 MAX8893A toc29 2.65 OUTPUT VOLTAGE (V) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP 2.60 4V VBATT 500mV/div 3.5V 2.55 VLDO2 10mV/div (AC-COUPLED) 2.50 10I LOAD 300mA LOAD 2.45 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 10µs/div INPUT VOLTAGE (V) 16 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP LDO2 STARTUP AND SHUTDOWN WAVEFORM LDO2 LOAD TRANSIENT WAVEFORM MAX8893A toc31 MAX8893A toc32 300mA 5mA IOUT 5mA VENLDO2 2V/div VLDO2 1V/div 200mA/div 200mV/div (AC-COUPLED) VLDO1 300mA LOAD, VLDO2 = 2.6V 500mA/div IIN 20µs/div 100µs/div LDO3 DROPOUT VOLTAGE vs. LOAD CURRENT LDO3 OUTPUT-VOLTAGE ERROR vs. LOAD CURRENT 100 50 0 -10 -20 -30 -40 -50 0 50 100 150 200 250 300 50 0 100 150 200 250 LOAD CURRENT (mA) LOAD CURRENT (mA) LDO3 OUTPUT VOLTAGE vs. INPUT VOLTAGE LDO3 LINE TRANSIENT WAVEFORM 300 MAX8893A toc36 MAX8893A toc35 3.3 3.2 OUTPUT VOLTAGE (V) MAX8893A toc34 MAX8893A toc33 150 0 OUTPUT-VOLTAGE ERROR (mV) DROPOUT VOLTAGE (mV) 200 3.1 4V VBATT 500mV/div 3.5V 3.0 2.9 2.8 VLDO3 10mV/div (AC-COUPLED) 2.7 2.6 300mA LOAD 2.5 2.7 3.1 3.5 3.9 4.3 4.7 INPUT VOLTAGE (V) 5.1 10I LOAD 5.5 10µs/div ______________________________________________________________________________________ 17 MAX8893A/MAX8893B/MAX8893C Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) LDO3 STARTUP AND SHUTDOWN WAVEFORM LDO3 LOAD TRANSIENT WAVEFORM MAX8893A toc38 MAX8893A toc37 300mA 5mA 5mA IOUT VENLDO3 2V/div VLDO3 2V/div 200mA/div VLDO3 200mV/div (AC-COUPLED) 300mA LOAD, VLDO3 = 3.3V 500mA/div IIN 20µs/div 100µs/div LDO4 DROPOUT VOLTAGE vs. LOAD CURRENT LDO4 OUTPUT-VOLTAGE ERROR vs. LOAD CURRENT 60 40 20 0 0 30 60 90 LOAD CURRENT (mA) 120 150 MAX8893A toc40 80 0 OUTPUT-VOLTAGE ERROR (mV) MAX8893A toc39 100 DROPOUT VOLTAGE (mV) MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP -10 -20 -30 -40 -50 0 30 60 90 120 LOAD CURRENT (mA) 18 ������������������������������������������������������������������������������������� 150 µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP LDO4 OUTPUT VOLTAGE INPUT VOLTAGE LDO4 LINE TRANSIENT WAVEFORM MAX8893A toc42 MAX8893A toc41 3.0 OUTPUT VOLTAGE (V) 2.9 4V 500mV/div VBATT 3.5V 2.8 2.7 VLDO4 10mV/div (AC-COUPLED) 2.6 20I LOAD 150mA LOAD 2.5 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 10µs/div INPUT VOLTAGE (V) LDO5 DROPOUT VOLTAGE vs. LOAD CURRENT LDO4 LOAD TRANSIENT WAVEFORM MAX8893A toc43 IOUT 5mA 5mA 200mA/div 200mV/div (AC-COUPLED) VLDO4 20µs/div MAX8893A toc44 150mA DROPOUT VOLTAGE (mV) 150 120 90 60 30 0 0 40 80 120 160 200 LOAD CURRENT (mA) ______________________________________________________________________________________ 19 MAX8893A/MAX8893B/MAX8893C Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) LDO4 OUTPUT-VOLTAGE ERROR vs. LOAD CURRENT LDO5 OUTPUT VOLTAGE vs. INPUT VOLTAGE 1.01 OUTPUT VOLTAGE (V) -10 MAX8893A toc46 1.02 MAX8893A toc45 0 OUTPUT-VOLTAGE ERROR (mV) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP -20 -30 1.00 0.99 -40 0.98 -50 0.97 200mA LOAD 0 40 80 120 160 2.7 200 3.1 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) LOAD CURRENT (mA) LDO5 LINE TRANSIENT WAVEFORM LDO5 LOAD TRANSIENT WAVEFORM MAX8893A toc47 4V MAX8893A toc48 500mV/div VBATT 3.5V 200mA IOUT VLDO5 10mV/div (AC-COUPLED) 5mA 5mA 200mA/div 200mV/div (AC-COUPLED) VLDO5 5I LOAD 10µs/div 20µs/div LDO4 AND LDO5 STARTUP AND SHUTDOWN WAVEFORM POWER-UP SEQUENCING (MAX8893A) MAX8893A toc49 VENLDO45 2V/div VLDO4 2V/div VLDO5 IIN MAX8893A toc50 1V/div VLDO4 = 3.0V, 150mA LOAD VLDO5 = 1.0V, 200mA LOAD 500mA/div 1.0V VBUCK 2.8V 2V/div VLDO1 2.6V 4V/div 4V/div VLDO2 3.3V VLDO3 3.0V VLDO4 1.0V VLDO5 5V/div 5V/div 2V/div 5I LOAD 100µs/div 2V/div VEN_ 100µs/div 20 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP POWER-UP SEQUENCING (MAX8893B) POWER-UP SEQUENCING (MAX8893C) MAX8893A toc51 MAX8893A toc52 2V/div VEN_ 1.0V VBUCK 2.6V 2V/div VLDO1 2.6V 4V/div 4V/div VLDO2 3.3V VLDO3 3.3V 2.8V VLDO5 1.0V VBUCK 1.8V VLDO1 2.6V VLDO2 5V/div VLDO3 5V/div VLDO4 2V/div 4V/div 4V/div 3.3V 3.3V 5V/div 5V/div 3.0V VLDO5 5V/div 2V/div 100µs/div 5V/div 100µs/div TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY FREQUENCY RESPONSE 0 MAX8893A toc53 1 RL = 600I ON-LOSS -10 -20 THD+N (%) MAGNITUDE (dB) 0.1 0.01 MAX8893A toc54 VLDO4 VEN_ OFF-ISOLATION -30 -40 -50 -60 -70 CROSSTALK -80 -90 0.001 -100 100 1000 10,000 100,000 1 10 100 1000 FREQUENCY (MHz) FREQUENCY (Hz) EYE DIAGRAM MAX8893A toc55 DIFFERENTIAL SIGNAL (V) 10 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 TIME (x 10-9)s ______________________________________________________________________________________ 21 MAX8893A/MAX8893B/MAX8893C Typical Operating Characteristics (continued) (Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = +25NC, unless otherwise noted.) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Test Circuits/Timing Diagrams 0V OR VCC CB NC1 50I COM1 MAX8893A MAX8893B MAX8893C NO1* 50I VIN NETWORK ANALYZER 50I MEAS VOUT OFF-ISOLATION = 20log VOUT VIN CROSSTALK = 20log VOUT VIN REF 50I 50I SWITCH IS ENABLED. MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED. *FOR CROSSTALK THIS PIN IS NO2. NC2 AND COM2 ARE OPEN. Figure 1. USB High-Speed Switch Off-Isolation and Crosstalk MAX8893A MAX8893B MAX8893C VIN_ LOGIC INPUT COM NO_ OR NC_ VOUT RL VIL 50% t OFF CL EN (EN) VOUT LOGIC INPUT SWITCH OUTPUT CL INCLUDES FIXTURE AND STRAY CAPACITANCE. RL VOUT = VIN_ RL + RON ( ) t R < 5ns t F < 5ns VIH 0.9 x V0UT 0V 0.1 x VOUT t ON IN DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH. Figure 2. USB High-Speed Switch Switching Time 22 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP RS VIN+ MAX8893A MAX8893B MAX8893C NC1 OR NO1 COM1 VOUT+ tPLH = tPLHX OR tPLHY tPHL = tPHLX OR tPHLY tSK(O) = |tPLHX - tPLHY| OR |tPHLX - tPHLY| tSK(P) = |tPLHX - tPHLX| OR |tPLHY - tPHLY| RL RS VIN- NC2 OR NO2 COM2 VOUTRL CB VIL TO VIH tINFALL tINRISE VCC 90% VIN+ 50% 90% 50% 10% 0V 10% VCC VIN- 50% 50% 0V tOUTRISE tPLHX tOUTFALL tPHLX VCC 90% VOUT+ 90% 50% 50% 10% 0V 10% VCC 50% VOUT- 50% 0V tPHLY tPLHY Figure 3. USB High-Speed Switch Output Signal Skew, Rise/Fall Time, Propagation Delay ______________________________________________________________________________________ 23 MAX8893A/MAX8893B/MAX8893C Test Circuits/Timing Diagrams (continued) MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Test Circuits/Timing Diagrams (continued) 5V VCC = 3.3V 3V COM VCOM MAX8893A MAX8893B MAX8893C 0V tFP tFPR CB CAPACITANCE METER VFP VIL OR VIH NC_ OR NO_ 3V VNO_ VNC_ 0V Figure 4. USB High-Speed Switch Fault-Protection Response/ Recovery Time Figure 5. USB High-Speed Switch Channel Off-/On-Capacitance Pin Configuration TOP VIEW (BUMPS ON BOTTIOM) 1 2 3 4 5 6 MAX8893A/MAX8893B/MAX8893C A LDO1 LDO2 LDO3 BATT IN1 LX B REFBP CB ENUSB ENLDO1 ENBUCK PGND C IN2 NC1 NC2 ENLDO2 ENLS BUCK D LDO5 NO1 NO2 ENLDO3 ENLDO45 SCL E LDO4 COM1 COM2 AGND LS SDA WLP (3.0mm x 2.5mm) 24 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP PIN NAME FUNCTION A1 LDO1 300mA LDO1 Output. Bypass LDO1 to AGND with a 2.2FF ceramic capacitor. The output voltage is programmable from 1.6V to 3.3V in 100mV steps. The output impedance of LDO1 is 300I when disabled with the LDO1_ADEN bit set to 1. A2 LDO2 300mA LDO2 Output. Bypass LDO2 to AGND with a 2.2FF ceramic capacitor. The output voltage is programmable from 1.2V to 3.3V in 100mV steps. The output impedance of LDO2 is 300I when disabled with the LDO2_ADEN bit set to 1. A3 LDO3 300mA LDO3 Output. Bypass LDO3 to AGND with a 2.2FF ceramic capacitor. The output voltage is programmable from 1.6V to 3.3V in 100mV steps. The output impedance of LDO3 is 300I when disabled with the LDO3_ADEN bit set to 1. A4 BATT Supply Voltage to the Control Section, LDO2, LDO3, and USB Switch. Connect a 2.2FF ceramic capacitor from BATT to AGND. A5 IN1 Supply Voltage to the Step-Down Converter. Connect a 2.2FF input ceramic capacitor from IN1 to PGND. A6 LX Inductor Connection for Step-Down Converter. LX is internally connected to the drain of the internal p-channel MOSFET and the drain of the internal n-channel synchronous rectifier. The output impedance of LX is 300I when the step-down converter is disabled with the BUCK_ADEN bit set to 1. B1 REFBP Reference Noise Bypass. Bypass REFBP to AGND with a 0.1FF ceramic capacitor to reduce noise on the LDO outputs. REFBP is high impedance in shutdown. B2 CB Digital Control Input for USB High-Speed Switch. Drive CB low to connect COM1 to NC1 and COM2 to NC2. Drive CB high to connect COM1 to NO1 and COM2 to NO2. B3 ENUSB B4 ENLDO1 Enable Input for LDO1. Drive ENLDO1 high to turn on the LDO1. Drive ENLDO1 low to turn off the LDO1. LDO1 can also be enabled/disabled through the I2C interface. ENLDO1 and I2C control bit are logically ORed. ENLDO1 has an internal 800kI pulldown resistor. B5 ENBUCK Enable Input for the Step-Down Converter. Drive ENBUCK high to turn on the step-down converter. Drive ENBUCK low to turn off the step-down converter. The step-down converter can also be enabled/ disabled through the I2C interface. ENBUCK and I2C control bit are logically ORed. ENBUCK has an internal 800kI pulldown resistor. B6 PGND C1 IN2 Active-Low Enable Input for USB High-Speed Switch. Drive ENUSB high to put the switch in high impedance. Drive ENUSB low for normal operation. Power Ground for Step-Down Converter Supply Voltage to LDO1, LDO4, and LDO5. Connect a 2.2FF input ceramic capacitor from IN2 to AGND. ______________________________________________________________________________________ 25 MAX8893A/MAX8893B/MAX8893C Pin Description MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Pin Description (continued) PIN NAME C2 NC1 Normally Closed Terminal for USB Switch 1. NC1 is high impedance in shutdown. FUNCTION C3 NC2 Normally Closed Terminal for USB Switch 2. NC2 is high impedance in shutdown. C4 ENLDO2 C5 ENLS Enable Input for Load Switch. Drive ENLS high to turn on the load switch. Drive ENLS low to turn off the load switch. The load switch can also be enabled/disabled through the I2C interface. ENLS and I2C control bit are logically ORed. ENLS has an internal 800kI pulldown resistor. C6 BUCK Voltage Feedback for Step-Down Converter D1 LDO5 200mA LDO5 Output. Bypass LDO5 to AGND with a 2.2FF ceramic capacitor. The output voltage of LDO5 is programmable from 0.8V to 3.3V in 100mV steps. The output impedance of LDO5 is 300I when disabled with the LDO5_ADEN bit set to 1. D2 NO1 Normally Open Terminal for USB Switch 1. NO1 is high impedance in shutdown. D3 NO2 Normally Open Terminal for USB Switch 2. NO2 is high impedance in shutdown. D4 ENLDO3 Enable Input for LDO3. Drive ENLDO3 high to turn on the LDO3. Drive ENLDO3 low to turn off the LDO3. LDO3 can also be enabled/disabled through the I2C interface. ENLDO3 and I2C control bit are logically ORed. ENLDO3 has an internal 800kI pulldown resistor. D5 ENLDO45 Enable Input for LDO4 and LDO5. Drive ENLDO45 high to turn on the LDO4 and LDO5. Drive ENLDO45 low to turn off the LDO4 and LDO5. LDO4 and LDO5 can also be enabled/disabled individually through the I2C interface. ENLDO45 and I2C control bits (ELDO4 and ELDO5) are logically ORed. ENLDO45 has an internal 800kI pulldown resistor. D6 SCL E1 LDO4 150mA LDO4 Output. Bypass LDO4 to GND with a 1FF ceramic capacitor. The output voltage of LDO4 is programmable from 0.8V to 3.3V in 100mV steps. The output impedance of LDO4 is 300I when disabled with the LDO4_ADEN bit set to 1. E2 COM1 Common Terminal for USB High Switch 1 E3 COM2 Common Terminal for USB High Switch 2 E4 AGND Analog Ground. Ground for all the LDOs, control section, and USB switches. E5 LS E6 SDA Enable Input for LDO2. Drive ENLDO2 high to turn on the LDO2. Drive ENLDO2 low to turn off the LDO2. LDO2 can also be enabled/disabled through the I2C interface. ENLDO2 and I2C control bit are logically ORed. ENLDO2 has an internal 800kI pulldown resistor. I2C-Compatible Serial Interface Clock High-Impedance Input Load Switch Output. LS is connected to the drain of an internal p-channel MOSFET. VLS = VBUCK RDS(ON) (p-channel MOSFET) x load current. I2C-Compatible Serial Interface Data High-Impedance Input 26 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP IN2 AGND BATT Li+ BATTERY CIN1 2.2µF IN1 LS MAX8893A MAX8893B MAX8893C CLS 1µF LOAD SWITCH CONTROL EN VBUCK IN LX ENLS BUCK VBUCK, 0.8V TO 2.4V 100mV STEP, 500mA LX 2.2µH CBUCK 2.2µF STEP-DOWN CONVERTER PGND EN IN SDA SCL OUT PGND ENBUCK LDO1 EN SCL OUT IN I2C AND LOGIC ENLDO1 OUT IN ENLDO2 VLDO3, 1.6V TO 3.3V 100mV STEP, 300mA CLDO3 2.2µF EN OUT ENLDO3 ENLDO3 VLDO4, 0.8V TO 3.3V 100mV STEP, 150mA LDO4 CLDO4 1.0µF LDO4 ANALOG LDO EN OUT IN ENLDO2 LDO3 LDO3 IN VLDO2, 1.2V TO 3.3V 100mV STEP, 300mA CLDO2 2.2µF EN REFBP ENLDO1 LDO2 LDO2 CREFBP 0.1µF VLDO1, 1.6V TO 3.3V 100mV STEP, 300mA CLDO1 2.2µF LDO1 ANALOG LDO SDA ENBUCK ENLDO45 ENLDO45 LDO5 VLDO5, 0.8V TO 3.3V 100mV STEP, 200mA CLDO5 2.2µF LDO5 ANALOG LDO EN ENUSB USBSEL ENUSB CB EN COM1 COM2 IN USB HIGH S/W NC1 NC2 NO1 NO2 Figure 6. Block Diagram and Application Circuit ______________________________________________________________________________________ 27 MAX8893A/MAX8893B/MAX8893C CBATT 2.2µF CIN2 2.2µF MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Detailed Description The MAX8893A/MAX8893B/MAX8893C highly integrated power-management ICs integrate a high-efficiency 500mA step-down DC-DC converter, five low-dropout linear regulators, a load switch with ultra-low on-resistance, a USB high-speed switch, and a 400kHz I2C serial interface. The step-down converter delivers over 500mA at I2C programmable output levels from 0.8V to 2.4V. It uses a proprietary hysteretic-PWM control scheme that switches up to 4MHz, allowing a trade-off between efficiency and tiny external components. The step-down converter also features dynamic voltage scaling (DVS) control. Its output voltage ramps up with the I2C-controlled ramp rate from 1mV/Fs to 12mV/Fs. Five low-dropout linear regulators feature low 45FVRMS output noise (LDO1, LDO4, and LDO5) and very low ground currents (LDO2 and LDO3). The USB high-speed switch is a high ESD-protected DPDT analog switch. It is ideal for USB 2.0 Hi-Speed (480Mbps) switching applications and also meets USB low- and full-speed requirements. The load switch features ultra-low on-resistance and operates from 0.8V to 2.4V input range. Its rise time is I2C programmable to control the inrush current. The internal I2C interface provides flexible control on regulator ON/OFF control, output voltage setting, step-down dynamic voltage scaling and ramp rate, and load switch timing. Step-Down DC-DC Converter Control Scheme The MAX8893A/MAX8893B/MAX8893C step-down converter is optimized for high-efficiency voltage conversion over a wide load range, while maintaining excellent transient response, minimizing external component size, and output voltage ripple. The step-down converter also features an optimized on-resistance internal MOSFET switch and synchronous rectifier to maximize efficiency. The IC utilizes a proprietary hysteretic-PWM control scheme that switches with nearly fixed frequency up to 4MHz allowing for ultra-small external components. Its output current is guaranteed up to 500mA. When the step-down output voltage falls below the regulation threshold, the error comparator begins a switching cycle by turning on the high-side switch. This switch remains on until the minimum on-time (tON) expires and the output voltage is in regulation or the current-limit threshold is exceeded. Once off, the high-side switch remains off until the minimum off-time (tOFF) expires and the output voltage again falls below the regulation threshold. During the off period, the low-side synchronous rectifier turns on and remains on until either the high-side switch turns on again or the inductor current reduces to the rectifier-off current threshold (ILXOFF = 30mA (typ)). The internal synchronous rectifier eliminates the need for an external Schottky diode. The step-down converter has the internal soft-start circuitry with a fixed ramp to eliminate input current spikes when it is enabled. Voltage Positioning Load Regulation The step-down converter uses a unique feedback network. By taking feedback from the LX node, the usual phase lag due to the output capacitor is removed, making the loop exceedingly stable and allowing the use of very small ceramic output capacitors. This configuration causes the output voltage to shift by the inductor series resistance multiplied by the load current. This voltagepositioning load regulation greatly reduces overshoot during load transients, which effectively halves the peak-to-peak output-voltage excursions compared to traditional step-down converters. Dynamic Voltage Scaling (DVS) Control with Ramp Rate The step-down output voltage has a variable ramp rate that is set by the BUCKRAMP bits in the DVS RAMP CONTROL register. This register controls the outputvoltage ramp rate during a positive voltage change (for example, from 1.0V to 1.1V), and a negative voltage change (for example, from 1.1V to 1.0V). Ramp rate adjustment range is from 1mV/Fs to 12mV/Fs in the step of 1mV/Fs. After the step-down converter is in regulation, its output voltage can dynamically ramp up at the rate set by the BUCKRAMP bits for a positive voltage change. For a negative voltage change, the decay rate of the output voltage depends on the size of the external load: a small load results in an output-voltage decay that is slower than the specified ramp rate and LX sinks current from the output capacitor to actively ramp down the output voltage; a large load (greater than COUT x Ramp Rate) results in an output-voltage decay with the specified ramp rate. When the step-down converter is disabled, the output voltage decays to ground at a rate determined by the output capacitance, internal discharge resistance, and the external load. 28 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Enable Inputs (ENBUCK, ENLDO_, ENLS, ENUSB) The MAX8893A/MAX8893B/MAX8893C have individual enable inputs for each regulator, load switch, and USB switch. The individual enable inputs (ENBUCK, ENLDO1, ENLDO2, ENLDO3, ENLDO45, ENLS) are logically ORed with the corresponding I2C serial interface control bit. ENUSB input is logically NANDed with the EUSB bit. See Tables 2, 3, and 4 for enable logic truth tables. The enable inputs (ENBUCK, ENLDO_, and ENLS) are internally pulled to AGND by an 800kI (typ) pulldown resistor. ENUSB is internally pulled up to BATT by an 800kω (typ) pullup resistor. Any valid enable input signal turns on the MAX8893A/ MAX8893B/MAX8893C. After the IC is up, the I2C interface is active and the IC can be reprogrammed through the I2C interface. To turn off the IC, both I2C bus and enable inputs must be low. Default Regulator Output Voltages The default regulator output voltages are set as shown in Table 1. All regulator output voltages (BUCK, LDO1, LDO2, LDO3, LDO4, and LDO5) are programmable through the I2C serial interface. All I2C register values return to the default value when no enable input signals are present. Table 1. Default Regulator Output Voltages PART BUCK (V) LDO1 (V) LDO2 (V) LDO3 (V) LDO4 (V) LDO5 (V) MAX8893A 1.0 2.8 2.6 3.3 3.0 1.0 MAX8893B 1.0 2.6 2.6 3.3 3.3 2.8 MAX8893C 1.0 1.8 2.6 3.3 3.3 3.0 Table 2. Truth Table for BUCK, LDO1 to LDO3, and Load Switch ENABLE INPUT (ENBUCK, ENLDO1, ENLDO2, ENLDO3, OR ENLS) CORRESPONDING I2C ON/OFF CONTROL BIT CORRESPONDING REGULATOR OR SWITCH 0 0 0 1 Off On 1 1 0 1 On On Table 3. Truth Table for LDO4 and LDO5 ENABLE INPUT (ENLDO45) ELDO4 BIT ELDO5 BIT LDO4 LDO5 0 0 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Off Off On On On On Off On Off On On On ______________________________________________________________________________________ 29 MAX8893A/MAX8893B/MAX8893C Low-Dropout Linear Regulators The MAX8893A/MAX8893B/MAX8893C contain five lowdropout, low-quiescent-current, high-accuracy, linear regulators (LDOs). The LDO output voltages are set through the I2C serial interface. The LDOs include an internal reference, error amplifier, p-channel pass transistor, and internal programmable voltage-divider. Each error amplifier compares the reference voltage to a feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference voltage, the pass-transistor gate is pulled lower, allowing more current to pass to the output and increasing the output voltage. If the feedback voltage is too high, the passtransistor gate is pulled up, allowing less current to pass to the output. MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Table 4. Truth Table for USB Switch ENUSB EUSB BIT USB SWITCH 0 0 On 0 1 1 0 On On 1 1 Off Power-Up Sequencing Drive ENBUCK or ENLDO_ high to turn on the BUCK converter or the corresponding LDOs. When ENBUCK and ENLDO_ are connected together and driven from low to high, all the regulators are turned on with the preset power-up sequencing. There are time delays between each regulator to limit input current rush. The MAX8893A/MAX8893B/MAX8893C have different power-up time delays between each regulator. See the Typical Operating Characteristics for details. Undervoltage Lockout When VIN rises above the undervoltage lockout threshold (2.85V typ), the MAX8893A/MAX8893B/MAX8893C can be enabled by driving any EN_ high or ENUSB low. The UVLO threshold hysteresis is typically 0.5V. Therefore, if VIN falls below 2.35V (typ), the undervoltage lockout circuitry disables all outputs and all internal registers are reset to default values. Reference Noise Bypass (REFBP) Bypass REFBP to AGND with a 0.1FF ceramic capacitor to reduce noise on the LDO outputs. REFBP is high impedance in shutdown. USB High-Speed Switch The USB high-speed switch is a Q15kV ESD-protected DPDT analog switch. It is ideal for USB 2.0 Hi-Speed (480Mbps) switching applications and also meets USB low- and full-speed requirements. The USB switch is fully specified to operate from a single 2.7V to 5.5V supply. The switch is based on charge-pumpassisted n-channel architecture. The switch also features a shutdown mode to reduce the quiescent current. Digital Control Input The USB high-speed switch provides a single-bit control logic input, CB. CB controls the position of the switches as shown in Figure 7. Driving CB rail-to-rail minimizes power consumption. BATT ENUSB MAX8893A MAX8893B MAX8893C CB NC1 COM1 Thermal-Overload Protection Thermal-overload protection limits total power dissipation in the MAX8893A/MAX8893B/MAX8893C. The step-down converter and LDOs have independent thermal protection circuits. When the junction temperature exceeds +160NC, the LDO, or step-down thermaloverload protection circuitry disables the corresponding regulators, allowing the IC to cool. The LDO thermaloverload protection circuit enables the LDOs after the LDO junction temperature cools down, resulting in pulsed LDO outputs during continuous thermal-overload conditions. The step-down converter’s thermal-overload protection circuitry enables the step-down converter after the junction temperature cools down. Thermaloverload protection safeguards the IC in the event of fault conditions. NO1 NC2 COM2 NO2 ENUSB CB N0_ NC_ COM_ 0 0 OFF ON — 0 1 ON OFF — 1 X OFF OFF HI-Z X = DON'T CARE. Figure 7. USB Switch Functional Diagram/Truth Table 30 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Overvoltage Fault Protection The USB switch features overvoltage fault protection on COM_. Fault protection protects the switch and USB transceiver from damaging voltage levels. When voltages on COM_ exceed the fault protection threshold (VFP), COM_, NC_, and NO_ are high impedance. Enable Input (ENUSB) The USB switch features a shutdown mode that reduces the quiescent current supply and places COM_ in high impedance. Drive ENUSB high to place the USB switch in shutdown mode. Drive ENUSB low to allow the USB switch to enter normal operation. Load Switch The MAX8893A/MAX8893B/MAX8893C include an ultralow RON p-channel MOSFET load switch. The switch has its own enable input, ENLS. When it is enabled, its output soft-starts with I2C programmed rising time to avoid inrush current. See Table 8. The switch input is from the step-down converter output and can operate over the 0.8V to 2.4V range. With LS_ADEN bit set to 1, when the switch is disabled, an internal 100ω resistor is connected between the load switch output and ground for quick discharging. I2C Serial Interface An I2C-compatible, 2-wire serial interface controls all the regulator output voltages, load switch timing, individual enable/disable control, and other parameters. The serial bus consists of a bidirectional serial-data line (SDA) and a serial-clock input (SCL). The MAX8893A/MAX8893B/ MAX8893C are slave-only devices, relying upon a master to generate a clock signal. The master initiates data transfer to and from the MAX8893A/MAX8893B/ MAX8893C and generates SCL to synchronize the data transfer (Figure 8). I2C is an open-drain bus. Both SDA and SCL are bidirectional lines, connected to a positive supply voltage through a pullup resistor. They both have Schmitt triggers and filter circuits to suppress noise spikes on the bus to assure proper device operation. SDA tSU,STA tSU,DAT tLOW tBUF tHD,STA tHD,DAT tSU,STO tHIGH SCL tHD,STA tR tF START CONDITION REPEATED START CONDITION STOP CONDITION START CONDITION Figure 8. 2-Wire Serial Interface Timing Detail ______________________________________________________________________________________ 31 MAX8893A/MAX8893B/MAX8893C Analog Signal Levels The on-resistance of the USB switch is very low and stable as the analog input signals are swept from ground to VIN (see the Typical Operating Characteristics). These switches are bidirectional, allowing NO_, NC_, and COM_ to be configured as either inputs or outputs. The charge-pump-assisted n-channel architecture allows the switch to pass analog signals that exceed VIN up to the overvoltage fault protection threshold. This allows USB signals that exceed VIN to pass, allowing compliance with USB requirements for voltage levels. MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Slave Address A bus master initiates communication with a slave device (MAX8893A/MAX8893B/MAX8893C) by issuing a START condition followed by the slave address. The slave address byte consists of 7 address bits (0111110) and a read/write bit (RW). Its address is 0x7C for write operations and 0x7D for read operations. After receiving the proper address, the MAX8893A/MAX8893B/ MAX8893C issue an acknowledge by pulling SDA low during the ninth clock cycle. Bit Transfer Each data bit, from the most significant bit to the least significant bit, is transferred one by one during each clock cycle. During data transfer, the SDA signal is allowed to change only during the low period of the SCL clock and it must remain stable during the high period of the SCL clock (Figure 9). START and STOP Conditions Both SCL and SDA remain high when the bus is not busy. The master signals the beginning of a transmission with a START (S) condition by transitioning SDA from high to low while SCL is high. When the master has finished communicating with the MAX8893A/MAX8893B/MAX8893C, it issues a STOP (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another transmission (Figure 10). Both START and STOP conditions are generated by the bus master. SCL SDA DATA LINE STABLE DATA VALID START CONDITION (S) DATA ALLOWED TO CHANGE STOP CONDITION (P) Figure 9. Bit Transfer SDA SCL START CONDITION STOP CONDITION Figure 10. START and STOP Conditions 32 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Write Operation The MAX8893A/MAX8893B/MAX8893C recognize the write-byte protocol as defined in the SMBus™ specification and shown in section A of Figure 12. The write-byte protocol allows the I2C master device to send 1 byte of data to the slave device. The write-byte protocol requires a register pointer address for the subsequent write. The MAX8893A/MAX8893B/MAX8893C acknowledge any register pointer even though only a subset of those registers actually exists in the device. The write-byte protocol is as follows: 1) The master sends a start command. 2) The master sends the 7-bit slave address followed by a write bit (0x7C). 3) The addressed slave asserts an acknowledge by pulling SDA low. 4) The master sends an 8-bit register pointer. 5) The slave acknowledges the register pointer. 6) The master sends a data byte. 7) The slave updates with the new data. 8) The slave acknowledges the data byte. 9) The master sends a STOP condition. In addition to the write-byte protocol, the MAX8893A/ MAX8893B/MAX8893C can write to multiple registers as SDA BY MASTER D7 D0 D6 NOT ACKNOWLEDGE SDA BY SLAVE ACKNOWLEDGE SCL 1 2 START CONDITION 8 9 CLOCK PULSE FOR ACKNOWLEDGEMENT Figure 11. Acknowledge shown in section B of Figure 12. This protocol allows the I2C master device to address the slave only once and then send data to a sequential block of registers starting at the specified register pointer. Use the following procedure to write to a sequential block of registers: 1) The master sends a start command. 2) The master sends the 7-bit slave address followed by a write bit (0x7C). 3) The addressed slave asserts an acknowledge by pulling SDA low. 4) The master sends the 8-bit register pointer of the first register to write. 5) The slave acknowledges the register pointer. 6) The master sends a data byte. 7) The slave updates with the new data. 8) The slave acknowledges the data byte. 9) Steps 6 to 8 are repeated for as many registers in the block, with the register pointer automatically incremented each time. 10) The master sends a STOP condition. SMBus is a trademark of Intel Corp. ______________________________________________________________________________________ 33 MAX8893A/MAX8893B/MAX8893C Acknowledge The acknowledge bit is used by the recipient to handshake the receipt of each byte of data (Figure 11). After data transfer, the master generates the acknowledge clock pulse and the recipient pulls down the SDA line during this acknowledge clock pulse, such that the SDA line stays low during the high duration of the clock pulse. When the master transmits the data to the MAX8893A/ MAX8893B/MAX8893C, it releases the SDA line and the MAX8893A/MAX8893B/MAX8893C take the control of the SDA line and generate the acknowledge bit. When SDA remains high during this 9th clock pulse, this is defined as the not acknowledge signal. The master can then generate either a STOP condition to abort the transfer, or a REPEATED START condition to start a new transfer. MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP LEGEND MASTER TO SLAVE SLAVE TO MASTER A. WRITING TO A SINGLE REGISTER WITH THE WRITE BYTE PROTOCOL 1 S 7 SLAVE ADDRESS 1 1 8 1 8 1 1 NUMBER OF BITS 0 A REGISTER POINTER A DATA A P 8 1 8 1 A DATA X+1 A R/W B. WRITING TO MULTIPLE REGISTERS 1 7 1 1 8 1 S SLAVE ADDRESS 0 A REGISTER POINTER X A 8 1 8 DATA X+n-1 A DATA X+n DATA X R/W 1 NUMBER OF BITS NUMBER OF BITS A P Figure 12. Writing to the MAX8893A/MAX8893B/MAX8893C Read Operation The method for reading a single register (byte) is shown in section A of Figure 13. To read a single register: section B of Figure 13. Use the following procedure to read a sequential block of registers: 1) The master sends a start command. 1) The master sends a start command. 2) 2) The master sends the 7-bit slave address followed by a read bit (0x7D). The master sends the 7-bit slave address followed by a read bit (0x7D). 3) 3) The addressed slave asserts an acknowledge by pulling SDA low. The addressed slave asserts an acknowledge by pulling SDA low. 4) 4) The master sends an 8-bit register pointer. The master sends an 8-bit register pointer of the first register in the block. 5) The slave acknowledges the register pointer. 5) The slave acknowledges the register pointer. 6) The master sends a REPEATED START condition. 6) The master sends a REPEATED START condition. 7) The master sends the 7-bit slave address followed by a read bit. 7) The master sends the 7-bit slave address followed by a read bit. 8) The slave asserts an acknowledge by pulling SDA low. 8) The slave asserts an acknowledge by pulling SDA low. 9) The slave sends the 8-bit data (contents of the register). 9) The slave sends the 8-bit data (contents of the register). 10) The master asserts an acknowledge by pulling SDA low. 11) The master sends a STOP condition. In addition, the MAX8893A/MAX8893B/MAX8893C can read a block of multiple sequential registers as shown in 10) The master asserts an acknowledge by pulling SDA low. 11) Steps 9 and 10 are repeated for as many registers in the block, with the register pointer automatically incremented each time. 12) The master sends a STOP condition. 34 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP MASTER TO SLAVE SLAVE TO MASTER A. READING A SINGLE REGISTER 1 S 7 SLAVE ADDRESS 1 1 8 1 0 A REGISTER POINTER 1 A Sr 8 1 1 SLAVE ADDRESS 1 A 8 DATA 1 1 A P NUMBER OF BITS R/W B. READING MULTIPLE REGISTERS 1 7 1 1 8 1 1 8 S SLAVE ADDRESS 0 A REGISTER POINTER X A Sr SLAVE ADDRESS R/W 1 1 1 A 8 1 DATA X A NUMBER OF BITS R/W 8 DATA X+1 1 8 A ... DATA X+n-1 1 8 A DATA X+n 1 1 NUMBER OF BITS A P Figure 13. Reading from the MAX8893A/MAX8893B/MAX8893C Table 5. Register Map NAME TABLE REGISTER ADDRESS (hex) RESET VALUE TYPE DESCRIPTION ON/OFF CONTROL Table 6 0x00 0x01 R/W BUCK, LDO1–LDO5, load switch, and USB switch ON/OFF control ACTIVE DISCHARGE CONTROL Table 7 0x01 0xFF R/W Active discharge enable/disable control for step-down converter and LDO regulators LS TIME CONTROL Table 8 0x02 0x08 R/W Load switch rising time, turn-on, and turnoff delay time control DVS RAMP CONTROL Table 9 0x03 0x09 R/W BUCK enable and ramp rate control BUCK Table 10 0x04 0x02 R/W BUCK output voltage setting LDO1 Table 11 0x05 0x0C 0x0A 0x02 R/W LDO1 output voltage setting LDO2 Table 12 0x06 0x0E R/W LDO2 output voltage setting LDO3 Table 13 0x07 0x11 R/W LDO3 output voltage setting R/W LDO4 output voltage setting LDO5 output voltage setting LDO4 Table 14 0x08 0x16 0x19 LDO5 Table 15 0x09 0x02 0x14 0x16 R/W SVER Table 16 0x46 N/A R only Die type information ______________________________________________________________________________________ 35 MAX8893A/MAX8893B/MAX8893C LEGEND MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Table 6. On/Off Control This register contains BUCK, LDO1−LDO5, USB switch, and load switch ON/OFF controls. REGISTER NAME ON/OFF CONTROL Register Pointer 0x00 Reset Value 0x01 Type Read/write Special Features BIT — NAME DESCRIPTION DEFAULT VALUE 0 = BUCK is disabled 1 = BUCK is enabled 0 0 = Load switch is disabled 1 = Load switch is enabled 0 B7 (MSB) EBUCK B6 ELS B5 ELDO1 0 = LDO1 is disabled 1 = LDO1 is enabled 0 B4 ELDO2 0 = LDO2 is disabled 1 = LDO2 is enabled 0 B3 ELDO3 0 = LDO3 is disabled 1 = LDO3 is enabled 0 B2 ELDO4 0 = LDO4 is disabled 1 = LDO4 is enabled 0 B1 ELDO5 0 = LDO5 is disabled 1 = LDO5 is enabled 0 B0 (LSB) EUSB 0 = USB switch is enabled 1 = USB switch is disabled 1 36 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP This register contains the active discharge enable bits for the BUCK, load switch, and LDO1−LDO5. REGISTER NAME ACTIVE DISCHARGE CONTROL Register Pointer 0x01 Reset Value 0xFF Type Read/write Special Features BIT — NAME DESCRIPTION DEFAULT VALUE 0 = BUCK active discharge is disabled 1 = BUCK active discharge is enabled 1 0 = Load switch active discharge is disabled 1 = Load switch active discharge is enabled 1 B7 (MSB) BUCK_ADEN B6 LS_ADEN B5 LDO1_ADEN 0 = LDO1 active discharge is disabled 1 = LDO1 active discharge is enabled 1 B4 LDO2_ADEN 0 = LDO2 active discharge is disabled 1 = LDO2 active discharge is enabled 1 B3 LDO3_ADEN 0 = LDO3 active discharge is disabled 1 = LDO3 active discharge is enabled 1 B2 LDO4_ADEN 0 = LDO4 active discharge is disabled 1 = LDO4 active discharge is enabled 1 B1 LDO5_ADEN 0 = LDO5 active discharge is disabled 1 = LDO5 active discharge is enabled 1 B0 (LSB) — Reserved for future use — ______________________________________________________________________________________ 37 MAX8893A/MAX8893B/MAX8893C Table 7. Active Discharge Control MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP Table 8. LS Time Control This register contains the load switch timing controls. REGISTER NAME LS TIME CONTROL Register Pointer 0x02 Reset Value 0x08 Type Read/write Special Features — BIT NAME B7 (MSB) — Reserved for future use — B6 — Reserved for future use — B5 — Reserved for future use — Load switch rising time control 00 = 10Fs 01 = 27Fs 10 = 100Fs 11 = 300Fs 01 LSTOD Load switch turn-on delay time control 0 = Load switch turn-on delay OFF 1 = Load switch turn-on delay is 34Fs 0 LSTOFFD Load switch turn-off delay time control 00 = 11Fs 01 = 63Fs 10 = 177Fs 11 = 11Fs 00 B4 LSRT B3 B2 B1 B0 (LSB) DESCRIPTION DEFAULT VALUE 38 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP This register contains DVS enable/disable and ramp rate control for the step-down converter. REGISTER NAME DVS RAMP CONTROL Register Pointer 0x03 Reset Value 0x09 Type Read/write Special Features — BIT NAME B7 (MSB) — Reserved for future use — B6 — Reserved for future use — B5 — Reserved for future use — B4 ENDVS 0 = BUCK DVS is disabled 1 = BUCK DVS is enabled 0 B3 B2 BUCKRAMP B1 B0 (LSB) DESCRIPTION Step-down output voltage ramp rate control 0000 (0x0) = 1mV/Fs 0001 (0x1) = 2mV/Fs 0010 (0x2) = 3mV/Fs 0011 (0x3) = 4mV/Fs 0100 (0x4) = 5mV/Fs 0101 (0x5) = 6mV/Fs 0110 (0x6) = 7mV/Fs 0111 (0x7) = 8mV/Fs 1000 (0x8) = 9mV/Fs 1001 (0x9) = 10mV/Fs 1010 (0xA) = 11mV/Fs 1011 (0xB) = 12mV/Fs DEFAULT VALUE 1001 (0x9) ______________________________________________________________________________________ 39 MAX8893A/MAX8893B/MAX8893C Table 9. DVS Ramp Control MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP Table 10. Buck This register contains the step-down converter output voltage controls. REGISTER NAME BUCK Register Pointer 0x04 Reset Value 0x02 Type Read/write Special Features BIT — NAME B7 (MSB) B6 B5 B4 BUCK B3 B2 B1 B0 (LSB) DESCRIPTION DEFAULT VALUE 00000000 (0x00) = 0.8V 00000001 (0x01) = 0.9V 00000010 (0x02) = 1.0V 00000011 (0x03) = 1.1V 00000100 (0x04) = 1.2V 00000101 (0x05) = 1.3V 00000110 (0x06) = 1.4V 00000111 (0x07) = 1.5V 00001000 (0x08) = 1.6V 00001001 (0x09) = 1.7V 00001010 (0x0A) = 1.8V 00001011 (0x0B) = 1.9V 00001100 (0x0C) = 2.0V 00001101 (0x0D) = 2.1V 00001110 (0x0E) = 2.2V 00001111 (0x0F) = 2.3V 00010000 (0x10) = 2.4V 40 ������������������������������������������������������������������������������������� 00000010 (0x02) µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP This register contains LDO1 output voltage controls. REGISTER NAME ON/OFF CONTROL Register Pointer 0x05 0x0C (MAX8893A) 0x0A (MAX8893B) 0x02 (MAX8893C) Reset Value Type Read/write Special Features BIT — NAME B7 (MSB) B6 B5 B4 LDO1 B3 B2 B1 B0 (LSB) DESCRIPTION 00000000 (0x00) = 1.6V 00000001 (0x01) = 1.7V 00000010 (0x02) = 1.8V 00000011 (0x03) = 1.9V 00000100 (0x04) = 2.0V 00000101 (0x05) = 2.1V 00000110 (0x06) = 2.2V 00000111 (0x07) = 2.3V 00001000 (0x08) = 2.4V 00001001 (0x09) = 2.5V 00001010 (0x0A) = 2.6V 00001011 (0x0B) = 2.7V 00001100 (0x0C) = 2.8V 00001101 (0x0D) = 2.9V 00001110 (0x0E) = 3.0V 00001111 (0x0F) = 3.1V 00010000 (0x10) = 3.2V 00010001 (0x11) = 3.3V DEFAULT VALUE MAX8893A 00001100 (0x0C) MAX8893B 00001010 (0x0A) MAX8893C 00000010 (0x02) ______________________________________________________________________________________ 41 MAX8893A/MAX8893B/MAX8893C Table 11. LDO1 MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP Table 12. LDO2 This register contains LDO2 output voltage controls. REGISTER NAME LDO2 Register Pointer 0x06 Reset Value 0x0E Type Read/write Special Features BIT — NAME B7 (MSB) B6 B5 B4 B3 B2 B1 B0 (LSB) LDO2 DESCRIPTION 00000000 (0x00) = 1.2V 00000001 (0x01) = 1.3V 00000010 (0x02) = 1.4V 00000011 (0x03) = 1.5V 00000100 (0x04) = 1.6V 00000101 (0x05) = 1.7V 00000110 (0x06) = 1.8V 00000111 (0x07) = 1.9V 00001000 (0x08) = 2.0V 00001001 (0x09) = 2.1V 00001010 (0x0A) = 2.2V 00001011 (0x0B) = 2.3V 00001100 (0x0C) = 2.4V 00001101 (0x0D) = 2.5V 00001110 (0x0E) = 2.6V 00001111 (0x0F) = 2.7V 00010000 (0x10) = 2.8V 00010001 (0x11) = 2.9V 00010010 (0x12) = 3.0V 00010011 (0x13) = 3.1V 00010100 (0x14) = 3.2V 00010101 (0x15) = 3.3V DEFAULT VALUE 00001110 (0x0E) 42 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP This register contains LDO3 output voltage controls. REGISTER NAME LDO3 Register Pointer 0x07 Reset Value 0x11 Type Read/write Special Features BIT — NAME B7 (MSB) B6 B5 B4 LDO3 B3 B2 B1 B0 (LSB) DESCRIPTION 00000000 (0x00) = 1.6V 00000001 (0x01) = 1.7V 00000010 (0x02) = 1.8V 00000011 (0x03) = 1.9V 00000100 (0x04) = 2.0V 00000101 (0x05) = 2.1V 00000110 (0x06) = 2.2V 00000111 (0x07) = 2.3V 00001000 (0x08) = 2.4V 00001001 (0x09) = 2.5V 00001010 (0x0A) = 2.6V 00001011 (0x0B) = 2.7V 00001100 (0x0C) = 2.8V 00001101 (0x0D) = 2.9V 00001110 (0x0E) = 3.0V 00001111 (0x0F) = 3.1V 00010000 (0x10) = 3.2V 00010001 (0x11) = 3.3V DEFAULT VALUE 00010001 (0x11) ______________________________________________________________________________________ 43 MAX8893A/MAX8893B/MAX8893C Table 13. LDO3 MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Table 14. LDO4 This register contains LDO4 output voltage controls. REGISTER NAME LDO4 Register Pointer 0x08 0x16(MAX8893A) 0x19(MAX8893B/MAX8893C) Reset Value Type Read/write Special Features BIT — NAME B7 (MSB) B6 B5 B4 LDO4 B3 B2 B1 B0 (LSB) DESCRIPTION 00000000 (0x00) = 0.8V 00000001 (0x01) = 0.9V 00000010 (0x02) = 1.0V 00000011 (0x03) = 1.1V 00000100 (0x04) = 1.2V 00000101 (0x05) = 1.3V 00000110 (0x06) = 1.4V 00000111 (0x07) = 1.5V 00001000 (0x08) = 1.6V 00001001 (0x09) = 1.7V 00001010 (0x0A) = 1.8V 00001011 (0x0B) = 1.9V 00001100 (0x0C) = 2.0V 00001101 (0x0D) = 2.1V 00001110 (0x0E) = 2.2V 00001111 (0x0F) = 2.3V 00010000 (0x10) = 2.4V 00010001 (0x11) = 2.5V 00010010 (0x12) = 2.6V 00010011 (0x13) = 2.7V 00010100 (0x14) = 2.8V 00010101 (0x15) = 2.9V 00010110 (0x16) = 3.0V 00010111 (0x17) = 3.1V 00011000 (0x18) = 3.2V 00011001 (0x19) = 3.3V DEFAULT VALUE MAX8893A 00010110 (0x16) MAX8893B /MAX8893C 00011001 (0x19) 44 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP This register contains LDO5 output voltage controls. REGISTER NAME LDO5 Register Pointer 0x09 0x02 (MAX8893A) 0x14 (MAX8893B) 0x16 (MAX8893C) Reset Value Type Read/write Special Features BIT — NAME B7 (MSB) B6 B5 B4 LDO5 B3 B2 B1 B0 (LSB) DESCRIPTION 00000000 (0x00) = 0.8V 00000001 (0x01) = 0.9V 00000010 (0x02) = 1.0V 00000011 (0x03) = 1.1V 00000100 (0x04) = 1.2V 00000101 (0x05) = 1.3V 00000110 (0x06) = 1.4V 00000111 (0x07) = 1.5V 00001000 (0x08) = 1.6V 00001001 (0x09) = 1.7V 00001010 (0x0A) = 1.8V 00001011 (0x0B) = 1.9V 00001100 (0x0C) = 2.0V 00001101 (0x0D) = 2.1V 00001110 (0x0E) = 2.2V 00001111 (0x0F) = 2.3V 00010000 (0x10) = 2.4V 00010001 (0x11) = 2.5V 00010010 (0x12) = 2.6V 00010011 (0x13) = 2.7V 00010100 (0x14) = 2.8V 00010101 (0x15) = 2.9V 00010110 (0x16) = 3.0V 00010111 (0x17) = 3.1V 00011000 (0x18) = 3.2V 00011001 (0x19) = 3.3V DEFAULT VALUE MAX8893A 00000010 (0x02) MAX8893B 00010100 (0x14) MAX8893C 00010110 (0x16) ______________________________________________________________________________________ 45 MAX8893A/MAX8893B/MAX8893C Table 15. LDO5 MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP Table 16. SVER This register contains the MAX8893A/MAX8893B/MAX8893C version number. REGISTER NAME SVER Register Pointer 0x46 Reset Value N/A Type Read Special Features — BIT NAME B7 (MSB) — Reserved for future use — B6 — Reserved for future use — B5 — Reserved for future use — B4 — Reserved for future use — B3 — Reserved for future use — B2 — Reserved for future use — 00 = MAX8893A 01 = MAX8893B 10 = MAX8893C — B1 SVER B0 (LSB) DESCRIPTION Applications Information Step-Down Converter Input Capacitor The input capacitor, CIN1, reduces the current peaks drawn from the battery or input power source and reduces switching noise in the IC. The impedance of CIN1 at the switching frequency should be kept very low. Ceramic capacitors with X5R or X7R temperature characteristics are highly recommended due to their small size, low ESR, and small temperature coefficients. Due to the step-down converter’s fast soft-start, the input capacitance can be very low. For most applications, a 2.2FF capacitor is sufficient. Connect CIN1 as close as possible to the IC to minimize the impact of PCB trace inductance. For other input capacitors, use a 2.2FF ceramic capacitor from IN2 to ground and a 2.2FF ceramic capacitor from BATT to ground. Output Capacitor The output capacitor, CBUCK, is required to keep the output voltage ripple small and to ensure regulation loop stability. CBUCK must have low impedance at the switching frequency. Ceramic capacitors with X5R or X7R temperature characteristics are highly recommended due to their small size, low ESR, and small temperature coefficients. Due to the unique feedback network, the DEFAULT VALUE output capacitance can be very low. For most applications a 2.2FF capacitor is sufficient. For optimum loadtransient performance and very low output ripple, the output capacitor value in FF should be equal to or larger than the inductor value in FH. Inductor Selection The recommended inductor for the step-down converter is from 1.0FH and 4.7FH. Low inductance values are physically smaller, but require faster switching, resulting in some efficiency loss. The inductor’s DC current rating needs to be only 100mA greater than the application’s maximum load current because the step-down converter features zero current overshoot during startup and load transients. For output voltages above 2.0V, when light load efficiency is important, the minimum recommended inductor is 2.2FH. For optimum voltage-positioning load transients, choose an inductor with DC series resistance in the 50mω to 150mω range. To achieve higher efficiency at heavy loads (above 200mA) or minimum load regulation (but some transient overshoot), the inductor resistance should be kept below 100mω. For light -oad applications up to 200mA, much higher resistance is acceptable with very little impact on performance. See Table 17 for some suggested inductors. 46 ������������������������������������������������������������������������������������� µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP MANUFACTURER Taiyo Yuden SERIES INDUCTANCE (FH) ESR (mI) ISAT (mA) DIMENSIONS (LTYP O WTYP O HMAX) (mm) LB2012 1.0 2.2 150 230 300 240 2.0 x 1.25 x 1.45 LB2016 1.0 1.5 2.2 3.3 90 110 130 200 455 350 315 280 2.0 x 1.6 x 1.8 LB2518 1.0 1.5 2.2 3.3 60 70 90 110 500 400 340 270 2.5 x 1.8 x 2.0 LBC2518 1.0 1.5 2.2 3.3 4.7 80 110 130 160 200 775 660 600 500 430 2.5 x 1.8 x 2.0 LQH32C_53 1.0 2.2 4.7 60 100 150 1000 790 650 3.2 x 2.5 x 1.7 LQM43FN 2.2 4.7 100 170 400 300 4.5 x 3.2 x 0.9 D310F 1.5 2.2 3.3 130 170 190 1230 1080 1010 3.6 x 3.6 x 1.0 D312C 1.5 2.2 2.7 3.3 100 120 150 170 1290 1140 980 900 3.6 x 3.6 x 1.2 CDRH2D11 1.5 2.2 3.3 4.7 50 80 100 140 900 780 600 500 3.2 x 3.2 x 1.2 Murata TOKO Sumida ______________________________________________________________________________________ 47 MAX8893A/MAX8893B/MAX8893C Table 17. Suggested Inductors MAX8893A/MAX8893B/MAX8893C FPMIC for Multimedia Application Processor in 2.5mm x 3.0mm WLP Capacitors for LDOs For LDOs, the required output capacitance is dependent on the load currents. With rated maximum load currents, 2.2FF (typ) capacitors are recommended for LDO1, LDO2, LDO3, and LDO5 and a 1.0FF capacitor is recommended for LDO4. For loads less than 150mA, it is sufficient to use 1.0FF capacitors for stable operation over the full temperature range for LDO1, LDO2, LDO3, and LDO5. Reduce output noise and improve load transient response, stability, and power-supply rejection by using larger output capacitors. USB High-Speed Switch USB Switching The USB high-speed switch is fully compliant with the USB 2.0 specification. The low on-resistance and low on-capacitance of these switches make it ideal for highperformance switching applications. It is ideal for routing USB data lines (see Figure 14) and for applications that require switching between multiple USB hosts (see Figure 15). The USB switch also features overvoltage fault protection to guard systems against shorts to the USB VBUS voltage that is required for all USB applications. Extended ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. COM1 and COM2 are further protected against static electricity. The state-of-the-art structures are developed to protect these pins against ESD up to ±15kV without damage. The ESD structures withstand high ESD in normal operation and when the device is powered down. After an ESD event, the USB switch continues to function without latchup. The USB high-speed switch is characterized for protection to the following limits: ASIC I D+ HI-SPEED USB TRANSCEIVER DNC1 MAX8893A MAX8893B MAX8893C NO1 VBUS COM1 D+ NC2 COM2 ASIC II NO2 D- D+ HI-SPEED USB TRANSCEIVER DGND USB CONNECTOR Figure 14. USB Data Routing/Typical Application Circuit MAX8893A MAX8893B MAX8893C D+ NC1 D+ COM1 HI-SPEED USB TRANSCEIVER D- USB HOST I NO1 NC2 D- COM2 NO2 D+ U ±15kV using Human Body Model U ±8kV using IEC 61000-4-2 Contact Discharge method D- U ±15kV using IEC 61000-4-2 Air-Gap Discharge method Figure 15. Switching Between Multiple USB Hosts 48 ������������������������������������������������������������������������������������� USB HOST II µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP USB Hi-Speed requires careful PCB layout with 45ω controlled-impedance matched traces of equal lengths. Ensure that bypass capacitors are as close as possible to the IC. Use large ground planes where possible. Refer to the MAX8893 evaluation kit for an example PCB layout design. Typical Operating Circuit INPUT 2.7V TO 5.5V LS IN1 1.0µF 2.2µF BUCK LX IN2 2.2µF 2.2µF 0.1µF AGND SDA ENLS ENBUCK LDO1 ON/OFF ENLDO1 LDO2 ON/OFF ENLDO2 LDO3 ON/OFF ENLDO3 ENLDO45 VLDO1 1.6V TO 3.3V LDO1 SCL BUCK ON/OFF LDO4/LDO5 ON/OFF 2.2µH REFBP 2.2µF LS ON/OFF VBUCK 0.8V TO 2.4V PGND BATT I 2C VLS 2.2µF MAX8893A MAX8893B MAX8893C VLDO2 1.2V TO 3.3V LDO2 2.2µF VLDO3 1.6V TO 3.3V LDO3 2.2µF VLDO4 0.8V TO 3.3V LDO4 1µF VLDO5 0.8V TO 3.3V LDO5 2.2µF USB ON/OFF USBSEL ENUSB NC1 CB NC2 COM1 NO1 COM2 NO2 ______________________________________________________________________________________ 49 MAX8893A/MAX8893B/MAX8893C PCB Layout and Routing High switching frequencies and relatively large peak currents make the PCB layout a very important aspect of design. Good design minimizes excessive EMI on the voltage gradients in the ground plane that can result in instability or regulation errors. Connect the input and output capacitors as close as possible to the IC. Connect the inductor as close as possible to the IC and keep the traces short, direct, and wide. Connect AGND to the exposed pad directly under the IC. Connect AGND and PGND to the ground plane. Keep noisy traces, such as the LX node, as short as possible. MAX8893A/MAX8893B/MAX8893C µPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP Chip Information PROCESS: BiCMOS Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 30 WLP W302A3+2 21-0016 50 ������������������������������������������������������������������������������������� µFPMICs for Multimedia Application Processors in a 3.0mm x 2.5mm WLP REVISION REVISION NUMBER DATE DESCRIPTION PAGES CHANGED 0 10/09 Initial release — 1 2/10 Added new TOCs 53, 54, and 55 to Typical Operating Characteristics section 21 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2010 Maxim Integrated Products 51 Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX8893A/MAX8893B/MAX8893C Revision History