TMS37F128 www.ti.com SCBS878 – APRIL 2012 CONTROLLER REMOTE ACCESS IDENTIFICATION DEVICE (CRAID) WITH INTEGRATED MICROCONTROLLER, 3D WAKEUP RECEIVER, AND IMMOBILIZER INTERFACE Check for Samples: TMS37F128 FEATURES – – – – – 1 • • 2 • • Wide Supply Voltage Range: 1.8 V to 3.6 V Ultralow Power Consumption – CPU Active Mode: 200 μA/MHz at 2.2 V – Standby Mode (LPM3): 0.7 μA – Off Mode (LPM4): 0.1 μA – Power-Down Mode: 60 nA Microcontroller System and Peripherals – 16-Bit RISC Architecture, 125-ns Instruction Cycle Time – Wake-Up From Standby Mode in <6 μs – Basic Clock Module Configurations – Single External Resistor – 32-kHz Crystal – High-Frequency Crystal – Resonator – External Clock Source – 16-Bit Timer_A With Three Capture/Compare Registers – 10-Bit 200-ksps Analog-to-Digital (A/D) Converter With Internal Reference, Sampleand-Hold, and Autoscan – 8KB + 256B Flash Memory – 256B RAM – 133-Byte EEPROM – Serial Onboard Programming, No External Programming Voltage Needed – Programmable Code Protection by Security Fuse – 80-Bit DST80 Security Authentication Coprocessor – 17 I/O Ports Low-Frequency (LF) Immobilizer Interface – Integrated Batteryless Immobilizer Interface – Half Duplex (HDX) Immobilizer Communication Achieves up to 4-in (10-cm) Read Range – Special Selective Addressing Mode Allows Reliable Learn-In Sequence – 80-Bit Authentication Key Length • Up to 8-kbit/s LF Uplink Data Rate 5-/3-Byte Challenge/Response Algorithm Fast Authentication Within 42 ms Fast Mutual Authentication Within 65 ms 133-Byte EEPROM – 91-Byte Free Available EEPROM User Memory – 32-Bit Unique Serial Number – High EEPROM Security and Flexibility – Write-Only Authentication Keys – Pages Are Irreversibly Lockable and Protectable – Protected Pages Programmable Only Through Mutual Authentication – Battery Check and Charge Functions – Each User Page is Lockable – Resonant Frequency: 134.2 kHz – Integrated Resonant Frequency Trimming Low-Frequency 3D Wakeup Receiver – Highest Communication Range of More Than Three Meters – High Input Sensitivity: 4.2 mVpp (Typ) – High Q System – Integrated Resonant Circuit Trimming Compensates for Component Offsets – Received Signal Strength Indicator (RSSI) Output for Each Channel – Resonant Circuit Usable as Clock Reference for Microcontroller (134.2 kHz) – Frequency Range: 120 kHz to 140 kHz – Ultra-Low Standby Current: 3.9 μA (Typ) With All Three Channels Active for Wake Pattern Detection – Interface to up to Three External Antennas – Two Different Programmable Wake Patterns – Selectable Wake Pattern Length: 0, 4, 8 or 16 Bits – Two Separate Adjustable Wake-Up Levels – Digital Channel Sensitivity Adjustment for Each Antenna 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MSP430 is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TMS37F128 SCBS878 – APRIL 2012 www.ti.com DESCRIPTION The Controller Remote Access Identification Device (CRAID) combines three functions in one device: • Low-power 16-bit microcontroller based on the MSP430F1232 core • 3D wakeup receiver • DST80 immobilizer interface With these three functions, it is ideally suited for state-of-the-art passive entry and passive start applications. The low-power microcontroller MSP430™ core offers a 16-bit RISC architecture, 8KB program memory, and 17 useraccessible I/O ports. The 3D low-frequency (LF) wakeup receiver offers high sensitivity to receive LF signals between 120 kHz and 140 kHz and has several other features such as RSSI measurement and bidirectional LF signaling. The embedded DST80 immobilizer interface offers a high level of security through its hardware encryption coprocessor and can also handle mutual authentication schemes. The immobilizer interface operates without battery support. Power management features include battery charge and check as well as a battery backup function allowing operation of all functions (including the microcontroller) with low or even no battery as long as there is sufficient energy from the LF field. The passive entry device manages the immobilizer communication, push-button interaction, and LF wake reception. The special high-Q design achieves communication ranges up to 3 m for the passive entry link with outstanding low standby current on the receiver side. The front end offers flexible configuration of two different wake patterns lengths of 0, 4, 8, or 16 bits. Each channel can be adjusted in sensitivity and resonance frequency, which results in reproducible system designs. By sensing the pressing of a push button, the device wakes up and controls an external UHF transmitter or transceiver. Security keys and rolling codes can be stored in the integrated EEPROM memory. This memory is accessible over the LF interface without support from the battery in the keyfob. The passive entry device offers a special battery backup mode to operate the microcontroller without battery support. The external resonant circuit with an LF coil and a resonant capacitor can be trimmed to the correct resonant frequency with the integrated trimming capability, eliminating part tolerances. Ordering Information (1) PACKAGE (2) TA –40°C to 85°C (1) (2) ORDERABLE PART NUMBER TSSOP – DBT TMS37F128D3IDBTRG4 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBT PACKAGE (TOP VIEW) TDAT TEN RF2 NPOR RF3 VCC_CU WDEEN VBAT VBATI P3.6/A6 P3.7/A7 P2.3/A3 P2.4/A4 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 NC P1.7 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 TCLK RF1 VCL AM_MOD GND_AF RSSI WAKE BUSY EOBA CLKA/M P3.0/A5 P2.2/A2 P2.1/A1 P2.0/A0 RST XIN XOUT VSS_MSP P2.5 VCC_MSP NC TEST Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37F128 TMS37F128 www.ti.com SCBS878 – APRIL 2012 Functional Block Diagram Car side Key fob side Current Measurement Load Drivers GIO UHF Transceiver or UHF Receiver CC11x1-Q1 SPI Interface GIO UHF antenna Optional for battery charge LF Base Station TMS3705-Q1 Up to 13 ft (4 m) cable length Charging Amplifier LF Immobilizer antenna Embedded Processor GIO UHF Transmitter or UHF Transceiver CC11x1-Q1 SPI Passive Entry Device (3D Analog Frontend, 3D LF Immobilizer and antenna Microcontroller) PEPS LF Driver Push Buttons TMS37F128 LED System Supply Power Supply Figure 1. Application Diagram Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37F128 3 TMS37F128 SCBS878 – APRIL 2012 www.ti.com VBAT VDD ANTENNA MATCHING NETWORK GDO0 GDO2 RF_P RF_N UHF Transceiver or UHF Transmitter CC11x1-Q1 RBIAS SI SO/GDO1 SCLK XOSC1 VBATI CS XTAL XOSC2 GND LED 1 VBATI VBATI P1.6 P1.7 P1.4 P1.5 P1.2 P1.3 P1.0 VBATI P1.1 LED 2 TEST P2.0 /RST P2.1 XOUT P2.2 XIN P2.3 VCC_MSP P2.4 VSS P2.5 VBATI P3.7 P3.6 P3.0 VBAT EOBA CRAID TMS37F128 BUSY VBATI NPOR WDEEN AMMOD WAKE CLKA/M RF1 RF2 RSSI RF3 TCLK CR2 LR3 TEN CR3 VCL VCL VCL VBAT LR2 VCC_CU CR1 GND LR1 CL VBAT TEST INTERFACE TDAT VBAT BATTERY Figure 2. Application Schematic 4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37F128 TMS37F128 www.ti.com SCBS878 – APRIL 2012 Operating Characteristics Part Number TMS37F128D3IDBTRG4 Features Immobilizer plus microcontroller with integrated power management DST80 authentication logic 80-bit key length, 5-byte challenge, 3-byte signature DST80 authentication time Mutual authentication: 65 ms Fast authentication: 42 ms Microcontroller 16-bit RISC ultra-low power based on MSP430F1232 core Supply voltage (VBAT) 1.8 V to 3.6 V Active current consumption 300 μA (typ) (VCC = 2.2 V, fosc= 1 MHz, microcontroller active) Standby current consumption 3.9 μA (typ) (three channels wake pattern active, microcontroller in LPM4, VCC = 3 V, TA = 25°C) Transponder Transmission Principle HDX (half-duplex telegram protocol) Operating Frequency 134.2 kHz Integrated resonant frequency trimming capability via LF or Test interface Security Challenge/response, mutual authentication Downlink 100% AM, PPM Bit coding with 2 kbit/s (typ) Uplink FSK modulation with 7.9 kbit/s (typ) EEPROM memory 133 bytes EEPROM endurance 200 000 cycles (TA = 25°C) (min) Clock reference for microcontroller Resonant circuit can be used as clock reference for the microcontroller Battery charge Integrated battery charge functionality Key learn-in Special selective addressing to provide secure learn-in procedure 91-byte free available EEPROM user memory 32-bit unique serial number 3D Wakeup Receiver Sensitivity 4.2 mVpp (typ), 2.7 mVpp (min), 5.1 mVpp (max) (VCC = 2.8 V, TA = 25°C) Sensitivity tuning Separate for each channel and each wake pattern Operating frequency 120 kHz to 140 kHz Resonant frequency trimming Separate for each channel Wake pattern Two independent wake patterns with selectable length: 0, 4, 8 or 16 bits Microcontroller Memory 8KB program memory, 256-byte RAM User data flash memory 256-byte information memory Flash program and erase endurance 100 000 cycles (typ) (TA = 25°C) Flash data retention 10 years (min) (TA = 25°C) Program, erase, read supply voltage 2.7 V (min) I/O ports 17 Operating temperature -40°C to 85°C Package 44-pin TSSOP (DBT) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37F128 5 PACKAGE OPTION ADDENDUM www.ti.com 30-May-2012 PACKAGING INFORMATION Orderable Device TMS37F128D3IDBTRG4 Status (1) ACTIVE Package Type Package Drawing TSSOP DBT Pins 30 Package Qty Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TMS37F128D3IDBTRG4 Package Package Pins Type Drawing TSSOP DBT 30 SPQ 0 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 24.4 Pack Materials-Page 1 6.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 11.7 1.6 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMS37F128D3IDBTRG4 TSSOP DBT 30 0 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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